A chip programming and testing array device
The design of spring-loaded locking and electric push rod solves the problem of cumbersome probe board replacement in chip programming and testing equipment, enabling quick replacement and convenient chip removal, thus improving the adaptability and work efficiency of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- UPS ELECTRONICS (SHENZHEN) CO LTD
- Filing Date
- 2025-06-06
- Publication Date
- 2026-06-30
AI Technical Summary
Existing chip programming and testing equipment suffers from cumbersome replacement operations due to the difficulty in quickly changing fixed probe boards, which affects production efficiency and increases costs.
The design employs a spring-loaded locking structure and an electric push rod to enable quick replacement of the probe plate and convenient chip removal. The probe plate is secured by the spring force, while the electric push rod assists in chip replacement. The combination of magnets and guide rods enhances connection stability and guidance.
It significantly shortens probe board replacement time, improves the conversion efficiency of chip programming and testing, saves chip replacement time, and enhances the adaptability and work efficiency of the equipment.
Smart Images
Figure CN224436511U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip programming and testing technology, and in particular to a chip programming and testing array device. Background Technology
[0002] In the chip manufacturing process, the programming and testing stage is crucial. It ensures that the chip is accurately programmed and that all performance indicators meet requirements before proceeding to subsequent assembly processes. Existing chip programming and testing equipment typically uses a fixed probe board to connect to the chip pins for signal transmission to complete the programming and testing work.
[0003] However, with the increasing diversity of chip types and the differences in test signals and pin connection methods required by different chips, fixed probe boards are difficult to meet the needs of rapid replacement to adapt to different chips. When it is necessary to program and test chips of different models or specifications, replacing probe boards is often cumbersome, requiring a lot of time for disassembly, reinstallation, and debugging, which seriously affects the efficiency of chip programming and testing, increases production costs and equipment downtime, and brings many inconveniences to chip manufacturing. Utility Model Content
[0004] This utility model mainly provides a chip programming and testing array device that can enhance impact resistance and provide timely alerts after an accident.
[0005] To achieve the above objectives, this utility model adopts the following technical solution: a chip programming and testing array device, including a workbench, a support platform on the surface of the workbench, a placement groove on the surface of the support platform, a support frame fixedly connected to the surface of the workbench, an electric push rod fixedly connected to the surface of the support frame, a mounting plate fixedly connected to the output end of the electric push rod, a probe plate fixedly connected to the surface of the mounting plate, a probe body fixedly connected to the surface of the probe plate, a locking block on the surface of the mounting plate, the locking block engaging with the probe plate, a square groove on the surface of the locking block, a locking plate slidably connected inside the square groove, a spring fixedly connected to the surface of the locking plate, a locking plate 2 fixedly connected to the other end of the spring, a pressure plate 1 and a pressure plate 2 fixedly connected to the surfaces of the locking plate 1 and the locking plate 2, a square hole on the surface of the mounting plate, and a slot on the surface of the probe plate.
[0006] Compared with the prior art, the advantages and positive effects of this utility model are as follows:
[0007] 1. In this utility model, the spring force makes the first and second clips firmly locked inside the slot, thereby achieving the purpose of fixing the probe board. When the probe body needs to be replaced according to the usage requirements, the first and second clips on both sides of the clip block are pressed to make the first and second clips slide inside the clip block. Then the clip block is removed from the mounting plate, making the replacement of the probe board simple and fast, without complicated tools and long-term debugging, significantly shortening the time spent on replacing the probe board and improving the conversion efficiency of the equipment for programming and testing different chips.
[0008] 2. In this utility model, the output end of the electric push rod 2 pushes the top rod and the top plate to move, which makes it easier to lift the chip after burning and testing from the placement slot, improves the convenience of removing the chip from the carrier platform, saves the time of chip replacement, and further improves the working efficiency of chip burning and testing. At the same time, the buffer pad can play a buffering role to prevent the chip from falling off the carrier platform due to inertia. Attached Figure Description
[0009] Figure 1 This invention provides a schematic diagram of a chip programming and testing array device;
[0010] Figure 2 A bottom view of a chip programming and testing array device is provided for this utility model;
[0011] Figure 3 This utility model provides an exploded view of a chip programming and testing array device;
[0012] Figure 4 This invention provides a partially exploded view of a chip programming and testing array device.
[0013] Figure 5 A bottom view of the mounting plate of a chip programming test array device is provided for this utility model;
[0014] Figure 6 This invention provides an exploded view of the card block of a chip programming and testing array device.
[0015] Legend: 1. Workbench; 2. Support platform; 3. Placement slot; 4. Support frame; 5. Electric push rod one; 6. Mounting plate; 7. Probe plate; 8. Probe body; 9. Round hole; 10. Guide rod; 11. Locking block; 12. Slot one; 13. Slot; 14. Square hole; 15. Round rod; 16. Slot two; 17. Magnet; 18. Square slot; 19. Insert rod; 20. Locking plate one; 21. Spring; 22. Locking plate two; 23. Pressure plate one; 24. Pressure plate two; 25. Anti-slip protrusion; 26. Electric push rod two; 27. Support plate; 28. Buffer pad; 29. Top rod; 30. Top plate. Detailed Implementation
[0016] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0017] Please see Figures 1-4 This utility model provides a technical solution: a chip programming and testing array device, including a workbench 1, a support platform 2 on the surface of the workbench 1, a placement groove 3 on the surface of the support platform 2, a support frame 4 fixedly connected to the surface of the workbench 1, an electric push rod 5 fixedly connected to the surface of the support frame 4, a mounting plate 6 fixedly connected to the output end of the electric push rod 5, a probe plate 7 fixedly connected to the surface of the mounting plate 6, a probe body 8 fixedly connected to the surface of the probe plate 7, a locking block 11 on the surface of the mounting plate 6, the locking block 11 engaging with the probe plate 7, a square groove 18 on the surface of the locking block 11, a locking plate 20 slidably connected inside the square groove 18, a spring 21 fixedly connected to the surface of the locking plate 20, a locking plate 22 fixedly connected to the other end of the spring 21, a pressure plate 23 and a pressure plate 24 fixedly connected to the surfaces of the locking plate 20 and the locking plate 22, a square hole 14 on the surface of the mounting plate 6, and a slot 13 on the surface of the probe plate 7.
[0018] like Figure 6 As shown, pressure plate 1 23 and pressure plate 24 have the same structure. Anti-slip protrusions 25 are fixedly connected to the surfaces of pressure plate 1 23 and pressure plate 24. The anti-slip protrusions 25 are made of rubber. When the locking block 11 is removed from the mounting plate 6, when the pressure plate 1 23 and pressure plate 24 are pressed, the fingers come into contact with the anti-slip protrusions 25 on the pressure plate 1 23 and pressure plate 24, which increases the friction between the fingers and the pressure plate 1 23 and pressure plate 24, thereby preventing slippage when lifting the locking block 11.
[0019] like Figure 4 and 6 As shown, a rod 19 is fixedly connected to the surface of the card block 11, and a slot 12 is opened on the surface of the mounting plate 6. The rod 19 is inserted into the slot 12. When the card block 11 is fixedly connected to the probe plate 7, the rod 19 on the card block 11 will be inserted into the slot 12 on the mounting plate 6, which serves to limit the card block 11 and prevent the card block 11 from sliding due to accidental collision, thus affecting the fixing effect on the probe plate 7.
[0020] like Figure 3As shown, a circular hole 9 is provided on the surface of the support frame 4, and a guide rod 10 is fixedly connected to the surface of the mounting plate 6. The guide rod 10 is inserted into the circular hole 9. During the up and down movement of the mounting plate 6, the guide rod 10 is always sliding in the circular hole 9, which can guide and limit the movement of the mounting plate 6, and prevent the mounting plate 6 from rotating and affecting the use effect of the probe body 8.
[0021] like Figure 1 and 2 As shown, there are five sets of placement slots 3, which are equidistantly distributed on the surface of the support stage 2. There are also five sets of probe bodies 8, which are equidistantly distributed on the surface of the probe plate 7. Each probe body 8 corresponds to a placement slot 3. This allows for simultaneous programming and testing of multiple chips, improving work efficiency.
[0022] like Figure 4 and 6 As shown, the surface of the mounting plate 6 has a slot 2 16, and a magnet 17 is fixedly connected inside the slot 2 16. A round rod 15 is fixedly connected to the surface of the probe plate 7. The round rod 15 is inserted into the slot 2 16 and is magnetically connected to the magnet 17. Here, the installation of the probe plate 7 can be limited by inserting the round rod 15 into the slot 2 16, so that the slot 13 on the probe plate 7 can be quickly aligned with the square hole 14, making it convenient for the first card 20 and the second card 22 to be inserted into the slot 13. At the same time, the magnet 17 and the round rod 15 are magnetically attracted together, which can further improve the stability of the connection between the probe plate 7 and the mounting plate 6 and prevent the middle part of the probe plate 7 from bending due to its own weight.
[0023] like Figure 3 As shown, an electric push rod 26 is fixedly connected to the bottom of the worktable 1. A support plate 27 is fixedly connected to the output end of the electric push rod 26. A top rod 29 is fixedly connected to the surface of the support plate 27. A top plate 30 is fixedly connected to the top of the top rod 29. The top plate 30 is slidably connected inside the placement slot 3. A buffer pad 28 is sleeved on the surface of the top rod 29. Here, the top rod 29 and the top plate 30 are moved by the output end of the electric push rod 26, which facilitates the lifting of the chip after burning and testing from the placement slot 3. This improves the convenience of removing the chip from the support table 2, saves the time of chip replacement, and further improves the working efficiency of chip burning and testing. At the same time, the buffer pad 28 can play a buffering role to prevent the chip from falling off the support table 2 due to inertia.
[0024] The usage and working principle of this device are as follows: First, place the chips to be programmed and tested one by one into the placement slots 3 on the support stage 2. Then, activate the electric push rod 5 on the support frame 4. The output end of the electric push rod 5 pushes the mounting plate 6 and probe plate 7 downwards, causing the probe body 8 to contact the chip for programming and testing. During the downward movement of the probe plate 7, the guide rod 10 on the mounting plate 6 slides within the circular hole 9, guiding and limiting the movement of the probe plate 7 to prevent rotation of the mounting plate 6 and affecting the performance of the probe body 8. After the programming and testing are completed, activate the electric push rod 5 again. Rod 5 moves probe plate 7 upwards. Then, electric push rod 26, through its output, pushes push rod 29 on carrier plate 27 and top plate 30 on top of push rod 29, facilitating the removal of the programmed and tested chip from placement slot 3. This improves the ease of chip removal from carrier stage 2, saves chip replacement time, and further enhances chip programming and testing efficiency. Simultaneously, buffer pad 28 acts as a buffer, preventing the chip from detaching from carrier stage 2 due to inertia when carrier plate 27 contacts the bottom surface of worktable 1. When probe replacement is required, pressing the pressure plates on both sides of the locking block 11... The pressure plate 23 and the second pressure plate 24 allow the first pressure plate 20 and the second pressure plate 22 to slide inside the pressure block 11 and compress the spring 21. Then, the pressure block 11 is removed from the mounting plate 6, making the replacement of the probe plate 7 simple and quick, requiring no complicated tools or lengthy adjustments. This significantly shortens the time spent replacing the probe plate 7 and improves the conversion efficiency of the equipment for programming tests on different chips. The anti-slip protrusions 25 on the first pressure plate 23 and the second pressure plate 24 increase the friction between the fingers and the pressure plates 23 and 24, preventing slippage when lifting the pressure block 11. When the pressure block 11 is fixedly connected to the probe plate 7, the insert on the pressure block 11... Rod 19 is inserted into slot 12 on mounting plate 6 to limit the movement of locking block 11, preventing it from sliding due to accidental collision and affecting the fixation of probe plate 7. When probe plate 7 is fixedly connected to mounting plate 6, round rod 15 is inserted into slot 16 to limit the installation of probe plate 7, allowing the slot 13 on probe plate 7 to quickly align with square hole 14, facilitating the insertion of locking plate 20 and locking plate 22 into slot 13. At the same time, the magnet 17 magnetically attracts the round rod 15, further improving the stability of the connection between probe plate 7 and mounting plate 6 and preventing the middle of probe plate 7 from bending due to its own weight.
[0025] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.
Claims
1. A chip programming and testing array device, comprising a workbench (1), characterized in that: The workbench (1) has a support platform (2) on its surface, and a placement groove (3) is provided on the surface of the support platform (2). A support frame (4) is fixedly connected to the surface of the workbench (1), and an electric push rod (5) is fixedly connected to the surface of the support frame (4). A mounting plate (6) is fixedly connected to the output end of the electric push rod (5). A probe plate (7) is fixedly connected to the surface of the mounting plate (6), and a probe body (8) is fixedly connected to the surface of the probe plate (7). A locking block (11) is provided on the surface of the mounting plate (6). 1) Engages with probe plate (7), the surface of the locking block (11) is provided with a square groove (18), the inside of the square groove (18) is slidably connected with a locking plate (20), the surface of the locking plate (20) is fixedly connected with a spring (21), the other end of the spring (21) is fixedly connected with a locking plate (22), the surfaces of the locking plate (20) and the locking plate (22) are fixedly connected with a pressure plate (23) and a pressure plate (24), the surface of the mounting plate (6) is provided with a square hole (14), and the surface of the probe plate (7) is provided with a locking groove (13).
2. The chip programming and testing array device according to claim 1, characterized in that: The first pressure plate (23) and the second pressure plate (24) have the same structure. The surfaces of the first pressure plate (23) and the second pressure plate (24) are fixedly connected with anti-slip protrusions (25), which are made of rubber.
3. The chip programming and testing array device according to claim 2, characterized in that: The surface of the card block (11) is fixedly connected with a plug rod (19), and the surface of the mounting plate (6) is provided with a slot one (12), and the plug rod (19) is inserted into the inside of the slot one (12).
4. The chip programming and testing array device according to claim 3, characterized in that: The support frame (4) has a circular hole (9) on its surface, and a guide rod (10) is fixedly connected to the surface of the mounting plate (6). The guide rod (10) is inserted into the circular hole (9).
5. The chip programming and testing array device according to claim 4, characterized in that: There are five sets of placement slots (3), which are equidistantly distributed on the surface of the support platform (2). There are also five sets of probe bodies (8), which are equidistantly distributed on the surface of the probe plate (7), and each probe body (8) corresponds to a placement slot (3).
6. The chip programming and testing array device according to claim 5, characterized in that: The mounting plate (6) has a slot 2 (16) on its surface. A magnet (17) is fixedly connected inside the slot 2 (16). A round rod (15) is fixedly connected to the surface of the probe plate (7). The round rod (15) is inserted into the slot 2 (16) and is magnetically connected to the magnet (17).
7. The chip programming and testing array device according to claim 1, characterized in that: The bottom of the workbench (1) is fixedly connected to an electric push rod two (26), the output end of the electric push rod two (26) is fixedly connected to a bearing plate (27), the surface of the bearing plate (27) is fixedly connected to a top rod (29), the top end of the top rod (29) is fixedly connected to a top plate (30), the top plate (30) is slidably connected to the inside of the placement groove (3), and a buffer pad (28) is sleeved on the surface of the top rod (29).