Semiconductor element and manufacturing method thereof
By introducing insulating structures, electric fuse elements and gap walls into semiconductor components, and using manufacturing process variations to form epitaxial structures, the problems of semiconductor components being susceptible to defects and insufficient security of IoT hardware are solved, and random encoding and physical incommendable functions are realized, which improves information security.
Patent Information
- Application Number
- CN202311694278.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2025-06-13
AI Technical Summary
Existing semiconductor components are susceptible to defects during production, and in the field of IoT, hardware security is difficult to ensure, especially in preventing counterfeit chips and data security.
By introducing an insulating structure, an electric fuse element and a gap wall into the semiconductor element, the gap wall is partially covered with the semiconductor layer of the electric fuse element by utilizing the manufacturing process variation, and an epitaxial structure is formed to electrically connect adjacent electric fuse elements, realizing the functions of random coding and physical incommensurable.
The purpose of random encoding in semiconductor components is achieved, hardware security is enhanced, counterfeit chips are prevented, and the security of IoT information is improved.