Die bonding method, apparatus, and program product

Abstract

This application discloses a die bonding method, equipment, and process product, relating to the field of semiconductor processing technology. The die bonding method includes transporting a conveyor belt to transport any row of initial labels on the belt to a dispensing station; the conveyor belt array has multiple rows and columns of initial labels; a dispensing module is moved to the dispensing station along a first direction, and the dispensing module is used to position, identify, and dispense each row of initial labels, and to perform dispensing quality inspection; the first direction is parallel to the arrangement direction of each row of initial labels; the conveyor belt is stepped with a preset row spacing to transport the next row of initial labels to the dispensing station, and dispensing is performed on multiple rows and columns of initial labels sequentially; the dispensed labels on the conveyor belt are sequentially subjected to chip bonding, pressing, and curing to obtain finished chip labels. This application replaces the movement of a large inertia platform with a lightweight movement method of the dispensing module, achieving a balance between cost and control accuracy.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to die bonding methods, equipment and process products. Background Technology

[0002] Chip bonding equipment typically employs a horizontal layout, with dispensing, mounting, and curing components arranged linearly. These components sequentially perform dispensing, chip mounting and bonding, and curing operations on the labels to obtain the final finished chip label. The core processes in chip bonding equipment are dispensing and chip mounting.

[0003] Currently, there are two main methods for dispensing adhesive onto multiple columns of labels on a tape: one is a multi-parallel method, where each column of labels is independently equipped with a complete dispensing mechanism and vision components, and the dispensing mechanisms of each column dispense adhesive simultaneously, with the vision components used for detection after dispensing; the other is a platform-moving method, where only one mounting mechanism is configured, and the adsorption platform carrying the tape is driven to move back and forth over a wide range along a direction perpendicular to the tape's transport direction, so that different columns of labels on the tape enter the fixed mounting head in sequence for sequential binding.

[0004] However, both of the current multi-row dispensing methods in die bonding have shortcomings. Although the multi-parallel solution is fast, the cost of equipment increases dramatically due to the need for multiple high-precision vision and dispensing systems. While the single-mechanism platform moving solution saves hardware costs, the adsorption hub platform is a large inertia platform, and the long-stroke reciprocating motion of a large inertia platform makes it difficult to guarantee control accuracy.

[0005] Therefore, a new die bonding method is urgently needed to solve the problem that current die bonding methods cannot balance cost and control accuracy during the dispensing process.

[0006] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Summary of the Invention

[0007] The main purpose of this application is to provide a die bonding method, equipment and process product, which aims to solve the technical problem that current die bonding methods are difficult to balance cost and control accuracy during the dispensing process.

[0008] To achieve the above objectives, this application proposes a die bonding method, the method comprising: A transport belt is used to transport any row of initial labels on the belt to the dispensing station; wherein the belt array has multiple rows and columns of the initial labels. The dispensing module is moved to the dispensing station along the first direction, and the dispensing module is used to locate, identify, and dispense adhesive onto each of the initial labels in any row, and to perform dispensing quality inspection; wherein, the first direction is parallel to the arrangement direction of each row of initial labels; The material strip is stepped at a preset spacing so that the next row of initial labels is transported to the dispensing station, and dispensing is performed on multiple rows and columns of initial labels in sequence. The glued labels on the material strip that have been glued are sequentially subjected to chip bonding, pressing and curing to obtain the finished chip labels.

[0009] In one embodiment, the step of moving the dispensing module along a first direction to the dispensing station, using the dispensing module to perform positioning identification, dispensing operations, and dispensing quality inspection on each of the initial labels in any row, includes: The dispensing module is moved along the first direction at a preset distance to the area surrounding the initial label of the target column; The initial label of the target column is located and identified, and the position of the dispensing module is compensated and moved according to the positioning result so that the dispensing nozzle of the dispensing module is aligned with the initial label of the target column; The dispensing module performs a dispensing operation to form the dispensing label, and performs dispensing quality inspection on the dispensing label to complete the dispensing operation of a single initial label. The dispensing operation steps involve moving the dispensing module along the first direction to the area surrounding the initial label in the next column, and sequentially performing positioning identification and compensation movement, dispensing operation, and dispensing quality detection. Repeat the column-by-column dispensing operation steps to complete the positioning, identification, compensation, and dispensing operations of the initial labels in all columns of any row, and to perform dispensing quality inspection.

[0010] In one embodiment, the step of causing the material strip to advance at a preset row spacing so that the next row of initial labels is transported to the dispensing station, and then sequentially performing dispensing operations on multiple rows and columns of initial labels, includes: The material strip is stepped to the preset row spacing, and the dispensing module is simultaneously reset in the opposite direction of the first direction, so that the dispensing module moves to the area around the initial label of the next target column; Repeat the column-by-column dispensing operation steps to complete the positioning, identification, compensation, and dispensing operations of the initial labels in all columns of any row, and to perform dispensing quality inspection.

[0011] In one embodiment, the die bonding method is applied to a die bonding device, which has preset a dispensing layout mode of same row and a dispensing layout mode of staggered row. The steps of causing the dispensing module to perform a dispensing operation to form the dispensing label, and performing dispensing quality inspection on the dispensing label to complete the dispensing operation of a single initial label include: If the dispensing layout is in the same row, the dispensing module performs dispensing operation on the initial label in the m-th row and n-th column to form the dispensing label, and performs dispensing quality inspection on the dispensing label in the m-th row and n-th column; where the m-th row is the row number of any row, and the n-th column is the column number of any column; If the dispensing staggered layout mode is in effect, the dispensing module performs dispensing operation on the initial label in the m-th row and n-th column, and simultaneously performs dispensing quality inspection on the dispensing label in the mk-th row and n-th column; where m, n, and k are all positive integers, and mk≥1; in the transport direction of the material strip, the row number of the initial label and the dispensing label gradually decreases.

[0012] In one embodiment, the step of sequentially bonding, pressing, and curing the glued label on the tape to obtain the finished chip label includes: Transport any row of the dispensing labels on the material strip to the binding station; The bonding module is moved along the second direction to the bonding station to perform positioning and identification, chip bonding, and bonding quality inspection on each of the dispensing labels in any row; wherein the second direction is parallel to the first direction. The material strip is stepped to the preset row spacing so that the next row of dispensing labels is transported to the binding station, and the binding operation is performed on multiple rows and columns of dispensing labels in sequence; The already bound labels are sequentially pressed and cured to obtain the finished chip labels.

[0013] In one embodiment, the step of moving the bonding module along the second direction to the bonding station, performing positioning and identification, chip bonding operations, and bonding quality inspection on each of the dispensing labels in any row, includes: The binding module is moved along the second direction at a preset distance to the area surrounding the dispensing label in the target column; The dispensing labels in the target column are located and identified, and the position of the binding module is compensated and moved according to the positioning result so that the nozzle of the binding module is aligned with the dispensing labels in the target column; The binding module performs the binding operation to form the binding label, and performs binding quality inspection on the binding label to complete the binding operation of a single adhesive label; The column-by-column binding operation involves moving the binding module along the second direction to the area surrounding the next column of adhesive labels, and sequentially performing positioning identification and compensation movement, binding operation, and binding quality inspection. Repeat the column-by-column binding operation steps to complete the positioning, identification, compensation, and binding operations of the dispensing labels in all columns of any row, and perform binding quality inspection.

[0014] In one embodiment, the die bonding method is applied to a die bonding device, which is preset with a same-row bonding layout mode and a staggered bonding layout mode; The steps of having the bonding module perform a bonding operation to form the bonding label, and performing bonding quality inspection on the bonding label to complete the bonding operation of a single adhesive label include: If the system is in the same row layout mode, the binding module performs a binding operation on the adhesive label in the m-th row and n-th column to form the bound label, and performs a binding quality inspection on the bound label in the m-th row and n-th column; where the m-th row is the row number of any row, and the n-th column is the column number of any column; If the binding staggered layout mode is in effect, the binding module performs a binding operation on the dispensing label in the m-th row and n-th column, and simultaneously performs a binding quality inspection on the binding label in the mk-th row and n-th column; where m, n, and k are all positive integers, and mk≥1; in the transport direction of the material strip, the row number of the dispensing label and the binding label gradually decreases.

[0015] In one embodiment, prior to the step of moving the bonding module along the second direction at a preset distance to the area surrounding the dispensing label of the target column, the method includes: The bonding module is moved to the die-attachment area, and the multiple bonding arms on the bonding module are rotated so that the nozzles on the multiple bonding arms pass through the die-attachment station in sequence to adsorb chips in batches. Correspondingly, the step of locating and identifying the dispensing labels in the target column, and compensating for the position of the binding module by moving it according to the positioning result, so as to align the nozzle of the binding module with the dispensing labels in the target column, includes: The dispensing label in the target column is located and identified. Based on the positioning result, the position of the binding module is compensated and moved, and the angle of the multiple binding arms on the binding module is compensated and rotated, so that the nozzle on one of the binding arms is aligned with the dispensing label in the target column. Correspondingly, the column-by-column binding operation step includes: The bonding module is moved along the second direction to the area surrounding the next column of adhesive labels, and the next bonding arm is rotated by a preset angle. Positioning recognition, compensation movement and compensation rotation, bonding operation and bonding quality inspection are performed in sequence.

[0016] Furthermore, to achieve the above objectives, this application also proposes a die bonding apparatus, the die bonding apparatus comprising: A transport module is used to transport a material strip, so that any row of initial labels on the material strip is transported to the dispensing station; wherein, the material strip array has multiple rows and columns of the initial labels; A dispensing module is used to move the dispensing module along a first direction to the dispensing station, and to perform positioning identification, dispensing operation, and dispensing quality inspection on each of the initial labels in any row; wherein, the first direction is parallel to the arrangement direction of each row of initial labels. The changing module is used to make the material strip step by a preset row spacing so that the next row of the initial labels is transported to the dispensing station and the dispensing operation is performed on multiple rows and columns of the initial labels in sequence. The bonding module is used to sequentially bond, press, and cure the glued labels on the material strip to obtain finished chip labels.

[0017] In addition, to achieve the above objectives, this application also proposes a die bonding apparatus, the apparatus comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the die bonding method as described above.

[0018] In addition, to achieve the above objectives, this application also proposes a storage medium, which is a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the die bonding method described above.

[0019] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the die bonding method described above.

[0020] One or more technical solutions proposed in this application have at least the following technical effects: The technical solution of this application first uses a conveyor belt to orderly deliver rows of initial labels to the dispensing station, providing a foundation for continuous production. Then, by moving the dispensing module along a first direction, multiple columns of labels within a single row are processed serially, achieving multi-column coverage with a single module and effectively reducing hardware costs. The dispensing module integrates positioning recognition, dispensing operations, and quality inspection functions, forming an instantaneous closed loop of measurement-execution-inspection, improving the processing accuracy and controllability of this process. Furthermore, compared to the single-mechanism platform movement scheme that uses a large-inertia adsorption hub and the entire conveyor belt to move along a first direction to allow each row of labels to sequentially enter the fixed dispensing module, the movement method in this application utilizes moving components and its mounted dispensing module with light load and low inertia. Its long-stroke reciprocating motion control accuracy, dynamic response characteristics, and stopping stability are all significantly improved compared to a large-inertia platform. This enables high-speed, high-acceleration, smooth reciprocating positioning, shortening the inter-row movement time. It also avoids the problem of vibration and inertial impact from the movement of a large-mass platform being transmitted to the conveyor belt, thus affecting the positioning reference. It also eliminates uncontrollable errors introduced by the microscopic sliding or stretching of the conveyor belt on the platform, achieving a balance between cost and dispensing accuracy for multiple rows of labels. Subsequently, by stepping the conveyor belt with a preset row spacing, one row of labels is removed after processing, and a new row of initial labels is moved in. Combined with the reciprocating movement of the dispensing module, this achieves streamlined dispensing of multiple rows and columns of labels, ensuring production continuity. Finally, by sequentially bonding, pressing, and curing the dispensing labels after dispensing, a complete die bonding process is formed.

[0021] Overall, this application replaces the large inertia platform movement with lightweight movement and replaces multiple parallel mechanisms with a single functional module, achieving high-precision and high-efficiency processing of multi-row and multi-column chip die bonding under the premise of reasonable control of equipment costs. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic flowchart of the die bonding method in Embodiment 1 of this application; Figure 2 This is a schematic flowchart of Embodiment 2 of the die bonding method of this application; Figure 3 This is a schematic flowchart of the die bonding method in Embodiment 3 of this application; Figure 4 This is a schematic diagram of the module structure of the die bonding device according to an embodiment of this application; Figure 5 This is a schematic diagram of the device structure of the hardware operating environment involved in the die bonding method in the embodiments of this application.

[0025] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0027] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0028] The main solution of this application embodiment is as follows: a transport strip is used to transport any row of initial labels on the strip to the dispensing station; wherein, the strip array has multiple rows and columns of initial labels; the dispensing module is moved to the dispensing station along a first direction, and the dispensing module is used to position, identify, and dispense each row of initial labels, and to perform dispensing quality inspection; wherein, the first direction is parallel to the arrangement direction of each row of initial labels; the strip is stepped by a preset row spacing so that the next row of initial labels is transported to the dispensing station, and the dispensing operation is performed on multiple rows and columns of initial labels in sequence; the dispensed labels on the strip that have been dispensed are sequentially subjected to chip bonding, pressing, and curing to obtain finished chip labels.

[0029] In this embodiment, for ease of description, the control module of the die bonding device will be used as the execution subject in the following description.

[0030] Chip bonding equipment typically employs a horizontal layout, with dispensing, mounting, and curing components arranged linearly. These components sequentially perform dispensing, chip mounting and bonding, and curing operations on the labels to obtain the final finished chip label. The core processes in chip bonding equipment are dispensing and chip mounting.

[0031] Currently, there are two main methods for dispensing adhesive onto multiple columns of labels on a tape: one is a multi-parallel method, where each column of labels is independently equipped with a complete dispensing mechanism and vision components, and the dispensing mechanisms of each column dispense adhesive simultaneously, with the vision components used for detection after dispensing; the other is a platform-moving method, where only one mounting mechanism is configured, and the adsorption platform carrying the tape is driven to move back and forth over a wide range along a direction perpendicular to the tape's transport direction, so that different columns of labels on the tape enter the fixed mounting head in sequence for sequential binding.

[0032] However, both of the current multi-row dispensing methods in die bonding have shortcomings. Although the multi-parallel solution is fast, the cost of equipment increases dramatically due to the need for multiple high-precision vision and dispensing systems. While the single-mechanism platform moving solution saves hardware costs, the adsorption hub platform is a large inertia platform, and the long-stroke reciprocating motion of a large inertia platform makes it difficult to guarantee control accuracy.

[0033] Therefore, a new die bonding method is urgently needed to solve the problem that current die bonding methods cannot balance cost and control accuracy during the dispensing process.

[0034] Based on this, this application provides a solution that uses a transport belt to transport any row of initial labels on the belt to the dispensing station; wherein the belt array has multiple rows and columns of initial labels; the dispensing module moves along a first direction to the dispensing station, and uses the dispensing module to position, identify, and dispense each row of initial labels, and to perform dispensing quality inspection; wherein the first direction is parallel to the arrangement direction of each row of initial labels; the belt steps with a preset row spacing to transport the next row of initial labels to the dispensing station, and dispensing is performed on multiple rows and columns of initial labels sequentially; the dispensed labels on the belt that have been dispensed are then sequentially subjected to chip bonding, pressing, and curing to obtain finished chip labels.

[0035] The technical solution of this application first uses a conveyor belt to orderly deliver rows of initial labels to the dispensing station, providing a foundation for continuous production. Then, by moving the dispensing module along a first direction, multiple columns of labels within a single row are processed serially, achieving multi-column coverage with a single module and effectively reducing hardware costs. The dispensing module integrates positioning recognition, dispensing operations, and quality inspection functions, forming an instantaneous closed loop of measurement-execution-inspection, improving the processing accuracy and controllability of this process. Furthermore, compared to the single-mechanism platform movement scheme that uses a large-inertia adsorption hub and the entire conveyor belt to move along a first direction to allow each row of labels to sequentially enter the fixed dispensing module, the movement method in this application utilizes moving components and its mounted dispensing module with light load and low inertia. Its long-stroke reciprocating motion control accuracy, dynamic response characteristics, and stopping stability are all significantly improved compared to a large-inertia platform. This enables high-speed, high-acceleration, smooth reciprocating positioning, shortening the inter-row movement time. It also avoids the problem of vibration and inertial impact from the movement of a large-mass platform being transmitted to the conveyor belt, thus affecting the positioning reference. It also eliminates uncontrollable errors introduced by the microscopic sliding or stretching of the conveyor belt on the platform, achieving a balance between cost and dispensing accuracy for multiple rows of labels. Subsequently, by stepping the conveyor belt with a preset row spacing, one row of labels is removed after processing, and a new row of initial labels is moved in. Combined with the reciprocating movement of the dispensing module, this achieves streamlined dispensing of multiple rows and columns of labels, ensuring production continuity. Finally, by sequentially bonding, pressing, and curing the dispensing labels after dispensing, a complete die bonding process is formed.

[0036] Overall, this application replaces the large inertia platform movement with lightweight movement and replaces multiple parallel mechanisms with a single functional module, achieving high-precision and high-efficiency processing of multi-row and multi-column chip die bonding under the premise of reasonable control of equipment costs.

[0037] It should be noted that the executing entity in this embodiment can be a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, or mobile phone, or an electronic device or a control module of a die bonding device capable of performing the above functions. The following description uses the control module of a die bonding device as an example to illustrate this embodiment and the subsequent embodiments.

[0038] Based on this, embodiments of this application provide a die bonding method, referring to... Figure 1 , Figure 1 This is a schematic flowchart of the first embodiment of the die bonding method of this application.

[0039] In this embodiment, the die bonding method includes steps S10 to S40: Step S10: Transport the conveyor belt to transport any row of initial labels on the conveyor belt to the dispensing station; wherein the conveyor belt array has multiple rows and columns of the initial labels. It should be noted that "material strip" refers to a flexible substrate or strip-shaped material that carries the chip, with multiple initial labels distributed on its surface to be applied with adhesive. Initial labels refer to the pads or die-bonding positions on the material strip that have not yet been applied with adhesive. A dispensing station refers to a pre-defined, fixed area on the equipment where the dispensing operation is performed.

[0040] Furthermore, it should be noted that during the transport of the material strip, the strip moves along the main transport direction, such as through the rotation of the first rotating hub, causing the strip to move along the main transport path. The first rotating hub can be in the form of an adsorption hub, which can adsorb the strip by providing negative pressure, causing it to adhere to the outer periphery of the adsorption hub. The first rotating hub and the strip do not need to move in a direction perpendicular to the transport direction of the strip to allow the strip and its initial label to actively align with the adhesive module. Therefore, this process does not involve a long-stroke reciprocating motion of a large-inertia platform perpendicular to the transport direction of the strip, thus avoiding the problem of vibration and inertial impact caused by the movement of a large-mass platform being transmitted to the strip and affecting the positioning reference.

[0041] In step S10, the drive device moves the material strip stepwise or continuously along its own transport direction, so that any row of initial labels arranged in an array on the material strip can be accurately conveyed and positioned to the preset dispensing station. The purpose of this is to orderly deliver the area of ​​material strip to be processed into the processing position, preparing it for the subsequent dispensing process. For example, in one example, the control module of the die bonding equipment first controls the rotation of the first rotating hub, which firmly adsorbs the material strip through vacuum adsorption holes on its outer circumference. According to a preset program, the control module drives the first rotating hub to rotate by a preset row spacing, thereby accurately stepping all the initial labels of the first row on the material strip to the dispensing station.

[0042] Step S20: Move the dispensing module along the first direction to the dispensing station, and use the dispensing module to locate, identify, and dispense adhesive to each of the initial labels in any row, and perform dispensing quality inspection; wherein, the first direction is parallel to the arrangement direction of each row of initial labels. It should be noted that the dispensing module is a functional component integrating a dispensing execution unit and a vision component. The vision component can include multiple vision sensors, such as a first vision sensor and a second vision sensor. The first vision sensor is used for positioning and identification, while the second vision sensor is used for quality inspection. The first direction is parallel to the arrangement direction of each row of initial labels. Typically, the arrangement direction of each row of initial labels is perpendicular to the conveyor belt direction, and the arrangement direction of each column of initial labels is parallel to the conveyor belt direction. This direction perpendicular to the conveyor belt direction is also known as the CD (Cross Direction) in the die bonding process.

[0043] In step S20, after a row of labels on the material strip is positioned at the dispensing station, the control module drives the entire dispensing module to move along the first direction. The dispensing module moves sequentially above each column of labels in that row. For each column, the dispensing module first uses its integrated first vision sensor to photograph and identify the position of the initial label, then performs position compensation based on the identification results, performs the dispensing operation, and finally uses its integrated second vision sensor to perform quality inspection on the newly formed glue dots. This process enables a single dispensing module to perform serial, high-precision processing of all columns of labels in a row. Thus, only a single dispensing module is needed to sequentially process multiple columns of initial labels in the same row on the material strip by reciprocating along the first direction. Compared to a parallel scheme with multiple mechanisms that independently configure a complete dispensing mechanism for each column of labels, this embodiment significantly reduces the number of high-precision vision and dispensing systems, thereby significantly reducing equipment hardware costs.

[0044] In one example, after the initial labels of the first row enter the dispensing station, the dispensing module first moves above the initial labels of the first column. A first vision sensor on the dispensing module photographs the labels of the first column, calculates the positional deviation, and then the module performs micro-adjustment compensation to align the dispensing nozzle with the label before dispensing. After dispensing is complete, a second vision sensor immediately photographs the glue dots and analyzes their shape and position. Subsequently, the dispensing module moves along the first direction to the second column, repeating the above positioning-dispensing-detection cycle until all columns of the first row are completed.

[0045] Step S30: The material strip is stepped at a preset spacing so that the next row of initial labels is transported to the dispensing station, and dispensing is performed on multiple rows and columns of initial labels in sequence. It should be noted that the preset row spacing refers to the center-to-center distance between two adjacent rows of labels on the conveyor belt. This distance is fixed, and the center-to-center distance between any two adjacent rows of labels is the same. Stepping refers to the intermittent movement of the conveyor belt according to the preset row spacing.

[0046] In step S30, after the dispensing module completes the dispensing operation for all columns in the current row, the control module controls the drive device to precisely move the conveyor belt a preset row spacing distance along the transport direction. This allows the initial labels for the next row that haven't been dispensed to be delivered to the dispensing station. Then, the control module controls the dispensing module to move again along the first direction, sequentially positioning, dispensing, and inspecting all columns in the new row. By repeating the inter-row stepping and column-by-column dispensing process, continuous and automated dispensing of multiple rows and columns of initial labels on the conveyor belt is achieved. For example, after dispensing all labels in the first row is completed, the control module drives the first rotating hub to rotate one row spacing, delivering the second row of initial labels into the work area. The dispensing module then quickly resets from the last column to the first column and begins dispensing the first column of the second row, repeating this cycle until all rows are dispensed.

[0047] Step S40: The glued labels on the material strip that have been glued are sequentially subjected to chip bonding, pressing and curing to obtain the finished chip labels.

[0048] It should be noted that "dispensing label" refers to a label with adhesive dots adhering to its surface after dispensing. "Chip bonding" refers to the process of precisely attaching and bonding the chip to the dispensing label. "Lamination and curing" are subsequent processes, where pressure and temperature are applied to cure the adhesive, thereby firmly fixing the chip to the tape.

[0049] In step S40, the tape that has completed the dispensing process continues to be transported forward to the downstream bonding station. Here, the bonding mechanism precisely places the chips adsorbed on each bonding arm onto the dispensed labels. Then, through a pressing and curing device, under a set pressure and temperature profile, the adhesive cures, and the chips are permanently fixed to the tape, ultimately forming a finished chip label that meets the requirements. The bonding mechanism can have multiple bonding arms, spaced at a certain angle between adjacent arms. Each bonding arm can adsorb one chip. After bonding one column of dispensing labels, the bonding mechanism can be moved and the multiple bonding arms rotated to switch the next bonding arm into position, aligning it with the next column of dispensing labels, allowing the next bonding arm to directly bond the chip. This eliminates the need for the bonding mechanism to return to the die bonding area to re-adsorb and replenish chips after each bonding operation, significantly improving bonding efficiency.

[0050] In one example, the dispensing tape is transferred from the first rotating hub to the second rotating hub. The bonding mechanism compensates for the actual position data of the adhesive dots recorded during the dispensing process and then bonds the chip to the adhesive dots. Subsequently, the tape enters the hot pressing station, where upper and lower hot pressing heads apply pressure and heat to the chip and tape according to a preset curve, allowing the adhesive to fully cure and completing the chip bonding process.

[0051] This embodiment provides a die bonding method. First, a conveyor belt sequentially delivers rows of initial labels to the dispensing station, laying the foundation for continuous production. Then, by moving the dispensing module along a first direction, multiple columns of labels within a single row are processed serially. This single module achieves multi-column coverage, effectively reducing hardware costs. The dispensing module integrates positioning recognition, dispensing operations, and quality inspection functions, forming an instantaneous closed loop of measurement-execution-inspection, improving the processing accuracy and controllability of this step. Furthermore, compared to the single-mechanism platform movement scheme that uses a large-inertia adsorption hub and the entire conveyor belt to move along a first direction to allow each row of labels to sequentially enter the fixed dispensing module, the movement method in this application utilizes moving components and its mounted dispensing module with light load and low inertia. Its long-stroke reciprocating motion control accuracy, dynamic response characteristics, and stopping stability are all significantly improved compared to a large-inertia platform. This enables high-speed, high-acceleration, smooth reciprocating positioning, shortening the inter-row movement time. It also avoids the problem of vibration and inertial impact from the movement of a large-mass platform being transmitted to the conveyor belt, thus affecting the positioning reference. It also eliminates uncontrollable errors introduced by the microscopic sliding or stretching of the conveyor belt on the platform, achieving a balance between cost and dispensing accuracy for multiple rows of labels. Subsequently, by stepping the conveyor belt with a preset row spacing, one row of labels is removed after processing, and a new row of initial labels is moved in. Combined with the reciprocating movement of the dispensing module, this achieves streamlined dispensing of multiple rows and columns of labels, ensuring production continuity. Finally, by sequentially bonding, pressing, and curing the dispensing labels after dispensing, a complete die bonding process is formed.

[0052] Overall, this application replaces the large inertia platform movement with lightweight movement and replaces multiple parallel mechanisms with a single functional module, achieving high-precision and high-efficiency processing of multi-row and multi-column chip die bonding under the premise of reasonable control of equipment costs.

[0053] Based on the first embodiment of this application, in the second embodiment of this application, the content that is the same as or similar to the first embodiment described above can be referred to the above description, and will not be repeated hereafter. Based on this, please refer to... Figure 2 Step S20 includes steps S21 to S25: Step S21: Move the dispensing module along the first direction at a preset distance to the area surrounding the initial label of the target column; It should be noted that the preset distance refers to the theoretical distance to move from the current processing column to the next target column. The target column refers to the column where the dispensing operation will be performed. The surrounding area refers to a range of allowable positional deviations; the dispensing module first moves to this approximate position to prepare for subsequent precise positioning.

[0054] In step S21, the control module drives the dispensing module to move a large distance along the first direction according to the pre-stored material strip column coordinate information, so that it quickly moves from the processing position of the previous column to the vicinity of the next target column. The purpose of this step is to achieve rapid switching between columns and shorten non-processing time.

[0055] In one example, the dispensing module has just completed dispensing the first column of the first row, and the control module then sends a movement command to cause the moving component to move the dispensing module a preset distance, such as 50 millimeters, along the first direction, so that the dispensing module roughly reaches the waiting area above the second column of the first row.

[0056] Step S22: Locate and identify the initial label in the target column, and compensate and move the position of the dispensing module according to the positioning result so that the dispensing nozzle of the dispensing module is aligned with the initial label in the target column; It should be noted that positioning and recognition refers to the process of using a vision sensor to capture images of the target label and then calculating its precise coordinates using image processing algorithms. Compensation movement refers to driving the dispensing module to make minute movements at the micrometer level based on the positional deviation calculated from the positioning results, in order to eliminate the deviation.

[0057] In step S22, the first vision sensor on the dispensing module takes a picture of the initial labels of the target column. The image processing unit analyzes the image and calculates the deviation between the actual center coordinates and the theoretical coordinates of the label, such as ΔX and ΔY. Based on this deviation, the motion controller generates a compensating motion command to drive the entire dispensing module to make micro-movements, so that the axis of the dispensing nozzle is precisely aligned with the actual center of the label. The purpose of this step is to eliminate errors caused by material positioning, label printing, etc., and ensure the absolute accuracy of the dispensing position. For example, the first vision sensor captures the actual position of the second column of labels as 5 micrometers to the right and 3 micrometers above the theoretical position. After calculating the deviation, the control module drives the dispensing module to move 5 micrometers to the right and 3 micrometers upward, so that the dispensing nozzle is precisely aligned with the center of the label.

[0058] Step S23: The dispensing module performs a dispensing operation to form the dispensing label, and performs a dispensing quality inspection on the dispensing label to complete the dispensing operation of a single initial label. Step S24, column-by-column dispensing operation steps, causing the dispensing module to move along the first direction to the area surrounding the initial label in the next column, and sequentially performing positioning identification and compensation movement, dispensing operation and dispensing quality detection; In step S24, after completing the positioning-compensation-dispensing-detection cycle of the current column, the control module issues a command to move the dispensing module to the next column, and then performs precise positioning, compensation, dispensing, and detection again in sequence. For example, after dispensing the second column of the first row, the dispensing module moves to the surrounding area of ​​the third column, then triggers the first vision sensor to position the third column, compensates for the deviation, then the dispensing module performs dispensing, and finally the second vision sensor performs dispensing quality detection.

[0059] Step S25: Repeat the column-by-column dispensing operation to complete the positioning identification and compensation movement of the initial labels in all columns of any row, dispensing operation, and dispensing quality inspection.

[0060] In step S25, the control module repeats step S24 multiple times through a loop logic until all columns in the current row have been processed. For example, if there are 8 columns in the first row, the control module will control the dispensing module to move from the first column to the eighth column in sequence, and repeat steps S21 to S24 8 times in a loop, thereby completing the dispensing work for all labels in the entire first row.

[0061] In this embodiment, efficient column switching is first achieved by rapidly moving the dispensing module around the target column. Then, by positioning and recognizing the target label and compensating for movement, visual feedback ensures precise alignment between the dispensing nozzle and the label, eliminating systematic errors. Dispensing and real-time quality inspection are then performed, forming a rapid closed loop for single-column processing. By setting and repeatedly executing column-by-column dispensing steps, the aforementioned precision processing flow is extended to all columns in the same row. Overall, this embodiment describes a complete, cyclically executable multi-column dispensing process that serially processes multiple columns, ensuring dispensing accuracy for each column while maximizing the simplification of motion logic, providing specific process steps for achieving efficient and high-precision multi-column dispensing.

[0062] In one optional implementation, step S30 includes steps S31 to S32: Step S31: The material strip is made to step into the preset row spacing, and the dispensing module is simultaneously reset in the opposite direction of the first direction, so that the dispensing module moves to the area around the initial label of the next target column; It should be noted that "reset" refers to the action of the dispensing module quickly moving from the last column position of the current row back to the starting column position. "Synchronization" refers to the simultaneous occurrence of the tape's stepping action and the dispensing module's reset action.

[0063] In step S31, after the dispensing module completes dispensing for all columns in the current row, the control module issues two parallel commands. The first command controls the drive device to advance the conveyor belt by a preset row spacing, sending the next row of labels into the processing area. The second command controls the dispensing module to quickly return from the last column to the first column in the opposite direction of the first direction. These two actions are designed to be executed simultaneously to utilize the travel time of the dispensing module's return stroke to complete the row-to-row stepping of the conveyor belt, thereby eliminating waiting time and improving overall efficiency.

[0064] In one example, the dispensing module has just completed dispensing the label in column 8 of row 1. The control module immediately instructs the dispensing module to return at high speed from column 8 to column 1, while simultaneously instructing the first rotating hub to rotate one row spacing, allowing the second row of labels to enter the working area. When the dispensing module returns to column 1, column 1 of row 2 is also in place and ready to begin work immediately.

[0065] Step S32: Repeat the column-by-column dispensing operation to complete the positioning identification and compensation movement of the initial labels in all columns of any row, dispensing operation, and dispensing quality inspection.

[0066] In this embodiment, by synchronizing the material tape stepping and the dispensing module reset, the originally serial return-stepping process is optimized into a parallel composite action. This improvement effectively masks the time required for row switching, improving the equipment's time utilization. Furthermore, by repeatedly executing the column-by-column dispensing operation, it ensures that the new row of multi-column labels can be processed efficiently and accurately in sequence. Overall, this embodiment, by optimizing the motion timing, further improves the overall cycle time and comprehensive efficiency of multi-row, multi-column continuous production while maintaining high-precision dispensing capabilities.

[0067] In one optional implementation, the die bonding method is applied to a die bonding device, which is preset with a co-row dispensing layout mode and a staggered dispensing layout mode. Step S23 includes steps S231 to S232: Step S231: If the dispensing layout is in the same row, the dispensing module performs dispensing operation on the initial label in the m-th row and n-th column to form the dispensing label, and performs dispensing quality inspection on the dispensing label in the m-th row and n-th column; where the m-th row is the row number of any row, and the n-th column is the column number of any column. It should be noted that the dispensing in the same row layout mode refers to the convergence of the direction of the dispensing nozzle in the dispensing module, the center of the field of view of the first vision sensor, and the center of the field of view of the second vision sensor at the same point. This allows the dispensing nozzle of the dispensing module to perform dispensing operations on the initial label in the m-th row and n-th column after the first vision sensor locates and identifies the initial label, and the second vision sensor to perform quality inspection on the initial label in the m-th row and n-th column. Therefore, in the dispensing in the same row layout mode, the dispensing nozzle, the first vision sensor, and the second vision sensor can identify, dispense, and inspect the same position.

[0068] To converge the directions of the dispensing nozzle, the field of view center of the first vision sensor, and the field of view center of the second vision sensor to a single point, an adjustment mechanism can be installed. Specifically, the position of the dispensing nozzle is controlled by the movement of the dispensing module. Both the first and second vision sensors can be mounted on an adjustment mechanism with arc-shaped adjustment holes. The first and second vision sensors can be fixed to these holes using bolts and nuts, and their positions and orientations can be adjusted by moving along the extension direction of the holes, thus converging the directions of the dispensing nozzle, the field of view center of the first vision sensor, and the field of view center of the second vision sensor to a single point. The adjustment mechanism can be mounted on the dispensing module, or it can be mounted on the same moving module, allowing it to move together with the dispensing module. Alternatively, it can be mounted on another moving component (such as a linear guide and a moving platform mechanism), allowing the adjustment mechanism and the dispensing module to move separately. Both of the above installation adjustment methods can move the dispensing nozzle to align with the label in the target column, and align the field of view center of each vision sensor with the label in the target column.

[0069] In the same-row dispensing layout mode of step S231, the control module executes a compact loop: driving the dispensing nozzle to dispense glue to the label in the current m-th row and n-th column; after the dispensing action is completed, the conveyor belt remains stationary, and the second vision sensor is triggered to photograph and detect the glue dots in the same m-th row and n-th column. This method achieves a three-in-one real-time closed loop of positioning, dispensing, and detection for the same label. For example, for the label in the 2nd row and 3rd column, after the dispensing module completes the dispensing, it does not move its position; its second vision sensor directly photographs the newly formed glue dots below to determine whether the glue dots are qualified, thus achieving instantaneous quality control of the machine.

[0070] Step S232: If the dispensing staggered layout mode is in effect, the dispensing module performs dispensing operation on the initial label in the m-th row and n-th column, and simultaneously performs dispensing quality inspection on the dispensing label in the mk-th row and n-th column; where m, n, and k are all positive integers, and mk≥1; in the transport direction of the material strip, the row number of the initial label and the dispensing label gradually decreases.

[0071] It should be noted that the staggered dispensing layout refers to mechanically adjusting the field of view of the second vision sensor (used for quality inspection) to lag behind the dispensing nozzle and the first vision sensor (used for positioning and identification) by a certain distance in the conveyor belt direction. This distance is converted into the number of steps in the conveyor belt, which is k steps. Synchronization means that the dispensing action and the inspection action are performed in parallel in time. This can be achieved by adjusting the position and orientation of the second vision sensor along the arc extension direction of the adjustment hole, thus achieving the effect of staggering the field of view of the second vision sensor from that of the first vision sensor by k steps.

[0072] Additionally, it should be noted that the row numbers of the initial labels and dispensing labels gradually decrease along the conveyor belt direction. This is because, when dispensing the initial labels on the conveyor belt, the initial labels at the front end along the conveyor belt direction are processed first, while those at the back end are processed later. Therefore, the initial row number is based on the row number processed first, and the row number gradually increases in the opposite direction of the conveyor belt direction.

[0073] In the staggered dispensing layout mode of step S232, the control module executes a parallel process: when the dispensing module moves to the m-th row and n-th column, after the first vision sensor completes its positioning, the dispensing nozzle dispenses glue to that column. Simultaneously, because the field of view of the second vision sensor lags behind by k rows spatially, its field of view now precisely covers the glue dots in the mk-th row and n-th column that have already moved k rows forward with the conveyor belt. The control module synchronously triggers the second vision sensor to perform quality inspection on the glue dots in the preceding column that have undergone sufficient settling and stabilization. This achieves complete time parallelism between dispensing in the current column and inspection in the preceding column. For example, setting k=3, when the dispensing module dispenses glue to the 5th row and 1st column, the second vision sensor simultaneously inspects the glue dots in the 2nd row and 1st column that have already moved forward. These glue dots have undergone a transport time of 3 row intervals, their shape has stabilized, and the inspection result is more reliable.

[0074] In this embodiment, two preset operating modes endow the equipment with excellent process adaptability. In the same-row dispensing layout mode, an instant closed loop of positioning, dispensing, and inspection for a single column of labels is achieved, facilitating rapid detection and feedback of dispensing defects and effectively preventing batch defects. In the staggered dispensing layout mode, parallel operation of dispensing the current column and inspecting the stabilized glue dots in the preceding column is realized. Without sacrificing production cycle time, the glue dots are given sufficient stabilization time, resulting in inspection results that more accurately reflect the final form of the glue, providing a more precise compensation benchmark for subsequent bonding processes. Furthermore, unlike the same-row dispensing layout mode, the staggered dispensing layout mode does not require waiting for the dispensing of a single label to be completed before quality inspection. Since image processing for quality inspection also takes time (typically tens of milliseconds), the staggered dispensing layout mode offers a significant capacity advantage over the same-row dispensing layout mode when continuously processing large quantities of labels across multiple columns and rows. Overall, this embodiment allows users to flexibly select the optimal processing mode based on the adhesive properties and precision requirements, achieving a dynamic balance between high precision and high efficiency.

[0075] Based on the first embodiment of this application, in the third embodiment of this application, the content that is the same as or similar to that in the first embodiment can be referred to the above description, and will not be repeated hereafter. Based on this, please refer to... Figure 3 Step S40 includes steps S41 to S44: Step S41: Transport any row of the dispensing labels on the material strip to the binding station; It should be noted that the bonding station refers to another fixed spatial area preset on the equipment, which is the location where the chip bonding operation is performed.

[0076] In step S41, the dispensing tape is transferred from the first rotating hub to the second rotating hub and continues to be transported forward under the drive of the second rotating hub, so that a row of dispensing labels on the tape is accurately delivered and positioned to the preset binding station. For example, the control module controls the second rotating hub to rotate, moving all columns of dispensing labels in the first row below the working area of ​​the binding module.

[0077] The second rotating hub can also be configured as an adsorption hub, which will not be elaborated here.

[0078] Step S42: Move the bonding module along the second direction to the bonding station, perform positioning and identification, chip bonding operation on each of the dispensing labels in any row, and perform bonding quality inspection; wherein, the second direction is parallel to the first direction; It should be noted that the bonding module is a component used to perform chip pickup and placement operations. It typically includes a bonding actuator and a vision component, which may include a third vision sensor and a fourth vision sensor. The bonding actuator may have multiple bonding arms, each with a suction nozzle at its end, which can pick up one chip. The second direction is parallel to the first direction in the dispensing process and is also a transverse direction perpendicular to the conveyor belt direction. Specifically, when the dispensing module has already dispensed several rows of labels and the dispensed labels have been transported to the bonding station, the dispensing and bonding operations can be performed simultaneously. For example, the dispensing module may be dispensing the initial label in the 31st row, while the bonding module is bonding the chip to the label in the 6th row.

[0079] In step S42, the bonding module moves along the second direction, sequentially moving above each column of adhesive labels in the current row. For each column, the bonding module first uses its corresponding third vision sensor to locate and identify the adhesive label, then compensates for any positional deviation, and then precisely bonds the adsorbed chip to the adhesive dot. A fourth vision sensor then performs quality inspection on the bonded chip. In one example, the bonding module moves to the first column of the first row. Its third vision sensor captures the position of the adhesive dot, calculates the deviation, and then the bonding module performs micro-adjustment to align the nozzle with the adhesive dot before descending to bond the chip. The fourth vision sensor immediately photographs the bonded chip to check for defects such as misalignment or warping. Afterward, the bonding module moves to the second column to continue the operation.

[0080] Step S43: The material strip is moved to the preset row spacing so that the next row of dispensing labels is transported to the binding station, and the multiple rows and columns of dispensing labels are bound in sequence. In step S43, after the binding and inspection of all columns in the current row are completed, the second rotating hub drives the material belt to advance one preset row spacing, sending the next row of pre-applied labels into the binding station. Then, the binding module performs column-by-column binding again, realizing the binding of multiple rows and columns. For example, after the binding of all columns in the first row is completed, the second rotating hub advances one row spacing, sending the second row of pre-applied labels into the work area. After the binding module resets, it begins to bind the second row column by column.

[0081] Step S44: Press and solidify the already bound labels sequentially to obtain the finished chip labels.

[0082] It should be noted that the "binding tag" refers to a tag that has already completed the chip binding process.

[0083] In step S44, the bonded tape continues to move forward into the thermosetting curing area. Precisely controlled pressure and temperature are applied by the upper and lower thermosetting heads to fully cure the adhesive, firmly fixing the chip to the tape and ultimately forming a finished chip label. For example, after bonding, the tape enters the thermosetting station. The upper thermosetting head presses down, and the lower thermosetting head pushes up, heating and pressurizing the chip and tape according to a preset curve, causing the adhesive to cure at a preset time and temperature, completing the die bonding process.

[0084] In this embodiment, the dispensing and bonding processes are seamlessly integrated by transporting the dispensing tape to the bonding station. The bonding module moves along a second direction to perform positioning, chip bonding, and quality inspection on multiple columns of dispensing labels within a single row. A single bonding module achieves multi-column bonding, continuing the low-cost structural layout concept, and its closed-loop process of positioning, bonding, and inspection ensures bonding accuracy. By stepping the tape with a preset row spacing, continuous bonding of multiple rows and columns of labels is achieved. Finally, pressing and curing complete the entire manufacturing process from label to finished product. Overall, this embodiment constructs a complete end-to-end die bonding process, ensuring high precision and efficiency throughout the entire process from dispensing to bonding to curing while controlling costs.

[0085] In one optional implementation, step S42 includes steps S422 to S426: Step S422: Move the binding module along the second direction at a preset distance to the area surrounding the dispensing label in the target column; Similarly, the area surrounding the dispensing label refers to a range of permissible positional deviations. The bonding module first moves to this approximate position to prepare for subsequent precise positioning.

[0086] Step S423: Position and identify the dispensing label in the target column, and compensate and move the position of the binding module according to the positioning result so that the nozzle of the binding module is aligned with the dispensing label in the target column; The bonding module can be equipped with multiple bonding arms, each with a suction nozzle at its end for adsorbing and releasing chips. These bonding arms are rotatable, allowing multiple chips to be adsorbed onto a single bonding module via its various bonding arms, enabling batch loading of chips. This allows the bonding module to carry multiple chips in a single loading cycle. In subsequent multi-column bonding processes, simply moving the bonding module to the next column and rotating the bonding arms allows for quick switching between different bonding arms to align with the dispensing labels, sequentially bonding the batch-loaded chips to different columns within the same row. In this configuration, after obtaining the positioning result, not only is it necessary to compensate for the position of the bonding module by moving it, but also to compensate for the angle of one of the bonding arms by rotating it, thereby aligning the suction nozzle of one bonding arm with the dispensing label of the target column.

[0087] Step S424: The binding module performs a binding operation to form the binding label and performs a binding quality inspection on the binding label to complete the binding operation of a single adhesive label. During the bonding process, the nozzle on one of the bonding arms releases the chip, allowing it to adhere to the adhesive label and form a bonded label. Bonding quality inspection involves a series of checks on the bonded label, including but not limited to verifying the chip's bonding position and angle, and checking for defects such as warping or misalignment. Specific inspection methods can be implemented using conventional image processing algorithms or artificial intelligence algorithms such as convolutional neural networks and YOLO, which will not be elaborated upon here.

[0088] Step S425, column-by-column binding operation step, causing the binding module to move along the second direction to the area surrounding the next column of the dispensing labels, and sequentially performing positioning identification and compensation movement, binding operation and binding quality detection; Step S426: Repeat the column-by-column binding operation to complete the positioning, identification, compensation, and binding operations of the dispensing labels in all columns of any row, and perform binding quality inspection.

[0089] In this embodiment, the bonding process is broken down into a standardized loop of inter-column movement, visual positioning, compensation alignment, bonding execution, and quality inspection. This loop is repeated to cover all columns in the same row, forming a logically clear and highly automated multi-column bonding workflow. Visual positioning and compensation movement ensure precise alignment between the nozzle and the adhesive dots, while immediate post-bonding inspection forms a quality closed loop for this process. Overall, this embodiment provides a specific, complete, and easily controllable set of process steps for high-precision, high-efficiency bonding of multi-column chips.

[0090] In one optional implementation, the die bonding method is applied to a die bonding device, which is preset with a same-row bonding layout mode and a staggered bonding layout mode. Step S424 includes steps S4241 to S4242: Step S4241: If the binding is in the same row layout mode, the binding module performs a binding operation on the glue label in the m-th row and n-th column to form the binding label, and performs a binding quality inspection on the binding label in the m-th row and n-th column; where the m-th row is the row number of any row, and the n-th column is the column number of any column; It should be noted that the same-row binding layout mode refers to the convergence of the direction of the nozzle in the binding module, the center of the field of view of the third vision sensor, and the center of the field of view of the fourth vision sensor at the same point. This allows the nozzle of the binding module to perform the binding operation on the label in the m-th row and n-th column after the third vision sensor locates and identifies the label. The fourth vision sensor can then perform quality inspection on the bound label in the m-th row and n-th column. Therefore, in the same-row binding layout mode, the nozzle, the third vision sensor, and the fourth vision sensor can identify, bind, and inspect the same location.

[0091] To converge the directions of the suction nozzle, the field of view center of the third vision sensor, and the field of view center of the fourth vision sensor to a single point, an adjustment mechanism can be installed. For example, the nozzle's pose (position and attitude) is controlled by the position of the binding module and binding arm, as well as the attitude of the binding arm. The third and fourth vision sensors can both be mounted on a single adjustment mechanism with arc-shaped adjustment holes. The third and fourth vision sensors can be fixed to these holes using bolts and nuts, and their positions and attitudes can be adjusted by moving along the extension direction of the holes, thus converging the directions of the suction nozzle, the field of view center of the third vision sensor, and the field of view center of the fourth vision sensor to a single point. The adjustment mechanism can be mounted on the binding module, or both can be mounted on the same moving module, allowing the adjustment mechanism to move together with the binding module. Alternatively, the adjustment mechanism can be mounted on another moving component (such as a linear guide rail and a moving platform mechanism), allowing the adjustment mechanism and the binding module to move separately. Both of the above installation adjustment methods can move the dispensing nozzle to align with the label in the target column, and align the field of view center of each vision sensor with the label in the target column.

[0092] Additionally, it should be noted that the mounting adjustment components corresponding to the first and second visual sensors are two independent and different mounting adjustment components corresponding to the third and fourth visual sensors.

[0093] In the same-row layout mode of step S4241, the control module executes a compact loop: the drive nozzle performs chip bonding on the adhesive dot in the current m-th row and n-th column. After the bonding action is completed, the fourth vision sensor is immediately triggered to take a picture of the bonded label in the same m-th row and n-th column to confirm whether the chip bonding position and angle are qualified. This method realizes an instantaneous closed loop of positioning-bonding-detection for the same label. For example, for the adhesive dot in the 2nd row and 3rd column, after the bonding module completes the chip bonding, its fourth vision sensor (i.e., the detection camera) directly takes a picture of the newly bonded chip to determine whether there is any offset or warping, realizing instantaneous quality control of the bonding process.

[0094] Step S4242: If the binding staggered layout mode is in effect, the binding module performs a binding operation on the dispensing label in the m-th row and n-th column, and simultaneously performs a binding quality inspection on the binding label in the mk-th row and n-th column; where m, n, and k are all positive integers, and mk≥1; in the transport direction of the material strip, the row number of the dispensing label and the binding label gradually decreases.

[0095] It should be noted that the staggered layout mode of the binding module refers to mechanically adjusting the field of view of the fourth vision sensor (i.e., the detection camera) in the conveyor belt direction to lag behind the third vision sensor (i.e., the positioning camera) and the nozzle by a certain distance, which is converted into the number of rows k. This can be achieved by adjusting the position and orientation of the fourth vision sensor along the arc extension direction of the adjustment hole, thus achieving the effect of staggering the field of view of the fourth vision sensor from that of the third vision sensor by k rows. Furthermore, synchronization refers to the binding action and the detection action being performed in parallel time.

[0096] Additionally, it should be noted that the row numbers of the dispensing labels and binding labels gradually decrease along the conveyor belt direction. This is because, during the binding process of the dispensing labels on the conveyor belt, the labels at the front end along the conveyor belt direction are processed first, while those at the back end are processed later. Therefore, the row number is initially determined by the row number processed first, and gradually increases in the reverse direction of the conveyor belt direction.

[0097] In the staggered layout mode of step S4242, the control module executes a parallel process: when the bonding module moves to the m-th row and n-th column, the third vision sensor completes the positioning of the adhesive dots on the dispensing label. After the bonding module compensates for the position based on the positioning result, the nozzle bonds the chip to that column. Simultaneously, after the bonding module compensates for the position based on the positioning result, because the field of view of the fourth vision sensor is spatially lagging behind by k rows, its field of view now precisely covers the bonded label on the mk-th row and n-th column, which has already moved k rows forward with the conveyor belt. The control module synchronously triggers the fourth vision sensor to perform a final quality re-inspection of the chip in the preceding column that has already been bonded. This achieves complete time parallelism between the current column's bonding and the preceding column's re-inspection. Furthermore, the bonding time between the chip to be re-inspected and the adhesive dot is longer than that between the chip and adhesive dot that is immediately inspected after bonding, resulting in a more stable state and a better reflection of the true bonding status between the chip and the label. Furthermore, since this mode can simultaneously detect the chip position and other information of the chips that have already moved forward k rows of bonding tags while performing chip bonding, it can achieve complete parallel processing and inspection, thereby effectively improving production efficiency.

[0098] In one example, k=3 is set so that when the bonding module bonds the chip to the 1st column of the 5th row, the fourth vision sensor simultaneously performs the final detection on the solidified chip in the 1st column of the 2nd row, which has already moved forward.

[0099] In this embodiment, by pre-setting two working modes—same-row and staggered—in the bonding process, the equipment's process flexibility is further enhanced. In the same-row bonding layout mode, real-time detection of the bonding quality of individual chips is achieved, facilitating rapid identification and correction of bonding deviations. In the staggered bonding layout mode, parallel operation of bonding the current column and re-inspection of the previously bonded chips is realized, effectively improving production efficiency and ensuring inspection accuracy. Overall, this embodiment enables the die bonding equipment to flexibly select different layout modes according to the different quality monitoring requirements of the process, achieving comprehensive coverage from process control to finished product inspection.

[0100] In one optional implementation, step S43 includes steps S431 to S432: Step S431: The material strip is made to step into the preset row spacing, and the binding module is simultaneously reset in the opposite direction of the second direction, so that the binding module moves to the area around the dispensing label of the next target column; It should be noted that synchronization refers to the stepping action of the conveyor belt and the reset action of the binding module occurring simultaneously in time, rather than sequentially.

[0101] In step S431, after the bonding module completes chip bonding and quality inspection of all columns of dispensing labels in the current row, the control module issues two parallel control commands. The first command controls the second rotating hub or corresponding drive device to precisely advance the conveyor belt by a preset row spacing along its transport direction, thereby sending the next row of dispensing labels into the bonding station. The second command synchronously controls the bonding module to return quickly from the last column of the current row to the starting position of the first column in the opposite direction of the second direction at a higher speed. These two actions are designed to be executed simultaneously within the same time window. The purpose is to utilize the travel time required for the bonding module to return to the starting column to complete the stepping action between the rows of conveyor belt, thereby overlapping the return and stepping times that originally needed to be executed serially, effectively eliminating the waiting time between processes and improving the overall operating efficiency of the equipment.

[0102] In one example, the bonding module has just completed bonding the chip to the 8th column of the first row of adhesive labels. The control module immediately instructs the bonding module to return at high speed from the 8th column position to the 1st column position in the reverse direction of the second direction. At the same time, it instructs the second rotating hub to drive the conveyor belt to step forward one row, so that the adhesive labels of the second row enter the bonding station. When the bonding module returns to above the first column, the adhesive labels of the first column of the second row are also accurately positioned, and the next round of bonding can begin immediately without additional waiting.

[0103] Step S432: Repeat the column-by-column binding operation to complete the positioning, identification, compensation, and binding operations of the dispensing labels in all columns of any row, and perform binding quality inspection.

[0104] In step S432, after the row switching is completed, the control module drives the bonding module to repeatedly execute the standardized loop of moving to the target column, positioning and identification, compensation movement, bonding execution, bonding quality detection, and moving to the next column, until all columns in the new row have completed chip bonding. For example, when the first column of the second row is in place, the bonding module positions, compensates, bonds, and detects that column; after completion, it moves to the second column, and so on, until all columns in the second row are bonded. Then, step S431 is triggered again to switch to the next row and reset the bonding arm, repeating this process to achieve continuous and efficient bonding of multi-row, multi-column dispensing labels.

[0105] In this embodiment, by synchronizing the material strip stepping and the bonding module reset, the two actions of bonding module return and material strip stepping during row switching are changed from serial to parallel, effectively masking the time overhead required for row transition and significantly improving the overall cycle time of the equipment during continuous multi-row production. Then, by repeatedly executing the column-by-column bonding operation steps, it is ensured that each column in the new row can complete chip bonding according to a uniform high-precision standard, maintaining the stability and consistency of bonding quality. Overall, this embodiment, while maintaining the low-cost structural advantage of a single bonding module achieving multi-column bonding, further improves the equipment's production efficiency by optimizing the timing logic of row movement, achieving a balance between high precision, high efficiency, and low cost.

[0106] In one optional implementation, before step S422, the die bonding method further includes step S421: Step S421: Move the bonding module to the die-attachment area and rotate the multiple bonding arms on the bonding module so that the nozzles on the multiple bonding arms pass through the die-attachment station in sequence to adsorb chips in batches. It should be noted that the die bonding area is a fixed spatial location where the bonding module loads the chip. The die bonding station is a specific point within the die bonding area, where the nozzle of the bonding arm and the upstream chip transfer mechanism exchange the chip.

[0107] In step S421, the control module first moves the bonding module as a whole to the die-attaching area. Then, it drives the multi-arm rotating structure on the bonding module to rotate, causing the multiple bonding arms distributed around its circumference to pass through the die-attaching station sequentially. Whenever a bonding arm rotates to the die-attaching station, its end nozzle activates a vacuum, adsorbing the chip delivered by the upstream flipping mechanism. This process is repeated multiple times until all bonding arms have adsorbed chips, thus completing the batch loading of a batch of chips. Compared to the traditional single-arm bonding head that needs to return and retrieve a chip after bonding each one, this solution significantly reduces the number of long-distance reciprocating movements of the bonding module between the bonding station and the die-attaching station. The bonding module only needs to move a short distance between rows along the second direction, and the multiple bonding arms can switch chips simply by rotating, significantly improving the overall cycle time and efficiency of multi-row bonding.

[0108] In one example, the bonding module is a 6-arm rotating head. The control module drives its rotation, allowing the 6 bonding arms to pass sequentially through the die-attaching station. Each arm receives a chip from the flipping arm at the die-attaching station, and eventually all 6 nozzles are filled with chips.

[0109] Preferably, the number of bonding arms on the bonding module can be adaptively set according to the number of columns of labels on the tape. For example, when there are 8 columns of labels in the same row on the tape, a bonding module with 8 bonding arms can be selected, so that the number of chips loaded in a single batch can complete the bonding of all columns of adhesive labels in the same row. Multiple bonding arms can be installed on a detachable mounting structure. When replacement is needed, it is not necessary to replace the entire bonding module; only the mounting structure needs to be disassembled and a mounting structure with a different number of arms can be selected, thus achieving rapid switching between different arm numbers.

[0110] Correspondingly, step S423 includes step S4231: Step S4231: Position and identify the dispensing label in the target column, and based on the positioning result, compensate and move the position of the binding module, and compensate and rotate the angles of the multiple binding arms on the binding module, so that the nozzle on one of the binding arms is aligned with the dispensing label in the target column; In step S4231, after the bonding module moves to the target column, the third vision sensor takes a picture for recognition. The control module not only drives the entire bonding module to make a small movement compensation along the second direction according to the deviation, but also drives the bonding arm currently in the bonding position to rotate its nozzle around its own axis θ to compensate for any possible angular deviation of the chip. In this way, through the combination of overall position fine-tuning and local angle fine-tuning, high-precision alignment between the chip and the adhesive dot is achieved. For example, if the third vision sensor detects that the chip needs to be rotated 0.5 degrees counterclockwise to align with the adhesive dot, the control module will instruct the bonding arm currently to be bonded to drive its nozzle to rotate 0.5 degrees in the opposite direction to complete the angle compensation.

[0111] Correspondingly, the column-by-column binding operation step, i.e., step S425, includes step S4251: Step S4251: Move the bonding module along the second direction to the area surrounding the next column of adhesive labels, and rotate the next bonding arm by a preset angle, and sequentially perform positioning recognition, compensation movement and compensation rotation, bonding operation and bonding quality detection.

[0112] It should be noted that the preset angle refers to the angle between two adjacent binding arms on the multi-arm rotating head. For example, the preset angle of a 6-arm head is 60 degrees.

[0113] In step S4251, after binding the current column is completed, the binding module moves as a whole to the next column along the second direction. Simultaneously, multiple binding arms rotate by a preset angle, switching the binding arm of the next adsorbed chip to the working position for binding. Then, for the new column, the complete process of positioning-overall compensation-angle compensation-binding-detection is executed again. Through the coordinated movement of the binding module and the switching of binding arms, rapid and orderly matching between different chips and different columns is achieved. For example, after binding the first column, the binding module moves to the second column, while multiple binding arms rotate by a certain angle, causing arm number 2 to enter the working position. Upon reaching the second column, arm number 2 performs angle compensation and performs binding, and so on.

[0114] In this embodiment, the bonding module first moves to the die-attachment area and rotates, utilizing a multi-arm structure to achieve batch loading of chips, significantly reducing the frequency of die picking and idle travel. Then, in the bonding alignment stage, angle compensation for the bonding arms is introduced, enabling multi-degree-of-freedom correction of the chip's posture and improving bonding accuracy. Finally, in the column-by-column operation step, the lateral movement of the module is combined with the indexing rotation of the multi-arm rotating head, achieving synchronous parallel processing of chip supply and inter-column movement. Overall, this embodiment significantly improves the throughput efficiency of multi-column bonding processes through batch picking, indexing switching, and coordinated motion strategies, and further consolidates bonding accuracy by introducing an angle compensation mechanism, making it a model process combining high efficiency and high precision.

[0115] This application also provides a die bonding apparatus, please refer to... Figure 4 The die bonding device includes: The transport module 10 is used to transport the material strip, so that any row of initial labels on the material strip is transported to the dispensing station; wherein, the material strip array has multiple rows and columns of the initial labels; The dispensing module 20 is used to move the dispensing module along the first direction to the dispensing station, and to perform positioning identification, dispensing operation and dispensing quality inspection on each of the initial labels in any row; wherein, the first direction is parallel to the arrangement direction of each row of initial labels. The changing module 30 is used to make the material strip step by a preset row spacing so that the next row of the initial labels is transported to the dispensing station and the dispensing operation is performed on multiple rows and columns of the initial labels in sequence. The bonding module 40 is used to sequentially bond, press, and cure the glued labels that have been glued on the material strip to obtain finished chip labels.

[0116] The die bonding apparatus provided in this application, employing the die bonding method described in the above embodiments, can solve the technical problem that current die bonding methods struggle to balance cost and control precision during the dispensing process. Compared with the prior art, the beneficial effects of the die bonding apparatus provided in this application are the same as those of the die bonding method provided in the above embodiments, and other technical features of the die bonding apparatus are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0117] This application provides a die bonding apparatus, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the die bonding method in Embodiment 1 above.

[0118] The following is for reference. Figure 5 The diagram illustrates a structural schematic of a die-bonding device suitable for implementing embodiments of this application. The die-bonding device in the embodiments of this application may include, but is not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 5 The die bonding device shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments of this application.

[0119] like Figure 5As shown, the die bonding device may include a processing unit 1001 (e.g., a central processing unit, a graphics processing unit, etc.) that can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage device 1003 into a random access memory (RAM) 1004. The RAM 1004 also stores various programs and data required for the operation of the die bonding device. The processing unit 1001, ROM 1002, and RAM 1004 are interconnected via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to the I / O interface 1006: input devices 1007 including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices 1008 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 1003 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1009. Communication device 1009 allows the die bonder to communicate wirelessly or wiredly with other devices to exchange data. While the figure shows die bonders with various systems, it should be understood that implementation or possession of all the systems shown is not required. More or fewer systems may be implemented alternatively.

[0120] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from ROM 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0121] The die bonding equipment provided in this application, employing the die bonding method described in the above embodiments, can solve the technical problem that current die bonding methods struggle to balance cost and control precision during the dispensing process. Compared with the prior art, the beneficial effects of the die bonding equipment provided in this application are the same as those of the die bonding method provided in the above embodiments, and other technical features of this die bonding equipment are the same as those disclosed in the previous embodiment method, and will not be repeated here.

[0122] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0123] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0124] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to perform the die-bonding method in the above embodiments.

[0125] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0126] The aforementioned computer-readable storage medium may be included in the die bonding apparatus or may exist independently without being assembled into the die bonding apparatus.

[0127] The aforementioned computer-readable storage medium carries one or more programs. When the aforementioned one or more programs are executed by the die bonding equipment, the die bonding equipment: transports a conveyor belt, transporting any row of initial labels on the conveyor belt to the dispensing station; wherein the conveyor belt array has multiple rows and columns of initial labels; moves a dispensing module along a first direction to the dispensing station, and uses the dispensing module to perform positioning identification, dispensing operations on each row of initial labels, and performs dispensing quality inspection; wherein the first direction is parallel to the arrangement direction of each row of initial labels; steps the conveyor belt with a preset row spacing, so that the next row of initial labels is transported to the dispensing station, and performs dispensing operations on multiple rows and columns of initial labels in sequence; and sequentially performs chip bonding, pressing, and curing on the dispensed labels on the conveyor belt to obtain finished chip labels.

[0128] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0129] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0130] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0131] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the above-described die bonding method. This solves the technical problem that current die bonding methods struggle to balance cost and control precision during the dispensing process. Compared to the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the die bonding method provided in the above embodiments, and will not be elaborated upon here.

[0132] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the die bonding method described above.

[0133] The computer program product provided in this application can solve the technical problem that current die bonding methods struggle to balance cost and control precision during the dispensing process. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as those of the die bonding methods provided in the above embodiments, and will not be repeated here.

[0134] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A method for solidifying a crystal, characterized in that, The method includes: A transport belt is used to transport any row of initial labels on the belt to the dispensing station; wherein the belt array has multiple rows and columns of the initial labels. The dispensing module is moved to the dispensing station along the first direction, and the dispensing module is used to locate, identify, and dispense adhesive onto each of the initial labels in any row, and to perform dispensing quality inspection; wherein, the first direction is parallel to the arrangement direction of each row of initial labels; The material strip is stepped at a preset spacing so that the next row of initial labels is transported to the dispensing station, and dispensing is performed on multiple rows and columns of initial labels in sequence. The glued labels on the material strip that have been glued are sequentially subjected to chip bonding, pressing and curing to obtain the finished chip labels.

2. The method as described in claim 1, characterized in that, The steps of moving the dispensing module along the first direction to the dispensing station, using the dispensing module to locate, identify, and dispense each of the initial labels in any row, and performing dispensing quality inspection, include: The dispensing module is moved along the first direction at a preset distance to the area surrounding the initial label of the target column; The initial label of the target column is located and identified, and the position of the dispensing module is compensated and moved according to the positioning result so that the dispensing nozzle of the dispensing module is aligned with the initial label of the target column; The dispensing module performs a dispensing operation to form the dispensing label, and performs dispensing quality inspection on the dispensing label to complete the dispensing operation of a single initial label. The dispensing operation steps involve moving the dispensing module along the first direction to the area surrounding the initial label in the next column, and sequentially performing positioning identification and compensation movement, dispensing operation, and dispensing quality detection. Repeat the column-by-column dispensing operation steps to complete the positioning, identification, compensation, and dispensing operations of the initial labels in all columns of any row, and to perform dispensing quality inspection.

3. The method as described in claim 2, characterized in that, The step of advancing the material strip by a preset spacing to transport the next row of initial labels to the dispensing station, and sequentially dispensing multiple rows and columns of initial labels, includes: The material strip is stepped to the preset row spacing, and the dispensing module is simultaneously reset in the opposite direction of the first direction, so that the dispensing module moves to the area around the initial label of the next target column; Repeat the column-by-column dispensing operation steps to complete the positioning, identification, compensation, and dispensing operations of the initial labels in all columns of any row, and to perform dispensing quality inspection.

4. The method as described in claim 2, characterized in that, The die bonding method is applied to a die bonding device, which is preset with a same-row dispensing layout mode and a staggered dispensing layout mode. The steps of causing the dispensing module to perform a dispensing operation to form the dispensing label, and performing dispensing quality inspection on the dispensing label to complete the dispensing operation of a single initial label include: If the dispensing layout is in the same row, the dispensing module performs dispensing operation on the initial label in the m-th row and n-th column to form the dispensing label, and performs dispensing quality inspection on the dispensing label in the m-th row and n-th column; where the m-th row is the row number of any row, and the n-th column is the column number of any column; If the dispensing staggered layout mode is in effect, the dispensing module performs dispensing operation on the initial label in the m-th row and n-th column, and simultaneously performs dispensing quality inspection on the dispensing label in the mk-th row and n-th column; where m, n, and k are all positive integers, and mk≥1; in the transport direction of the material strip, the row number of the initial label and the dispensing label gradually decreases.

5. The method as described in claim 1, characterized in that, The steps of sequentially bonding, pressing, and curing the glued labels on the tape to obtain finished chip labels include: Transport any row of the dispensing labels on the material strip to the binding station; The bonding module is moved along the second direction to the bonding station to perform positioning and identification, chip bonding, and bonding quality inspection on each of the dispensing labels in any row; wherein the second direction is parallel to the first direction. The material strip is stepped to the preset row spacing so that the next row of dispensing labels is transported to the binding station, and the binding operation is performed on multiple rows and columns of dispensing labels in sequence; The already bound labels are sequentially pressed and cured to obtain the finished chip labels.

6. The method as described in claim 5, characterized in that, The steps of moving the bonding module along the second direction to the bonding station, positioning and identifying each of the dispensing labels in any row, bonding the chip, and inspecting the bonding quality include: The binding module is moved along the second direction at a preset distance to the area surrounding the dispensing label in the target column; The dispensing labels in the target column are located and identified, and the position of the binding module is compensated and moved according to the positioning result so that the nozzle of the binding module is aligned with the dispensing labels in the target column; The binding module performs the binding operation to form the binding label, and performs binding quality inspection on the binding label to complete the binding operation of a single adhesive label; The column-by-column binding operation involves moving the binding module along the second direction to the area surrounding the next column of adhesive labels, and sequentially performing positioning identification and compensation movement, binding operation, and binding quality inspection. Repeat the column-by-column binding operation steps to complete the positioning, identification, compensation, and binding operations of the dispensing labels in all columns of any row, and perform binding quality inspection.

7. The method as described in claim 6, characterized in that, The die bonding method is applied to a die bonding device, which is preset with a same-row binding layout mode and a staggered binding layout mode. The steps of having the bonding module perform a bonding operation to form the bonding label, and performing bonding quality inspection on the bonding label to complete the bonding operation of a single adhesive label include: If the system is in the same row layout mode, the binding module performs a binding operation on the adhesive label in the m-th row and n-th column to form the bound label, and performs a binding quality inspection on the bound label in the m-th row and n-th column; where the m-th row is the row number of any row, and the n-th column is the column number of any column; If the binding staggered layout mode is in effect, the binding module performs a binding operation on the dispensing label in the m-th row and n-th column, and simultaneously performs a binding quality inspection on the binding label in the mk-th row and n-th column; where m, n, and k are all positive integers, and mk≥1; in the transport direction of the material strip, the row number of the dispensing label and the binding label gradually decreases.

8. The method as described in claim 6, characterized in that, Before the step of moving the bonding module along the second direction at a preset distance to the area surrounding the dispensing label of the target column, the following steps are included: The bonding module is moved to the die-attachment area, and the multiple bonding arms on the bonding module are rotated so that the nozzles on the multiple bonding arms pass through the die-attachment station in sequence to adsorb chips in batches. Correspondingly, the step of locating and identifying the dispensing labels in the target column, and compensating for the position of the binding module by moving it according to the positioning result, so as to align the nozzle of the binding module with the dispensing labels in the target column, includes: The dispensing label in the target column is located and identified. Based on the positioning result, the position of the binding module is compensated and moved, and the angle of the multiple binding arms on the binding module is compensated and rotated, so that the nozzle on one of the binding arms is aligned with the dispensing label in the target column. Correspondingly, the column-by-column binding operation step includes: The bonding module is moved along the second direction to the area surrounding the next column of adhesive labels, and the next bonding arm is rotated by a preset angle. Positioning recognition, compensation movement and compensation rotation, bonding operation and bonding quality inspection are performed in sequence.

9. A die bonding apparatus, characterized in that, The die bonding apparatus includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the die bonding method as described in any one of claims 1 to 8.

10. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the steps of the die-bonding method as described in any one of claims 1 to 8.

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