Blowing temperature control device
By setting up an insulation cover in the air blowing temperature control device to form an insulation chamber, the problems of insufficient heat utilization of the temperature control airflow and heat loss of the test seat are solved, achieving temperature stability and efficient energy utilization, and improving the accuracy and efficiency of semiconductor testing.
Patent Information
- Application Number
- CN202522073879.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-25
- Publication Date
- 2026-06-30
- Estimated Expiration
- 2035-09-25
AI Technical Summary
In existing air-blowing temperature control devices, the heat of the temperature-controlled airflow is not fully utilized, and the heat of the test socket is quickly dissipated, resulting in poor temperature stability and affecting the accuracy and efficiency of chip testing.
An insulation cover is installed on the outside of the test seat to form an insulation chamber, allowing part of the temperature-controlled airflow to flow into the insulation chamber, thereby enhancing the temperature stability of the test seat and reusing the heat of the airflow.
It improves the temperature stability of the test socket, reduces energy waste, enhances temperature control performance and the accuracy and reliability of chip testing, and is suitable for synchronous temperature control of multiple test sockets.