A handling gripper for 12-inch wafer cassettes

By designing a handling gripper for 12-inch wafer cassettes, and employing clamping slots and fiber optic sensors for detection, the problem of horizontal clamping and detection of wafer cassettes was solved, achieving an efficient and low-cost handling process.

CN224419245UActive Publication Date: 2026-06-26SHANGHAI GECHUANGWEISHENG INTELLIGENT TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI GECHUANGWEISHENG INTELLIGENT TECH CO LTD
Filing Date
2023-11-10
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In the existing technology, there are challenges in how to horizontally grip and detect whether the wafer cassette is placed horizontally during the automated handling process of wafer cassettes.

Method used

A handling gripper for a 12-inch wafer cassette was designed. It uses an exposed opposing slot for the first and second clamping plates, combined with positioning pins and limit blocks to fix the wafer cassette. A fiber optic sensor is used to detect whether the clamping and placement are in place, and a motion module is used to achieve dual-axis motion.

Benefits of technology

It enables horizontal clamping and real-time inspection of wafer cassettes, and features a lightweight and low-cost structure, improving handling efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a kind of for 12 inch wafer box's handling gripper, solve the problem that conventional handling equipment is difficult to horizontally type's clamping wafer box and detecting wafer box whether horizontal placement, its main scheme includes: mounting plate, support plate and angle seat, support plate horizontal placement and in one end through angle seat with The mounting plate vertical fixed, its other end is also provided with first clamping plate and second clamping plate, first clamping plate and second clamping plate are connected and fixed with support plate bottom surface by fixed block, and first clamping plate and second clamping plate are exposed fixed block and form relative type's clamping groove, clamping groove is fixed with the positioning pin and limit block for positioning wafer box, wafer box side surface and the inside surface of mounting plate are fitted, and its top surface is fixed with the boss corresponding with clamping groove, the both ends of boss corresponding clamping groove are equipped with fiber-optic sensor, and each end fiber-optic sensor includes at least 3, and the two fiber-optic sensors of outer side are horizontally aligned and the height is higher than the fiber-optic sensor of middle position setting.
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Description

Technical Field

[0001] This utility model relates to the field of handling gripper technology, and in particular to a handling gripper for a 12-inch wafer cassette. Background Technology

[0002] In semiconductor manufacturing, wafer boxes primarily serve to place and transport wafers. To simplify transportation and minimize the risk of contamination, chip manufacturers utilize wafer boxes to handle and store wafers.

[0003] Currently, automated handling of wafer cassettes typically involves servo linear modules paired with support and positioning structures. However, during the wafer cassette handling process, the surfaces on which the wafer cassettes work together have a certain slope. Therefore, how to grip the wafer cassettes horizontally and how to detect whether the wafer cassettes are placed horizontally are issues that cannot be ignored in the handling process. To address these issues, we propose a handling gripper for 12-inch wafer cassettes. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the defects of the existing technology. This utility model proposes a lightweight device with a handling gripper for 12-inch wafer cassettes that can detect in real time whether the wafer cassette is clamped in place.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a handling gripper for a 12-inch wafer cassette, comprising: a mounting plate, a support plate, and a corner bracket. The support plate is placed horizontally and is vertically fixed to the mounting plate at one end via the corner bracket. The other end is provided with a first clamping plate and a second clamping plate. The first clamping plate and the second clamping plate are both connected and fixed to the bottom surface of the support plate via a fixing block. The first clamping plate and the second clamping plate are exposed to the fixing block and form opposing slots. Positioning pins and limiting blocks for positioning the wafer cassette are fixed on the slots. The side of the wafer cassette is in contact with the inner surface of the mounting plate. The top surface of the wafer cassette is fixed with a boss corresponding to the slot. Fiber optic sensors are provided at both ends of the slot corresponding to the boss. Each end of the fiber optic sensor includes at least three, wherein the two outer fiber optic sensors are horizontally aligned and their height is higher than that of the middle fiber optic sensor.

[0006] Furthermore, the support plate has an exposed mounting plate at its end, and the mounting plate has a connecting platform fixed at the bottom of the corresponding exposed part. The connecting platform is used to connect and fix with an external motion module, and the motion module is used to drive the mounting plate to move in both the horizontal and vertical directions.

[0007] Furthermore, the top of the boss is a horizontal platform, and its bottom is a stepped structure. The top surface of the wafer box is a slope and is connected to the stepped slope as a whole.

[0008] Furthermore, the distance between the inner bottom of the slot and the bottom surface of the support plate is greater than the thickness of the top horizontal platform end of the boss, and the movement of the motion module in the corresponding height direction can drive the top horizontal platform end of the boss to be inserted into and disengaged from the positioning pin.

[0009] Furthermore, the first clamping plate and the second clamping plate are provided with elongated slots at the bottom surfaces of the corresponding fixing platforms. The bottom surfaces of the fixing platforms are slotted at the corresponding slots and are connected and fixed to the bottom surfaces of the fixing platforms in the slots by countersunk bolts.

[0010] Furthermore, the limiting block includes two blocks, which are respectively fixedly connected to both ends of the slot, and the positioning pin is located in the middle section of the slot, which can be embedded in the side end of the boss.

[0011] Furthermore, the length of the exposed fixing platform of the first clamping plate and the second clamping plate is not less than 19mm, and the distance between the first clamping plate and the second clamping plate is not more than 105mm.

[0012] Furthermore, photoelectric sensors for collision detection are fixed at both ends of the fixed platform, and the photoelectric sensors are electrically connected to the motion module.

[0013] Compared with the prior art, the advantages of this utility model include: the exposed opposing slots of the first clamping plate and the second clamping plate can correspond to the boss end of the top of the wafer box; during the transportation process, the limiting block and the positioning pin can fix the position of the wafer box; and the setting of three fiber optic sensors can detect whether the wafer box has been clamped and placed in place in real time after the wafer box is clamped. The overall transportation structure is lightweight, low in cost, and highly efficient. Attached Figure Description

[0014] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:

[0015] Figure 1 The schematic diagram shows a motion module structure according to one embodiment of the present invention;

[0016] Figure 2 A schematic view of a transport gripper according to one embodiment of the present invention is shown.

[0017] Figure 3 The schematic diagram shows a bottom structure of a handling gripper according to one embodiment of the present invention;

[0018] Figure 4The schematic diagram shows a wafer cassette structure according to one embodiment of the present invention.

[0019] The following are the labels in the diagram: 1. Mounting plate; 2. Support plate; 3. Angle seat; 4. First clamping plate; 5. Second clamping plate; 6. Fixing block; 7. Slot; 8. Positioning pin; 9. Limiting block; 10. Boss; 11. Fiber optic sensor; 12. Connecting platform; 13. Motion module; 14. Horizontal platform; 15. Ladder platform; 16. Slot; 17. Countersunk bolt; 18. Photoelectric sensor. Detailed Implementation

[0020] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0021] According to one embodiment of the present invention, in conjunction with Figures 1-4 As shown.

[0022] like Figure 2 and Figure 3 As shown, for the overall structure, a handling gripper for a 12-inch wafer cassette includes: a mounting plate 1, a support plate 2, and a corner bracket 3. The support plate 2 is placed horizontally and is vertically fixed to the mounting plate 1 at one end via the corner bracket 3. The other end is provided with a first clamping plate 4 and a second clamping plate 5. The first clamping plate 4 and the second clamping plate 5 are both connected and fixed to the bottom surface of the support plate 2 via a fixing block 6. The first clamping plate 4 and the second clamping plate 5 are exposed outside the fixing block 6 and form opposing slots 7. Positioning pins 8 and limiting blocks 9 for positioning the wafer cassette are fixed on the slots 7. The side of the wafer cassette is in contact with the inner surface of the mounting plate 1. The top surface of the wafer cassette is fixed with a boss 10 corresponding to the slot 7. Fiber optic sensors 11 are provided at both ends of the boss 10 corresponding to the slot 7. Each end of the fiber optic sensor 11 includes at least 3, wherein the two outer fiber optic sensors 11 are horizontally aligned and their height is higher than that of the middle fiber optic sensor 11.

[0023] With the above structure, the exposed opposing slots 7 of the first clamping plate 4 and the second clamping plate 5 can correspond to the end of the boss 10 on the top of the wafer box. During the transportation process, the limiting block 9 and the positioning pin 8 can fix the position of the wafer box. The three fiber optic sensors 11 are set so that after the wafer box is clamped, it can detect whether the wafer box is clamped in place in real time. When the wafer box is horizontally placed in place, the two outer fiber optic sensors 11 receive signals, and the fiber optic sensor 11 in the middle position does not receive signals, indicating that the wafer box is not tilted.

[0024] During actual handling, the fixed platform works in conjunction with the external linear motion module 13, with a structure as follows: Figure 1 As shown, specifically, the support plate 2 has an exposed mounting plate 1 at its end, and the mounting plate 1 also has a connecting platform 12 fixed at the bottom of the corresponding exposed part. The connecting platform 12 is used to connect and fix with the external motion module 13, and the motion module 13 is used to drive the mounting plate 1 to move in both the horizontal and vertical directions.

[0025] Regarding the coordinated dragging between the transport gripper and the wafer cassette, in this embodiment, the top of the boss 10 is a horizontal platform surface 14, and its bottom is a stepped platform 15 structure. The top surface of the wafer cassette is a slope and is attached to the slope of the stepped platform 15 to form an integral whole, thereby ensuring that the wafer cassette can be gripped horizontally, which facilitates its positioning and fixation with the first clamping plate 4 and the second clamping plate 5.

[0026] Similarly, to ensure the realization of the dual-axis motion process of the motion module 13, the distance between the inner bottom of the slot 7 and the bottom surface of the support plate 2 in this solution is greater than the thickness of the end of the top horizontal platform surface 14 of the boss 10. The motion of the motion module in the corresponding height direction can drive the end of the top horizontal platform surface 14 of the boss 10 to be inserted into and disengaged from the positioning pin 8. In some embodiments, the limiting block 9 includes two blocks and is fixedly connected to both ends of the slot 7 respectively. The positioning pin is located in the middle section of the slot 7 and can be inserted into the side end of the boss 10.

[0027] To accommodate the handling of wafer cassettes of different sizes, this application provides elongated slots 16 on the bottom surfaces of the corresponding fixing platforms of the first clamping plate 4 and the second clamping plate 5. The bottom surfaces of the fixing platforms are slotted at the corresponding slots 16 and connected and fixed to the bottom surfaces of the fixing platforms within the slots 16 using countersunk bolts 17. The elongated, adjustable slots 16 allow for adjustment of the exposed length of the fixing platforms of the first clamping plate 4 and the second clamping plate 5, thus accommodating wafer cassettes of different specifications, ensuring convenience and reliability.

[0028] In some embodiments, the length of the exposed fixing platform of the first clamping plate 4 and the second clamping plate 5 is 19mm, and the distance between the first clamping plate 4 and the second clamping plate 5 is 105mm.

[0029] Furthermore, this application also fixes photoelectric sensors 18 for collision detection at both ends of the fixed platform. The photoelectric sensors 18 are electrically connected to the motion module 13. The photoelectric sensors 18 can detect the distance between the fixed platform and external equipment in real time during the horizontal movement of the motion module 13, so as to avoid collisions and contact during the handling of the wafer cassette.

[0030] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. A handling gripper for a 12-inch wafer cassette, characterized in that, include: The mounting plate, support plate, and corner bracket are provided. The support plate is placed horizontally and is vertically fixed to the mounting plate at one end by the corner bracket. The other end is provided with a first clamping plate and a second clamping plate. The first clamping plate and the second clamping plate are both connected and fixed to the bottom surface of the support plate by fixing blocks. The first clamping plate and the second clamping plate are exposed outside the fixing blocks to form opposing slots. Positioning pins and limiting blocks for positioning wafer cassettes are fixed on the slots. The side of the wafer cassette is in contact with the inner surface of the mounting plate. The top surface of the wafer cassette is fixed with a boss corresponding to the slot. Fiber optic sensors are provided at both ends of the slot corresponding to the boss. Each end of the fiber optic sensor includes at least 3 fiber optic sensors, of which the two outer fiber optic sensors are horizontally aligned and their height is higher than that of the middle fiber optic sensor.

2. The handling gripper for a 12-inch wafer cassette according to claim 1, characterized in that: The support plate has an exposed mounting plate at its end, and a connecting platform is fixed at the bottom of the corresponding exposed part of the mounting plate. The connecting platform is used to connect and fix with an external motion module, and the motion module is used to drive the mounting plate to move in both the horizontal and vertical directions.

3. A handling gripper for a 12-inch wafer cassette according to claim 2, characterized in that: The top of the boss is a horizontal platform, and its bottom is a stepped structure. The top surface of the wafer box is a slope and is connected to the stepped slope as a whole.

4. A handling gripper for a 12-inch wafer cassette according to claim 3, characterized in that: The distance between the inner bottom of the slot and the bottom surface of the support plate is greater than the thickness of the top horizontal platform end of the boss. The movement of the motion module in the corresponding height direction can drive the top horizontal platform end of the boss to be inserted into and disengaged from the positioning pin.

5. A handling gripper for a 12-inch wafer cassette according to claim 2, characterized in that: The first clamping plate and the second clamping plate are also provided with elongated slots at the bottom surface of the corresponding fixing platform. The bottom surface of the fixing platform is slotted at the corresponding slot and is connected and fixed to the bottom surface of the fixing platform in the slot by countersunk bolts.

6. A handling gripper for a 12-inch wafer cassette according to claim 1, characterized in that: The limiting block includes two blocks, which are respectively fixedly connected to both ends of the slot. The positioning pin is located in the middle section of the slot and can be embedded in the side end of the boss.

7. A handling gripper for a 12-inch wafer cassette according to claim 5, characterized in that: The length of the exposed fixing platform of the first clamp and the second clamp is not less than 19mm, and the distance between the first clamp and the second clamp does not exceed 105mm.

8. A handling gripper for a 12-inch wafer cassette according to claim 5, characterized in that: The fixed platform is also equipped with photoelectric sensors for collision detection at both ends, and the photoelectric sensors are electrically connected to the motion module.