High-temperature-resistant UV viscosity-reducing adhesive tape and preparation method thereof

Abstract

The invention relates to a high-temperature-resistant UV viscosity-reducing adhesive tape and a preparation method thereof, and belongs to the technical field of UV viscosity-reducing adhesive tapes. The high-temperature-resistant UV viscosity-reducing adhesive tape comprises a base material layer, an adhesive layer and a release layer which are sequentially arranged, wherein the adhesive layer is prepared from an adhesive; the adhesive is prepared from the following components in parts by weight: 100 parts of an acrylate polymer, 0.1 to 2 parts of a cross-linking agent, 1 to 3 parts of a photoinitiator, 0.2 to 0.8 part of an antioxidant and 35 to 100 parts of a first solvent; the acrylate polymer comprises the following components in parts by weight: 70-80 parts of a soft monomer, 20-30 parts of a hard monomer, 5-10 parts of a polyfunctional monomer, 0.1-1 part of an initiator, 0.05-0.2 part of a polymerization inhibitor, 1-7 parts of an end-capping reagent and 100-200 parts of a second solvent. The UV viscosity-reducing adhesive tape can still keep excellent viscosity-reducing performance after being subjected to high-temperature treatment, and the effect that the viscosity is not reduced or even improved after being subjected to high-temperature treatment can be achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of UV anti-viscosity tapes, and in particular relates to a high-temperature resistant UV anti-viscosity tape and a preparation method thereof. Background Art

[0002] Against the backdrop of today's rapidly developing semiconductor industry, semiconductor devices are rapidly advancing toward miniaturization and high integration. This trend has made wafer thinning a key technology for improving chip performance, and its importance is becoming increasingly prominent. During the wafer thinning process, UV-resistant adhesive tape is typically used to secure the wafer to a supporting substrate to ensure stability during the grinding and thinning process. After the grinding and thinning process is completed, UV irradiation is used to reduce the adhesiveness of the tape, enabling precise separation of the wafer from the tape.

[0003] With the increasing demand for lightweight and integrated semiconductor devices, the demand for various adhesive tapes in the manufacturing process is also growing. These tapes are primarily used to secure and bond components. Excellent bonding performance is a fundamental and critical requirement for these tapes. However, conventional UV adhesive tapes currently struggle to achieve both temperature resistance and adhesive-removing properties in practical applications, a significant limitation that has severely hampered their widespread adoption in high-end semiconductor manufacturing.

[0004] Traditional methods for preparing UV-based adhesives for reducing viscosity primarily involve adding a multifunctional UV resin to a high-viscosity acrylic adhesive. However, this method has numerous drawbacks, including poor miscibility between the resin and the masterbatch, prone to precipitation, and insufficient heat resistance to meet the requirements of advanced semiconductor manufacturing processes. Semiconductor device manufacturing often involves high-temperature processes. Inadequate heat resistance can cause deformation, changes in viscosity, or even failure in high-temperature environments, compromising wafer retention and subsequent separation operations, ultimately leading to a decrease in chip manufacturing yield.

[0005] Furthermore, with the increasing complexity of semiconductor device structures and the continuous improvement of performance requirements, the comprehensive performance requirements for UV adhesive tapes are also constantly increasing. During the wafer fixing process, the tape needs to have sufficient viscosity to withstand the various forces generated during the grinding process to ensure that the wafer does not shift or damage. During the separation phase, it must be able to quickly and completely reduce the viscosity to facilitate the separation of the wafer and the tape, and avoid scratching or contamination of the wafer surface.

[0006] Therefore, the development of a UV adhesive tape that can simultaneously meet the requirements of high temperature resistance, good bonding performance and effective viscosity reduction performance is of great practical significance for promoting the advancement of semiconductor device manufacturing technology and improving the yield and efficiency of chip manufacturing. Summary of the Invention

[0007] In order to solve the above technical problems, the present invention provides a high-temperature resistant UV anti-viscosity tape and a preparation method thereof. After high-temperature treatment, the UV anti-viscosity tape can still maintain excellent anti-viscosity performance, and can achieve the effect of not decreasing the viscosity after high-temperature treatment, or even improving it.

[0008] A first object of the present invention is to provide a high-temperature resistant UV-resistant adhesive tape, comprising a substrate layer, a release layer disposed on the substrate layer, and an adhesive layer disposed between the substrate layer and the release layer, wherein the adhesive layer is prepared from an adhesive; the adhesive comprises, by weight, 100 parts of an acrylate polymer, 0.1-2 parts of a cross-linking agent, 1-3 parts of a photoinitiator, 0.2-0.8 parts of an antioxidant, and 35-100 parts of a first solvent;

[0009] The acrylate polymer comprises, by weight, 70-80 parts of soft monomer, 20-30 parts of hard monomer, 5-10 parts of multifunctional monomer, 0.1-1 parts of initiator, 0.05-0.2 parts of polymerization inhibitor, 1-7 parts of end-capping agent and 100-200 parts of second solvent.

[0010] In one embodiment of the present invention, the preparation of the acrylate polymer comprises the following steps:

[0011] S1, adding 1 / 3-2 / 3 of the soft monomer, 1 / 3-2 / 3 of the hard monomer, 1 / 3-2 / 3 of the multifunctional monomer and 1 / 3-2 / 3 of the second solvent to a reaction vessel, and passing nitrogen at 55° C.-65° C. for 20 min-40 min; then dropwise adding 1 / 3-2 / 3 of the initiator and the remaining soft monomer, the remaining hard monomer, and the remaining multifunctional monomer to the reaction vessel, and reacting for 3 h-5 h after the dropwise addition is completed; finally, adding the remaining initiator and continuing the reaction for 4 h-8 h to obtain a mixture;

[0012] S2. Air is introduced into the mixture for 20-40 minutes, and then an inhibitor is added to react for 55-65 minutes. Finally, a capping agent and the remaining second solvent are added, and the mixture is reacted at 55-65° C. for 2-4 hours to obtain the acrylate polymer.

[0013] In one embodiment of the present invention, the crosslinking agent is selected from an amino crosslinking agent and / or an epoxy crosslinking agent; the amino crosslinking agent is selected from one or more of Dow Corning Z-6020, Dow Corning Z-6011 and Dow Corning Z-6121; the epoxy crosslinking agent is selected from one or more of Soken Chemical NE-100C, Dow Corning Z-6040 and Mitsubishi Chemical TETRAD-C; preferably, the epoxy crosslinking agent is Soken Chemical NE-100C;

[0014] The photoinitiator is selected from one or more of photoinitiator TPO, photoinitiator TMO and photoinitiator BDK; preferably, the photoinitiator is photoinitiator TMO;

[0015] The antioxidant is selected from one or more of antioxidant 245, antioxidant 1010, antioxidant 1076 and antioxidant 168; it can capture high-temperature free radicals, block the oxidation chain reaction, and prevent the main chain from breaking (high-temperature oxidation of acrylates easily produces free radicals).

[0016] In one embodiment of the present invention, the soft monomer is selected from one or more of methyl acrylate, ethyl acrylate, lauryl acrylate, 2-ethylhexyl acrylate and isooctyl acrylate;

[0017] The hard monomer is selected from one or more of methyl methacrylate, bornyl methacrylate, and alkyl methacrylate; the glass transition temperature of the hard monomer is greater than -30°C, which can increase the glass transition temperature of the acrylate polymer and reduce the chain segment movement at high temperatures. At the same time, the high-temperature resistant initiator and cross-linking agent enable it to continue to function normally after high-temperature treatment. After UV light irradiation, a three-dimensional cross-linked network structure is formed, which is easy to tear off from the adhered object;

[0018] The multifunctional monomer is selected from one or more of epoxy acrylate, 1,6-hexanediol diacrylate, dipentaerythritol hexaacrylate and pentaerythritol triacrylate;

[0019] The initiator is selected from one or more of benzoyl peroxide (BPO), azobisisobutyronitrile (AIBN), dilauroyl peroxide (LPO), tert-amyl peroxide-2-ethylhexanoate (TAPO), tert-amyl peroxide-2-ethylhexanoate (TAPO) and dihydroxycyclohexane peroxide (BHCP);

[0020] The polymerization inhibitor is selected from one or more of hydroquinone, p-hydroxyanisole and di-tert-butyl-p-cresol;

[0021] The end-capping agent is selected from one or more of isooctanoic acid, 4-phenylethynylaniline and methyl ethyl ketone oxime.

[0022] In one embodiment of the present invention, the first solvent and the second solvent are independently selected from one or more of toluene, methylcyclohexane, cyclohexanone, acetylacetone, methyl isobutyl ketone, butanone, ethyl acetate, butyl acetate and n-heptane.

[0023] Furthermore, the first solvent and the second solvent are independently selected from toluene and / or ethyl acetate.

[0024] In one embodiment of the present invention, the substrate layer is a polyethylene naphthalate (PEN) film.

[0025] In one embodiment of the present invention, the release layer is a polyethylene terephthalate (PET) film.

[0026] In one embodiment of the present invention, the thickness of the substrate layer is 25 μm-100 μm, for example, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, 40 μm, 41 μm, 42 μm, 43 μm, 44 μm, 45 μm, 46 μm, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, 54 μm, 55 μm, 56 μm, 57 μm, 58 μm, 59 μm, μm, 60μm, 61μm, 62μm, 63μm, 64μm, 65μm, 66μm, 67μm, 68μm, 69μm, 70μm, 71μm, 72μm, 73μm, 74μm, 75μm, 76μm, 77μm, 78μm, 79μm, 80 μm, 81μm, 82μm, 83μm, 84μm, 85μm, 86μm, 87μm, 88μm, 89μm, 90μm, 91μm, 92μm, 93μm, 94μm, 95μm, 96μm, 97μm, 98μm, 99μm, 100μm, etc.;

[0027] The thickness of the adhesive layer is 10 μm-40 μm, for example, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, 40 μm, etc.

[0028] The thickness of the release layer is 25 μm-75 μm, for example, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, 40 μm, 41 μm, 42 μm, 43 μm, 44 μm, 45 μm, 46 μm, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, 54 μm, 55 μm, 56 μm, 57 μm, 58 μm, 59 μm, 60 μm, 61 μm, 62 μm, 63 μm, 64 μm, 65 μm, 66 μm, 67 μm, 68 μm, 69 μm, 70 μm, 71 μm, 72 μm, 73 μm, 74 μm, 75 μm, 76 μm, 77 μm, 78 μm, 79 μm, 80 μm, 81 μm, 82 μm, 83 μm, 84 μm 8μm, 49μm, 50μm, 51μm, 52μm, 53μm, 54μm, 55μm, 56μm, 57μm, 58μm, 59μm, 60μm, 61μm, 6 2μm, 63μm, 64μm, 65μm, 66μm, 67μm, 68μm, 69μm, 70μm, 71μm, 72μm, 73μm, 74μm, 75μm, etc.

[0029] A second object of the present invention is to provide a method for preparing the high temperature resistant UV adhesive tape, comprising the following steps:

[0030] S1, uniformly mixing an acrylate polymer, a cross-linking agent, a photoinitiator, an antioxidant, and a first solvent to obtain an adhesive;

[0031] S2. Apply the adhesive described in S1 on the substrate layer, volatilize the solvent to form a release layer, and then cure to obtain the high-temperature resistant UV-resistant adhesive tape.

[0032] In one embodiment of the present invention, in S2, the temperature of the solvent volatilization treatment is 110° C.-125° C., for example, 110° C., 111° C., 112° C., 113° C., 114° C., 115° C., 116° C., 117° C., 118° C., 119° C., 120° C., 121° C., 122° C., 123° C., 124° C., 125° C., etc.; the time is 2 min-6 min, for example, 2 min, 3 min, 4 min, 5 min, 6 min, etc.;

[0033] The aging temperature is 40°C-50°C, for example, 40°C, 41°C, 42°C, 43°C, 44°C, 45°C, 46°C, 47°C, 48°C, 49°C, 50°C, etc.; the number of days is 2-4 days, for example, 2 days, 2.5 days, 3 days, 3.5 days, 4 days, etc.

[0034] The technical solution of the present invention has the following advantages over the prior art:

[0035] (1) The substrate layer of the high-temperature-resistant UV adhesive tape of the present invention is polyethylene naphthalate (PEN) film, which has a glass transition temperature of over 120°C and a melting point of approximately 270°C, much higher than films such as PET. The high heat resistance of the substrate layer provides structural support for the UV adhesive tape, preventing the adhesive layer from penetrating or remaining due to softening of the substrate layer during high-temperature baking. It can maintain stability at temperatures of 150°C or even higher, making it suitable for high-temperature semiconductor processes.

[0036] (2) In the preparation process of the high-temperature resistant UV viscosity-reducing adhesive of the present invention, a hard monomer with a glass transition temperature greater than -30°C is selected to restrict the movement of the molecular chain through the rigid chain segment, making it difficult to soften or flow at high temperatures. At the same time, a multifunctional monomer is introduced to construct a three-dimensional cross-linked network, thereby enhancing the thermomechanical strength and suppressing the high-temperature melting phenomenon.

[0037] (3) The adhesive layer of the high-temperature resistant UV viscosity-reducing adhesive described in the present invention contains an antioxidant, which can terminate the free radicals (R·, ROO·) in the oxidation chain reaction, prevent the resin main chain from breaking, inhibit the degradation of the adhesive layer at high temperature, and avoid the generation of low molecular weight residues after UV irradiation, thereby achieving stable adhesion at high temperature, easy peeling after UV irradiation, and no residual adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below according to specific embodiments of the present invention in conjunction with the accompanying drawings, wherein:

[0039] Figure 1 This is a schematic structural diagram of the high temperature resistant UV adhesive tape of the present invention;

[0040] Explanation of reference numerals: 1-release layer, 2-adhesive layer, 3-substrate layer. DETAILED DESCRIPTION

[0041] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. It should be understood that the specific embodiments are only used to illustrate the present invention and are not intended to limit the present invention.

[0042] In the present invention, unless otherwise defined, technical and scientific terms used herein have the same meanings as commonly understood by one skilled in the art to which the present invention belongs.

[0043] In the present invention, unless stated otherwise, the term "and / or" used in the present invention includes any and all combinations of one or more of the associated listed items.

[0044] In the present invention, unless otherwise stated, the experimental methods used in the examples of the present invention are conventional methods unless otherwise stated, and the materials, reagents, etc. used are all commercially available unless otherwise stated.

[0045] In the present invention, unless otherwise stated, when the terms "comprise" and / or "include" are used in the specification of the present invention, they indicate the existence of the described features, integers, steps, operations, raw materials or components, but do not exclude the existence or addition of one or more other features, integers, steps, operations, raw materials, components or their combinations.

[0046] Example 1

[0047] Reference Figure 1 As shown, the high temperature resistant UV viscosity reducing adhesive of this embodiment includes a base material layer 3, an adhesive layer 2 and a release layer 1 stacked in sequence from bottom to top.

[0048] The substrate layer is a polyethylene naphthalate (PEN) film with a thickness of about 50 μm;

[0049] The thickness of the adhesive layer is approximately 25 μm;

[0050] The release layer is a polyethylene terephthalate (PET) film with a thickness of about 50 μm and a release force of about 15 gf / 25 mm.

[0051] The acrylic ester polymer comprises, in parts by weight, 75 parts of a soft monomer, methyl acrylate, 25 parts of a hard monomer, alkyl methacrylate, 8 parts of a multifunctional monomer, pentaerythritol triacrylate, 0.5 parts of an initiator, 0.12 parts of a polymerization inhibitor, hydroquinone, 4 parts of a capping agent, 75 parts of a solvent, ethyl acetate, and 75 parts of a solvent, toluene.

[0052] The preparation of acrylate polymers comprises the following steps:

[0053] S1. Add 2 / 5 of the soft monomer, 2 / 5 of the hard monomer, 2 / 5 of the multifunctional monomer, and 2 / 5 of the solvent to a reaction vessel, and flow nitrogen at 60° C. for 30 minutes; then dropwise add 2 / 5 of the initiator and the remaining soft monomer, the remaining hard monomer, and the remaining multifunctional monomer to the reaction vessel, and react for 4 hours after the dropwise addition is completed; finally, add the remaining initiator and continue the reaction for 6 hours to obtain a mixture;

[0054] S2. Air was introduced into the mixture for 30 minutes, and then a polymerization inhibitor was added and reacted for 60 minutes. Finally, a capping agent and the remaining solvent were added and reacted at 60° C. for 2 hours to obtain an acrylate polymer.

[0055] The adhesive comprises, by weight, 100 parts of an acrylate polymer, 0.2 parts of an epoxy crosslinking agent (purchased from Soken Chemical, model NE-100C), 2 parts of a photoinitiator TMO, 0.2 parts of an antioxidant, and 35 parts of a solvent, ethyl acetate.

[0056] The preparation of high temperature resistant UV viscosity reducing adhesive specifically includes the following steps:

[0057] S1, mixing an acrylate polymer, a cross-linking agent, a photoinitiator, an antioxidant and a solvent to obtain an adhesive;

[0058] S2. Use a comma-type coating head to coat the adhesive on the substrate layer, and use an oven to remove the solvent at a temperature of 120°C for 2 minutes; then compound the release layer and age it at 45°C for 3 days to obtain a high-temperature resistant UV-resistant adhesive tape.

[0059] Example 2

[0060] The same as Example 1, except for the composition of the adhesive, which is as follows:

[0061] The adhesive comprises, by weight, 100 parts of an acrylate polymer, 0.5 parts of an epoxy crosslinking agent (purchased from Soken Chemical, model NE-100C), 2 parts of a photoinitiator TMO, 2450.2 parts of an antioxidant, and 35 parts of a solvent, ethyl acetate.

[0062] Example 3

[0063] The same as Example 1, except for the composition of the adhesive, which is as follows:

[0064] The adhesive comprises, by weight, 100 parts of an acrylate polymer, 0.2 parts of an epoxy crosslinking agent (purchased from Soken Chemical, model NE-100C), 2 parts of a photoinitiator TMO, 2450.5 parts of an antioxidant, and 35 parts of a solvent, ethyl acetate.

[0065] Example 4

[0066] The same as Example 1, except for the composition of the adhesive, which is as follows:

[0067] The adhesive comprises, by weight, 100 parts of an acrylate polymer, 0.2 parts of an epoxy crosslinking agent (purchased from Soken Chemical, model NE-100C), 3 parts of a photoinitiator TMO, 2450.2 parts of an antioxidant, and 35 parts of a solvent, ethyl acetate.

[0068] Comparative Example 1

[0069] The adhesive is basically the same as Example 1, except that: the adhesive, calculated by weight, includes 100 parts of an acrylate polymer, 10 parts of a multifunctional monomer trimethylolpropane triacrylate, 0.2 parts of an epoxy crosslinker (purchased from Soken Chemical, model NE-100C), 2 parts of a photoinitiator TMO, 0.2 parts of an antioxidant 2450.2 parts, and 35 parts of a solvent ethyl acetate.

[0070] Comparative Example 2

[0071] The process is basically the same as Example 1, except that the epoxy cross-linking agent is replaced by an isocyanate cross-linking agent (Anzo Chemical, model number H088).

[0072] Comparative Example 3

[0073] The process is basically the same as Example 1, except that no antioxidant is added.

[0074] Test Example 1

[0075] The UV adhesives of Examples 1-4 and Comparative Examples 1-3 were tested for their 180° peel strength at room temperature, 180° peel strength at high temperature, and whether residual adhesive appeared after high temperature.

[0076] 180° peel strength at room temperature: The sample strip width is 25mm. Use a 2kg roller at a speed of 300mm / min to stick the sample on the SUS steel plate / glass, roll back and forth three times, and let it stand at room temperature for 20 minutes. The tensile testing machine parameters are: tensile speed is 300mm / min, and the distance is 150mm.

[0077] High-temperature 180° peel strength: The sample is 25 mm wide and is attached to a SUS steel plate / glass using a 2 kg roller at a speed of 300 mm / min. The sample is rolled back and forth three times and heated at 250°C for 10 min. Tensile testing machine parameters: tensile speed 300 mm / min, distance 150 mm.

[0078] High-temperature adhesive residue: The sample strip is 25 mm wide and is attached to a SUS steel plate or glass. It is heated at 250°C for 10 minutes and then cooled to room temperature. After debonding, the residual adhesive is observed. Debonding parameters: LED device debonding, power 80%, time 25 seconds, debonding energy 9000 mJ / cm 2 ;

[0079] Table 1 shows the relevant test results:

[0080] Table 1

[0081]

[0082] As shown in Table 1, the high-temperature-resistant UV-resistant adhesive of the examples exhibits low post-UV adhesion to steel and glass, with no residual adhesive residue, after being debonded by baking at 250°C for 10 minutes. A comparison of Examples 1 and 2 shows that increasing the crosslinker ratio increases the degree of crosslinking and reduces post-UV peel strength. A comparison of Examples 1 and 3 shows that increasing the antioxidant ratio increases the non-UV portion and slightly reduces pre-UV peel strength. This antioxidant inhibits free radical chain reactions at high temperatures, delays polymer thermal decomposition, and leaves no residual adhesive residue after UV treatment. A comparison of Examples 1 and 4 shows that increasing the photoinitiator ratio increases the degree of crosslinking and reduces post-UV peel strength.

[0083] Comparison of Example 1 and Comparative Example 1 shows that the acrylate polymer and the multifunctional monomer trimethylolpropane triacrylate have a higher risk of adhesive residue due to excessive cross-linking and residual small molecules, and serious adhesive residue will be left on steel plates and glass after high temperature.

[0084] Comparing Example 1 and Comparative Example 2 shows that traditional isocyanate crosslinkers have poor heat resistance and are easily decomposed during high-temperature baking, resulting in post-UV viscosity reduction failure and residual adhesive on steel plates and glass. The epoxy crosslinker molecular segments have high thermal stability, ensuring that the UV-cured adhesive layer maintains its performance during subsequent high-temperature baking.

[0085] Comparison of Example 1 and Comparative Example 3 shows that when no antioxidant is added, high temperature will lead to excessive cross-linking or molecular chain breakage, resulting in the adhesive layer still having high viscosity after UV irradiation and residual adhesive appearing after high temperature treatment.

[0086] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A high temperature resistant UV adhesive tape, characterized in that: The adhesive layer comprises a substrate layer, a release layer disposed on the substrate layer, and an adhesive layer disposed between the substrate layer and the release layer, wherein the adhesive layer is prepared from an adhesive; the adhesive comprises, by weight, 100 parts of an acrylate polymer, 0.1-2 parts of a cross-linking agent, 1-3 parts of a photoinitiator, 0.2-0.8 parts of an antioxidant, and 35-100 parts of a first solvent; The acrylate polymer comprises, by weight, 70-80 parts of soft monomer, 20-30 parts of hard monomer, 5-10 parts of multifunctional monomer, 0.1-1 parts of initiator, 0.05-0.2 parts of polymerization inhibitor, 1-7 parts of end-capping agent and 100-200 parts of second solvent.

2. The high temperature resistant UV adhesive tape according to claim 1, characterized in that: The preparation of the acrylic acid ester polymer comprises the following steps: S1, adding 1 / 3-2 / 3 of the soft monomer, 1 / 3-2 / 3 of the hard monomer, 1 / 3-2 / 3 of the multifunctional monomer and 1 / 3-2 / 3 of the second solvent to a reaction vessel, and passing nitrogen at 55° C.-65° C. for 20 min-40 min; then dropwise adding 1 / 3-2 / 3 of the initiator and the remaining soft monomer, the remaining hard monomer, and the remaining multifunctional monomer to the reaction vessel, and reacting for 3 h-5 h after the dropwise addition is completed; finally, adding the remaining initiator and continuing the reaction for 4 h-8 h to obtain a mixture; S2. Air is introduced into the mixture for 20-40 minutes, and then an inhibitor is added to react for 55-65 minutes. Finally, a capping agent and the remaining second solvent are added, and the mixture is reacted at 55-65° C. for 2-4 hours to obtain the acrylate polymer.

3. The high temperature resistant UV adhesive tape according to claim 1, characterized in that: The cross-linking agent is selected from amino cross-linking agents and / or epoxy cross-linking agents; The photoinitiator is selected from one or more of photoinitiator TPO, photoinitiator TMO and photoinitiator BDK; The antioxidant is selected from one or more of antioxidant 245, antioxidant 1010, antioxidant 1076 and antioxidant 168.

4. The high temperature resistant UV adhesive tape according to claim 1, characterized in that: The soft monomer is selected from one or more of methyl acrylate, ethyl acrylate, lauryl acrylate, 2-ethylhexyl acrylate and isooctyl acrylate; The hard monomer is selected from one or more of methyl methacrylate, bornyl methacrylate and alkyl methacrylate; The multifunctional monomer is selected from one or more of epoxy acrylate, 1,6-hexanediol diacrylate, dipentaerythritol hexaacrylate and pentaerythritol triacrylate; The initiator is selected from one or more of benzoyl peroxide (BPO), azobisisobutyronitrile (AIBN), dilauroyl peroxide (LPO), tert-amyl peroxide-2-ethylhexanoate (TAPO), tert-amyl peroxide-2-ethylhexanoate (TAPO) and dihydroxycyclohexane peroxide (BHCP); The polymerization inhibitor is selected from one or more of hydroquinone, p-hydroxyanisole and di-tert-butyl-p-cresol; The end-capping agent is selected from one or more of isooctanoic acid, 4-phenylethynylaniline and methyl ethyl ketone oxime.

5. The high temperature resistant UV adhesive tape according to claim 1, characterized in that: The first solvent and the second solvent are independently selected from one or more of toluene, methylcyclohexane, cyclohexanone, acetylacetone, methyl isobutyl ketone, butanone, ethyl acetate, butyl acetate and n-heptane.

6. The high temperature resistant UV adhesive tape according to claim 1, characterized in that: The substrate layer is a polyethylene naphthalate (PEN) film.

7. The high temperature resistant UV adhesive tape according to claim 1, characterized in that: The release layer is a polyethylene terephthalate (PET) film.

8. The high temperature resistant UV adhesive tape according to claim 1, characterized in that: The thickness of the substrate layer is 25 μm-100 μm; The thickness of the adhesive layer is 10 μm-40 μm; The thickness of the release layer is 25 μm-75 μm.

9. The method for preparing the high temperature resistant UV adhesive tape according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, uniformly mixing an acrylate polymer, a cross-linking agent, a photoinitiator, an antioxidant, and a first solvent to obtain an adhesive; S2. Apply the adhesive described in S1 on the substrate layer, volatilize the solvent to form a release layer, and then cure to obtain the high-temperature resistant UV-resistant adhesive tape.

10. The method for preparing the high temperature resistant UV adhesive tape according to claim 9, characterized in that: In S2, the solvent volatilization treatment is performed at a temperature of 110°C to 125°C for a time of 2 minutes to 6 minutes; The aging temperature is 40° C.-50° C., and the number of days is 2-4 days.

Images