Detection device and detection method

Abstract

The application provides a detection device applied to the detection field, for example, the spectrum detection field. The detection device comprises a light coupler, a scattering assembly, a detector and a processor. The light coupler is used for receiving a to-be-detected light beam and coupling the to-be-detected light beam to the scattering assembly. The scattering assembly is used for scattering the to-be-detected light beam and outputting a plurality of scattered to-be-detected light beams to the detector in a time-division manner at different angles. The plurality of scattered to-be-detected light beams and the plurality of angles correspond to each other. The detector is used for detecting different regions in the plurality of scattered to-be-detected light beams and obtaining a plurality of electric signals. The detector is also used for transmitting the plurality of electric signals to the processor. The processor is used for calculating the plurality of electric signals and obtaining related information of the to-be-detected light beam. In the technical scheme provided in the application, the output direction of the to-be-detected light beam is adjusted, the related information of the to-be-detected light beam can be acquired by the detector in a time-division manner, and therefore the cost of the detection device is reduced.

Description

Technical Field

[0001] This application relates to the field of testing, and in particular to testing equipment and testing methods. Background Technology

[0002] A spectrometer is used to acquire the spectral information of a light beam under test. A spectrometer consists of a scattering medium and a multiplexer. The scattering medium scatters the light beam, generating a characteristic scattering distribution pattern. The scattering medium is made by pressing particles with a small average particle size, resulting in low manufacturing costs. The small average particle size ensures that light of different wavelengths travels through different optical paths when passing through the scattering medium, thus producing speckle patterns with different distributions. The multiplexer acquires multiple electrical signals corresponding to different regions in the speckle pattern. By calculating these multiple electrical signals, the spectral information of the light beam under test can be obtained. However, the high cost of the detectors leads to a higher cost for the spectrometer as a whole. Summary of the Invention

[0003] This application provides a detection device and a detection method. By adjusting the output direction of the beam to be detected, the relevant information of the beam to be detected can be obtained by the detector in a time-division manner, thereby reducing the cost of the detection device.

[0004] This application provides a detection device. The detection device includes an optical coupler, a scattering component, a detector, and a processor. The optical coupler receives a beam of light to be detected and couples it to the scattering component. The scattering component scatters the beam of light to be detected, outputting multiple scattered beams of light to the detector at different angles. Each of the multiple scattered beams of light corresponds to a specific angle. For example, at a first moment, the scattering component outputs a first scattered beam of light to the detector at a first angle; at a second moment, the scattering component outputs a second scattered beam of light to the detector at a second angle. The detector detects multiple different regions within the multiple scattered beams of light to obtain multiple electrical signals. Each region corresponds to a specific electrical signal. The detector also transmits the multiple electrical signals to the processor. The processor calculates the multiple electrical signals to obtain relevant information about the beam of light to be detected.

[0005] In one alternative embodiment of the first aspect, the scattering component includes a scattering medium and an optical modulator. The scattering medium receives the beam to be detected from the optical coupler, scatters the beam, and directs the scattered beam to the optical modulator. The optical modulator outputs multiple scattered beams to the detector at different angles. Each of the multiple scattered beams corresponds one-to-one with a specific angle. In this application, the relative state between the beam to be detected and the scattering medium remains constant, resulting in higher system stability.

[0006] In one alternative embodiment of the first aspect, the scattering component includes an optical modulator and a scattering medium. The optical modulator receives a beam of light to be detected from an optical coupler and outputs multiple beams of light to be detected to the scattering medium at different angles. Each beam of light to be detected corresponds to one of the multiple angles. The scattering medium scatters the multiple beams of light to be detected, resulting in multiple scattered beams of light to be detected. Each beam of light to be detected corresponds to one of the multiple scattered beams of light to be detected. The scattering medium also directs the multiple scattered beams of light to be detected onto a detector. In this application, the positions of the scattering medium and the detector are relatively fixed. Therefore, multiple regions correspond to the same scattering region of the scattering medium. Therefore, this application can reduce the area of ​​the scattering medium, thereby reducing the hardware cost of the detection device. In another alternative embodiment of the first aspect, the detector is a linear array detector. The optical modulator is a one-dimensional optical modulator. The photosensitive surface of the detector is located on a first plane. The optical modulator changes the output direction of the scattered beams of light to be detected, causing the spot of light illuminating the first plane to move along a first direction. For example, at a first moment, the first spot of light illuminating the first plane from the first scattered beam of light to be detected is located at a first position. By changing the output direction of the scattered light beam to be detected, at a second moment, the second light spot on the first plane, illuminated by the second scattered light beam to be detected, is located at a second position. In this application, by using a one-dimensional optical modulator, the hardware cost of the detection equipment can be reduced.

[0007] In one alternative embodiment of the first aspect, the difference between the first width of the spot of the scattered beam of light illuminating the first plane and the second width of the photosensitive surface of the detector is less than or equal to 50% of the first width. The directions of the first width and the second width are perpendicular to the first direction. When the difference between the first width and the second width is too large, a significant amount of energy of the beam of light is wasted, resulting in low beam energy used to acquire relevant information. The lower the beam energy used to acquire relevant information, the lower the reliability of the relevant information. Therefore, this application can improve the reliability of the acquired relevant information.

[0008] In one alternative embodiment of the first aspect, multiple regions include a first region and a second region, which overlap. When the optical modulator is in a first state, the detector detects the first region of the beam to be detected; when the optical modulator is in a second state, the detector detects the second region of the beam to be detected. When the first and second regions do not overlap, the change between the first and second states is significant. When the first and second regions overlap, the change between the first and second states is small. For example, the optical modulator is a mirror; the first state is a first angle of the mirror, and the second state is a second angle of the mirror. When the first and second regions overlap, the change between the first and second angles is small. The smaller the state change, the lower the hardware cost of the optical modulator. Therefore, this application can reduce the hardware cost of the detection equipment.

[0009] In one alternative embodiment of the first aspect, the area of ​​the overlapping region is less than or equal to 90% of the area of ​​the first region. When the area of ​​the overlapping region is too large, it will affect the reliability of the obtained relevant information. Therefore, this application can improve the reliability of the obtained relevant information.

[0010] In one alternative embodiment of the first aspect, the detection device further includes a focusing device. The focusing device is located on the optical transmission path between the scattering component and the detector. The focusing device is used to change the focal length of the scattered beam to be detected. Assume the multiplexed electrical signals equal h electrical signals. In practical applications, the value of h can be changed according to the required measurement accuracy. Changing the focal length by adjusting the value of h can improve the utilization rate of the beam to be detected, that is, it can increase the proportion of beam energy used to acquire relevant information. The utilization rate of the beam to be detected affects the reliability of the relevant information. Therefore, this application can improve the reliability of the acquired relevant information.

[0011] In one alternative of the first aspect, the focusing range of the focusing device is between 1 mm and 5 mm.

[0012] In one alternative embodiment of the first aspect, the detection device further includes a mask. The mask is located on the light transmission path between the scattering component and the detector. The mask can be used to replace some of the computational functions implemented in software. Therefore, by adding a mask, the efficiency of acquiring relevant information can be improved.

[0013] In one alternative embodiment of the first aspect, the photosensitive surface of the detector is located on a first plane. The ratio of the size of the spot of the light beam to be detected illuminating the first plane to the size of the photosensitive surface is between 1,000 and 1,000,000.

[0014] In one alternative embodiment of the first aspect, the detection device further includes a temperature controller. The temperature controller is used to maintain the temperature of the scattering medium within the target range. The temperature of the scattering medium affects its weight matrix. When temperature changes cause changes in the weight matrix, but the processor obtains relevant information based on the original weight matrix, the reliability of the relevant information is affected. Therefore, by adding a temperature controller, the reliability of the obtained relevant information can be improved.

[0015] In one alternative embodiment of the first aspect, the detection device further includes a first vibration isolator and a second vibration isolator. The first vibration isolator is used to reduce vibrations of the scattering medium. The second vibration isolator is used to reduce vibrations of the optical modulator. Vibrations of both the optical modulator and the scattering medium can affect the reliability of the relevant information. Therefore, by adding vibration isolators, the reliability of the acquired relevant information can be improved.

[0016] In one alternative embodiment of the first aspect, the processor includes a data acquisition unit, a memory, and a controller. The data acquisition unit receives multiple electrical signals from the detector and transmits these signals to the memory. The memory stores the multiple electrical signals. The controller retrieves the multiple electrical signals from the memory, performs calculations on them, and obtains relevant information about the beam to be detected.

[0017] In an alternative embodiment of the first aspect, the processor is further configured to generate a control signal after receiving each of the multiple electrical signals. The optical modulator is configured to adjust the output angle of the scattered beam to be detected according to the control signal.

[0018] In one alternative embodiment of the first aspect, the detection device further includes a light source. The light source is used to illuminate the object to be detected with a target beam. The beam to be detected is either reflected or transmitted light from the target beam.

[0019] A second aspect of this application provides a detection method. The detection method is applied to a detection device. The detection method includes the following steps: the detection device scatters a light beam to be detected, obtaining a scattered light beam; the detection device detects a first region of the scattered light beam to be detected using a detector, obtaining a first electrical signal; the detection device changes the output direction of the scattered light beam to be detected, causing the spot of the scattered light beam to move relative to the photosensitive surface of the detector; the detection device detects a second region of the scattered light beam to be detected using a detector, obtaining a second electrical signal; the detection device obtains relevant information about the light beam to be detected based on the first and second electrical signals.

[0020] In one alternative embodiment of the second aspect, the first region and the second region include an overlapping region. The detection device obtains relevant information about the beam to be detected based on h electrical signals. The h electrical signals include a first electrical signal and a second electrical signal, where h is an integer greater than or equal to 2. The detection method further includes the step of: the detection device adjusting the area size of the overlapping region according to the value of h. In practical applications, the area size of the overlapping region affects the accuracy of the relevant information. In this application, adjusting the area size of the overlapping region can improve the accuracy of the acquired relevant information.

[0021] In one alternative embodiment of the second aspect, the detection device obtains relevant information about the beam to be detected based on h electrical signals. The h electrical signals include a first electrical signal and a second electrical signal, where h is an integer greater than or equal to 2. The detection method further includes the step of adjusting the size of the beam spot according to the value of h. In practical applications, the size of the beam spot affects the utilization rate of the beam to be detected. The utilization rate of the beam to be detected affects the accuracy of the relevant information. In this application, adjusting the size of the beam spot according to the value of h can improve the accuracy of the acquired relevant information.

[0022] It should be understood that the description of the detection method is similar to that of the inspection device described in the first aspect or any of the alternative embodiments of the first aspect. Therefore, the description of the detection method can refer to the inspection device described in the first aspect or any of the alternative embodiments of the first aspect. For example, the scattering component includes a scattering medium and a light modulator. The detection device scatters the light beam to be detected through the scattering medium. The detection device changes the output direction of the scattered light beam to be detected through the light modulator. As another example, the detection device includes a focusing device. The detection device adjusts the focusing device according to the value of h to adjust the size of the spot of the scattered light beam to be detected. Attached Figure Description

[0023] Figure 1 This is a first structural schematic diagram of the detection device provided in the embodiments of this application;

[0024] Figure 2a This is a first structural schematic diagram of the light spot and photosensitive surface provided in an embodiment of this application;

[0025] Figure 2b This is a second structural schematic diagram of the light spot and photosensitive surface provided in an embodiment of this application;

[0026] Figure 3 A third structural schematic diagram of the light spot and photosensitive surface provided in an embodiment of this application;

[0027] Figure 4a This is a second structural schematic diagram of the detection device provided in the embodiments of your application;

[0028] Figure 4bThis is a third structural schematic diagram of the detection device provided in the embodiments of your application;

[0029] Figure 5 This is a fourth structural schematic diagram of the light spot and photosensitive surface provided in an embodiment of this application;

[0030] Figure 6 A fifth structural schematic diagram of the light spot and photosensitive surface provided in an embodiment of this application;

[0031] Figure 7 This is a fourth structural schematic diagram of the detection device provided in the embodiments of this application;

[0032] Figure 8 This is a schematic diagram of the mask structure provided in an embodiment of this application;

[0033] Figure 9 This is a schematic diagram of the working process of the testing equipment provided in the embodiments of this application;

[0034] Figure 10 This is a schematic flowchart of the detection method provided in the embodiments of this application. Detailed Implementation

[0035] This application provides a detection device and a detection method. By adjusting the output direction of the beam to be detected, relevant information of the beam to be detected can be acquired by a detector in a time-division manner, thereby reducing the cost of the detection device. It should be understood that the terms "first," "second," etc., used in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance, nor as indicating or implying order. Furthermore, for the sake of brevity and clarity, reference numerals and / or letters are repeated in several figures of this application. This repetition does not indicate a strict limiting relationship between the various embodiments and / or configurations.

[0036] The detection equipment provided in this application is applied in the field of detection, such as spectroscopic detection. In the field of spectroscopic detection, the spectral information of a beam to be detected can be acquired by a spectrometer. Specifically, the spectrometer includes a scattering medium and multiple detectors. The beam to be detected forms a speckle pattern through the scattering medium. Each detector is used to detect information in different regions of the speckle pattern, obtaining multiple electrical signals. By calculating the multiple electrical signals, the spectral information of the beam to be detected can be obtained. However, the detectors are expensive, which leads to a high cost for the spectrometer.

[0037] Therefore, this application provides a testing device. Figure 1 This is a first structural schematic diagram of the detection device provided in an embodiment of this application. Figure 1 As shown, the detection device 100 includes an optical coupler 101, a scattering component 102, a detector 103, and a processor 104. The various structures in the detection device 100 are described below.

[0038] Optical coupler 101 is also called a coupler or coupling module. Optical coupler 101 includes, but is not limited to, structures such as lens groups, optical fibers and their arrays, and mirror groups. Optical coupler 101 is used to collect the light beam to be detected and guide the collected light beam to the scattering component 102. A stable space or optical fiber path exists between optical coupler 101 and scattering component 102 for transmitting the light beam to be detected. The stable space refers to air, a special gas, or a vacuum.

[0039] The scattering component 102 is used to receive the light beam to be detected from the optical coupler 101, scatter the light beam to be detected, and obtain a scattered light beam to be detected. The scattering component 102 is also used to output multiple scattered light beams to be detected to the detector 103 at different angles. Each of the multiple scattered light beams to be detected corresponds one-to-one with a different angle. For example, in... Figure 1 In the example, at a first moment, the scattering component 102 outputs a first scattered beam of light to be detected to the detector 103 at a first angle; this first scattered beam of light is also referred to as beam 1. At a second moment, the scattering component 102 outputs a second scattered beam of light to be detected to the detector 103 at a second angle; this second scattered beam of light is also referred to as beam 2. The solid lines with arrows in the figure represent beam 1 and beam 2. Beam 1 and beam 2 illuminate the first plane, forming a light spot. The position of the arrow on the solid line represents the center position of the light spot.

[0040] The photosensitive surface of detector 103 is located on a first plane. The area of ​​the scattered light spot of the beam to be detected is larger than the area of ​​the photosensitive surface. Therefore, at different times, detector 103 can detect different regions of the scattered beam to be detected. Detector 103 is also called a photodetector and is used to convert optical signals into electrical signals. In this embodiment, detector 103 is used to detect multiple different regions in multiple scattered beams to be detected in a time-division manner, obtaining multiple electrical signals. Multiple regions and multiple electrical signals correspond one-to-one. Multiple regions and multiple scattered beams to be detected correspond one-to-one. For example, at a first moment, detector 103 is used to detect a first region of beam 1 and obtain a first electrical signal; at a second moment, detector 103 is used to detect a second region of beam 2 and obtain a second electrical signal. In this embodiment, because the scattered beam to be detected is measured in a time-division manner, detector 103 can include fewer pixels, thereby reducing the cost of detector 103. For example, detector 103 is a single-pixel or linear array detector. A single-pixel detector refers to a detector that includes only one pixel. A linear array detector refers to a detector that includes only one column of pixels. The detector 103 is also used to transmit multiple electrical signals to the processor 104.

[0041] Processor 104 can be a central processing unit (CPU), a network processor (NP), or a combination of CPU and NP. Processor 104 may further include hardware chips or other general-purpose processors. The aforementioned hardware chips can be application-specific integrated circuits (ASICs), programmable logic devices (PLDs), or combinations thereof. Processor 104 is used to calculate multiple electrical signals to obtain relevant information about the beam to be detected. Processor 104 can also be used to output a clock signal. Scattering component 102 is used to adjust the output angle of the scattered beam to be detected according to the clock signal.

[0042] according to Figure 1 As can be seen from the description, the scattered beam of light to be detected forms a spot on the first plane. Figure 2a This is a first structural schematic diagram of the light spot and photosensitive surface provided in an embodiment of this application. Figure 2a As shown, at the first moment, beam 1 illuminates the first plane, forming a light spot 201. The area of ​​the photosensitive surface 202 of detector 103 is smaller than the area of ​​the light spot 201. In practical applications, to ensure measurement accuracy and provide a certain adjustment margin, the ratio of the size of the light spot 201 to the size of the photosensitive surface 202 can be between 1000 and 1000000. The photosensitive surface 202 is within the range of the light spot 201. Figure 2b This is a schematic diagram of the second structure of the light spot and photosensitive surface provided in an embodiment of this application. Figure 2b As shown, at the second moment, beam 2 illuminates the first plane, forming a light spot 203. Because the center positions of the light spots of beam 1 and beam 2 are different, the position of the photosensitive surface 202 shifts relative to the position of the light spot. Figure 2a and Figure 2b In the example, spot 203 can be understood as being obtained by moving spot 201 in the negative X-axis direction. The changes in spot shape and area caused by the angle change of the scattered beam are ignored; that is, it is assumed that spot 203 and spot 201 have the same area and shape. Figure 2b and Figure 2a In the example, Figure 2b The photosensitive surface 202 in the middle can be understood as Figure 2a The photosensitive surface 202 is obtained by moving the light spot 201 in the positive direction of the X-axis.

[0043] Figure 3 This is a schematic diagram of the third structure of the light spot and photosensitive surface provided in an embodiment of this application. Figure 3As shown, the relative position of the photosensitive surface 202 changes due to the movement of the light spot 201. For example, in Figure 3 In the example, at the first moment, the photosensitive surface 202 is located at position 1. Driven by a clock signal, the scattering component 102 changes the output angle of the light beam, causing the light spot 201 to move in the negative direction of the X-axis. At the second moment, the photosensitive surface 202 is located at position 2. The above process is repeated until the fifth moment, when the photosensitive surface 202 is located at position 5. The scattering component 102 again changes the position of the light spot 201, causing the light spot 201 to move in the positive directions of the X-axis and Y-axis, and at the sixth moment, the photosensitive surface 202 is located at position 6. The above process is repeated so that the photosensitive surface 202 is located in multiple different regions of the light spot 201. In each region, the detector 103 acquires one electrical signal through the photosensitive surface 202, resulting in multiple electrical signals.

[0044] according to Figure 1 As described above, the scattering component 102 is used to achieve the functions of scattering and changing the output direction of the light beam. The scattering component 102 can include a scattering medium and an optical modulator. The scattering medium is used to achieve the scattering function. The scattering medium is also called a scattering module. The scattering medium can be a nanoparticle pellet, a multimode fiber, or a diffractive optical array structure, etc. The optical modulator is used to achieve the function of changing the output direction of the light beam. The optical modulator is also called a scattered light modulation module. The optical modulator can be a transmissive liquid crystal spatial light modulator, a reflective liquid crystal spatial light modulator, a digital micromirror and its array based on micro-electro-mechanical system (MEMS) technology, a magneto-optical spatial light modulator, a rotating mirror system, or an electro-optical microcavity array, etc. In practical applications, the scattering medium and the optical modulator can be located in different positions within the detection device 100, which will be described below.

[0045] Figure 4a This is a second structural schematic diagram of the detection device provided in the embodiments of your application. For example... Figure 4a As shown, in Figure 1 Based on this, the scattering component 102 includes a scattering medium 401 and an optical modulator 402. The scattering medium 401 receives the light beam to be detected from the optical coupler 101 and scatters it to obtain a scattered light beam to be detected. The scattering medium 401 also illuminates the optical modulator 402 with the scattered light beam. The optical modulator 402 outputs multiple scattered light beams to the detector 103 at different angles and time divisions. Figure 4a In the example, by changing the angle of the light modulator 402, the output angle of the light beam can be changed.

[0046] Figure 4b This is a third structural schematic diagram of the detection device provided in the embodiments of your application. Figure 4bAs shown, in Figure 1 Based on this, the scattering component 102 includes a scattering medium 401 and an optical modulator 402. The optical modulator 402 is used to receive a beam to be detected from the optical coupler 101. The optical modulator 402 is also used to output multiple beams to be detected to the scattering medium 401 at different time intervals and angles. For example, at a first moment, the optical modulator 402 is used to transmit a first beam to be detected to the scattering medium 401 at a first angle; at a second moment, the optical modulator 402 is used to transmit a second beam to be detected to the scattering medium 401 at a second angle. Figure 4b In the example, by changing the angle of the optical modulator 402, the output angle of the light beam can be changed. The scattering medium 401 is used to receive multiple beams to be detected in a time-division manner, and to scatter the multiple beams to be detected to obtain multiple scattered beams to be detected. The multiple scattered beams to be detected correspond one-to-one with the multiple beams to be detected. The scattering medium 401 is also used to output multiple scattered beams to be detected to the detector 103 at different angles in a time-division manner.

[0047] According to the foregoing Figure 1 As described above, processor 104 is used to obtain relevant information about the beam to be detected based on multiple electrical signals. In practical applications, processor 104 can be used to obtain relevant information about the beam to be detected based on the weight matrix of scattering medium 401 and multiple electrical signals.

[0048]

[0049] The weight matrix 1 of the scattering medium 401 comprises m rows and n columns. Therefore, the weight matrix 1 includes m × n values, where m and n are integers greater than 0. The scattering medium 401 includes m scattering regions. Each of the m scattering regions corresponds to a row of values ​​in the weight matrix 1. The value corresponding to each scattering region depends on the physical properties of the scattering medium in that region. The weight matrix can be obtained through measurement. This application embodiment does not limit the method by which the processor 104 obtains the weight matrix 1. Figure 4a and Figure 4b In the detection device, the processor 104 can obtain relevant information about the beam to be detected in a similar manner. This will be described below.

[0050] exist Figure 4a In the detection equipment, the areas detected by detector 103 at different times correspond to different scattering regions in the scattering medium 401. For example, Figure 3 Position 1 in the diagram represents the first region of the light spot 201 detected by detector 103 at the first moment. The first region of the light spot 201 is obtained by passing through the first scattering region of the scattering medium 401. Figure 3Position 2 in the diagram represents the second region of the light spot 201 detected by detector 103 at the second moment. The second region of light spot 201 is obtained through the second scattering region of scattering medium 401. Therefore, the multiple regions detected by detector 103 correspond one-to-one with the multiple different scattering regions in scattering medium 401. Processor 104 can obtain relevant information about the beam to be detected according to the following formula.

[0051]

[0052] The processor 104 obtains h electrical signals from the detector 103. These h electrical signals are K1, k2, ..., Kh. Formula set 1 includes h formulas. Each of the h formulas corresponds one-to-one with one of the h electrical signals. h is an integer less than or equal to m. The value of h is greater than or equal to the value of n. Through these h formulas, the processor 104 can obtain n values ​​of λ. These n values ​​of λ are λ1, λ2, ..., λn. The value of λ1 can be used to characterize the energy intensity of the beam to be detected at wavelength λ1. The processor 104 can also establish a correspondence between the n values ​​of λ and the n wavelengths. This correspondence is the spectral information of the beam to be detected. In this embodiment, the relevant information of the beam to be detected can be either the n values ​​of λ or the corresponding correspondence.

[0053] exist Figure 4b In the detection equipment, the areas detected by detector 103 at different times correspond to the same scattering region in scattering medium 401. However, since the angle at which the beam to be detected is incident on the same scattering region is different at different times, the beams to be detected at different incident angles will also produce different weight values. Therefore, in Figure 4b In the detection device, processor 104 can obtain a weight matrix 2 similar to weight matrix 1. Weight matrix 2 can be obtained through measurement. This application embodiment does not limit the method by which processor 104 obtains weight matrix 2. Processor 104 can obtain relevant information about the beam to be detected through a set of formulas similar to the above-described formula set 1.

[0054] according to Figure 4a and Figure 4b As described above, the detection device 100 can change the output angle of the scattered beam to be detected through the optical modulator 402. Figure 4a In the example, the optical modulator 402 is used to directly change the output angle of the scattered beam to be detected. Figure 4bIn the example, the optical modulator 402 is used to change the output angle of the scattered beam of the test beam by changing the output angle of the beam to be tested. Generally, the greater the change in the output angle of the scattered beam of the test beam, the longer the adjustment time required for the optical modulator 402, or the higher the hardware cost of the optical modulator 402. To reduce the adjustment time or hardware cost, the multiple regions detected by the detector 103 can include overlapping regions. Figure 5 This is a fourth structural schematic diagram of the light spot and photosensitive surface provided in an embodiment of this application. (See attached diagram.) Figure 5 As shown, at the first moment, beam 1 illuminates the first plane, forming a light spot 201. The position of the photosensitive surface 202 of detector 103 relative to the light spot 201 is position 1. At the second moment, the position of the photosensitive surface 202 relative to the light spot 201 is position 2. Position 1 can also be referred to as the first region of the light spot 201 or the first region of beam 1. Position 2 can also be referred to as the second region of the light spot 201 or the first region of beam 2. Figure 5 As shown, the solid-lined boxes represent the first region, and the dashed-lined boxes represent the second region. There is an overlap between the first and second regions. In practical applications, if the area of ​​the overlapping region is too large, it will affect the reliability of the acquired information about the beam being detected. Therefore, the area of ​​the overlapping region can be less than or equal to 90% of the area of ​​the first region.

[0055] As described above, processor 104 can obtain relevant information about the beam to be detected based on the h-channel electrical signal. In practical applications, the value of h can be changed according to the required measurement accuracy. When there is an overlapping area between the first and second regions, processor 104 can also adjust the size of the overlapping area according to the value of h. For example, when the value of h decreases, processor 104 reduces the area of ​​the overlapping area; when the value of h increases, processor 104 increases the area of ​​the overlapping area.

[0056] according to Figure 1 As described above, detector 103 can be a single-pixel or linear array detector. When detector 103 is a single-pixel detector, in order to measure the main area of ​​light spot 201 as close as possible, optical modulator 402 needs to be a two-dimensional optical modulator. A two-dimensional optical modulator can move light spot 201 along two dimensions. For example, in Figure 3 In the example, the optical modulator 402 can move the light spot 201 along the X-axis and Y-axis directions. In this embodiment, when the detector 103 is a linear array detector, the optical modulator 402 can be a one-dimensional optical modulator. A one-dimensional optical modulator can only move the light spot 201 along one dimension. Figure 6 This is a fifth structural schematic diagram of the light spot and photosensitive surface provided in an embodiment of this application. Figure 6As shown, the photosensitive surface 202 of detector 103 is rectangular. Detector 103 has multiple pixels distributed along the Y-axis. By adjusting the light modulator 402, the light spot 201 can be moved along the negative X-axis direction. The negative X-axis direction is also called the first direction. For example, in... Figure 6 In the example, at the first moment, the photosensitive surface 202 is located at position 1. By adjusting the light modulator 402, the light spot 201 is moved in the negative direction of the X-axis. At the second moment, the photosensitive surface 202 is located at position 2. The above process is repeated so that the photosensitive surface 202 is located in multiple different regions of the light spot 201. In practical applications, the hardware cost of a two-dimensional light modulator is generally higher than that of a one-dimensional light modulator. Therefore, the embodiments of this application can reduce the hardware cost of the detection device 100. Furthermore, by using a linear array detector, the detection efficiency can be improved.

[0057] In practical applications, the beam energy used to acquire relevant information is related to the reliability of the acquired information. The lower the beam energy used to acquire relevant information, the lower the reliability of the relevant information. Therefore, embodiments of this application can improve the reliability of relevant information by increasing the beam energy used to acquire relevant information. For example, as... Figure 6 As shown, the first width of the light spot 201 on the first plane after the scattered light beam to be detected is d2. The second width of the photosensitive surface 202 of the detector 103 is d1. The direction of the second width is perpendicular to the direction of the first width. The difference between d2 and d1 is less than or equal to 50 percent of d2.

[0058] As described above, the value of h can be changed according to the required measurement accuracy. When the value of h decreases, the energy of the beam used to acquire relevant information decreases, thus affecting the reliability of the relevant information. Therefore, the detection device 100 may also include a focusing device. The focusing device is used to change the size of the spot on the first plane after the scattered beam of light to be detected illuminates. Figure 7 This is a fourth structural schematic diagram of the detection device provided in an embodiment of this application. Figure 7 As shown, in Figure 4a In addition to the above, the detection device 100 also includes a focusing device 703. The focusing device 703 is located on the light transmission path between the scattering component 102 and the detector 103. The focusing range of the focusing device 703 is between 1 mm and 5 mm. When the detection device 100 includes a focusing device 703, the processor 104 can also be used to adjust the focusing device 703 according to the value of h, thereby changing the size of the light spot 201. For example, when the value of h decreases, the processor 104 adjusts the focusing device 703 to make the area of ​​the light spot 201 smaller; when the value of h increases, the processor 104 adjusts the focusing device 703 to make the area of ​​the light spot 201 larger.

[0059] like Figure 7 As shown, the detection device 100 also includes a mask 704. The mask 704 is located on the light transmission path between the scattering component 102 and the detector 103. The mask 704 can be used to replace some of the computational functions implemented in software. Figure 8 This is a schematic diagram of the mask structure provided in an embodiment of this application. Figure 8 As shown, mask 704 includes different regions with alternating black and white areas. For example, regions 1 and 4 of mask 704 are black areas. The black areas block the scattered beam of light to be detected. Regions 2 and 3 of mask 704 are white areas. The white areas allow the scattered beam of light to be detected to pass through. When the four regions (regions 1, 2, 3, and 4) correspond to the first region of spot 201, mask 704 is equivalent to performing frequency domain filtering on the first electrical signal. Therefore, by adding a mask, the embodiments of this application can improve the efficiency of acquiring relevant information.

[0060] In practical applications, the detection device 100 may also include a light source. For example, when the detection device 100 is an absorption coefficient measuring device, it is used to detect the proportion of light absorbed by the object to be tested. Figure 7 As shown, the light source 701 is used to output the target beam. The target beam illuminates the object to be tested 702. The object to be tested 702 is used to reflect or transmit the target beam. The beam to be tested obtained by the optical coupler 101 is the reflected or transmitted light of the target beam.

[0061] In practical applications, the temperature of the scattering medium 401 affects its weighting matrix. When temperature changes cause changes in the weighting matrix, but the processor obtains relevant information based on the original weighting matrix, the reliability of the relevant information is affected. Therefore, the detection device 100 may also include a temperature controller. The temperature controller is used to maintain the temperature of the scattering medium 401 within the target range. Similarly, vibrations of the light modulator 402 and the scattering medium 401 also cause changes in the weighting matrix. When the processor 104 uses this to obtain relevant information based on the original weighting matrix, the reliability of the obtained relevant information is affected. Therefore, the detection device 100 may also include a first vibration isolator and a second vibration isolator. The vibration isolator can be a spring or a gasket, etc. The first vibration isolator is used to reduce the vibration of the scattering medium 401. The second vibration isolator is used to reduce the vibration of the light modulator 402.

[0062] Figure 9 This is a schematic diagram illustrating the workflow of the testing equipment provided in an embodiment of this application. Figure 9As shown, detector 103 receives a running command and detects a first region of the scattered beam of light to be detected according to the running command, obtaining a first electrical signal. Detector 103 also outputs the first electrical signal to processor 104. After obtaining the first electrical signal, processor 104 outputs a clock signal. The clock signal can also be called a control signal. Optical modulator 402 adjusts the output angle of the scattered beam of light to be detected according to the clock signal. After adjusting the output angle, detector 103 detects a second region of the scattered beam of light to be detected, obtaining a second electrical signal. Detector 103 also outputs the second electrical signal to processor 104. After obtaining the second electrical signal, processor 104 outputs the clock signal again. The above process is repeated until processor 104 obtains h electrical signals. Processor 104 obtains relevant information about the beam of light to be detected based on the h electrical signals.

[0063] In practical applications, the processor 104 can include a data acquisition unit, a memory, and a controller. The data acquisition unit receives multiple electrical signals from the detector 103 and transmits these signals to the memory. The memory can be volatile or non-volatile, or a combination of both. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), or flash memory, etc. The volatile memory can be random access memory (RAM). The memory stores the multiple electrical signals. The controller retrieves the multiple electrical signals from the memory, performs calculations on them, and obtains relevant information about the beam to be detected.

[0064] It should be understood that the aforementioned Figures 1 to 8 These are just a few examples of the testing equipment provided in the embodiments of this application. In practical applications, those skilled in the art can make adaptive modifications to the testing equipment as needed. For example, in Figure 1 In this device, between detector 103 and scattering component 102, detection equipment 100 also includes filters or attenuators. Filters are used to isolate stray light. Attenuators are used to control the amount of light entering the device to prevent detector 103 from saturating. For example, in... Figure 3 In this process, when the photosensitive surface 202 is at position 5, the scattering component 102 moves the moving light spot 201 in the positive direction of the Y-axis, so that position 6 of the photosensitive surface 202 is directly below position 5. At this time, the time required for the scattering component 102 to adjust the position of the light spot can be reduced.

[0065] The testing equipment provided in this application has been described above. The testing method provided in this application is described below. Figure 10This is a schematic flowchart of the detection method provided in an embodiment of this application. Figure 10 As shown, the detection method includes the following steps.

[0066] In step 1001, the detection device scatters the light beam to be detected to obtain the scattered light beam to be detected.

[0067] The detection equipment includes a scattering medium, also known as a scattering module. The scattering medium can be a nanoparticle pellet, multimode fiber, or diffractive optical array structure, etc. The detection equipment scatters the light beam to be detected through the scattering medium to obtain the scattered light beam.

[0068] In step 1002, the detection device detects the first region of the scattered beam of light to be detected by a detector and obtains a first electrical signal.

[0069] The detection device includes a detector, also known as a photodetector. The photosensitive surface of the detector is located on a first plane. The size of the scattered light beam on the first plane is larger than the size of the photosensitive surface. The photosensitive surface is located inside the light spot. The area where the photosensitive surface is located corresponds to the first region of the light spot, and also to the first region of the scattered light beam to be detected. The detection device detects the first region of the scattered light beam to be detected through the detector, obtaining a first electrical signal.

[0070] In step 1003, the detection device changes the output direction of the scattered beam to be detected, so that the spot of the scattered beam to be detected moves relative to the photosensitive surface of the detector.

[0071] The detection device includes an optical modulator. The optical modulator can be a transmissive liquid crystal spatial light modulator, a reflective liquid crystal spatial light modulator, a digital micromirror and its array based on MEMS technology, a magneto-optical spatial light modulator, a rotating mirror system, or an electro-optical microcavity array, etc. The detection device changes the output direction of the scattered light beam to be detected by the optical modulator, causing the spot of the scattered light beam to move relative to the photosensitive surface of the detector. For example, at the first moment, the photosensitive surface is located at position 1 of the light spot; at the second moment, the photosensitive surface is located at position 2 of the light spot.

[0072] In step 1004, the detection device detects the second region of the scattered beam of light to be detected by a detector to obtain a second electrical signal.

[0073] After the light spot moves relative to the photosensitive surface of the detector, the area where the photosensitive surface is located corresponds to the second region of the light spot, and also to the second region of the scattered beam to be detected. The detection device detects the second region of the scattered beam to be detected by the detector and obtains the second electrical signal.

[0074] In step 1005, the detection device obtains relevant information about the beam to be detected based on the first electrical signal and the second electrical signal.

[0075] The detection device can obtain relevant information about the beam to be detected based on the weight matrix of the scattering medium and multiple electrical signals. For example, the weight matrix consists of m rows and n columns. The weight matrix includes m×n values. m and n are integers greater than 0. The scattering medium includes m scattering regions. Each scattering region corresponds to a row of values ​​in the weight matrix. The value corresponding to each scattering region depends on the physical properties of the scattering medium in that scattering region. Alternatively, the target scattering region of the scattering medium corresponds to m different incident angles. Each of the m different incident angles corresponds to a row of values ​​in the weight matrix. The value corresponding to each incident angle depends on the physical properties of the target scattering region. The weight matrix can be obtained by measurement. This application does not limit the method by which the detection device obtains the weight matrix. The relevant information about the beam to be detected is n energy intensities of the beam at n wavelengths. There is a one-to-one correspondence between the n energy intensities and the n wavelengths. Alternatively, the relevant information about the beam to be detected is a correspondence between the n energy intensities and the n wavelengths.

[0076] It should be understood that Figure 10 The detection method and the aforementioned Figures 1 to 9 The descriptions of the detection equipment in any of the figures are similar. Therefore, regarding Figure 10 For a description of the detection method, please refer to the aforementioned... Figures 1 to 9 The following figure illustrates the description of the detection device. For example, the first and second regions include an overlapping area. The detection method further includes the following steps: the detection device adjusts the area of ​​the overlapping region according to the value of h. Alternatively, the detection device adjusts the focuser according to the value of h to change the size of the scattered beam of light to be detected.

[0077] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

Claims

1. A testing device, characterized in that, It includes an optical coupler, a scattering component, a detector, and a processor, wherein: The optical coupler is used to receive the light beam to be detected and couple the light beam to be detected to the scattering component; The scattering component is used to scatter the light beam to be detected, and output multiple scattered light beams to the detector at different angles in time-division, wherein the multiple scattered light beams to be detected correspond one-to-one with multiple angles; The detector is used to detect multiple different regions in the multiple scattered beams to be detected, obtain multiple electrical signals, and transmit the multiple electrical signals to the processor. The multiple regions and the multiple electrical signals correspond one-to-one, and the multiple regions and the multiple scattered beams to be detected correspond one-to-one. The processor is used to calculate the multiple electrical signals to obtain relevant information about the beam to be detected.

2. The detection device according to claim 1, characterized in that, The scattering component includes a scattering medium and an optical modulator, wherein: The scattering medium is used to receive the light beam to be detected from the optical coupler, scatter the light beam to be detected, and incident the scattered light beam to be detected onto the optical modulator. The optical modulator is used to output multiple scattered beams of light to be detected to the detector at different angles.

3. The detection device according to claim 1, characterized in that, The scattering component includes an optical modulator and a scattering medium, wherein: The optical modulator is used to receive the beam to be detected from the optical coupler and output multiple beams to be detected to the scattering medium at different angles; The scattering medium is used to scatter multiple beams to be detected, resulting in multiple scattered beams to be detected. The multiple scattered beams to be detected are then incident on the detector, with each beam to be detected corresponding to the other beam.

4. The detection device according to claim 2 or 3, characterized in that, The detector is a linear array detector, and the optical modulator is a one-dimensional optical modulator.

5. The detection device according to claim 4, characterized in that, The photosensitive surface of the detector is located on a first plane, and the difference between the first width of the light spot on the first plane after the scattered light beam to be detected and the second width of the photosensitive surface is less than or equal to 50% of the first width.

6. The detection device according to any one of claims 1 to 3, characterized in that, The plurality of regions includes a first region and a second region, wherein the first region and the second region include an overlapping region.

7. The detection device according to claim 6, characterized in that, The area of ​​the overlapping region is less than or equal to 90 percent of the area of ​​the first region.

8. The detection device according to any one of claims 1 to 3, characterized in that, The detection device further includes a focusing device located on the light transmission path between the scattering component and the detector, wherein: The focusing device is used to change the focal length of the scattered beam to be detected.

9. The detection device according to any one of claims 1 to 3, characterized in that, The detection device also includes a mask located on the light transmission path between the scattering component and the detector.

10. The detection device according to any one of claims 1 to 3, characterized in that, The photosensitive surface of the detector is located on a first plane, and the ratio of the size of the spot of the scattered light beam illuminating the first plane to the size of the photosensitive surface is between 1,000 and 1,000,000.

11. The detection device according to claim 2 or 3, characterized in that, The testing equipment also includes a temperature controller, wherein: The temperature controller is used to maintain the temperature of the scattering medium within the target range.

12. The detection device according to claim 2 or 3, characterized in that, The testing equipment also includes a first vibration isolator and a second vibration isolator, wherein: The first vibration isolator is used to reduce the vibration of the scattering medium; The second vibration isolator is used to reduce the vibration of the optical modulator.

13. A detection method, characterized in that, include: The beam to be detected is scattered to obtain the scattered beam to be detected. A first electrical signal is obtained by detecting the first region of the scattered beam of light to be detected by a detector; The output direction of the scattered light beam to be detected is changed so that the spot of the scattered light beam to be detected moves relative to the photosensitive surface of the detector. A second electrical signal is obtained by detecting a second region of the scattered beam of light to be detected by the detector. The relevant information of the beam to be detected is obtained based on the first electrical signal and the second electrical signal.

14. The detection method according to claim 13, characterized in that, The first region and the second region include an overlapping region; The step of obtaining the relevant information of the beam to be detected based on the first electrical signal and the second electrical signal includes: obtaining the relevant information of the beam to be detected based on h electrical signals, wherein the h electrical signals include the first electrical signal and the second electrical signal, and h is an integer greater than or equal to 2; The method further includes: The size of the overlapping region is adjusted according to the value of h.

15. The detection method according to claim 13 or 14, characterized in that, The step of obtaining the relevant information of the beam to be detected based on the first electrical signal and the second electrical signal includes: obtaining the relevant information of the beam to be detected based on h electrical signals, wherein the h electrical signals include the first electrical signal and the second electrical signal, and h is an integer greater than or equal to 2; The method further includes: The size of the spot of the scattered beam to be detected is adjusted according to the value of h.

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