Magnetic semiconductor heat sink (rotor TL23)
CN309469546SActive Publication Date: 2025-08-29曾银平
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Patent Information
- Application Number
- CN202430833224.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-28
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2039-12-28
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Figure 000007_ABST
Abstract
1. The name of this design product: Magnetic semiconductor radiator (rotor TL23). 2. Purpose of this product: a heat dissipation product for cooling mobile phones. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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