Cooling subassembly

By adopting a stacked structure of vapor chambers and cooling units on the digital micromirror device (DMD), combined with Peltier elements and cold plates, the problems of complexity and condensation water accumulation in existing cooling systems are solved, achieving efficient, compact and reliable cooling effects, and improving the performance and eco-friendliness of the projector.

CN115039521BActive Publication Date: 2025-09-19BARCO NV
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Patent Information

Application Number
CN202080095328.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-01-30
Publication Date
2025-09-19
Estimated Expiration
2040-01-30

AI Technical Summary

Technical Problem

Existing technologies for cooling digital micromirror devices (DMDs) have problems such as system complexity, bulkiness, high cost, prone to condensation accumulation, and the need for external equipment maintenance, making it difficult to achieve an efficient and compact cooling solution.

Method used

A stacked structure of vapor chambers and cooling units is adopted, with the vapor chambers facing the feet of the DMD and the cooling units facing the back surface of the DMD. Peltier elements and cold plates are used for efficient cooling and are integrated into the projector, avoiding external freezers and air dryers.

Benefits of technology

A cheaper, simpler, more reliable, compact, lightweight, and faster-starting cooling solution is achieved, which reduces maintenance requirements, improves the ecological performance of the projector, avoids condensation dripping, and reduces the impact on the environment.

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Abstract

A cooling subassembly for cooling an electronic device that dissipates heat. The subassembly includes a vapor chamber (7), a Peltier element (9), and a cold plate (10), which are placed on top of each other to form a stack, so that the Peltier element is sandwiched between the vapor chamber (7) and the cold plate (10). The vapor chamber (7) has a head (7a) facing the Peltier element, a foot (7b) for facing the electronic device (7a) that dissipates heat, and a wall (7c) extending between the foot (7b) and the head (7a). The area of ​​the head (7a) is larger than the area of ​​the foot (7b).
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