Wafer correction system and semiconductor process equipment

By using the center and notch correction mechanisms of the wafer correction system, accurate positioning of the wafer center and edge notches is achieved, solving the damage and breakage problems caused by inaccurate wafer positioning in existing technologies, and improving the gripping accuracy and the accuracy of process analysis.

CN114664720BActive Publication Date: 2026-07-24BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202210264112.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-03-17
Publication Date
2026-07-24
Estimated Expiration
2042-03-17

AI Technical Summary

Technical Problem

Existing wafer storage devices can only adjust the level of the wafer and cannot correct other positions, which leads to inaccurate positioning of the robotic arm when grasping the wafer, easily causing wafer damage or breakage.

Method used

A wafer alignment system is adopted, including a center alignment mechanism and a notch alignment mechanism. Through the cooperation of a position detection device and a controller, the position of the wafer center and edge notch is accurately positioned. The power support component and a rotary motor drive the load-bearing structure to move and rotate, thereby achieving precise wafer alignment.

Benefits of technology

This improved the robotic arm's precision in grasping wafers, reduced the breakage rate, and ensured the accuracy and efficiency of process defect analysis.

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Abstract

The application provides a wafer correction system and a semiconductor process equipment, wherein the wafer correction system comprises: a wafer correction device, which comprises a bearing structure and a center correction mechanism, wherein the bearing structure is used for bearing a wafer, and the center correction mechanism is matched with the bearing structure to drive the bearing structure to move in a horizontal plane; a position detection device, which is used for detecting a first current position of the center of the wafer; and a controller, which is in communication connection with the position detection device and the center correction mechanism, has a first preset target position in the horizontal plane, and is used for controlling the center correction mechanism to act according to the first current position and the first preset target position, so as to drive the bearing structure to move to the center of the wafer coinciding with the first preset target position. The wafer correction system can at least correct the center position of the wafer, and can ensure that the center position of the wafer is uniquely determined after correction, so as to facilitate the positioning and grabbing of a subsequent mechanical hand and be beneficial to reducing the broken piece rate.
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