Glass powder, dielectric paste and thick film heating body

By adjusting the formulation of glass powder and dielectric slurry, the problem of mismatch between the thermal expansion coefficients of the dielectric layer and SUS630 stainless steel was solved, thereby improving the density and electrical properties of the dielectric layer, making it suitable for SUS630 stainless steel thick film heating devices.

CN121974567APending Publication Date: 2026-05-05SUZHOU ISILVER MATERIALS
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Patent Information

Application Number
CN202511973889.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-25
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

The dielectric slurry of existing thick-film heating elements does not take into account the matching of the coefficient of thermal expansion with SUS630 stainless steel, which leads to coating cracking and affects adhesion and electrical properties.

Method used

A dense dielectric layer is formed by using a specific ratio of glass powder and dielectric slurry, including raw materials such as B2O3, MgO, CaO, and SiO2, and adding inorganic oxide additives to adjust the coefficient of thermal expansion to match SUS630 stainless steel.

Benefits of technology

The dielectric layer has a thermal expansion coefficient that matches that of stainless steel, preventing cracking, improving adhesion and electrical properties, and providing excellent printability and breakdown voltage resistance.

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Abstract

The invention provides glass powder, dielectric paste and a thick film heating body. The glass powder is prepared from the following raw materials in percentage by weight: 15 to 40 percent of B2O3, 15 to 40 percent of MgO, 20 to 50 percent of CaO, 7 to 20 percent of SiO2 and 0.1 to 8 percent of glass powder additive, wherein the total weight of the raw materials of the glass powder is 100 percent. Based on the total weight of the dielectric paste being 100%, the dielectric paste comprises 55-80% of the glass powder, 0-5% of cobalt blue, 8-35% of an organic carrier, 3-15% of a diluent, 0.5-3% of an inorganic additive and 0.2-1% of an auxiliary agent. The invention also provides a thick film heating body prepared from the dielectric paste. A dielectric layer formed by the dielectric paste is compact, free of cracking, high in binding force with stainless steel, good in breakdown voltage resistance and excellent in electrical property.
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