Fluorine-containing resin-based resin composition and application thereof

By designing a fluorinated resin-based resin composition and utilizing the synergistic effect of chemically synthesized spherical silicon and quartz short fibers, the problems of dielectric loss and dimensional stability in high-frequency and high-density installation of copper-clad laminates were solved, and a low-loss, dimensionally stable metal-clad foil laminate was prepared, which is suitable for high-frequency signal transmission and high-precision processing.

CN122302455APending Publication Date: 2026-06-30GUANGDONG SHENGYI SCI TECH
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Patent Information

Application Number
CN202411973905.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing technologies struggle to provide copper-clad laminates with low dielectric loss and good dimensional stability for high-frequency and high-density electronic products, especially in 224GHz applications where the dimensional shrinkage of PTFE copper-clad laminates severely affects processing accuracy.

Method used

By designing a fluorinated resin-based resin composition, combining the synergistic effect of chemically synthesized silica and quartz short fibers, and controlling their dosage within a specific range, a metal-coated foil with a dielectric loss of less than 0.05% and a controllable absolute value of dimensional expansion and contraction within 1000ppm was prepared.

Benefits of technology

It has achieved a dielectric loss of less than 0.05% and a controllable absolute value of dimensional expansion and contraction within 1000ppm, meeting the needs of high-frequency and high-speed signal transmission and high-precision processing.

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Abstract

The invention provides a fluorine-containing resin-based resin composition and application thereof, and more specifically relates to a fluorine-containing resin-based resin composition, a resin film, a metal foil-clad plate and a printed circuit board. The fluorine-containing resin-based resin composition comprises the following components in parts by weight: 30-60 parts of fluorine-containing resin, 31-67 parts of chemical ball silicon with the average particle size of more than or equal to 4 microns and 3-9 parts of quartz short fiber with the average diameter of more than or equal to 4 microns, the chemical-method spherical silicon is obtained by calcining at the temperature of 800 DEG C or above through an organic silicon hydrolysis method; the length-diameter ratio of the quartz short fiber is greater than or equal to 5: 1, and the length is less than or equal to 100 microns. The specific composition of the fluorine-containing resin-based resin composition is designed, the fluorine-containing resin-based resin composition with excellent performance is prepared, and finally the support-material-free PTFE metal foil-coated plate with the dielectric loss lower than five ten thousandths and the size expansion and shrinkage absolute value controllable within 1000 ppm is prepared.
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