disc device
By setting protrusions on the flexible part of the disk assembly and using conductive adhesive to bond the electrodes of the piezoelectric element to the pads, the problem of bonding diffusion is solved, and the stability and reliability of the electrical connection are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KK TOSHIBA
- Filing Date
- 2022-05-26
- Publication Date
- 2026-06-23
AI Technical Summary
In disc devices, the joint may be flattened between the piezoelectric element and the flexible element and spread in an undesirable direction, leading to instability of the joint and potential electrical connection problems.
By providing protrusions on the flexible component, located locally between the first and second joints, and using a conductive adhesive to bond the electrodes of the piezoelectric element to the pads of the flexible component, the diffusion of the joints is restricted, ensuring the stability of the electrical connection.
It effectively suppresses the diffusion of the joint in the desired direction, improves the reliability and stability of the electrical connection, and reduces the risk of instability of the joint.
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Figure CN116798455B_ABST
Abstract
Citation Information
Patent Citations
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