Power module device of power electronic transformer

By directly assembling the electrical components on the fin radiator and setting up the air duct, the thermal management problem of the high-voltage direct-mounted power electronic transformer power module is solved, which improves its working life and reliability at high temperatures, and achieves higher power density in a smaller space.

CN222638377UActive Publication Date: 2025-03-18POWER INVESTMENT (GUIAN NEW DISTRICT) DATA CENT CO LTD +2
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Patent Information

Application Number
CN202421290406.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-06
Publication Date
2025-03-18
Estimated Expiration
2034-06-06

AI Technical Summary

Technical Problem

The existing power module design of high-voltage direct-mounted power electronic transformer ignores thermal management issues, resulting in working at high temperatures, reducing its life and reliability.

Method used

A power electronic transformer power module device is designed, and the heat dissipation efficiency is improved by directly assembling the electrical components on the fin radiator and setting the air duct. The device includes a housing, a PMC board assembly module, a switch radiator assembly module and a DC capacitor, and is designed to save space.

Benefits of technology

It effectively improves the thermal management of the power module, improves its operating life and reliability at high temperatures, and at the same time achieves higher power density in a smaller space, saving design space.

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Abstract

The utility model discloses a power module device of a power electronic transformer, which belongs to the technical field of power electronic transformers and comprises a shell, a PMC (permanent magnet synchronous controller) board card assembly module, a switch radiator assembly module and a direct-current capacitor, the PMC board card assembly module, the switch radiator assembly module and the direct-current capacitor are positioned in the shell, and both the PMC board card assembly module and the switch radiator assembly module are positioned above the direct-current capacitor. The switch radiator assembly module comprises a switch assembly, a fin radiator and an air duct cover; the switch assembly is installed on the side wall of the fin radiator. Holes formed in the air channel cover, the side wall of the fin radiator and the shell form an air channel. The heat management problem of the power module is fully considered, the electric device is directly assembled on the heat radiator, the heat radiation efficiency is improved, the power module can work normally at high temperature, the service life of the power module is prolonged, and the reliability of the power module is improved.
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