Patterning in devices with organic light-emitting diode displays and sensors

Abstract

The present disclosure relates to patterning in a device having an organic light emitting diode display and a sensor. The electronic device may include a display and an optical sensor formed below the display. A pixel removal area on the display may at least partially overlap with the sensor. The pixel removal area may include a plurality of non-pixel areas, each non-pixel area not containing a thin film transistor. The plurality of non-pixel areas are configured to increase the transmittance of light through the display to the sensor. In addition to removing the thin film transistors in the pixel removal area, additional layers in the display stack structure may also be removed. Specifically, the cathode layer, polyimide layer and / or substrate in the display stack structure may be patterned to have openings in the pixel removal area. The polarizer may be bleached in the pixel removal area to obtain additional transmittance gain. The cathode layer may be removed using laser ablation using a point laser or blanket illumination.

Description

[0001] This patent application claims priority to U.S. Provisional Patent Application No. 62 / 991,888, filed on March 19, 2020, which is hereby incorporated by reference in its entirety. Background Art

[0002] The present disclosure relates generally to electronic devices, and more particularly to electronic devices having displays.

[0003] Electronic devices often include displays. For example, an electronic device may have an organic light-emitting diode (OLED) display based on organic light-emitting diode pixels. In this type of display, each pixel includes a light-emitting diode and a thin-film transistor that controls the application of a signal to the light-emitting diode to generate light. The light-emitting diode may include an OLED layer positioned between an anode and a cathode.

[0004] There is a trend towards bezel-less electronic devices with full-screen displays. However, these devices may still need to include sensors such as cameras, ambient light sensors, and proximity sensors to provide other device capabilities. Since the display now covers the entire front of the electronic device, the sensors will have to be placed below the display stack. However, in practice, the amount of light transmission through the display stack is very low (i.e., transmission may be less than 20% in the visible spectrum), which severely limits the sensing performance below the display.

[0005] It is in this context that the implementation scheme of this article is generated. Summary of the Invention

[0006] Disclosed herein is an electronic device that may include a display and an optical sensor formed below the display. A pixel-removed region on the display may at least partially overlap the sensor. The pixel-removed region may include multiple non-pixel regions, each of which is free of thin-film transistors. The multiple non-pixel regions are configured to increase the transmittance of light from the display to the sensor.

[0007] In addition to removing the thin film transistors in the pixel removal area, additional layers in the display stack structure can also be removed. Specifically, the cathode layer of the light-emitting diode in the display can be patterned to have an opening in the pixel removal area. The polyimide layer can be patterned to have an opening in the pixel removal area. The substrate (e.g., formed of PET or PEN) can be patterned to have an opening in the pixel removal area. The polarizer can be bleached in the pixel removal area to obtain additional transmittance gain.

[0008] The cathode layer can be removed using laser ablation using a spot laser or blanket illumination. The cathode layer can be removed after forming one or more additional encapsulation layers in the pixel removal area. The encapsulation layer can also be removed during the cathode etch. Additional encapsulation layers can be formed after etching to ensure that the organic layers of the display pixels are adequately sealed.

[0009] In some cases, the cathode can be removed in the area between pixels in the display (without disrupting the larger pixel array pattern). Isolated cathode openings can be formed between adjacent pixels. Alternatively, a grid of cathode openings can be formed, resulting in isolated cathode islands above each pixel. An auxiliary conductive layer can be used to electrically connect the remaining cathode portions. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of an illustrative electronic device with a display and one or more sensors according to one embodiment.

[0011] Figure 2 is a schematic diagram of an illustrative display having a light-emitting element according to one embodiment.

[0012] Figure 3 is a cross-sectional side view of an illustrative display stack at least partially covering a sensor according to one embodiment.

[0013] Figure 4 is a cross-sectional side view of an illustrative display stackup having a pixel removed area at least partially covering a sensor according to one embodiment.

[0014] Figure 5 is a cross-sectional side view of an illustrative display stackup having a pixel removed region including an opening in a cathode layer according to one embodiment.

[0015] Figure 6 is a cross-sectional side view of an illustrative display stackup having pixel removed areas comprising openings in a polyimide layer according to one embodiment.

[0016] Figure 7 is a cross-sectional side view of an illustrative display stackup having a pixel removed region comprising an opening in a substrate layer according to one embodiment.

[0017] Figure 8 is a cross-sectional side view of an illustrative display stackup having a polarizer with bleached portions in pixel removal areas according to one embodiment.

[0018] Figure 9 is a graph showing an exemplary distribution of polarizer transmittance with respect to position according to one embodiment.

[0019] Figure 10 is a cross-sectional side view of a display showing an exemplary method of removing portions of a cathode layer using a point laser according to one embodiment.

[0020] Figure 11 is a cross-sectional side view of a display showing an exemplary method of removing portions of a cathode layer using blanket lighting according to an embodiment.

[0021] Figure 12 is a cross-sectional side view of a display according to one embodiment, illustrating an exemplary method of simultaneously removing portions of a cathode layer and a substrate.

[0022] Figure 13 is a top view of an illustrative display having openings in the cathode in the pixel-removed area according to one embodiment.

[0023] Figure 14 is a top view of an illustrative display with isolated openings in the cathode between pixels according to one embodiment.

[0024] Figure 15 is a top view of an illustrative display having a grid with openings in the cathode between pixels according to one embodiment.

[0025] Figure 16 is a cross-sectional side view illustrating an exemplary method of forming a display having cathode openings in pixel-removed areas according to one embodiment.

[0026] Figure 17 is a cross-sectional side view illustrating an exemplary method of forming a display using a mask layer that also serves as an encapsulation layer, according to one embodiment.

[0027] Figure 18 is a cross-sectional side view illustrating an exemplary method of forming a display having an etched cathode between pixels, according to one embodiment.

[0028] Figure 19 is a cross-sectional side view illustrating an exemplary method of forming a display having an etched cathode and a blanket organic encapsulation layer between pixels, according to one embodiment. DETAILED DESCRIPTION

[0029] Figure 11 shows an exemplary electronic device of the type that may have a display. Electronic device 10 may be a computing device such as a laptop computer, a computer monitor including an embedded computer, a tablet computer, a cellular phone, a media player, or other handheld or portable electronic device, a smaller device (such as a wristwatch device, a pendant device, a headphone or earpiece device, a device embedded in glasses or other equipment worn on a user's head, or other wearable or miniature device), a display, a computer display including an embedded computer, a computer display not including an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which electronic equipment with a display is installed in an information kiosk or automobile), or other electronic equipment. Electronic device 10 may have the shape of a pair of glasses (e.g., a support frame), may be formed into a housing having the shape of a helmet, or may have other configurations for facilitating mounting and securing components of one or more displays on a user's head or near their eyes.

[0030] like Figure 1 As shown, electronic device 10 may include control circuitry 16 for supporting the operation of device 10. Control circuitry 16 may include storage devices, such as hard drive storage devices, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory configured to form a solid-state drive), volatile memory (e.g., static random access memory or dynamic random access memory), etc. Processing circuitry in control circuitry 16 may be used to control the operation of device 10. The processing circuitry may be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio chips, application-specific integrated circuits, etc.

[0031] Input-output circuitry in device 10, such as input-output devices 12, may be used to allow data to be provided to device 10, and to allow data to be provided from device 10 to external devices. Input-output devices 12 may include buttons, joysticks, scroll wheels, touchpads, keypads, keyboards, microphones, speakers, tone generators, vibrators, cameras, sensors, light-emitting diodes and other status indicators, data ports, etc. A user may control the operation of device 10 by supplying commands through the input resources of input-output devices 12, and may receive status information and other output from device 10 using the output resources of input-output devices 12.

[0032] Input-output device 12 may include one or more displays, such as display 14. Display 14 may be a touch screen display including a touch sensor for collecting touch input from a user, or display 14 may be insensitive to touch. The touch sensor of display 14 may be based on an array of capacitive touch sensor electrodes, an acoustic touch sensor structure, a resistive touch component, a force-based touch sensor structure, a light-based touch sensor, or other suitable touch sensor arrangements. The touch sensor for display 14 may be formed by electrodes formed on a common display substrate with the display pixels of display 14, or may be formed by a separate touch sensor panel that overlaps with the pixels of display 14. If desired, display 14 may be insensitive to touch (i.e., the touch sensor may be omitted). Display 14 in electronic device 10 may be a heads-up display that can be viewed without requiring the user to move away from a typical viewpoint, or may be a head-mounted display incorporated into a device worn on the user's head. If desired, display 14 may also be a holographic display for displaying holograms.

[0033] Control circuitry 16 may be used to run software, such as operating system code and application programs, on device 10. During operation of device 10, software running on control circuitry 16 may display images on display 14.

[0034] The input-output device 12 may also include one or more sensors 13, such as force sensors (e.g., strain gauges, capacitive force sensors, resistive force sensors, etc.), audio sensors such as microphones, touch and / or proximity sensors such as capacitive sensors (e.g., two-dimensional capacitive touch sensors associated with a display, and / or touch sensors forming buttons, touchpads, or other input devices not associated with a display), and other sensors. According to some embodiments, the sensor 13 may include optical sensors such as optical sensors that emit and detect light (e.g., optical proximity sensors such as transmissive reflective optical proximity structures), ultrasonic sensors, and / or other touch sensors and / or proximity sensors, monochrome and color ambient light sensors, image sensors, fingerprint sensors, temperature sensors, proximity sensors and other sensors for measuring three-dimensional contactless gestures ("air gestures"), pressure sensors, sensors for detecting position, orientation and / or motion (e.g., accelerometers, magnetic sensors (such as compass sensors), gyroscopes and / or inertial measurement units that include some or all of these sensors), health sensors, radio frequency sensors, depth sensors (e.g., structured light sensors and / or depth sensors based on stereo imaging devices), optical sensors (such as self-mixing sensors and light detection and ranging (lidar) sensors that collect time-of-flight measurements), humidity sensors, moisture sensors, gaze tracking sensors and / or other sensors. In some arrangements, device 10 may use sensors 13 and / or other input-output devices to capture user input (e.g., buttons may be used to capture button press input, a touch sensor overlapping the display may be used to capture user touch screen input, a trackpad may be used to capture touch input, a microphone may be used to capture audio input, an accelerometer may be used to monitor when a finger contacts an input surface and, therefore, may be used to capture finger press input, etc.).

[0035] Display 14 may be an organic light-emitting diode display or may be a display based on other types of display technology (e.g., a liquid crystal display). Device configurations in which display 14 is an organic light-emitting diode display are sometimes described herein as examples. However, this is merely illustrative. Any suitable type of display may be used if desired. Generally speaking, display 14 may have a rectangular shape (i.e., display 14 may have a rectangular footprint and a rectangular perimeter edge extending around the rectangular footprint) or may have other suitable shapes. Display 14 may be planar or may have a curved profile.

[0036] Figure 2 A top view of a portion of display 14 is shown in FIG. Figure 2As shown, display 14 may have an array of pixels 22 formed on a substrate. Pixels 22 may receive data signals via signal paths such as data lines D and may receive one or more control signals via control signal paths such as horizontal control lines G (sometimes referred to as gate lines, scan lines, emission control lines, etc.). There may be any suitable number of rows and columns of pixels 22 in display 14 (e.g., dozens or more, hundreds or more, or thousands or more). Each pixel 22 may have a light-emitting diode 26 that emits light 24 under the control of a pixel control circuit formed by a thin-film transistor circuit, such as a thin-film transistor 28 and a thin-film capacitor. Thin-film transistor 28 may be a polysilicon thin-film transistor, a semiconductor oxide thin-film transistor (such as an indium gallium zinc oxide (IGZO) transistor), or a thin-film transistor formed from other semiconductors. Pixels 22 may include light-emitting diodes of different colors (e.g., red, green, and blue) to provide display 14 with the ability to display color images, or may be monochrome pixels.

[0037] Display driver circuitry may be used to control the operation of pixels 22. Display driver circuitry may be formed from integrated circuits, thin-film transistor circuitry, and / or other suitable circuitry. Figure 2 The display driver circuit 30 may include a circuit for communicating with system control circuits such as Figure 1 The communication circuit 32 can be formed by traces on a flexible printed circuit or other cables. During operation, the control circuit (e.g., Figure 1 Control circuitry 16 of display 14 may provide display driver circuitry 30 with information about images to be displayed on display 14.

[0038] To display an image on display pixels 22, display driver circuitry 30 may provide image data to data lines D, while simultaneously issuing clock signals and other control signals to supporting display driver circuitry, such as gate driver circuitry 34, via paths 38. Display driver circuitry 30 may also provide clock signals and other control signals to gate driver circuitry 34 on opposite edges of display 14, if desired.

[0039] Gate driver circuitry 34 (sometimes referred to as row control circuitry) can be implemented as part of an integrated circuit and / or can be implemented using thin-film transistor circuitry. Horizontal control lines G in display 14 can carry gate line signals, such as scan line signals, emission enable control signals, and other horizontal control signals for controlling each row of display pixels 22. There can be any suitable number of horizontal control signals for each row of pixels 22 (e.g., one or more row control signals, two or more row control signals, three or more row control signals, four or more row control signals, etc.).

[0040] The area of ​​display 14 where display pixels 22 are formed is sometimes referred to herein as the active area. Electronic device 10 has an outer housing with a peripheral edge. The area surrounding the active area and within the peripheral edge of device 10 is the border area. Images can only be displayed to the user of the device within the active area. It is generally desirable to minimize the border area of ​​device 10. For example, device 10 may be provided with a full-screen display 14 that extends across the entire front face of the device. If desired, display 14 may also wrap around the edge of the front face, allowing at least a portion of the side edge or at least a portion of the back surface of device 10 to be used for display purposes.

[0041] Device 10 may include a sensor 13 mounted behind a display 14 . Figure 3 is a cross-sectional side view of an illustrative display stackup of display 14 at least partially covering a sensor according to one embodiment. Figure 3 As shown, the display stack may include a substrate, such as substrate 300. Substrate 300 may be formed of glass, metal, plastic, ceramic, sapphire, or other suitable substrate materials. In some arrangements, substrate 300 may be an organic substrate formed of polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) (as examples). One or more polyimide (PI) layers 302 may be formed over substrate 300. A polyimide layer may sometimes be referred to as an organic substrate (e.g., substrate 300 is a first substrate layer and substrate 302 is a second substrate layer). The surface of substrate 302 may optionally be covered with one or more buffer layers 303 (e.g., an inorganic buffer layer, such as a silicon oxide layer, a silicon nitride layer, an amorphous silicon layer, etc.).

[0042] A thin-film transistor (TFT) layer 304 may be formed over the inorganic buffer layer 303 and the organic substrates 302 and 300. The TFT layer 304 may include thin-film transistor circuitry, such as thin-film transistors, thin-film capacitors, associated routing circuitry, and other thin-film structures formed within a plurality of metal routing layers and dielectric layers. An organic light-emitting diode (OLED) layer 306 may be formed over the TFT layer 304. The OLED layer 306 may include a diode cathode layer, a diode anode layer, and an emissive material interposed between the cathode and anode layers. The TFT circuitry in layer 304 may be used to control the display pixel array formed by the OLED layer 306.

[0043] The circuits formed in TFT layer 304 and OLED layer 306 can be protected by encapsulation layer 308. For example, encapsulation layer 308 can include a first inorganic encapsulation layer, an organic encapsulation layer formed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer formed on the organic encapsulation layer. Encapsulation layer 308 formed in this manner can help prevent moisture and other potential contaminants from damaging the conductive circuits covered by layer 308.

[0044] One or more polarizing films 312 may be formed over encapsulation layer 308 using adhesive 310. Adhesive 310 may be implemented using an optically clear adhesive (OCA) material that provides high transmittance. One or more touch layers 316 implementing the touch sensor functionality of touch screen display 14 may be formed over polarizing films 312 using adhesive 314 (e.g., an OCA material). For example, touch layer 316 may include horizontal touch sensor electrodes and vertical touch sensor electrodes that together form a capacitive touch sensor electrode array. Finally, the display stack may be covered by a cover glass layer 320 formed over touch layer 316 using additional adhesive 318 (e.g., an OCA material). Cover glass 320 may serve as an outer protective layer for display 14.

[0045] Still refer to Figure 3 , the sensor 13 may be formed below the display stack within the electronic device 10. Figure 1 As mentioned, sensor 13 can be an optical sensor, such as a camera, proximity sensor, ambient light sensor, fingerprint sensor, or other light-based sensor. In such cases, the performance of sensor 13 depends on the transmission of light through the display stack, as indicated by arrow 350. However, typical display stacks have fairly limited transmission characteristics. For example, more than 80% of light in the visible spectrum can be lost when traveling through the display stack, making sensing beneath display 14 challenging.

[0046] Each of the multiple layers in the display stack contributes to reducing light transmission to the sensor 13. In particular, the dense thin-film transistors and associated routing structures in the TFT layer 304 of the display stack contribute significantly to the low transmission. According to one embodiment, at least some of the display pixels may be selectively removed in an area of ​​the display stack directly above the sensor 13. The area of ​​the display 14 that at least partially covers or overlaps the sensor 13 from which at least a portion of the display pixels have been removed is sometimes referred to as a pixel removal area. Removing display pixels in the pixel-free area (e.g., removing transistors and / or capacitors associated with one or more sub-pixels) can greatly help increase transmission and improve the performance of the sensor 13 below the display. In addition to removing display pixels, additional layers such as the polyimide layer 302 and / or portions of the substrate 300 may also be removed for additional transmission improvement. The polarizer 312 may also be bleached for additional transmission improvement.

[0047] Figure 4 is a cross-sectional side view of an exemplary display showing how pixels may be removed in the pixel removal area to increase transmission through the display. Figure 4As shown, display 14 may include a pixel region 322 and a pixel-removed region 324. In pixel region 322, the display may include a pixel formed by an emissive material 306-2 interposed between an anode 306-1 and a cathode 306-3. A signal may be selectively applied to anode 306-1 to cause emissive material 306-2 to emit light for the pixel. Circuitry in thin-film transistor layer 304 may be used to control the signal applied to anode 306-1.

[0048] In pixel removal region 324, anode 306-1 and emissive material 306-2 may be omitted. Without the pixel removal region, additional pixels may be formed in region 324 adjacent to the pixels in region 322. However, to increase the transmittance of light to sensor 13 below the display, the pixels in region 324 are removed. The absence of emissive material 306-2 and anode 306-1 may increase transmittance through the display stack. Additional circuitry within thin-film transistor layer 304 may also be omitted in the pixel removal region to increase transmittance.

[0049] Additional transmission improvements through the display stack may be obtained by selectively removing additional components from the display stack in the pixel removal areas 324 . Figure 5 FIG. 3 is a cross-sectional side view of an exemplary display with the cathode removed in pixel removal area 324. Figure 5 As shown, a portion of cathode 306-3 can be removed in pixel removal area 324. This creates an opening 326 in cathode 306-3. In other words, cathode 306-3 can have a conductive material that defines opening 326 in the pixel removal area. Removing the cathode in this manner allows more light to pass through the display stack to sensor 13. Cathode 306-3 can be formed from any desired conductive material. The cathode can be removed by etching (e.g., laser etching or plasma etching). Alternatively, the cathode can be patterned during the initial cathode deposition and formation steps to have an opening in pixel removal area 324.

[0050] Figure 6 3 is a cross-sectional side view of an exemplary display in which a portion of the polyimide layer is removed in pixel removal area 324. As shown, in addition to cathode layer 306-3, polyimide layer 302 may also be removed in pixel removal area 324. Removal of polyimide layer 302 results in opening 328 in the pixel removal area. In other words, the polyimide layer may have a polyimide material that defines opening 328 in the pixel removal area. The polyimide layer may be removed by etching (e.g., laser etching or plasma etching). Alternatively, the polyimide layer may be patterned during the initial polyimide formation step to have an opening in pixel removal area 324. Removal of polyimide layer 302 in pixel removal area 324 may result in additional transmittance of light to sensor 13 in pixel removal area 324.

[0051] Figure 7 3 is a cross-sectional side view of an exemplary display with a portion of the substrate removed in pixel removal area 324. As shown, in addition to cathode layer 306-3 and polyimide layer 302, substrate 300 may also be removed in pixel removal area 324. Removal of substrate 300 results in opening 330 in the pixel removal area. In other words, substrate 300 may have a material (e.g., PET, PEN, etc.) that defines opening 330 in the pixel removal area. The substrate can be removed by etching (e.g., with a laser). Alternatively, the substrate may be patterned during the initial substrate formation step to have an opening in pixel removal area 324. Removal of substrate 300 in pixel removal area 324 may result in additional transmittance of light to sensor 13 in pixel removal area 324. Polyimide opening 328 and substrate opening 330 may be considered to form a single, integral opening. When portions of polyimide layer 302 and / or substrate 300 are removed, inorganic buffer layer 303 may serve as an etch stop for the etching step. Openings 328 and 330 may be filled with air or another desired transparent filler.

[0052] In addition to having openings in cathode 306-3, polyimide layer 302, and / or substrate 300, the polarizers in the display may be bleached for additional transmittance in the pixel removed areas. Figure 8 FIG is a cross-sectional side view of an exemplary display having a bleached polarizer in pixel removal area 324. Figure 8 As shown, polarizer 312 includes a bleached portion 312-1 and an unbleached portion 312-2. In unbleached portion 312-2, the polarizer may have a transmission (e.g., transmission of visible light) of approximately 50%. However, the unbleached polarizer can function as a linear polarizer that polarizes light emitted from pixels in pixel region 322. In contrast, bleached polarizer portion 312-1 may have a light transmission of 80% or greater, 90% or greater, 95% or greater, 99% or greater, etc. Therefore, bleached polarizer portion 312-1 allows more light to pass through to sensor 13 below the display.

[0053] Bleached polarizer portion 312-1 can be formed by exposing polarizer 312 to ultraviolet light, a bleaching chemical (e.g., potassium hydroxide), or using other desired polarizer bleaching techniques. Bleaching can be performed, for example, after polarizer lamination. If desired, the portion of polarizer 312 in portion 312-1 can be removed (e.g., using laser ablation, etc.). These arrangements can be used to ensure that region 312-1 is transparent and allows light to pass through to sensor 13.

[0054] exist Figure 8In FIG. 3 , polarizer 312 is depicted as having a fully bleached portion 312-1 and a fully unbleached portion 312-2. However, the polarizer may optionally have a transmittance gradient between the fully bleached portion and the fully unbleached portion. This can be achieved by partially bleaching the polarizer between the fully bleached portion and the fully unbleached portion.

[0055] Figure 9 3 is a graph of an exemplary transmittance distribution of polarizer 312. As shown, the polarizer may have a transmittance distribution 360 that varies based on the position within the distribution. In pixel regions 322, the polarizer may not be bleached (e.g., not bleached at all). Thus, the transmittance of the polarizer in these regions may be approximately 50%, as shown in FIG. Figure 9 As shown. In the pixel removal area 324, the polarizer may be bleached (e.g., completely bleached). In other words, the polarizer may have a local maximum in transmittance in the pixel removal area 324. The local maximum may be approximately 100% (e.g., Figure 9 ), greater than 99%, greater than 95%, greater than 90%, greater than 80%, between 80% and 100% (including the end values), etc.

[0056] Instead of an immediate transition between the bleached and unbleached parts of the polarizer, the polarizer can have a transmission gradient between the fully bleached and fully unbleached parts. Figure 9 As shown, the transmittance can be gradually varied between positions x1 and x2. The transmittance can be gradually varied linearly, exponentially, according to a step function, or according to any other desired profile. The transmittance has one or more intermediate transmittances between the maximum transmittance (in pixel removal region 324) and the minimum transmittance (in pixel region 322). The transmittance gradient can be achieved by partially bleaching the polarizer according to a desired gradient between a fully bleached portion and a partially bleached portion. The transmittance gradient can help mitigate visible artifacts associated with pixel removal regions.

[0057] In some cases, cathode 306-3 may be formed during the initial deposition step in both pixel region 322 and pixel removal region 324. The cathode may then be removed, as needed, from pixel removal region 324. One possible method of removing the cathode is laser etching (eg, laser ablation). Figure 10 is a cross-sectional side view of an exemplary display showing how a point laser can be used to selectively remove the cathode of the display.

[0058] like Figure 10 As shown, the cathode can optionally be removed before all overlying layers cover the cathode. In one example, portions of the cathode can be laser ablated immediately after cathode deposition. Figure 10In another example shown, encapsulation 308 may be formed over cathode 306 - 3 and then portions of the cathode may be removed using laser ablation.

[0059] A light source 402 (e.g., a laser) can be controlled by a computer-controlled positioner 404. The computer-controlled positioner 404 can move the laser 402 to ablate the cathode 306-3 in a desired area. The laser 402 can emit a single beam 406 for ablating (etching) the cathode. In one exemplary ablation technique, the laser can heat the cathode, causing it to vaporize. Because the laser 402 emits a single beam that precisely ablates a specific desired portion (e.g., a single point) of the cathode 306-3, the laser 402 is sometimes referred to as a point laser.

[0060] Figure 11 FIG2 is a cross-sectional side view of an exemplary display showing how blanket lighting can be used to remove the cathode of the display. Figure 11 As shown, a mask layer 408 may be formed over the cathode. The mask layer 408 may cover the portion of the cathode 306-3 that is intended to remain after etching (e.g., the portion of the cathode in the pixel area 322). The light source 410 (e.g., one or more lasers) may emit blanket illumination 412 over a wider area than the point laser 402. However, the mask layer 408 has an opening 416 that overlaps the desired cathode opening 326. The mask layer 408 may be opaque to the light 412 from the light source 410. Thus, the mask layer 408 blocks the light 412 in areas where the cathode is not removed (such as the pixel area 322). However, the mask layer 408 allows the light 412 to pass through the opening 416 to remove the cathode 306-3 and form the cathode opening 326.

[0061] The mask layer 408 can be formed using photolithography. In other words, the mask layer 408 can be a photoresist material that is patterned by exposure to light of a specific wavelength. The mask can control the exposure of the photoresist material to light to produce a mask with openings 416 at desired locations. The photoresist material can then be opaque to the wavelength of the blanket illumination 412 to prevent light from reaching the unetched portions of the cathode 306-3. Figure 11 , mask layer 408 is formed over encapsulation layer 308. The mask layer can be removed after etching cathode 306-3 so that the mask layer is not present in the final display stack structure (e.g., mask layer 408 is sacrificial). If desired, mask layer 408 can optionally be formed directly on cathode 306-3 without an intervening encapsulation layer 308.

[0062] The light source 410 may be controlled by a computer-controlled positioner 404. The computer-controlled positioner 404 may move the light source 410 to ablate the cathode 306-3 in a desired area.

[0063] As previously combined Figure 7 As shown, portions of the polyimide layer 302 and substrate 300 may also be removed from the display in the pixel removal areas in order to increase transmittance. Figure 12 A cross-sectional side view of a display illustrating an exemplary method in which the cathode, polyimide layer, and substrate are ablated by a single laser.

[0064] like Figure 12 As shown, the cathode, polyimide layer, and substrate can optionally be removed before all overlying layers cover the cathode. In one example, portions of the cathode, polyimide layer, and substrate can be laser ablated immediately after cathode deposition. For another example, Figure 12 As shown, encapsulation 308 may be formed over cathode 306-3, and then portions of the cathode, polyimide layer, and substrate may be removed using laser ablation.

[0065] A light source 418 (e.g., a laser) can be controlled by a computer-controlled positioner 404. The computer-controlled positioner 404 can move the laser 418 to ablate the cathode 306-3, polyimide layer 302, and substrate 300 in desired areas. The laser 418 can emit one or more beams 420 for ablation (etching) of the cathode, polyimide layer, and substrate. The laser 418 can remove portions of 306-3, polyimide layer 302, and / or substrate 300 simultaneously or sequentially. The laser 418 can have multiple focal points so that multiple layers are etched simultaneously. The laser 418 can also have an adjustable focus so that the target layer can be dynamically changed based on the focus. Ultimately, the laser 418 can be used to form an opening 326 in the cathode 306-3, an opening 328 in the polyimide layer 302, and an opening 330 in the substrate 300.

[0066] exist Figure 4 , an example is shown in which display 14 has a pixel region 322 and a pixel removed region 324 in which pixels are removed from positions they would occupy if following the pattern from pixel region 322 . Figure 13 This is a top view of this type of display. Figure 13 As shown, the display 14 has a pixel region 322 having a plurality of pixels 22 arranged in a desired pattern. In a pixel removal region 324, pixels that would otherwise be present in the pattern of region 322 are removed, and no pixels are present. The cathode 306-3 may be patterned to cover the pixel region 322 but not the pixel removal region 324. The pixel removal region 324 may be surrounded on either side by an active area of ​​the display (e.g., active display pixels 22).

[0067] Figure 13The example of having pixel removed areas 322 not covered by cathode 306-3 is merely illustrative. Figure 14 In another possible arrangement shown, display 14 includes increased transmission regions 424 interposed between pixels 22 of the display. In this case, pixels are not completely removed from the pattern to increase transmittance through the display. However, portions of the OLED stack, such as cathode 306-3, may be removed in the areas between non-emitting pixels to increase transmittance.

[0068] exist Figure 14 In the embodiment of the present invention, the increased transmission areas 424 (sometimes referred to as cathode removal areas 424, pixel-free areas 424, etc.) are formed as islands. In other words, each cathode removal area 424 is surrounded on the sides by portions of cathode 306-3. The cathode 306-3 thus still forms a continuous grid across the pixel array. This example is merely illustrative.

[0069] Figure 15 FIG. 3 is a top view of another possible arrangement of cathode 306-3. Figure 15 As shown, cathode removed areas 424 are formed in a grid between pixels 22 in the display. In this arrangement, each portion of cathode 306-3 is an island surrounded on the sides by cathode removed areas 424. Each portion of cathode 306-3 may overlap a corresponding pixel 22 in the display. Figure 15 In arrangements of the type shown, it may be desirable for cathode portion 306-3 to be electrically connected (e.g., so that voltage can be applied to the cathode globally rather than on a per-pixel basis). Thus, a transparent conductive material (e.g., indium tin oxide) may be used to electrically connect the island portions of cathode 306-3.

[0070] exist Figures 13 to 15 In the embodiment of the present invention, the cathode can be removed in the non-pixel areas (such as areas 324 and 424). Additional layers can be removed in these areas to further improve transmission (for example, as shown in FIG. Figure 6 Remove the polyimide layer as in Figure 7 Remove the substrate as in Figure 8 bleaching the polarizer as in, etc.). The cathode in regions 324 and 424 can be removed by laser ablation at various stages in the manufacture of the display (e.g., as in conjunction with Figures 10 to 12 discussed).

[0071] Figure 16 is a cross-sectional side view of a display illustrating exemplary processing steps that may be used to remove the cathode layer 306-3 in the non-pixel areas 324 or 424. Figure 16As shown, at step 602, a display may include a thin film transistor circuit 304 on a substrate 302. Anodes 306-1 of two different pixels are formed on the thin film transistor circuit 304. A pixel defining layer 504 is formed over a portion of the anode 306-1 to define a light emitting region of the anode 306-1. An emissive layer 306-2 is formed over the anode 306-1 and over the region between the anodes 306-1 (e.g., the pixel removal region 324). A cathode layer 306-3 is formed over the emissive layer 306-2. Thus, at step 602, the cathode layer 306-3 is formed over the anode 306-1 and between adjacent anodes 306-1 (e.g., in the pixel removal region).

[0072] A plurality of encapsulation layers 308 (sometimes referred to as planarization layers 308) may be formed over the OLED layer 306. Figure 16 As shown, the first encapsulation layer 308-1 can be formed over both the pixel area and the non-pixel area (e.g., the pixel removal area 324 between pixels). The second encapsulation layer 308-2 can be formed over the encapsulation layer 308-1. The encapsulation layer 308-2 can be formed only in the pixel area of ​​the display (thus, in the pixel area). Figure 16 308-2 is not present between anode 306-1 and anode 306-1 in the embodiment of the present invention. Encapsulation layer 308-3 may be formed over encapsulation layers 306-1 and 306-1. Encapsulation layer 308-3 may be formed over both pixel regions and non-pixel regions (e.g., pixel removal regions 324 between pixels). In one example, encapsulation layers 308-1 and 308-3 may be inorganic encapsulation layers, while encapsulation layer 308-2 may be an organic encapsulation layer.

[0073] At step 602, a mask layer 502 may also be formed over the pixel region of the display. Mask layer 502 may be a sacrificial mask layer designed to prevent the cathode from being etched in the pixel region of the display, while allowing the cathode to be etched in the pixel-removed region of the display. Thus, mask layer 502 may have an opening over the pixel-removed region of the display.

[0074] At step 604, etching may be performed to remove one or more layers in the pixel removal area of ​​the display. Figure 16 As shown, the etching process can remove the emissive layer 306-2, the cathode layer 306-3, and the planarization layers 308-1 and 308-3. In this way, the cathode is removed in the desired area (e.g., the pixel removal area 324). Any desired etching process (e.g., laser etching or plasma etching) can be used. The etching process can involve removing the sacrificial mask layer 502. In one example, the etching process can remove the mask layer 502 while removing the desired layer between the pixels. In another example, the mask layer can be removed in a separate step after the desired layer between the pixels has been etched.

[0075] At step 606, an additional encapsulation layer 308-4 may be deposited over the display. Encapsulation layer 308-4 may be an inorganic passivation layer used to reseal emissive layer 306-2 (which was exposed after etching in step 604). Inorganic passivation layers 308-1, 308-3, and 308-4 may be formed of the same material or different materials.

[0076] Figure 17 is a cross-sectional side view of the display illustrating exemplary processing steps that may be used to remove cathode layer 306-3 in region 324 or 424. Figure 17 As shown, at step 702, a display may include a thin film transistor circuit 304 on a substrate 302. Anodes 306-1 of two different pixels are formed on the thin film transistor circuit 304. A pixel defining layer 504 is formed over a portion of the anode 306-1 to define a light emitting region of the anode 306-1. An emissive layer 306-2 is formed over the anode 306-1 and over the region between the anodes 306-1 (e.g., the pixel removal region 324). A cathode layer 306-3 is formed over the emissive layer 306-2. Thus, at step 702, the cathode layer 306-3 is formed over the anode 306-1 and between adjacent anodes 306-1 (e.g., in the pixel removal region).

[0077] A plurality of encapsulation layers 308 (sometimes referred to as planarization layers 308) may be formed over the OLED layer 306. Figure 17 As shown, the first encapsulation layer 308-1 can be formed over both the pixel area and the non-pixel area (e.g., the pixel removal area 324 between pixels). The second encapsulation layer 308-2 can be formed over the encapsulation layer 308-1. The encapsulation layer 308-2 can be formed only in the pixel area of ​​the display (thus, in the pixel area). Figure 17 In one example, encapsulation layer 308-1 may be an inorganic encapsulation layer, and encapsulation layer 308-2 may be an organic encapsulation layer.

[0078] exist Figure 17 In the embodiment, the organic encapsulation layer 308-2 is used as a mask layer for the etching step. In other words, the organic material formed in step 702 acts as a barrier to protect the pixel area from etching. At step 704, etching may be performed to remove one or more layers in the pixel removal area of ​​the display. Figure 17As shown, the etching process can remove the emissive layer 306-2, the cathode layer 306-3, and the planarization layer 308-1. In this way, the cathode is removed in the desired area (e.g., the pixel removal area 324). Any desired etching process (e.g., laser etching or plasma etching) can be used. The etching process may involve removing some material in the encapsulation layer 308-2. However, at least some of the layer 308-2 remains and serves as an encapsulation layer in the final stacked structure of the display.

[0079] At step 706, an additional encapsulation layer 308-3 may be deposited over the display. Encapsulation layer 308-3 may be an inorganic passivation layer used to reseal emissive layer 306-2 (which was exposed after etching in step 704). Inorganic passivation layers 308-1 and 308-3 may be formed of the same material or different materials.

[0080] Figure 16 and Figure 17 The exemplary method of can be used to remove the cathode in the pixel removal area 324 in the display. To remove the cathode in the cathode removal area 424 (e.g., Figure 14 and Figure 15 As shown), you can use Figure 18 and Figure 19 Methods of the type shown.

[0081] Figure 18 It is shown that it can be used to remove no-pixel areas such as Figure 14 and Figure 15 A cross-sectional side view of a display showing exemplary processing steps for cathode layer 306-3 in a non-pixel region 424 in FIG. Figure 18 As shown, at step 802, a display may include thin film transistor circuitry 304 on substrate 302. Anodes 306-1 of two different pixels are formed on thin film transistor circuitry 304. Pixel defining layers 504 are formed in regions between pixels and define the light emitting region of each pixel. Emissive layer 306-2 is formed above anodes 306-1 and in regions between anodes 306-1 (e.g., cathode removal regions 424). Cathode layer 306-3 is formed above emissive layer 306-2. Thus, at step 802, cathode layer 306-3 is formed above anodes 306-1 and between adjacent anodes 306-1 (e.g., in cathode removal regions).

[0082] A plurality of encapsulation layers 308 (sometimes referred to as planarization layers 308) may be formed over the OLED layer 306. Figure 18 As shown, first encapsulation layer 308-1, second encapsulation layer 308-2, and third encapsulation layer 308-3 may be formed over cathode 306-3. In one example, encapsulation layers 308-1 and 308-3 may be inorganic encapsulation layers, while encapsulation layer 308-2 may be an organic encapsulation layer.

[0083] At step 802, a mask layer 502 may also be formed over the pixels of the display. The mask layer 502 may be a sacrificial mask layer designed to prevent the cathode from being etched in the pixel area of ​​the display while allowing the cathode to be etched in the cathode removal area of ​​the display (e.g., Figure 14 or Figure 15 Thus, the mask layer 502 may have an opening above the cathode removal area of ​​the display.

[0084] At step 804, etching may be performed to remove one or more layers in the cathode removal area of ​​the display. Figure 18 As shown, the etching process can remove the emitter layer 306-2, the cathode layer 306-3, and the planarization layers 308-1, 308-2, and 308-3. In this way, the cathode is removed in the desired area (e.g., cathode removal area 424). Any desired etching process (e.g., laser etching or plasma etching) can be used. The etching process can involve removing the sacrificial mask layer 502. In one example, the etching process can remove the mask layer 502 while removing the desired layer between the pixels. In another example, the mask layer can be removed in a separate step after the desired layer between the pixels has been etched.

[0085] At step 806, an additional conductive layer 506 may optionally be deposited in the cathode removal area to electrically connect the remaining portion of cathode 306-3. Figure 15 This may be useful in situations where an otherwise electrically isolated portion of the cathode is to remain after etching. In situations where the cathode remains electrically connected across the display, such as in Figure 14 , the additional conductive layer 506 may be omitted. The additional conductive layer 506 may be a transparent conductive layer such as indium tin oxide (ITO) or any other desired material. In the case where the auxiliary conductive layer 506 is included, the cathode may include both the original portion 306-3 and the auxiliary portion 506. In one possible arrangement, these different portions may be formed of different materials. For example, the material of the auxiliary conductive layer 506 may have a higher transmittance than the material of the original cathode portion 306-3.

[0086] An additional encapsulation layer 308-4 may also be deposited over the display. Encapsulation layer 308-4 may be an inorganic passivation layer used to reseal emissive layer 306-2 (which is exposed after etching in step 804). Inorganic passivation layers 308-1, 308-3, and 308-4 may be formed of the same material or different materials.

[0087] Figure 19 4 is a cross-sectional side view of a display illustrating exemplary processing steps that may be used to remove cathode layer 306-3 in non-pixel areas such as area 424. Figure 19 As shown, at step 902, a display may include thin film transistor circuitry 304 on substrate 302. Anodes 306-1 for two different pixels are formed on thin film transistor circuitry 304. Pixel defining layers 504 are formed in regions between pixels and define the light emitting region of each pixel. Emissive layer 306-2 is formed above anodes 306-1 and in regions between anodes 306-1 (e.g., cathode removal regions 424). Cathode layer 306-3 is formed above emissive layer 306-2. Thus, at step 902, cathode layer 306-3 is formed above anodes 306-1 and between adjacent anodes 306-1 (e.g., in cathode removal regions).

[0088] One or more encapsulation layers 308 (sometimes referred to as planarization layers 308) may be formed over the OLED layer 306. Figure 19 As shown, a first encapsulation layer 308-1 can be formed over cathode 306-3. In one example, encapsulation layer 308-1 can be an inorganic encapsulation layer.

[0089] At step 902, a mask layer 502 may also be formed over the pixels of the display. The mask layer 502 may be a sacrificial mask layer designed to prevent the cathode from being etched in the pixel area of ​​the display while allowing the cathode to be etched in the cathode removal area of ​​the display (e.g., Figure 14 or Figure 15 Thus, the mask layer 502 may have an opening above the cathode removal area of ​​the display.

[0090] At step 904, etching may be performed to remove one or more layers in the cathode removal area of ​​the display. Figure 19 As shown, the etching process can remove the emitter layer 306-2, the cathode layer 306-3, and the planarization layer 308-1. In this way, the cathode is removed in the desired area (e.g., cathode removal area 424). Any desired etching process (e.g., laser etching or plasma etching) can be used. The etching process can involve removing the sacrificial mask layer 502. In one example, the etching process can remove the mask layer 502 while removing the desired layer between the pixels. In another example, the mask layer can be removed in a separate step after the desired layer between the pixels has been etched.

[0091] At step 906, an additional encapsulation layer 308-4 may also be deposited over the pixel. Encapsulation layer 308-4 may be an inorganic passivation layer used to reseal emissive layer 306-2 (which was exposed after etching in step 904). A blanket organic passivation layer 308-2 may then be formed over the display, followed by inorganic passivation layer 308-3. Inorganic passivation layers 308-1, 308-3, and 308-4 may be formed of the same material or different materials.

[0092] Figures 16 to 19 The method can be used to remove the cathode from the display in the pixel-free area 324 (eg, pixel removal area) and / or the pixel-free area 424 (areas between pixels in the pixel array). Figures 16 to 19 In a display formed in any of the embodiments, additional layers besides the cathode may be removed to further improve transmission (e.g., as may be seen in FIG. Figure 6 Remove the polyimide layer as shown, Figure 7 Remove the substrate as shown, Figure 8 bleached polarizers, etc.).

[0093] As described above, one aspect of the present technology is to collect and use information, such as information from input-output devices. The present disclosure contemplates that, in some cases, data including personal information that uniquely identifies or can be used to contact or locate a specific person may be collected. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, Twitter IDs, home addresses, data or records related to a user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, username, password, biometric information, or any other identifying or personal information.

[0094] This disclosure recognizes that the use of such personal information within the disclosed technology can be used to benefit users. For example, this personal information data can be used to deliver targeted content that is of particular interest to the user. Thus, the use of such personal information data enables users to exercise planned control over the content delivered. Furthermore, this disclosure contemplates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into a user's overall health or serve as positive feedback for individuals using technology to pursue health goals.

[0095] This disclosure contemplates that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information will adhere to established privacy policies and / or practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information. Such policies should be easily accessible to users and updated as the collection and / or use of data changes. Personal information collected from users should be used for the entity's legitimate and reasonable purposes and not shared or sold beyond those legitimate uses. Furthermore, such collection / sharing should be conducted with the user's informed consent. Furthermore, such entities should consider taking any necessary steps to safeguard and secure access to such personal information and ensure that others with access to the personal information adhere to their privacy policies and procedures. Furthermore, such entities may subject themselves to third-party assessments to demonstrate compliance with widely accepted privacy policies and practices. Furthermore, policies and practices should be tailored to the specific type of personal information collected and / or accessed and to applicable laws and standards, including jurisdictional considerations. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained for different types of personal data in each country.

[0096] Regardless of the foregoing, the present disclosure also contemplates implementation schemes in which users selectively block the use or access of personal information data. That is, the present disclosure contemplates providing hardware elements and / or software elements to prevent or block access to such personal information data. For example, the present technology may be configured to allow users to "opt in" or "opt out" of participating in the collection of personal information data at any time during or after registration for a service. As another example, a user may choose not to provide specific types of user data. As another example, a user may choose to limit the length of time that user-specific data is retained. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be informed that their personal information data will be accessed when downloading an application ("app"), and then be reminded again just before the personal information data is accessed by the app.

[0097] Furthermore, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risk can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. Where appropriate, de-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or characteristics of stored data (e.g., collecting location data at a city level rather than an address level), controlling how data is stored (e.g., aggregating data across users), and / or other methods.

[0098] Thus, while this disclosure broadly covers the use of information, which may include personal information data, to implement one or more of the various disclosed embodiments, this disclosure also contemplates that various embodiments may be implemented without access to personal information data. That is, various embodiments of the present technology will not be unable to function properly due to the lack of all or a portion of such personal information data.

[0099] According to one embodiment, an electronic device is provided, comprising a display and a sensor below the display, wherein the display comprises a plurality of pixels, at least one substrate and a thin film transistor layer, the thin film transistor layer being formed above the at least one substrate and configured to control the plurality of pixels, the display comprising a pixel-free area at least partially overlapping with the sensor, and the at least one substrate having an opening in the pixel-free area, the opening increasing the transmittance of light passing through the display to the sensor.

[0100] According to another embodiment, the at least one substrate comprises at least one polyimide layer formed over an additional substrate.

[0101] According to another embodiment, the opening is formed in the at least one polyimide layer in the non-pixel area.

[0102] According to another embodiment, the opening is formed in the additional substrate in the pixel-free area.

[0103] According to another embodiment, the additional substrate comprises a material selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate.

[0104] According to another embodiment, the opening is a first opening formed in the at least one polyimide layer in the non-pixel area, and the display includes a second opening formed in the additional substrate in the non-pixel area.

[0105] According to another embodiment, the display includes a polarizer layer formed over the plurality of pixels, the polarizer layer having a bleached portion in the non-pixel area and an unbleached portion formed over the plurality of pixels.

[0106] According to another embodiment, the polarizer has a first transmittance in the bleached portion, a second transmittance in the unbleached portion, and at least one intermediate transmittance greater than the second transmittance and less than the first transmittance at a position between the bleached portion and the unbleached portion.

[0107] According to another embodiment, the plurality of pixels includes a plurality of anode, emissive and cathode layers, and the display includes a third opening formed in the cathode layer in the non-pixel area.

[0108] According to one embodiment, an electronic device is provided, comprising a sensor, a display overlapping the sensor, the sensor being configured to sense light passing through the display, and the display comprising a plurality of light-emitting diodes formed by a plurality of anodes, an emitting material overlapping the plurality of anodes, and a cathode layer overlapping the emitting material, a first packaging layer formed above the cathode layer having a first opening overlapping at least a portion of the sensor, the cathode layer having a second opening overlapping the first opening, and a second packaging layer formed above the first packaging layer overlapping the first opening and the second opening.

[0109] According to another embodiment, the first encapsulation layer is a first inorganic encapsulation layer and the second encapsulation layer is a second inorganic encapsulation layer.

[0110] According to another embodiment, the display includes an organic encapsulating layer interposed between the first inorganic encapsulating layer and the second inorganic encapsulating layer.

[0111] According to another embodiment, the display includes a third inorganic encapsulating layer having a third opening overlapping the first opening and the second opening, the third inorganic encapsulating layer being interposed between the organic encapsulating layer and the second inorganic encapsulating layer.

[0112] According to another embodiment, the organic encapsulating layer is in direct contact with the first and second inorganic encapsulating layers.

[0113] According to another embodiment, the display includes a third inorganic encapsulating layer having respective portions that each overlap with respective portions of the first inorganic encapsulating layer, respective portions of the cathode layer, respective portions of the emissive layer, and respective anodes.

[0114] According to another embodiment, the display includes a pixel-defining layer interposed between the plurality of anodes, and the organic encapsulation layer overlaps the third inorganic encapsulation layer and the pixel-defining layer.

[0115] According to another embodiment, the organic encapsulation layer has opposite first and second sides, the first side of the organic encapsulation layer is in direct contact with the third inorganic encapsulation layer and the pixel defining layer, and the second side of the organic encapsulation layer is in direct contact with the second inorganic encapsulation layer.

[0116] According to another embodiment, the display includes a thin film transistor layer, the plurality of light emitting diodes are formed on the thin film transistor layer, and the second opening overlaps a pixel removal area in which the thin film transistor layer does not contain a thin film transistor.

[0117] According to another embodiment, the second opening is one of a plurality of cathode openings, each cathode opening being interposed between adjacent ones of the plurality of light emitting diodes, and each cathode opening being laterally surrounded by the cathode layer.

[0118] According to another embodiment, the second opening is part of a grid of openings in the cathode layer, the grid of openings defining a respective cathode island above each of the plurality of light emitting diodes.

[0119] According to another embodiment, the display comprises an auxiliary conductive layer electrically connecting the respective cathode islands of the cathode layer.

[0120] According to one embodiment, a method of forming a display is provided, the display including a thin film transistor layer and a plurality of light-emitting diodes formed by a plurality of anodes, an emitting material overlapping the plurality of anodes, and a cathode layer overlapping the emitting material, the method comprising: forming a first encapsulation layer above the cathode layer, the first encapsulation layer being a blanket layer; patterning a mask layer above the first encapsulation layer, the mask layer having at least one opening; and etching the cathode layer in a region overlapping the at least one opening, at least a portion of the mask layer being retained after etching the cathode layer and serving as a second encapsulation layer of the display.

[0121] The foregoing is intended to be illustrative only, and various modifications may be made by those skilled in the art without departing from the scope and spirit of the embodiments described. The foregoing embodiments may be implemented independently or in any combination.

Claims

1. An electronic device comprising: a display comprising a plurality of pixels, at least one substrate, and a thin film transistor layer formed over the at least one substrate and configured to control the plurality of pixels, wherein a plurality of light emitting diodes are formed on the thin film transistor layer; as well as A sensor beneath the display, wherein the display includes a non-pixel region that at least partially overlaps the sensor, and wherein the at least one substrate has an opening in the non-pixel region that increases transmittance of light passing through the display to the sensor, wherein the thin-film transistor layer covers the opening. 2 . The electronic device of claim 1 , wherein the at least one substrate comprises at least one polyimide layer formed over an additional substrate. 3 . The electronic device according to claim 2 , wherein the opening is formed in the at least one polyimide layer in the non-pixel area. 4 . The electronic device according to claim 2 , wherein the opening is formed in the additional substrate in the non-pixel area. 5 . The electronic device of claim 4 , wherein the additional substrate comprises a material selected from the group consisting of: polyethylene terephthalate and polyethylene naphthalate.

6. The electronic device of claim 2, wherein the opening is a first opening formed in the at least one polyimide layer in the non-pixel area, and wherein the display includes a second opening formed in the additional substrate in the non-pixel area.

7. The electronic device according to claim 6, wherein the display further comprises: A polarizer layer is formed over the plurality of pixels, wherein the polarizer layer has a bleached portion in the non-pixel area and an unbleached portion formed over the plurality of pixels.

8. An electronic device according to claim 7, wherein the polarizer has a first transmittance in the bleached portion, a second transmittance in the unbleached portion, and at least one intermediate transmittance at a position between the bleached portion and the unbleached portion, wherein the intermediate transmittance is greater than the second transmittance and less than the first transmittance, wherein the plurality of pixels include a plurality of anodes, emission layers, and cathode layers, and wherein the display further includes a third opening formed in the cathode layer in the pixel-free area.

9. An electronic device comprising: sensor; a display that overlaps the sensor, wherein the sensor is configured to sense light passing through the display, and wherein the display comprises: a plurality of light emitting diodes formed from a plurality of anodes, an emissive material overlapping the plurality of anodes, and a cathode layer overlapping the emissive material; forming a first encapsulation layer over the cathode layer, the first encapsulation layer having a first opening overlapping at least a portion of the sensor, wherein the cathode layer has a second opening overlapping the first opening; and a second encapsulation layer formed above the first encapsulation layer and overlapping the first opening and the second opening; The display further comprises a thin film transistor layer, wherein the plurality of light emitting diodes are formed on the thin film transistor layer, and the thin film transistor layer covers the opening. 10 . The electronic device according to claim 9 , wherein the first encapsulation layer is a first inorganic encapsulation layer, and the second encapsulation layer is a second inorganic encapsulation layer.

11. The electronic device according to claim 10, wherein the display further comprises: An organic encapsulating layer is interposed between the first inorganic encapsulating layer and the second inorganic encapsulating layer.

12. The electronic device according to claim 11, wherein the display further comprises: a third inorganic encapsulating layer having a third opening overlapping the first opening and the second opening, wherein the third inorganic encapsulating layer is interposed between the organic encapsulating layer and the second inorganic encapsulating layer. 13 . The electronic device according to claim 11 , wherein the organic encapsulating layer is in direct contact with the first and second inorganic encapsulating layers.

14. The electronic device according to claim 11, wherein the display further comprises: A third inorganic encapsulating layer has respective portions that each overlap with a respective portion of the first inorganic encapsulating layer, a respective portion of the cathode layer, a respective portion of the emissive material, and a respective anode.

15. The electronic device according to claim 14, wherein the display further comprises: a pixel defining layer interposed between the plurality of anodes, wherein the organic encapsulation layer overlaps the third inorganic encapsulation layer and the pixel defining layer, wherein the organic encapsulation layer has opposing first and second sides, wherein the first side of the organic encapsulation layer is in direct contact with the third inorganic encapsulation layer and the pixel defining layer, and wherein the second side of the organic encapsulation layer is in direct contact with the second inorganic encapsulation layer. 16 . The electronic device according to claim 9 , wherein the second opening overlaps a pixel-removed region, in which the thin film transistor layer does not contain a thin film transistor.

17. The electronic device of claim 9, wherein the second opening is one of a plurality of cathode openings, wherein each cathode opening is interposed between adjacent ones of the plurality of light emitting diodes, and wherein each cathode opening is laterally surrounded by the cathode layer.

18. The electronic device defined in claim 9 wherein the second opening is part of a grid of openings in the cathode layer, the grid of openings defining a respective cathode island above each of the plurality of light emitting diodes.

19. The electronic device according to claim 18, wherein the display further comprises: An auxiliary conductive layer electrically connects the corresponding cathode islands of the cathode layer.

20. A method of forming a display comprising a thin film transistor layer and a plurality of light emitting diodes formed from a plurality of anodes, an emissive material overlapping the plurality of anodes, and a cathode layer overlapping the emissive material, wherein the plurality of light emitting diodes are formed on the thin film transistor layer, the method comprising: forming a first encapsulation layer over the cathode layer, wherein the first encapsulation layer is a blanket layer; patterning a mask layer over the first encapsulation layer, wherein the mask layer has at least one opening; as well as etching the cathode layer in a region overlapping the at least one opening, wherein at least a portion of the mask layer remains after etching the cathode layer and serves as a second encapsulation layer for the display, The thin film transistor layer covers the opening.

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