A manufacturing process for headphone speakers

Abstract

This invention discloses a manufacturing process for an earphone speaker, comprising sequentially performing a magnetic circuit assembly process, a bass driver assembly process, a tweeter assembly process, and a high-low frequency combination process. The magnetic circuit assembly process includes a bass magnetic circuit assembly process, a tweeter lower magnetic circuit assembly process, and a tweeter upper magnetic circuit assembly process. The bass magnetic circuit assembly process includes sequentially performing an inner magnetic circuit assembly, an outer magnetic circuit assembly, and an inner and outer magnetic circuit combination process. The tweeter lower magnetic circuit assembly process includes sequentially performing a center magnetic circuit assembly and a tweeter lower magnetic circuit combination process. The high-low frequency combination process includes the following steps: driver loading: loading the tweeter and bass driver; assembly: combining and interlocking the tweeter bracket of the tweeter and the bass bracket of the bass driver to form an earphone speaker unit. Through modular step-by-step assembly, full-process precision testing, and automated solidification control, it achieves efficient, high-precision, and high-stability manufacturing of a coaxial high-low frequency dual-unit earphone speaker.

Description

Technical Field

[0001] This invention relates to the field of electroacoustic conversion equipment manufacturing technology, and in particular to a manufacturing process for an earphone speaker. Background Technology

[0002] The headphone speaker is a core electroacoustic component of an audio terminal. Its assembly precision, structural consistency, and magnetic circuit stability directly determine sound quality, frequency response, distortion, and lifespan. With the increasing demand for miniaturization, high fidelity, and coaxial dual-frequency sound in consumer electronics, coaxial dual-driver headphone speakers with both high and low frequencies have become the mainstream structure. However, existing manufacturing processes generally suffer from the following defects: 1. Chaotic magnetic circuit assembly process: The inner and outer magnetic circuits of the bass are not assembled in a standardized step-by-step manner, and the upper and lower magnetic circuits of the tweeter are processed independently without a unified process. The timing of magnetization and the assembly sequence are unreasonable, which can easily cause uneven magnetic field distribution, large deviation of magnetic circuit concentricity, and cause voice coil rubbing, nonlinear distortion, and sensitivity fluctuation.

[0003] 2. Insufficient precision in driver assembly: The lack of refined control in the voice coil winding, spot welding, glue application, curing, and testing of the woofer and tweeter drivers leads to poor solder joint conductivity, uneven glue layer thickness, and insufficient curing, resulting in poor acoustic consistency and low yield.

[0004] 3. Poor matching of high and low frequencies: The high and low frequency drivers are not precisely positioned or sealed, resulting in large gaps, phase shifts, harsh transitions between high and low frequencies, and sound field separation, resolution, and imaging capabilities that fail to meet the requirements of high-end audio.

[0005] 4. Lack of automation and online inspection: Key processes lack visual inspection, rapid curing, and online acoustic testing, resulting in low production efficiency, uncontrollable processes, and an inability to achieve large-scale, high-quality, and stable manufacturing.

[0006] In summary, existing headphone speaker manufacturing processes cannot simultaneously meet the requirements of assembly precision, acoustic performance, production efficiency, and product consistency, thus hindering the industrial application of high-end coaxial dual-unit headphone speakers. Therefore, it is necessary to develop a new technology to solve the above problems. Summary of the Invention

[0007] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a manufacturing process for headphone speakers. This process achieves efficient, high-precision, and high-stability manufacturing of coaxial high and low frequency dual-unit headphone speakers through modular step-by-step assembly, precision testing throughout the entire process, and automated solidification control.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: A manufacturing process for an earphone speaker includes a magnetic circuit assembly process, a woofer assembly process, a tweeter assembly process, and a tweeter-woofer combination process performed sequentially. The magnetic circuit assembly process includes a bass magnetic circuit assembly process, a treble lower magnetic circuit assembly process, and a treble upper magnetic circuit assembly process. The bass magnetic circuit assembly process includes sequentially performing inner magnetic circuit assembly, outer magnetic circuit assembly, and inner and outer magnetic combination. In the internal magnetic circuit assembly, the bass inner pole piece is assembled on one side of the bass inner magnet, and the other side of the bass inner magnet is assembled on one side of the bass magnetic cover to form the internal magnetic circuit. In the external magnetic circuit assembly, the bass outer pole piece is assembled on one side of the bass outer magnet to form an external magnetic circuit and the external magnetic circuit is magnetized; In the inner and outer magnetic combination, the inner magnetic circuit is magnetized, and then the bass outer magnet of the outer magnetic circuit is assembled on one side of the bass magnetic cover, and the outer magnetic circuit surrounds the bass inner pole piece and the bass inner magnet to form the bass magnetic circuit. The high-frequency lower magnetic circuit assembly process includes sequentially performing the central magnetic circuit assembly and the high-frequency lower magnetic circuit combination. In the central magnetic circuit assembly, the lower inner magnet is assembled on one side of the tweeter magnetic cover to form the central magnetic circuit; In the aforementioned high-frequency lower magnetic circuit assembly, the central magnetic circuit and the lower outer magnet are magnetized respectively, and then the lower outer magnet is assembled on one side of the high-frequency magnetic cover, with the lower outer magnet surrounding the lower inner magnet to form the high-frequency lower magnetic circuit; In the process of assembling the upper magnetic circuit of the tweeter, the upper outer magnet is assembled on the T-iron to form the upper magnetic circuit of the tweeter; The bass driver assembly process includes the following steps: Install the voice coil: Assemble the bass voice coil onto the bass mount; Diaphragm assembly: Assemble the bass diaphragm onto one side of the bass bracket and connect one end of the bass voice coil to the bass diaphragm to form a semi-finished product; Magnetic circuit assembly: The bass magnetic circuit, which is produced by the bass magnetic circuit assembly process, is assembled on the other side of the semi-finished bass bracket, and the other end of the bass voice coil is inserted between the bass inner magnet and the bass outer magnet of the bass magnetic circuit. Install damping mesh: Install damping mesh at the sound hole of the bass bracket to form a bass driver; The tweeter assembly process includes the following steps: Diaphragm assembly: The tweeter voice coil is assembled onto the tweeter diaphragm to form a diaphragm assembly; Bracket loading: Load the tweeter bracket, and then assemble the diaphragm assembly onto the tweeter bracket; Install the upper magnet circuit of the tweeter: Assemble the upper magnet circuit of the tweeter onto one side of the tweeter bracket; Install the lower magnetic circuit for the tweeter: Assemble the lower magnetic circuit for the tweeter onto the other side of the tweeter bracket to form the tweeter driver; The high and low frequency combination process includes the following steps: Unit loading: Loading the tweeter and woofer; Assembly: The tweeter bracket of the tweeter unit and the woofer bracket of the woofer unit are interlocked to form the headphone speaker unit.

[0009] As a preferred embodiment, the internal magnetic circuit assembly includes the following steps: First, load the bass inner electrode sheet, apply glue to the bass inner electrode sheet, then load the bass inner magnet, attach the glued side of the bass inner electrode sheet to one side of the bass inner magnet, apply glue to the other side of the bass inner magnet, load the bass magnet cover, then attach the glued side of the bass inner magnet to one side of the bass magnet cover, bake to obtain the inner magnetic circuit, and finally collect the inner magnetic circuit. The external magnetic circuit assembly includes the following steps: First, load the bass outer pole piece, apply glue to the bass outer pole piece, then load the bass outer magnet, and attach the glued side of the bass outer pole piece to one side of the bass outer magnet to form the outer magnetic circuit. Then, magnetize the outer magnetic circuit. The internal and external magnetic combination includes the following steps: First, the inner magnetic circuit is loaded and magnetized. Then, glue is applied to the other side of the bass outer magnet of the outer magnetic circuit. After glue application, CCD detection is performed. Then, the other side of the glued bass outer magnet of the outer magnetic circuit is attached to one side of the bass magnet cover, so that the outer magnetic circuit surrounds the bass inner pole piece and the bass inner magnet. The inner and outer magnetic circuits are combined. Finally, concentricity CCD detection is performed before the disc is closed.

[0010] As a preferred embodiment, the central magnetic circuit assembly includes the following steps: First, the lower inner magnet is loaded, glue is applied to the lower inner magnet, then the tweeter magnet is loaded, the glued side of the lower inner magnet is attached to one side of the tweeter magnet, and then baked to obtain the center magnetic circuit. Finally, the center magnetic circuit is collected. The high-frequency magnetic circuit assembly includes the following steps: First, the center magnetic circuit is loaded and magnetized. Then, the lower outer magnetic circuit is loaded and magnetized. Next, adhesive is applied to the lower outer magnetic circuit, followed by adhesive CCD detection. Then, the adhesive-coated side of the lower outer magnetic circuit is attached to one side of the tweeter magnet cover, and the lower outer magnetic circuit is placed around the lower inner magnetic circuit. The tweeter lower magnetic circuit assembly is completed. Finally, the tweeter lower magnetic circuit is put away.

[0011] As a preferred embodiment, the tweeter upper magnetic circuit assembly process includes the following steps: First, the upper outer magnet is loaded and magnetized. Then, glue is applied to the upper outer magnet, followed by glue application CCD detection. Next, the T-iron is loaded, and then the glued side of the upper outer magnet is attached to one side of the T-iron. The tweeter upper magnet assembly is now complete. Finally, the tweeter upper magnet assembly is finished.

[0012] As a preferred embodiment, the bass driver assembly process includes the following steps in the voice coil mounting step: First, load the bass bracket, apply solder paste to the injection-molded metal parts on the bass bracket, then wind the bass voice coil, and assemble the bass voice coil onto the bass bracket. Next, check the lead curvature of the bass voice coil and the state of the solder paste on the bass bracket. Then, spot solder the bass voice coil leads to the injection-molded metal parts on the bass bracket, cut the wires and remove any excess wires. Then, perform a CCD check on the spot soldering, followed by a continuity test and automatic lead crimping. Then, apply solder joint adhesive and check the solder joint adhesive, followed by UV curing of the solder joint adhesive. Next, apply lead wire adhesive and UV cure the lead wire adhesive. Finally, apply bracket adhesive to one side of the bass bracket, and then perform a CCD check on the solder joint adhesive, lead wire adhesive, and bracket adhesive.

[0013] As a preferred embodiment, the bass driver assembly process includes the following steps in the diaphragm mounting step: First, apply center adhesive to the bass diaphragm and perform a CCD check on the center adhesive. Then, flip the bass diaphragm and fasten it to the bass bracket, so that one side of the bass diaphragm is attached to the bracket adhesive on one side of the bass bracket, and one end of the bass voice coil is attached to the center adhesive of the bass diaphragm. Then, apply pressure and UV curing to cure the center adhesive and bracket adhesive, and then apply UV curing to the bracket adhesive to form a semi-finished product.

[0014] As a preferred embodiment, the bass driver assembly process includes the following steps in the magnetic circuit assembly step: First, the semi-finished product obtained in the diaphragm assembly process of the bass unit is flipped over. Then, the center adhesive is UV cured a second time, and the concentricity of the bass voice coil is checked by CCD. Next, the bass magnetic circuit obtained in the bass magnetic circuit assembly process is mounted on the disc. Then, the bass magnetic circuit is automatically mounted on the other side of the bass bracket of the semi-finished product, and the other end of the bass voice coil is inserted between the bass inner magnet and the bass outer magnet of the bass magnetic circuit. The height of the bass magnetic cover is automatically measured, magnetic cover adhesive is applied, and then the magnetic cover adhesive is UV cured. The bass driver assembly process includes the following steps in the damping mesh installation step: First, the woofer assembly process involves placing the driver, after the magnetic circuit is completed, into a mesh attaching fixture. Then, damping meshes are attached to the sound holes on both sides of the woofer bracket. Next, the damping meshes undergo pressure holding and testing. Then, listening tests and curve tests are performed in sequence. Finally, visual inspection and mounting are carried out to obtain the woofer driver.

[0015] As a preferred embodiment, the tweeter assembly process includes the following steps in the diaphragm mounting step: First, apply center glue to the tweeter diaphragm, then perform a CCD check on the center glue, then wind the tweeter voice coil, and then fasten the tweeter voice coil to the tweeter diaphragm so that one end of the tweeter voice coil is attached to the center glue of the tweeter diaphragm. Then, check the tweeter voice coil, tweeter voice coil curvature, and center glue pressing to form the diaphragm assembly. The tweeter assembly process includes the following steps in the bracket loading step: First, load and flatten the tweeter bracket. Then, pre-apply solder paste to the injection-molded metal parts on the tweeter bracket. Next, apply bracket adhesive to the tweeter bracket and inspect the adhesive and solder paste using a video microscope. Then, flip the fixture containing the diaphragm assembly and attach the diaphragm assembly to one side of the tweeter bracket on the fixture containing the tweeter bracket, so that one side of the tweeter diaphragm of the diaphragm assembly is attached to the bracket adhesive on one side of the tweeter bracket. Then, spot solder the lead wire of the tweeter voice coil to the injection-molded metal parts on the tweeter bracket. Then, remove the fixture containing the diaphragm assembly, cut the wire and remove the excess wire. Then, inspect the spot soldering using a video microscope. Then, apply pressure and UV cure the bracket adhesive. Finally, perform a continuity test. The tweeter assembly process includes the following steps in the process of installing the tweeter's magnetic circuit: First, after the tweeter assembly process is completed, copper ring adhesive is applied to the tweeter bracket. The copper ring is then attached to the copper ring adhesive. Next, the copper ring adhesive and center adhesive are inspected under a video microscope. Then, the upper magnetic circuit of the tweeter, which is installed in the tooling, is fastened to one side of the tweeter bracket, so that the upper outer magnet of the upper magnetic circuit is attached to the copper ring adhesive on the copper ring. Then, the upper magnetic circuit of the tweeter is pushed out of the tooling. Solder joint adhesive is applied and UV cured. Then, sealant is applied to the upper magnetic circuit of the tweeter and CCD inspection is performed on the sealant. Finally, the upper magnetic circuit sealant of the tweeter is baked and cured after the tray is closed, forming a semi-finished product. The tweeter assembly process includes the following steps in the tweeter lower magnetic circuit assembly step: First, the semi-finished product obtained in the tweeter upper magnetic circuit assembly process is placed into the tooling. Then, the bracket adhesive is UV cured a second time. Next, the tweeter lower magnetic circuit is snapped onto the other side of the tweeter bracket, and a pre-curing adhesive for the tweeter lower magnetic circuit is applied. The pre-curing adhesive for the tweeter lower magnetic circuit is then UV cured. Then, a fixing adhesive for the tweeter lower magnetic circuit is applied, and the fixing adhesive for the tweeter lower magnetic circuit is inspected under a video microscope. The fixing adhesive is then UV cured again. Then, a reinforcing adhesive for the tweeter lower magnetic circuit is applied, and the reinforcing adhesive for the tweeter lower magnetic circuit is inspected by CCD and then sealed. The reinforcing adhesive for the tweeter lower magnetic circuit is then baked and cured. Then, a curve test is performed. Finally, an appearance inspection is performed and the tweeter is mounted to obtain the tweeter.

[0016] As a preferred embodiment, the high and low frequency combination process includes the following steps in the individual component loading step: First, the tweeter is loaded and flattened. Then, the mounting surface of the tweeter that matches the woofer is applied with bonding adhesive. The bonding adhesive is then checked by CCD. Finally, the woofer is loaded. The high and low frequency combination process involves first performing a pressure-holding UV curing treatment after the tweeter bracket of the tweeter unit and the woofer bracket of the woofer unit are interlocked, then removing the pressure-holding fixture and performing a second UV curing treatment, then laser engraving the logo, then ejecting the product and attaching a center hole mesh to the center hole of the tweeter bracket, then rewinding, and then performing listening tests, curve tests and impedance tests in sequence, and finally performing appearance inspection and rewinding to obtain the headphone speaker unit.

[0017] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution: This invention employs a multi-step molding process: inner magnetic circuit → outer magnetic circuit → inner and outer magnetic combination for bass, and lower magnetic circuit + upper magnetic circuit for treble. This clearly defines the magnetization and assembly sequence, ensuring concentricity and magnetic field uniformity from the outset, effectively preventing voice coil rubbing and excessive distortion. Combined with adhesive dispensing CCD detection and concentricity CCD detection, precise adhesive control and high assembly alignment are achieved, significantly improving magnetic circuit consistency, making the magnetic circuit system stable and reliable, and significantly enhancing magnetic field uniformity. This invention achieves full-process control over the woofer driver, including voice coil spot welding, continuity testing, UV curing, damping mesh mounting, and listening and curve testing. This ensures reliable solder joints, sufficient adhesive layer curing, stable low-frequency damping, deep low-frequency extension, and low distortion. The tweeter driver features precision molding of the diaphragm assembly, flattening of the bracket, copper ring positioning, and multiple sealing and curing processes, resulting in good high-frequency extension, strong resolution, and accurate phase. The quality of both the woofer and tweeter drivers is controllable, resulting in excellent acoustic performance. This invention utilizes an interlocking positioning structure for high and low frequency brackets, combined with adhesive curing, resulting in high assembly precision, excellent sealing, smooth transition between high and low frequency responses, and significantly improved sound field separation, imaging, and sound layering, meeting the demands of high-fidelity listening. The coaxial assembly also offers high precision and natural acoustic integration. The process steps of this invention are sequentially connected and modularized, making it suitable for automated production lines and significantly shortening the production cycle. Multiple steps are set up with CCD visual inspection, UV rapid curing, and online continuity / curve / impedance testing to remove defective products in real time. The process is highly controllable and significantly improves the yield rate and production stability of mass production. The process of this invention is compatible with most coaxial dual-unit headphone speaker structures, can be adapted to products of different sizes and specifications, facilitates production line reuse and product iteration, and has good industrial application value.

[0018] To more clearly illustrate the structural features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the magnetic circuit assembly process according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the low-frequency driver assembly process according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the tweeter assembly process according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the high and low frequency combination process according to an embodiment of the present invention; Figure 5 This is an exploded view of an earphone speaker according to an embodiment of the present invention; Figure 6 This is a cross-sectional schematic diagram of an earphone speaker according to an embodiment of the present invention.

[0020] Explanation of reference numerals in the attached diagram: 1. T-shaped bracket; 2. T-shaped iron; 3. Upper outer magnet; 4. Copper ring; 5. Tweeter diaphragm; 6. Tweeter voice coil; 7. Lower inner magnet; 8. Lower outer magnet; 9. Tweeter magnet cover; 10. Center mesh; 11. Woofer bracket; 12. Woofer diaphragm; 13. Woofer voice coil; 14. Woofer inner pole piece; 15. Woofer inner magnet; 16. Woofer outer pole piece; 17. Woofer outer magnet; 18. Woofer magnet cover; 19. Damping mesh; 20. Injection molded hardware. Detailed Implementation

[0021] In the description of this invention, it should be noted that if terms such as "center," "upper," "lower," "left," "right," "front," "back," "vertical," "horizontal," "inner," and "outer" appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0022] Please refer to Figures 1 to 6 As shown, it illustrates the specific structure of a headphone speaker manufacturing process provided by an embodiment of the present invention.

[0023] The manufacturing process of this headphone speaker includes, in sequence, the magnetic circuit assembly process, the woofer assembly process, the tweeter assembly process, and the woofer-woofer combination process; wherein: The magnetic circuit assembly process includes a bass magnetic circuit assembly process, a treble lower magnetic circuit assembly process, and a treble upper magnetic circuit assembly process; the bass magnetic circuit assembly process includes sequential inner magnetic circuit assembly, outer magnetic circuit assembly, and inner and outer magnetic circuit combination.

[0024] In the internal magnetic circuit assembly, the bass inner pole piece is assembled onto one side of the bass inner magnet, and the other side of the bass inner magnet is assembled onto one side of the bass magnet cover to form the internal magnetic circuit; specifically, in this embodiment: The internal magnetic circuit assembly includes the following steps: First, load the bass inner electrode sheet, apply glue to the bass inner electrode sheet, then load the bass inner magnet, attach the glued side of the bass inner electrode sheet to one side of the bass inner magnet, apply glue to the other side of the bass inner magnet, load the bass magnet cover, then attach the glued side of the bass inner magnet to one side of the bass magnet cover, bake to obtain the inner magnetic circuit, and finally collect the inner magnetic circuit.

[0025] In the external magnetic circuit assembly, the bass outer pole piece is assembled onto one side of the bass outer magnet to form an external magnetic circuit, and the external magnetic circuit is magnetized; specifically, in this embodiment: The external magnetic circuit assembly includes the following steps: First, the bass outer pole piece is loaded, glue is applied to the bass outer pole piece, then the bass outer magnet is loaded, and the glued side of the bass outer pole piece is attached to one side of the bass outer magnet to form the outer magnetic circuit. After the outer magnetic circuit is formed, it is magnetized.

[0026] In the aforementioned inner and outer magnetic assembly, the inner magnetic circuit is magnetized, and then the bass outer magnet of the outer magnetic circuit is assembled onto one side of the bass magnetic cover, with the outer magnetic circuit surrounding the bass inner pole piece and the bass inner magnet to form the bass magnetic circuit; specifically, in this embodiment: The internal and external magnetic combination includes the following steps: First, the inner magnetic circuit is loaded and magnetized. Then, glue is applied to the other side of the bass outer magnet of the outer magnetic circuit. After glue application, CCD detection is performed. Then, the other side of the glued bass outer magnet of the outer magnetic circuit is attached to one side of the bass magnet cover, so that the outer magnetic circuit surrounds the bass inner pole piece and the bass inner magnet. The inner and outer magnetic circuits are combined. Finally, concentricity CCD detection is performed before the disc is closed.

[0027] The high-frequency magnetic circuit assembly process includes sequential assembly of the center magnetic circuit and combination of the high-frequency magnetic circuit.

[0028] In the central magnetic circuit assembly, the lower inner magnet is assembled onto one side of the tweeter magnet cover to form the central magnetic circuit; specifically, in this embodiment: The central magnetic circuit assembly includes the following steps: First, the lower inner magnet is loaded, glue is applied to the lower inner magnet, then the tweeter magnet is loaded, the glued side of the lower inner magnet is attached to one side of the tweeter magnet, and then baked to obtain the center magnetic circuit. Finally, the center magnetic circuit is collected.

[0029] In the aforementioned high-frequency lower magnetic circuit assembly, the central magnetic circuit and the lower outer magnet are respectively magnetized, and then the lower outer magnet is assembled onto one side of the tweeter magnetic cover, with the lower outer magnet surrounding the lower inner magnet to form the high-frequency lower magnetic circuit; specifically, in this embodiment: The high-frequency magnetic circuit assembly includes the following steps: First, the center magnetic circuit is loaded and magnetized. Then, the lower outer magnetic circuit is loaded and magnetized. Next, adhesive is applied to the lower outer magnetic circuit, followed by adhesive CCD detection. Then, the adhesive-coated side of the lower outer magnetic circuit is attached to one side of the tweeter magnet cover, and the lower outer magnetic circuit is placed around the lower inner magnetic circuit. The tweeter lower magnetic circuit assembly is completed. Finally, the tweeter lower magnetic circuit is put away.

[0030] In the aforementioned tweeter upper magnetic circuit assembly process, the upper outer magnet is assembled onto the T-iron to form the tweeter upper magnetic circuit; specifically, in this embodiment: The assembly process of the upper magnetic circuit for the tweeter includes the following steps: First, the upper outer magnet is loaded and magnetized. Then, glue is applied to the upper outer magnet, followed by glue application CCD detection. Next, the T-iron is loaded, and then the glued side of the upper outer magnet is attached to one side of the T-iron. The tweeter upper magnet assembly is now complete. Finally, the tweeter upper magnet assembly is finished.

[0031] The bass driver assembly process includes the following steps: Install the voice coil: Assemble the bass voice coil onto the bass mount; Diaphragm assembly: Assemble the bass diaphragm onto one side of the bass bracket and connect one end of the bass voice coil to the bass diaphragm to form a semi-finished product; Magnetic circuit assembly: The bass magnetic circuit, which is produced by the bass magnetic circuit assembly process, is assembled on the other side of the semi-finished bass bracket, and the other end of the bass voice coil is inserted between the bass inner magnet and the bass outer magnet of the bass magnetic circuit. Install damping mesh: Install damping mesh at the sound hole of the bass bracket to form a bass driver.

[0032] Specifically, in this embodiment, the bass driver assembly process includes the following steps in the voice coil mounting step: First, load the bass bracket, apply solder paste to the injection-molded metal parts on the bass bracket, then wind the bass voice coil, and assemble the bass voice coil onto the bass bracket. Next, check the lead curvature of the bass voice coil and the state of the solder paste on the bass bracket. Then, spot solder the bass voice coil leads to the injection-molded metal parts on the bass bracket, cut the wires and remove any excess wires. Then, perform a CCD check on the spot soldering, followed by a continuity test and automatic lead crimping. Then, apply solder joint adhesive and check the solder joint adhesive, followed by UV curing of the solder joint adhesive. Next, apply lead wire adhesive and UV cure the lead wire adhesive. Finally, apply bracket adhesive to one side of the bass bracket, and then perform a CCD check on the solder joint adhesive, lead wire adhesive, and bracket adhesive.

[0033] The woofer assembly process includes the following steps in the diaphragm mounting step: First, apply center adhesive to the bass diaphragm and perform a CCD check on the center adhesive. Then, flip the bass diaphragm and fasten it to the bass bracket, so that one side of the bass diaphragm is attached to the bracket adhesive on one side of the bass bracket, and one end of the bass voice coil is attached to the center adhesive of the bass diaphragm. Then, apply pressure and UV curing to cure the center adhesive and bracket adhesive, and then apply UV curing to the bracket adhesive to form a semi-finished product.

[0034] The woofer assembly process includes the following steps in the magnetic circuit assembly step: First, the semi-finished product obtained in the diaphragm assembly process of the bass unit is flipped over. Then, the center adhesive is UV cured a second time, and the concentricity of the bass voice coil is checked by CCD. Next, the bass magnetic circuit obtained in the bass magnetic circuit assembly process is mounted on the disc. Then, the bass magnetic circuit is automatically mounted on the other side of the bass bracket of the semi-finished product, and the other end of the bass voice coil is inserted between the bass inner magnet and the bass outer magnet of the bass magnetic circuit. The height of the bass magnetic cover is automatically measured, magnetic cover adhesive is applied, and then the magnetic cover adhesive is UV cured. The bass driver assembly process includes the following steps in the damping mesh installation step: First, the woofer assembly process involves placing the driver, after the magnetic circuit is completed, into a mesh attaching fixture. Then, damping meshes are attached to the sound holes on both sides of the woofer bracket. Next, the damping meshes undergo pressure holding and testing. Then, listening tests and curve tests are performed in sequence. Finally, visual inspection and mounting are carried out to obtain the woofer driver.

[0035] The tweeter assembly process includes the following steps: Diaphragm assembly: The tweeter voice coil is assembled onto the tweeter diaphragm to form a diaphragm assembly; Bracket loading: Load the tweeter bracket, and then assemble the diaphragm assembly onto the tweeter bracket; Install the upper magnet circuit of the tweeter: Assemble the upper magnet circuit of the tweeter onto one side of the tweeter bracket; Install the lower magnetic circuit for the tweeter: Assemble the lower magnetic circuit for the tweeter onto the other side of the tweeter bracket to form the tweeter unit.

[0036] Specifically, in this embodiment: The tweeter assembly process includes the following steps in the diaphragm mounting step: First, apply center glue to the tweeter diaphragm, then perform a CCD check on the center glue. Next, wind the tweeter voice coil, then fasten the tweeter voice coil to the tweeter diaphragm, so that one end of the tweeter voice coil is attached to the center glue of the tweeter diaphragm. Then, check the tweeter voice coil, tweeter voice coil curvature, and center glue pressing to form the diaphragm assembly.

[0037] The tweeter assembly process includes the following steps in the bracket loading step: First, load and flatten the tweeter bracket. Then, pre-apply solder paste to the injection-molded metal parts on the tweeter bracket. Next, apply bracket adhesive to the tweeter bracket and inspect the adhesive and solder paste using a video microscope. Then, flip the fixture containing the diaphragm assembly and attach the diaphragm assembly to one side of the tweeter bracket on the fixture containing the tweeter bracket, so that one side of the tweeter diaphragm of the diaphragm assembly is attached to the bracket adhesive on one side of the tweeter bracket. Then, spot solder the lead wire of the tweeter voice coil to the injection-molded metal parts on the tweeter bracket. Then, remove the fixture containing the diaphragm assembly, cut the wire and remove the excess wire, then inspect the spot soldering using a video microscope. Finally, apply pressure and UV cure the bracket adhesive, and then perform a continuity test.

[0038] The tweeter assembly process includes the following steps in the process of installing the tweeter's magnetic circuit: First, after the tweeter unit assembly process is completed, copper ring adhesive is applied to the tweeter bracket. The copper ring is then attached to the copper ring adhesive, and the copper ring adhesive and center adhesive are inspected under a video microscope. Next, the tweeter's upper magnetic circuit, which is installed in the tooling, is snapped onto one side of the tweeter bracket, so that the upper outer magnet of the tweeter's upper magnetic circuit is attached to the copper ring adhesive on the copper ring. Then, the tweeter's upper magnetic circuit is pushed out of the tooling. Solder joint adhesive is then applied and UV cured. Subsequently, sealant is applied to the tweeter's upper magnetic circuit and CCD inspection is performed on the tweeter's upper magnetic circuit sealant. Finally, the tweeter's upper magnetic circuit sealant is baked and cured after the tray is closed, forming a semi-finished product.

[0039] The tweeter assembly process includes the following steps in the tweeter lower magnetic circuit assembly step: First, the semi-finished product obtained in the tweeter upper magnetic circuit assembly process is placed into the tooling. Then, the bracket adhesive is UV cured a second time. Next, the tweeter lower magnetic circuit is snapped onto the other side of the tweeter bracket, and a pre-curing adhesive for the tweeter lower magnetic circuit is applied. The pre-curing adhesive for the tweeter lower magnetic circuit is then UV cured. Then, a fixing adhesive for the tweeter lower magnetic circuit is applied, and the fixing adhesive for the tweeter lower magnetic circuit is inspected under a video microscope. The fixing adhesive is then UV cured again. Then, a reinforcing adhesive for the tweeter lower magnetic circuit is applied, and the reinforcing adhesive for the tweeter lower magnetic circuit is inspected by CCD and then sealed. The reinforcing adhesive for the tweeter lower magnetic circuit is then baked and cured. Then, a curve test is performed. Finally, an appearance inspection is performed and the tweeter is mounted to obtain the tweeter.

[0040] The high and low frequency combination process includes the following steps: Unit loading: Loading the tweeter and woofer; Assembly: The tweeter bracket of the tweeter unit and the woofer bracket of the woofer unit are interlocked to form the headphone speaker unit.

[0041] Specifically, in this embodiment, the high and low frequency combination process includes the following steps in the individual component loading step: First, the tweeter is loaded and flattened. Then, a bonding adhesive is applied to the mounting surface of the tweeter that mates with the woofer. The bonding adhesive is then inspected using a CCD. Finally, the woofer is loaded.

[0042] The high and low frequency combination process involves first performing a pressure-holding UV curing treatment after the tweeter bracket of the tweeter unit and the woofer bracket of the woofer unit are interlocked, then removing the pressure-holding fixture and performing a second UV curing treatment, then laser engraving the logo, then ejecting the product and attaching a center hole mesh to the center hole of the tweeter bracket, then rewinding, and then performing listening tests, curve tests and impedance tests in sequence, and finally performing appearance inspection and rewinding to obtain the headphone speaker unit.

[0043] like Figure 5 and Figure 6 As shown, the headphone speaker manufactured using this headphone speaker production process includes a tweeter and a woofer that are interlocked, wherein: The tweeter unit includes a tweeter bracket 1 and a T-iron 2, an upper outer magnet 3, a copper ring 4, a tweeter diaphragm 5, a tweeter voice coil 6, a lower inner magnet 7, a lower outer magnet 8, and a tweeter magnet cover 9, all mounted on the tweeter bracket 1. The tweeter voice coil 6 is connected to the tweeter diaphragm 5, which is mounted on one side of the tweeter bracket 1. The copper ring 4 is located above and abuts against the tweeter diaphragm 5. The upper outer magnet 3 is connected to the T-iron 2 and is located above and abuts against the copper ring 4. The lower inner magnet 7 is mounted on one side of the tweeter magnet cover 9, and the lower outer magnet 8 surrounds the lower inner magnet 7. The lower end of the lower outer magnet 8 abuts against one side of the tweeter magnet cover 9. The lower outer magnet 8 is mounted on the other side of the tweeter bracket 1. The tweeter bracket 1 is provided with injection-molded hardware 20 and has a central hole with a central hole mesh 10 attached thereto.

[0044] The bass unit includes a bass bracket 11 and a bass diaphragm 12, a bass voice coil 13, a bass inner electrode 14, a bass inner magnet 15, a bass outer electrode 16, a bass outer magnet 17, and a bass magnet cover 18 mounted on the bass bracket 11. The bass voice coil 13 is connected to the bass diaphragm 12, the bass diaphragm 12 is mounted on one side of the bass bracket 11, the bass inner magnet 15 is mounted on one side of the bass magnet cover 18, the bass inner electrode 14 is mounted on the upper side of the bass inner magnet 15, and the bass outer magnet 17 is mounted on one side of the bass magnet cover 18. The bass outer pole piece 16 is mounted on the upper side of the bass outer magnet 17 and surrounds the bass inner pole piece 14. The lower end of the bass voice coil 13 extends into the gap between the bass inner magnet 15 and the bass outer magnet 17. The bass outer magnet 17 is mounted on the other side of the bass bracket 11. The bass bracket 11 is provided with injection-molded hardware 20. The bass bracket 11 has sound holes on both sides, and damping mesh 19 is attached to the sound holes on both sides. The upper end of the bass bracket 11 is fastened to the mounting surface of the lower end of the tweeter bracket 1.

[0045] In summary, the key design features of this invention are: The bass magnetic circuit employs an independent, step-by-step molding process, with the inner magnetic circuit → outer magnetic circuit → inner and outer magnetic circuit combination; the tweeter magnetic circuit has an independent lower magnetic circuit + upper magnetic circuit. This clearly defines the magnetization and assembly sequence, ensuring concentricity and magnetic field uniformity from the source, effectively avoiding voice coil rubbing and excessive distortion. Combined with adhesive dispensing CCD detection and concentricity CCD detection, precise adhesive control and high assembly alignment are achieved, significantly improving magnetic circuit consistency, system stability, and magnetic field uniformity. This invention also features full-process control over the bass driver, from voice coil spot welding, continuity testing, UV curing, damping mesh mounting, and listening and curve testing. This ensures reliable solder joints, sufficient adhesive curing, stable low-frequency damping, deep low-frequency extension, and low distortion. The tweeter undergoes precise diaphragm molding, bracket flattening, copper ring positioning, and multiple sealing and curing processes, resulting in good high-frequency extension, strong resolution, and accurate phase. The quality of both the bass and tweeter drivers is controllable, resulting in excellent acoustic performance.

[0046] This invention utilizes an interlocking positioning structure for the high and low frequency brackets, combined with adhesive curing, resulting in high assembly precision, excellent sealing, smooth transition between high and low frequency responses, and significantly improved sound field separation, imaging, and sonic layering to meet high-fidelity listening requirements. The coaxial assembly offers high precision and natural acoustic integration. The sequential, modular process steps are compatible with automated production lines, significantly shortening the production cycle. Multiple stages include CCD visual inspection, UV rapid curing, and online continuity / curve / impedance testing, allowing for real-time rejection of defective products. This ensures strong process controllability and significantly improves mass production yield and stability. Furthermore, the process is compatible with most coaxial dual-unit headphone speaker structures, adaptable to products of different sizes and specifications, facilitating production line reuse and product iteration, and possessing significant industrial application value.

Claims

1. A manufacturing process for an earphone speaker, characterized in that: This includes the sequential assembly processes of the magnetic circuit, the woofer assembly, the tweeter assembly, and the combination of woofer and tweeter. The magnetic circuit assembly process includes a bass magnetic circuit assembly process, a treble lower magnetic circuit assembly process, and a treble upper magnetic circuit assembly process. The bass magnetic circuit assembly process includes sequentially performing inner magnetic circuit assembly, outer magnetic circuit assembly, and inner and outer magnetic combination. In the internal magnetic circuit assembly, the bass inner pole piece is assembled on one side of the bass inner magnet, and the other side of the bass inner magnet is assembled on one side of the bass magnetic cover to form the internal magnetic circuit. In the external magnetic circuit assembly, the bass outer pole piece is assembled on one side of the bass outer magnet to form an external magnetic circuit and the external magnetic circuit is magnetized; In the inner and outer magnetic combination, the inner magnetic circuit is magnetized, and then the bass outer magnet of the outer magnetic circuit is assembled on one side of the bass magnetic cover, and the outer magnetic circuit surrounds the bass inner pole piece and the bass inner magnet to form the bass magnetic circuit. The high-frequency lower magnetic circuit assembly process includes sequentially performing the central magnetic circuit assembly and the high-frequency lower magnetic circuit combination. In the central magnetic circuit assembly, the lower inner magnet is assembled on one side of the tweeter magnetic cover to form the central magnetic circuit; In the aforementioned high-frequency lower magnetic circuit assembly, the central magnetic circuit and the lower outer magnet are magnetized respectively, and then the lower outer magnet is assembled on one side of the high-frequency magnetic cover, with the lower outer magnet surrounding the lower inner magnet to form the high-frequency lower magnetic circuit; In the process of assembling the upper magnetic circuit of the tweeter, the upper outer magnet is assembled on the T-iron to form the upper magnetic circuit of the tweeter; The bass driver assembly process includes the following steps: Install the voice coil: Assemble the bass voice coil onto the bass mount; Diaphragm assembly: Assemble the bass diaphragm onto one side of the bass bracket and connect one end of the bass voice coil to the bass diaphragm to form a semi-finished product; Magnetic circuit assembly: The bass magnetic circuit, which is produced by the bass magnetic circuit assembly process, is assembled on the other side of the semi-finished bass bracket, and the other end of the bass voice coil is inserted between the bass inner magnet and the bass outer magnet of the bass magnetic circuit. Install damping mesh: Install damping mesh at the sound hole of the bass bracket to form a bass driver; The tweeter assembly process includes the following steps: Diaphragm assembly: The tweeter voice coil is assembled onto the tweeter diaphragm to form a diaphragm assembly; Bracket loading: Load the tweeter bracket, and then assemble the diaphragm assembly onto the tweeter bracket; Install the upper magnet circuit of the tweeter: Assemble the upper magnet circuit of the tweeter onto one side of the tweeter bracket; Install the lower magnetic circuit for the tweeter: Assemble the lower magnetic circuit for the tweeter onto the other side of the tweeter bracket to form the tweeter driver; The high and low frequency combination process includes the following steps: Unit loading: Loading the tweeter and woofer; Assembly: The tweeter bracket of the tweeter unit and the woofer bracket of the woofer unit are interlocked to form the headphone speaker unit.

2. The manufacturing process for an earphone speaker according to claim 1, characterized in that: The internal magnetic circuit assembly includes the following steps: First, load the bass inner electrode sheet, apply glue to the bass inner electrode sheet, then load the bass inner magnet, attach the glued side of the bass inner electrode sheet to one side of the bass inner magnet, apply glue to the other side of the bass inner magnet, load the bass magnet cover, then attach the glued side of the bass inner magnet to one side of the bass magnet cover, bake to obtain the inner magnetic circuit, and finally collect the inner magnetic circuit. The external magnetic circuit assembly includes the following steps: First, load the bass outer pole piece, apply glue to the bass outer pole piece, then load the bass outer magnet, and attach the glued side of the bass outer pole piece to one side of the bass outer magnet to form the outer magnetic circuit. Then, magnetize the outer magnetic circuit. The internal and external magnetic combination includes the following steps: First, the inner magnetic circuit is loaded and magnetized. Then, glue is applied to the other side of the bass outer magnet of the outer magnetic circuit. After glue application, CCD detection is performed. Then, the other side of the glued bass outer magnet of the outer magnetic circuit is attached to one side of the bass magnet cover, so that the outer magnetic circuit surrounds the bass inner pole piece and the bass inner magnet. The inner and outer magnetic circuits are combined. Finally, concentricity CCD detection is performed before the disc is closed.

3. The manufacturing process for an earphone speaker according to claim 1, characterized in that: The central magnetic circuit assembly includes the following steps: First, the lower inner magnet is loaded, glue is applied to the lower inner magnet, then the tweeter magnet is loaded, the glued side of the lower inner magnet is attached to one side of the tweeter magnet, and then baked to obtain the center magnetic circuit. Finally, the center magnetic circuit is collected. The high-frequency magnetic circuit assembly includes the following steps: First, the center magnetic circuit is loaded and magnetized. Then, the lower outer magnetic circuit is loaded and magnetized. Next, adhesive is applied to the lower outer magnetic circuit, followed by adhesive CCD detection. Then, the adhesive-coated side of the lower outer magnetic circuit is attached to one side of the tweeter magnet cover, and the lower outer magnetic circuit is placed around the lower inner magnetic circuit. The tweeter lower magnetic circuit assembly is completed. Finally, the tweeter lower magnetic circuit is put away.

4. The manufacturing process for an earphone speaker according to claim 1, characterized in that: The assembly process of the upper magnetic circuit for the tweeter includes the following steps: First, the upper outer magnet is loaded and magnetized. Then, glue is applied to the upper outer magnet, followed by glue application CCD detection. Next, the T-iron is loaded, and then the glued side of the upper outer magnet is attached to one side of the T-iron. The tweeter upper magnet assembly is now complete. Finally, the tweeter upper magnet assembly is finished.

5. The manufacturing process for an earphone speaker according to claim 1, characterized in that: The woofer assembly process includes the following steps in the voice coil mounting step: First, load the bass bracket, apply solder paste to the injection-molded metal parts on the bass bracket, then wind the bass voice coil, and assemble the bass voice coil onto the bass bracket. Next, check the lead curvature of the bass voice coil and the state of the solder paste on the bass bracket. Then, spot solder the bass voice coil leads to the injection-molded metal parts on the bass bracket, cut the wires and remove any excess wires. Then, perform a CCD check on the spot soldering, followed by a continuity test and automatic lead crimping. Then, apply solder joint adhesive and check the solder joint adhesive, followed by UV curing of the solder joint adhesive. Next, apply lead wire adhesive and UV cure the lead wire adhesive. Finally, apply bracket adhesive to one side of the bass bracket, and then perform a CCD check on the solder joint adhesive, lead wire adhesive, and bracket adhesive.

6. The manufacturing process for an earphone speaker according to claim 5, characterized in that: The woofer assembly process includes the following steps in the diaphragm mounting step: First, apply center adhesive to the bass diaphragm and perform a CCD check on the center adhesive. Then, flip the bass diaphragm and fasten it to the bass bracket, so that one side of the bass diaphragm is attached to the bracket adhesive on one side of the bass bracket, and one end of the bass voice coil is attached to the center adhesive of the bass diaphragm. Then, apply pressure and UV curing to cure the center adhesive and bracket adhesive, and then apply UV curing to the bracket adhesive to form a semi-finished product.

7. The manufacturing process for an earphone speaker according to claim 6, characterized in that: The woofer assembly process includes the following steps in the magnetic circuit assembly step: First, the semi-finished product obtained in the diaphragm assembly process of the bass unit is flipped over. Then, the center adhesive is UV cured a second time, and the concentricity of the bass voice coil is checked by CCD. Next, the bass magnetic circuit obtained in the bass magnetic circuit assembly process is mounted on the disc. Then, the bass magnetic circuit is automatically mounted on the other side of the bass bracket of the semi-finished product, and the other end of the bass voice coil is inserted between the bass inner magnet and the bass outer magnet of the bass magnetic circuit. The height of the bass magnetic cover is automatically measured, magnetic cover adhesive is applied, and then the magnetic cover adhesive is UV cured. The bass driver assembly process includes the following steps in the damping mesh installation step: First, the woofer assembly process involves placing the driver, after the magnetic circuit is completed, into a mesh attaching fixture. Then, damping meshes are attached to the sound holes on both sides of the woofer bracket. Next, the damping meshes undergo pressure holding and testing. Then, listening tests and curve tests are performed in sequence. Finally, visual inspection and mounting are carried out to obtain the woofer driver.

8. The manufacturing process for an earphone speaker according to claim 1, characterized in that: The tweeter assembly process includes the following steps in the diaphragm mounting step: First, apply center glue to the tweeter diaphragm, then perform a CCD check on the center glue, then wind the tweeter voice coil, and then fasten the tweeter voice coil to the tweeter diaphragm so that one end of the tweeter voice coil is attached to the center glue of the tweeter diaphragm. Then, check the tweeter voice coil, tweeter voice coil curvature, and center glue pressing to form the diaphragm assembly. The tweeter assembly process includes the following steps in the bracket loading step: First, load and flatten the tweeter bracket. Then, pre-apply solder paste to the injection-molded metal parts on the tweeter bracket. Next, apply bracket adhesive to the tweeter bracket and inspect the adhesive and solder paste using a video microscope. Then, flip the fixture containing the diaphragm assembly and attach the diaphragm assembly to one side of the tweeter bracket on the fixture containing the tweeter bracket, so that one side of the tweeter diaphragm of the diaphragm assembly is attached to the bracket adhesive on one side of the tweeter bracket. Then, spot solder the lead wire of the tweeter voice coil to the injection-molded metal parts on the tweeter bracket. Then, remove the fixture containing the diaphragm assembly, cut the wire and remove the excess wire. Then, inspect the spot soldering using a video microscope. Then, apply pressure and UV cure the bracket adhesive. Finally, perform a continuity test. The tweeter assembly process includes the following steps in the process of installing the tweeter's magnetic circuit: First, after the tweeter assembly process is completed, copper ring adhesive is applied to the tweeter bracket. The copper ring is then attached to the copper ring adhesive. Next, the copper ring adhesive and center adhesive are inspected under a video microscope. Then, the upper magnetic circuit of the tweeter, which is installed in the tooling, is fastened to one side of the tweeter bracket, so that the upper outer magnet of the upper magnetic circuit is attached to the copper ring adhesive on the copper ring. Then, the upper magnetic circuit of the tweeter is pushed out of the tooling. Solder joint adhesive is applied and UV cured. Then, sealant is applied to the upper magnetic circuit of the tweeter and CCD inspection is performed on the sealant. Finally, the upper magnetic circuit sealant of the tweeter is baked and cured after the tray is closed, forming a semi-finished product. The tweeter assembly process includes the following steps in the tweeter lower magnetic circuit assembly step: First, the semi-finished product obtained in the tweeter upper magnetic circuit assembly process is placed into the tooling. Then, the bracket adhesive is UV cured a second time. Next, the tweeter lower magnetic circuit is snapped onto the other side of the tweeter bracket, and a pre-curing adhesive for the tweeter lower magnetic circuit is applied. The pre-curing adhesive for the tweeter lower magnetic circuit is then UV cured. Then, a fixing adhesive for the tweeter lower magnetic circuit is applied, and the fixing adhesive for the tweeter lower magnetic circuit is inspected under a video microscope. The fixing adhesive is then UV cured again. Then, a reinforcing adhesive for the tweeter lower magnetic circuit is applied, and the reinforcing adhesive for the tweeter lower magnetic circuit is inspected by CCD and then sealed. The reinforcing adhesive for the tweeter lower magnetic circuit is then baked and cured. Then, a curve test is performed. Finally, an appearance inspection is performed and the tweeter is mounted to obtain the tweeter.

9. The manufacturing process for an earphone speaker according to claim 1, characterized in that: The high and low frequency combination process includes the following steps in the individual component loading step: First, the tweeter is loaded and flattened. Then, the mounting surface of the tweeter that matches the woofer is applied with bonding adhesive. The bonding adhesive is then checked by CCD. Finally, the woofer is loaded. The high and low frequency combination process involves first performing a pressure-holding UV curing treatment after the tweeter bracket of the tweeter unit and the woofer bracket of the woofer unit are interlocked, then removing the pressure-holding fixture and performing a second UV curing treatment, then laser engraving the logo, then ejecting the product and attaching a center hole mesh to the center hole of the tweeter bracket, then rewinding, and then performing listening tests, curve tests and impedance tests in sequence, and finally performing appearance inspection and rewinding to obtain the headphone speaker unit.

Images