Circuit board defect detection system and method

By dividing the area to be inspected on the circuit board and analyzing its feature information, combined with the optimal selection of spectral channels and high-precision detection technology, the problems of wasted computing resources and detection delay in circuit board defect detection are solved, and efficient and accurate defect detection is achieved.

CN121661027APending Publication Date: 2026-03-13HANGZHOU HANGDING ELECTRONIC PROD CO LTD
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Patent Information

Application Number
CN202511862679.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-11
Publication Date
2026-03-13

AI Technical Summary

Technical Problem

Existing circuit board defect detection technologies consume a lot of computational resources in full image processing, resulting in high detection latency and making it difficult to meet the real-time requirements of high-speed production.

Method used

The system employs a spectral image input module, a spectral feature extraction module, a regional importance calculation module, and a precise detection output module. By dividing the area to be inspected on the circuit board, it acquires spectral image parameters, circuit board design information, and process execution history data. It then performs regional importance calculation and coupling analysis to achieve regional importance classification. Combined with optimal spectral channel selection and high-precision detection technology, it enables precise defect detection.

Benefits of technology

Significantly reduces computational load, shortens detection latency, meets the real-time requirements of high-speed production, improves the dynamic balance between detection accuracy and efficiency, ensures the defect detection rate in core areas, and simplifies processes in non-core areas.

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Abstract

The invention relates to the technical field of image processing, in particular to a circuit board defect detection system and method. According to the method, a plurality of detection sub-regions are obtained through division, and spectral image parameters, circuit board design information and process execution historical data are obtained based on circuit board feature information of each region; further obtaining pixel intensity ratio anomaly, function influence degree and historical defect frequency factors, and performing coupling analysis to obtain circuit board region evaluation information to realize region importance grading; the resource waste caused by full-region non-difference detection is avoided, the calculation load is greatly reduced, the detection delay is shortened, and the real-time requirement of high-speed production is met; according to the method, lightweight feature extraction is carried out on multispectral imaging information to obtain a fused multispectral image, the defect detection rate of a core area is guaranteed, the process of a non-core area is simplified through lightweight processing and low-standard detection, the dynamic balance of detection precision and efficiency is improved, and the overall detection quality is improved.
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