Jet flow washing type liquid cooling radiator and electronic equipment
By using a jet-fluid liquid cooling radiator, which utilizes jet modules and a honeycomb heat dissipation groove structure, the problems of excessive size and noise in high-power chip heat sinks are solved, achieving efficient and quiet cooling.
Patent Information
- Application Number
- CN202610470877.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-10
- Publication Date
- 2026-05-29
AI Technical Summary
Existing technologies for heat sinks of high-power chips suffer from excessive size and noise, especially air-cooled and plate heat sinks, which require large equipment size, fan power, and noise to ensure efficient heat dissipation.
The system employs a jet-fluid liquid cooling radiator, which injects low-temperature coolant into the heat sink through a jet module. The coolant in the heat sink absorbs heat and then discharges it. Combined with the honeycomb-shaped heat sink and heat sink fins, the system increases the contact area of the coolant, reduces cooling loss, and eliminates the need for a cooling fan to achieve silent operation.
It improves cooling efficiency, reduces system energy consumption and size, and lowers noise, achieving high-intensity heat dissipation and quiet operation.