A detachable multi-radio channel high speed socket assembly
Patent Information
- Application Number
- CN202521909018.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-04
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-09-04
AI Technical Summary
[0003]根据多通道在PCB板上的布局及与互配连接器对接使用需求，直接制作插座与PCB板焊接固定往往会出现由于射频通道数过多导致插座体积相对较大且形状不规则，模具生产的插座基座容易产生变形问题，进一步会引发固定于插座基座上的焊接引脚发生不同程度尺寸的位移偏差，导致插座与PCB板焊接固定时焊接引脚无法准确对齐PCB板上的焊接孔，影响插座的装配尺寸精度
[0016](1)解决装配尺寸精度的问题，通过采用插座模块的拼合结构设计，缩小体积从而避免体积过大导致变形的问题；另一方面通过在插座模块上设置逃料孔，用于减小基座局部的料厚，从而减小插座模块基座因局部肉厚较厚而导致的缩水变形问题；
Smart Images
Figure CN224745976U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of connector technology, and in particular relates to a detachable multi-RF channel high-speed socket assembly. Background Technology
[0002] PCBs are equipped with socket components for direct connection to connectors, such as various interfaces on electronic devices. This type of PCB socket component is also widely used in the field of chip testing, and multiple radio frequency channels are used to transmit high-speed signals simultaneously.
[0003] Based on the layout of multiple channels on the PCB board and the requirements for interfacing with compatible connectors, directly manufacturing sockets and soldering them to the PCB board often results in a relatively large and irregularly shaped socket due to the large number of RF channels. The socket base produced by the mold is prone to deformation, which in turn causes varying degrees of displacement deviation of the soldering pins fixed on the socket base. This leads to the soldering pins not being able to accurately align with the soldering holes on the PCB board when the socket is soldered to the PCB board, affecting the assembly dimensional accuracy of the socket. Summary of the Invention
[0004] To address the technical problem that an excessive number of RF channels leads to a relatively large socket size, which further affects assembly dimensional accuracy, this application proposes a detachable multi-RF channel high-speed socket assembly. The specific technical solution is as follows:
[0005] A detachable multi-RF channel high-speed socket assembly is fixed to a printed circuit board and includes at least two interlockable socket modules and a cover plate that covers and fixes all socket modules. Each socket module has a connection port and an assembly portion disposed on the opposite side of the connection port. The assembly portion is a notch and has solder pins protruding along the thickness direction of the socket module.
[0006] As an optional implementation, the thickness of the assembly part is equal to that of the printed circuit board.
[0007] As an alternative implementation, the assembly part has a positioning post protruding along the thickness direction of the socket module, the positioning post matching the positioning hole on the printed circuit board so that the solder pins are aligned with the solder hole on the printed circuit board during assembly.
[0008] As an alternative implementation, the welding pins are located on the contacts, which are injection molded and fixed inside the socket module.
[0009] As an optional implementation, the socket module is provided with toothed protrusion one and toothed protrusion two at both ends in the length direction. The toothed protrusion one and toothed protrusion two are staggered in the width direction of the socket module, so that when any two adjacent socket modules are spliced together, the toothed protrusion one and toothed protrusion two interlock and keep the connection port coplanar.
[0010] As an optional implementation, the openings of the recesses of both the first toothed protrusion and the second toothed protrusion are arranged along the length direction of the socket module.
[0011] As an optional implementation, the socket module is provided with a material escape hole.
[0012] As an optional implementation, the cover plate is fixedly connected to the socket module by screws, and both the first toothed protrusion and the second toothed protrusion are provided with connection holes that match the screws.
[0013] As an alternative implementation, the cover plate has a notch to avoid the soldering pins.
[0014] As an optional implementation, the socket assembly further includes two positioning blocks located at both ends, the two positioning blocks respectively engaging and interlocking with toothed protrusion one and toothed protrusion two, and the positioning blocks having positioning grooves with the same opening direction as the connection port.
[0015] The beneficial effects of this utility model are as follows:
[0016] (1) To solve the problem of assembly dimension accuracy, the volume is reduced by adopting the splicing structure design of the socket module, thereby avoiding the problem of deformation caused by excessive volume; on the other hand, by setting material escape holes on the socket module, the local material thickness of the base is reduced, thereby reducing the shrinkage deformation problem caused by the local thick material of the socket module base.
[0017] (2) Improve maintenance convenience. The splicing structure of the socket module is completed by the cooperation of toothed protrusion one and toothed protrusion two. On the one hand, it can reduce the local plastic thickness of the socket module, thereby reducing the shrinkage and deformation problem caused by the local thickness of the socket module. On the other hand, when disassembling any socket module, it is only necessary to desolder the soldered pins and then move the socket module along the thickness direction of the socket module. The installation is the opposite. This process will not interfere with adjacent socket modules, which can avoid the problem of having to disassemble all socket modules when a problem occurs in a certain channel, thus increasing the difficulty and risk of rework. Attached Figure Description
[0018] Figure 1 This diagram illustrates the usage status of the multi-RF channel high-speed socket assembly.
[0019] Figure 2The diagram shown is a structural schematic of the socket as viewed from the back.
[0020] Figure 3 The diagram shown is a structural schematic of the socket as viewed from the front.
[0021] Figure 4 What is shown is Figure 2 A magnified view of a section at point A in the middle;
[0022] Figure 5 The diagram shown is a partial structural schematic of the printed circuit board;
[0023] Figure 6 The diagram shown is a structural schematic of the contact element;
[0024] Figure 7 This diagram shows the assembly status of the socket and the printed circuit board;
[0025] Figure 8 The diagram shown is a structural schematic of the cover plate;
[0026] Figure 9 This is a schematic diagram of another structure of the cover plate;
[0027] Figure 10 The diagram shows the alignment of the positioning block with the socket. Detailed Implementation
[0028] In the following description, certain specific details are set forth to provide a thorough understanding of various embodiments. However, those skilled in the art will understand that the present invention can be practiced without these details. In other instances, well-known structures have not been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments. Unless the context otherwise requires, throughout the specification and appended claims, the word "comprising" shall be interpreted in an open-ended, inclusive sense, i.e., as "including but not limited to".
[0029] See Figure 1 The diagram shown is a schematic of the multi-RF channel high-speed socket assembly in use in this application. The socket assembly is fixed on the printed circuit board 10 (PCB) and provides multiple high-speed RF signal transmission channels.
[0030] The socket assembly includes multiple interlockable socket modules 21 and cover plates 22 fixed to both sides of the socket modules 21. The cover plates 22 are used to fix the multiple socket modules 21 into a whole and also serve as external protection. The socket modules 21 are designed to be modular, allowing for different combinations according to design requirements. Figure 1 As shown in the example, it is a combination of four socket modules 21.
[0031] Figure 2 and Figure 3 The diagram shows the structure of the socket module 21 under different observation states. Figure 2 Based on the state shown, in the xyz coordinate system, the socket module 21 is in the width direction of the socket module 21, the length direction of the socket module 21, and the thickness direction of the socket module 21.
[0032] The socket module 21 has a connection port 21a for connecting to a plug to complete a conductive connection. The connection port 21a is located in the positive direction of the x-axis. On the opposite side of the connection port 21a, an assembly part 21b is formed by setting a notch structure, so that the thickness of the socket module 21 in the assembly part 21 is less than the thickness of the main body of the socket module 21, and the thickness difference between the socket module 21 in the assembly part 21 and the main body matches the thickness of the printed circuit board 10, so that when the printed circuit board 10 is connected to the socket module 21 through the assembly part 21b, the printed circuit board 10 and the socket module 21 are coplanar on the xoy plane.
[0033] Figure 4 As shown Figure 2 A magnified view of a portion of point A in the middle. Figure 5 The diagram shows a partial structural schematic of the printed circuit board 10. The assembly part 21b has several sets of solder pins 31 protruding along the thickness direction of the socket module 21. Correspondingly, the printed circuit board 10 has corresponding solder holes 11. The printed circuit board 10 is placed on the assembly part 21b, and the solder pins 31 are kept passing through the solder holes 11. The solder pins 31 are then soldered to the printed circuit board 10 to fix them and maintain electrical connection.
[0034] A positioning post 21c protruding along the thickness direction of the socket module 21 is also provided on the assembly part 21b. Correspondingly, there is a corresponding positioning hole 12 on the printed circuit board 10. The protrusion distance of the positioning post 21c should be greater than the protrusion distance of the solder pin 31. During the placement of the printed circuit board 10, the positioning post 21c is aligned with the positioning hole 12 to ensure the assembly position relationship between the printed circuit board 10 and the socket module 21, so that the solder pin 31 is aligned with the solder hole 11.
[0035] Figure 6 A schematic diagram of the contact 30 is shown. The solder pin 31 is located on the contact 30, and the contact 30 is fixed inside the socket module 21 by injection molding.
[0036] The socket module 21 has toothed protrusions 23a and 23b at both ends along its length. A "toothed protrusion" is a structure consisting of protruding and recessed parts. The toothed protrusions 23a and 23b are staggered along the width of the socket module 21, meaning the protruding part of toothed protrusion 23a corresponds to the recessed part of toothed protrusion 23b. This ensures that when any two adjacent socket modules 21 are joined by toothed protrusions 23a and 23b, the end face of the connection port 21a remains on the same plane. Figure 7 A schematic diagram showing the state of the socket module 21 assembled with the printed circuit board 10 is shown.
[0037] In this application, a toothed design with toothed protrusion 23a and toothed protrusion 23b is adopted. On the one hand, it can reduce the local plastic thickness of the socket module 21, thereby reducing the shrinkage and deformation problem caused by the local thickness of the socket module 21. On the other hand, when disassembling any socket module 21, it is only necessary to desolder the solder pin 31 and then move the socket module 21 along the thickness direction. The installation is the opposite. This process will not interfere with adjacent socket modules 21. It can avoid the problem of having to disassemble all socket modules 21 when a problem occurs in a certain channel, which would increase the difficulty and risk of rework.
[0038] Multiple material escape holes 21d are also provided on the socket module 21. The material escape holes 21d can be arranged in a regular or irregular manner. The material escape holes 21d are also provided to reduce the local material thickness of the base, thereby reducing the shrinkage and deformation problem caused by the local thick material of the base.
[0039] The cover plates 22 on both sides are fixedly connected to the socket module 21 by screws, as shown in the figure. Figure 3 Both toothed protrusion 23a and toothed protrusion 23b are provided with connecting holes 24; see also Figure 8 The cover plate 22 is provided with a second connection hole 22a corresponding to the first connection hole 24. The socket module 21 can be fixed to the cover plate 22 by passing the bolt through both the first connection hole 24 and the second connection hole 22a at the same time.
[0040] Figure 9 Another shape of the cover plate 22 is shown, which has a notch 22b at the solder pin 31 to facilitate soldering, desoldering and observation of the soldering status of the solder pin 31; therefore, this shape of cover plate 22 is more suitable for installation on one side of the printed circuit board 10.
[0041] See Figure 10 and Figure 1The socket assembly also includes two positioning blocks 40 located at both ends. The two positioning blocks 40 respectively cooperate with the two outermost socket modules 21. Corresponding to the toothed protrusions 23a and 23b on both sides of the socket module 21, the positioning blocks 40 also have a corresponding toothed design, so that the positioning blocks 40 and the socket modules 21 are engaged by the toothed design. The positioning blocks 40 have positioning grooves 40a with the same opening direction as the connection port 21a. The function of the positioning grooves 40a is to cooperate with the positioning pins on the plug, assist the plug and the socket in insertion, and ensure accurate contact and conduction of the contacts.
[0042] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.
Claims
1. A detachable multi-RF channel high-speed socket assembly, the socket assembly being fixed to a printed circuit board, characterized in that, It includes at least two interlockable socket modules and a cover plate that covers and secures all socket modules. Each socket module has a connection port and an assembly portion located on the opposite side of the connection port. The assembly portion is a notch and has welding pins protruding along the thickness direction of the socket module.
2. A detachable multi-RF channel high speed socket assembly according to claim 1, wherein, The thickness of the assembly part is equal to that of the printed circuit board.
3. A detachable multi-RF channel high speed socket assembly as recited in claim 1, wherein, The assembly part has a positioning post protruding along the thickness direction of the socket module. The positioning post matches the positioning hole on the printed circuit board so that the solder pins are aligned with the solder hole on the printed circuit board during assembly.
4. The detachable multi-RF channel high-speed socket assembly according to claim 1, characterized in that, The welding pins are located on the contact element, which is fixed inside the socket module by injection molding.
5. A detachable multi-RF channel high-speed socket assembly according to claim 1, characterized in that, The socket module has a toothed protrusion 1 and a toothed protrusion 2 at both ends in the length direction. The toothed protrusion 1 and the toothed protrusion 2 are staggered in the width direction of the socket module so that when any two adjacent socket modules are assembled, the toothed protrusion 1 and the toothed protrusion 2 interlock and keep the connection port coplanar.
6. A detachable multi-RF channel high-speed socket assembly according to claim 5, characterized in that, The openings of the recesses of both the first and second toothed protrusions are arranged along the length direction of the socket module.
7. A detachable multi-RF channel high-speed socket assembly according to claim 1, characterized in that, The socket module is provided with a material escape hole.
8. A detachable multi-RF channel high speed socket assembly as recited in claim 5, wherein, The cover plate is fixedly connected to the socket module by screws, and both the first toothed protrusion and the second toothed protrusion are provided with connection holes that match the screws.
9. A detachable multi-RF channel high-speed socket assembly according to claim 8, characterized in that, The cover plate has a notch to avoid the welding pins.
10. A detachable multi-RF channel high-speed socket assembly according to claim 1, characterized in that, The socket assembly also includes two positioning blocks located at both ends. The two positioning blocks respectively engage and interlock with toothed protrusion one and toothed protrusion two. The positioning blocks have positioning grooves with the same opening direction as the connection port.