High-gain diamond logic phase inverter and preparation method thereof
By forming hydrogen terminals on a diamond substrate and depositing a ferroelectric dielectric layer, combined with photolithography and plasma treatment, a high-gain diamond logic inverter was prepared. This solves the problem of insufficient voltage gain in the existing technology and achieves high voltage gain of the logic inverter in the deep subthreshold region, meeting the needs of high-density integrated circuits.
Patent Information
- Application Number
- CN202510863171.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2025-10-10
AI Technical Summary
The voltage gain of existing diamond-based logic inverters is small, which cannot meet the needs of high-density and high-performance integrated circuits, and there is a lack of reliable methods to regulate the conductivity of hydrogen-terminated diamond surfaces.
Hydrogen plasma treatment is used to form a hydrogen-terminated diamond substrate, and the ferroelectric dielectric layer is deposited at low temperature using an electron beam evaporation process. The drive and load transistor structures are formed through a photolithography process, and oxygen plasma treatment is used to regulate the surface conductivity to achieve current matching.
It achieves high voltage gain of logic inverter in the deep subthreshold region, breaks through the Boltzmann limit, meets the needs of high-density integrated circuits, and is compatible with standard CMOS processes.