Printed circuit board housing device with at least three housing-forming printed circuit board elements for partitioning a housing cavity, manufacturing method and use

Abstract

Printed circuit board housing device (10) with at least three printed circuit board elements (11), namely a lower printed circuit board element (11.1) and an upper printed circuit board element (11.3) and at least one intermediate printed circuit board element (11.2) arranged between them, wherein the at least three printed circuit board elements (11) are arranged in a planar arrangement, wherein at least on the upper printed circuit board element (11.3) a plurality of interconnected components from the following group are provided: conductor tracks (12), sensor units (13), contact points (14), microchip units (15); characterized in that the lower printed circuit board element (11.1) together with the at least one intermediate printed circuit board element (11.2) and the upper printed circuit board element (11.3) forms a housing (10a) for the enclosure on at least one side of at least one of the components on the upper printed circuit board element (11.3).3) components provided; wherein a housing cavity (17) is formed by means of the at least one intermediate circuit board element (11.2), which is sealed by the upper and lower circuit board elements (11.3, 11.1) in such a way that the housing is formed and sealed exclusively by the interconnected circuit board elements (11.1, 11.2, 11.3), wherein the housing (10a) is sealed against the environment by a permanent irreversible, fully circumferential connection of the circuit board elements (11) to each other, with the housing cavity (17) in a hermetic seal against moisture and dust, wherein at least one of the components arranged on the upper circuit board element (11.3) is / remains contactable on the outer top surface of the upper circuit board element (11.3), wherein the permanent irreversible connection of the circuit board elements (11.3) are connected to each other by a metallic connection along one / the respective circumferential connection line (17.1), wherein an electromagnetic shielding function is integrated into the housing (10a) formed by the at least three circuit board elements ( 11).

Description

[0001] The present invention relates to a printed circuit board housing device comprising at least three printed circuit board elements, namely a bottom printed circuit board element, a top printed circuit board element, and at least one intermediate printed circuit board element arranged between them. The at least three printed circuit board elements are arranged in a planar arrangement, and at least on the top printed circuit board element, a plurality of interconnectable components from the following group are provided / arranged: conductor tracks, sensor units, contact points, and microchip units. Furthermore, the present invention also relates to a method for manufacturing such a printed circuit board housing device. Finally, the present invention also relates to the use of such a printed circuit board housing device or individual components thereof, particularly for control cabinet or vehicle applications.

[0002] Sensors, measuring instruments, microchip units, and similar components mounted on printed circuit boards (PCBs) ideally need to be protected from moisture, extreme temperature fluctuations, dust, and / or electromagnetic interference in a wide variety of applications. In many applications, such as in motor vehicles, this requirement applies to numerous measuring points, making the cost per point a significant factor. Therefore, there is a demand for enclosures or housings for these PCB components that offer a good compromise between protection and technical and cost considerations. Ideally, the enclosure should be as simple and cost-effective as possible. In other words, there is a need for a very simple, cost-effective, and flexible enclosure solution suitable for numerous applications.

[0003] Currently, there is no sufficiently satisfactory technical solution for enclosing printed circuit board components, particularly for control cabinet or automotive applications. Especially when dealing with hermetically sealed measuring points, the available technologies result in comparatively high costs.

[0004] EP 3 144 967 B1 describes an arrangement in which a stepped printed circuit board enables advantageous integration of components. The printed circuit board itself can already form a large part of a housing.

[0005] EP 2 308 274 B1 describes, as a measure to eliminate housing parts, the use of an open-edged groove into which coolant can be introduced, using a heat-conducting sealing element.

[0006] The following publications describe enclosures in which printed circuit boards form individual enclosure components: DE 10 2019 102 333 A1, DE 10 2010 033 662 A1, DE 10 2008 057 887 A1, DE 10 2005 062 799 A1, DE 10 2005 055 950 A1.

[0007] The objective is to provide a device that allows printed circuit board (PCB) components to be isolated from their environment in a technically simple and cost-effective manner. Furthermore, the objective is to design a device for isolating PCB components in such a way as to require minimal material, particularly with regard to optional scaling or size adjustments. The objective also includes ensuring a durable and robust seal for the PCB component housing, especially with a relatively simple connection technology for creating the enclosure. Finally, the objective is to develop a design concept for providing a PCB component housing that effectively protects sensor components mounted on the PCBs from moisture and dust.

[0008] This problem is solved by a printed circuit board housing device according to claim 1 and a printed circuit board housing device according to the respective dependent claim, as well as by a use according to the respective dependent use claim. Advantageous embodiments of the invention are explained in the respective dependent claims. The features of the exemplary embodiments described below can be combined with one another unless explicitly stated otherwise.

[0009] A printed circuit board housing device is provided with at least three printed circuit board elements, namely a bottom printed circuit board element and a top printed circuit board element and at least one intermediate printed circuit board element arranged between them, wherein the at least three printed circuit board elements are arranged in a planar arrangement, wherein at least on the top printed circuit board element a plurality of interconnectable / connected components from the following group are provided / arranged: conductor tracks, sensor units, contact points, microchip units.

[0010] According to the invention, it is proposed that the lower circuit board element together with the at least one intermediate circuit board element and the upper circuit board element form a housing for the enclosure of at least one of the components provided on the upper circuit board element on at least one side;wherein a housing cavity is formed by means of at least one intermediate circuit board element, which is sealed by the upper and lower circuit board elements in such a way that the housing is formed and sealed exclusively by the interconnected circuit board elements, wherein the housing is sealed from the environment by a permanent, irreversible, fully circumferential connection of the circuit board elements to one another, in particular by a circumferential connection line provided between each pair of circuit board elements, in particular circumferential soldering, in particular with the housing cavity in a hermetic seal / seal against moisture and dust. This enables a good compromise between minimized costs, robust connection technology and functional integration with a minimal number of components required.

[0011] The invention is based on the concept of providing the housing entirely through the outer surfaces and edges of the printed circuit board (PCB), with sealing preferably ensured by a circumferential solder joint located at the edge and within the respective PCB plane. In other words, the sealing of the PCB components can be ensured solely by means of the PCB elements themselves (no additional housing components are required), particularly in combination with a circumferential solder joint. This also allows for the advantage that soldering can be performed between components of the same material (each PCB material), especially by heating (only) one side of the corresponding PCB.

[0012] The invention is also based on the following approaches: Several circuit boards can be connected to form a housing that can be sealed from the environment. At least three circuit boards form a housing structure that can be hermetically sealed, preventing, for example, moisture from entering the housing. The circuit boards are connected to each other, particularly by soldering. Preferably, the top circuit board is first connected to the intermediate board, and only then is the housing cavity sealed by bonding or soldering to the bottom circuit board. This also offers advantages with regard to the thermal stress on the components located on the top circuit board. The thermal stress can be kept comparatively low, and optionally an additional intermediate board can be provided as an additional spacer, e.g. when the lower board is baked onto the intermediate board by temperature influence from below (lower board rests on a heating plate, for example) (largest possible distance between heat source and the components provided on the upper board).

[0013] The circuit boards themselves can already form a sealing structure. Preferably, a circumferential solder joint is provided, which is formed on at least one side, and in the case of intermediate circuit boards, also on both flat sides of the circuit board. Thus, two circuit boards can form the base and lid of the housing, and at least one circuit board forms an intermediate / spacer. The sealing is optionally achieved exclusively by soldering. Mounting tabs or similar fasteners can be provided on the underside of the circuit board, e.g., for mounting the circuit board housing in a control cabinet or in a vehicle, particularly a motor vehicle.

[0014] The following specific aspects or further developments of the invention may be particularly advantageous depending on the application: - at least three circuit boards, one of which (case base) has holes or mounting tabs; - a middle / intermediate board is present as a frame element or spacer element; - a third circuit board is used as a housing cover and soldered all around to the frame element; -Additional components can be docked onto the housing cover circuit board, especially connectors such as LAN and / or USB connections; - the housing can be formed by at least three circuit board elements, which enclose a compartment or a housing cavity on both sides;

[0015] The sensor unit preferably comprises a temperature and / or humidity sensor component. The term "microchip unit" specifically includes a microcontroller (µC unit).

[0016] In this process, at least one of the components arranged on the top-side circuit board element remains contactable on the outer top side of the top-side circuit board element, e.g. for reading a sensor unit via a connector socket.

[0017] It has been shown that the inventive design also enables a significant cost reduction per sensor measuring point, for example by a factor of 5 to 10. For example, numerous measuring points for temperature and / or humidity are provided in a motor vehicle, and these currently cost approximately 50 to 100 euros per measuring point. The printed circuit board housing device according to the invention, on the other hand, can be provided at drastically reduced costs, particularly by connecting a large number of printed circuit board housing devices in series at several measuring points, e.g., in a refrigerated transport vehicle.For a series connection of several printed circuit board housing devices, at least two plug sockets are preferably provided per printed circuit board housing device, in particular identical plug sockets, especially in opposite orientations (plug connection in opposite directions, especially for the purpose of straight cable routing between several printed circuit board housing devices).

[0018] It has been shown that the entire structural design and the mechanical protective and housing components can essentially be provided using printed circuit board elements, which also leads to cost advantages in particular.

[0019] Particularly in the case of a soldered connection between the circuit board elements, an additional shielding function is integrated into the housing, especially with regard to electromagnetic compatibility (EMC), particularly concerning non-conducted interference reception and emission. Thus, the invention also enables a sensor component that can be used in numerous applications, even in installation situations with interference fields, especially with good, unaffected measurement quality (no or at most a barely perceptible loss of sensor functionality).

[0020] The top-side printed circuit board element is preferably contactable on both sides, in particular by having sensors on the top-side printed circuit board element in metrological communication with the environment on the one hand (top side), and in electronic connection with other components on the other hand (bottom side). Thus, the top-side printed circuit board element can provide a housing wall that is, in a sense, through-hole plated, i.e., through which individual electronic components or sensor components extend.

[0021] The aforementioned problem can, according to an alternative formulation of the inventive concept, also be solved in particular by providing a printed circuit board housing device with at least three housing-forming printed circuit board elements, namely a bottom printed circuit board element and a top printed circuit board element and at least one intermediate printed circuit board element arranged between them, wherein the at least three printed circuit board elements are arranged in a planar arrangement, wherein a plurality of interconnectable / connected components from the following group are provided / arranged on at least one of the printed circuit board elements: conductor tracks, sensor units, contact points, microchip units; wherein the at least three printed circuit board elements form a housing for the at least one-sided enclosure of at least one of the components and are connected to each other in such a housing-forming manner.In particular, a fully circumferential connecting line between each pair of printed circuit board elements ensures that the at least one enclosed component is shielded from the environment, at least with regard to moisture, and preferably also protected against electromagnetic interference, especially by a printed circuit board housing device with further features described here. By assigning a housing function to each printed circuit board element used, additional components (components other than printed circuit board elements) can be dispensed with. Thus, a very cost-effective measuring point can be provided (sensors integrated on the printed circuit board and in the housing formed by the printed circuit board elements). An electromagnetic shielding function is integrated into the housing formed by the at least three printed circuit board elements.

[0022] The term "connecting line" can also be understood as a linear connecting surface or a circumferential band, i.e., also a line with a certain width.

[0023] The following section describes in more detail the connection technology and sealing of the housing, in particular a connection by soldering.

[0024] According to one embodiment, the permanent, irreversible connection of the printed circuit board elements to one another is achieved through soldering, particularly with previously applied circumferential solder traces on the respective circuit board. This also eliminates the need for adhesives or other fasteners. The use of soldering technology to create the hermetic seal also enables a particularly sustainable manufacturing process, especially through the application of moderate heat over a large area.

[0025] According to one embodiment, the permanent, irreversible connection of the printed circuit board elements to one another is a metallic connection along one or more of the respective circumferential connection lines, in particular a connection made of solder. This also facilitates material- and component-friendly manufacturing, especially housing-forming connections at comparatively moderate temperatures.

[0026] The following describes in more detail the implementation of a shielding function, in particular by providing several preferably congruent, fully circumferential metallic connection lines.

[0027] According to the invention, an electromagnetic shielding function is integrated into the housing formed by the at least three printed circuit board elements, in particular by means of a connection realized by circumferential solder traces, especially by means of congruent solder traces. This advantageously promotes a particularly robust operation, even of sensors. The inventive design concept and the fully circumferential soldering can also generate a kind of Faraday cage effect, i.e., a particularly effective electromagnetic shield.

[0028] According to one embodiment, an electromagnetic shielding function is ensured by means of the housing-forming circuit board elements for the housing cavity by means of the circuit board elements arranged in pairs on top of each other, each connected to the other in a metallurgical bond along a completely circumferential connection line, in particular with the at least two completely circumferential metallic connection lines of the at least three circuit board elements in an identical arrangement one above the other, and in particular with the at least two completely circumferential metallic connection lines in a plane-parallel orientation to each other at a distance at least approximately corresponding to the thickness of one / the corresponding intermediate circuit board element. This also ensures a particularly effective shielding function.

[0029] The following describes in more detail the particularly advantageous design with plug socket(s) for more specific wired applications, in particular with double plug sockets for a series connection of numerous measuring points.

[0030] According to an advantageous embodiment, at least one connector socket is provided on the outer side of the top-side circuit board element, in particular a connector socket contacted to at least one sensor unit. This also facilitates wired reading of measured values.

[0031] At least two connector sockets can optionally be provided on the outer side of the top-facing circuit board element, particularly in opposite orientations. This also facilitates, for example, a series arrangement of several circuit board housing devices, such as when implementing sensors in a refrigerated vehicle with numerous cooling compartments and numerous measuring points.

[0032] In the following, an additional external sensor system is described in more detail, namely in an arrangement that connects through the top-side circuit board (electronic connections of a sensor preferably all located inside the housing).

[0033] According to one embodiment, at least one sensor unit (or one of the other components described herein) is provided on the upper circuit board element, which is in metrological communication with the environment and can optionally be contacted from the outside. In particular, this sensor unit is for measuring temperature and / or humidity. The sensor unit (or one of the other components described herein) is connected to at least one other component by means of conductor tracks arranged internally within the housing cavity. The sensor unit can also extend through the upper circuit board element, i.e., protrude from both sides, so that internal sections of the sensor unit are hermetically sealed within the housing, and measurement data can be acquired at external sections.Integrating sensors into a housing wall formed by a printed circuit board (PCB) also offers the advantage of simple and cost-effective adaptation of the sensor housing concept to the specific application. The necessary PCB components can be provided and customized very cost-effectively.

[0034] The following describes in more detail an optional sensor cavity and protection against mechanical impact for at least one external component.

[0035] According to an advantageous embodiment, at least one sensor cavity is formed on the upper printed circuit board element for receiving or mechanically protecting one or more sensor units, in particular by means of a preferably air-permeable, especially perforated or perforated, printed circuit board cover and an intermediate printed circuit board spacer element. This allows the printed circuit board housing concept according to the invention to also be transferred to external components. The functionality integrated into the printed circuit board elements can thus be further expanded. In other words: Although essentially only printed circuit board elements are used, numerous functional and device-related variations can be realized for the respective measurement technology to be implemented.

[0036] According to an advantageous embodiment, at least one mounting tab, bore, or other fastening means for mounting the printed circuit board housing device is provided on the underside of the printed circuit board element, in particular integrated into the printed circuit board plane of the underside of the printed circuit board element. This also facilitates mounting at the intended location or at the desired measuring point, especially without additional fastening means (re-functional integration into the printed circuit board elements, and thus a reduction in the number of components required).

[0037] The preferred frame-like geometry of the intermediate circuit board element is described in more detail below.

[0038] According to an advantageous embodiment, the intermediate circuit board element is designed in a frame-like manner, in particular with a circumferential width that is at least approximately constant, and in particular with a width that is at most a factor of 2 of the width of the circumferential connection lines or the circumferential solder traces. This also provides a comparatively large housing cavity with minimal material usage.

[0039] The intermediate circuit board element preferably defines only a spacer function for defining or clamping the housing cavity, in particular with the thickness of the intermediate circuit board element determining the height of the housing cavity. This also allows for scaling in height, especially without requiring any design modifications. Therefore, the intermediate circuit board element can be designed very simply: a circuit board frame with a fully circumferential connection line provided on both sides of the respective circuit board surface.

[0040] The following section describes the preferred planar soldering / connection in more detail from a design perspective, exclusively in a top view in the corresponding printed circuit board plane.

[0041] According to an advantageous embodiment, a housing cavity of predefined depth is formed by means of the at least one intermediate circuit board element, the depth being defined by the thickness and the number of the at least one intermediate circuit board element. This function, isolated to the intermediate circuit board element, also provides design freedom and variations with minimized adaptation effort.

[0042] The printed circuit board elements are preferably arranged and connected to one another in a congruent arrangement with their respective circumferential connecting lines, particularly with rectangular contours of the circumferential connecting lines. This provides, for example, an advantageous use of the (measurably) usable surface area provided by the printed circuit board elements, even in a series arrangement of numerous measuring points.

[0043] The circumferential connecting lines preferably run along an outer edge of the respective circuit board element. This allows the space created for hermetically sealed components to be utilized as fully as possible, in relation to the footprint required for the respective measuring point.

[0044] According to one embodiment, the at least three printed circuit board elements are each housing-constituting printed circuit board elements, such that each installed printed circuit board element fulfills a housing function, wherein the upper and lower printed circuit board elements each form a housing wall arranged in the corresponding printed circuit board plane, and wherein the intermediate printed circuit board elements provided for defining the height of the clamped housing cavity each form a lateral plane section of the housing, and wherein all printed circuit board elements are materially bonded to each other in pairs along completely circumferential connection lines, wherein the connection lines consist of an electromagnetically shielding material, in particular a metallic material, in particular solder material.Preferably, all intermediate circuit board elements forming the lateral plane of the housing are frame-like, in particular with a comparatively thin circumferential web, especially with a web width at least approximately corresponding to the width of the circumferential connection line (or a width only slightly increased in comparison). The width of a material-bonded connection line can also be determined by the web width, particularly depending on the desired shielding effects.

[0045] The aforementioned problem is also solved in particular by a printed circuit board housing device with a housing for at least one-sided enclosing of at least one printed circuit board component, with at least three housing-forming printed circuit board elements arranged one above the other, wherein a plurality of interconnectable / connected components from the following group are provided / arranged on at least one of the printed circuit board elements: conductor tracks, sensor units, contact points, microchip units; wherein at least one sensor unit is provided, in particular a sensor unit for measuring temperature and / or humidity, wherein the at least three printed circuit board elements form a housing for at least one-sided enclosure of at least one sensor unit and are connected to each other in such a housing-forming manner by a fully circumferential connecting line provided between each of the two printed circuit board elements.that at least one enclosed sensor unit is sealed off from the environment, at least with regard to moisture, and is also protected against electromagnetic influences by means of the fully circumferential connection lines, wherein the permanent irreversible connection of the circuit board elements to one another is a metallic connection along the respective circumferential connection line, in particular a connection made of solder material, wherein at least one connector socket contacted with the sensor unit is provided on the outer side of the top circuit board element; in particular by a circuit board housing device according to the features described herein. This provides numerous advantages mentioned above. An electromagnetic shielding function is integrated into the housing formed by the at least three circuit board elements.

[0046] The aforementioned problem is also solved by a method for manufacturing a printed circuit board housing device, in particular a printed circuit board housing device described above, comprising a housing formed from at least three printed circuit board elements, comprising the steps: -Providing a bottom-side printed circuit board element and a top-side printed circuit board element and at least one frame-like intermediate printed circuit board element that can be arranged between them, wherein the bottom-side printed circuit board element and the top-side printed circuit board element each have a fully circumferential connection line on one / the inner side that is located on the inside during intended use, and wherein the frame-like intermediate printed circuit board element has a geometrically corresponding fully circumferential connection line on both sides, wherein at least on the top-side printed circuit board element a plurality of interconnectable / connected components from the following group are provided / arranged: conductor tracks, sensor units, contact points, microchip units; -Arrangement of the intermediate circuit board element on the inside of the top-side circuit board element; -Connecting the intermediate circuit board element to the upper circuit board element along the now overlapping circumferential connection lines, in particular by applying temperature, in particular by soldering; - Arranging the inside of the bottom-side circuit board element on the (still exposed, opposite) second side of the intermediate circuit board element; -Connecting the intermediate circuit board element to the lower circuit board element along the now superimposed circumferential connection lines, in particular by applying heat from the outer surface of the lower circuit board element, in particular by soldering; wherein the connection is carried out in such a way that the lower circuit board element together with the at least one intermediate circuit board element and the upper circuit board element forms a housing for the enclosure of at least one of the components provided on the upper circuit board element on at least one side; wherein the intermediate (sandwich) arrangement of the at least one intermediate circuit board element forms a housing cavity which is sealed by the upper and lower circuit board elements along the circumferential connection lines,so that the housing is formed and sealed exclusively by the interconnected circuit board elements, and is also electromagnetically shielded. An electromagnetic shielding function is integrated into the housing formed by the at least three circuit board elements. This offers the advantages described above, particularly with regard to minimized costs per measuring point or per circuit board housing device. Particularly noteworthy advantages include: all housing-forming components can be provided by circuit board elements, and a metallurgical bond can be easily achieved along metallic connection lines, ensuring a robust and durable seal. Especially when soldering, this connection requires no additional technology or material.and the durability of the entire device can be largely the same as that of printed circuit boards, so that the device can be used without additional precautions.

[0047] In this process, at least one of the components arranged on the top-side printed circuit board element remains contactable on the outer top side of the top-side printed circuit board element, with electronic contact to further printed circuit board components being realized on the inner underside of the top-side printed circuit board element.

[0048] The respective circumferential connection line can already be provided on the respective printed circuit board element. Therefore, the manufacturing process can also be described as an assembly process, in particular a soldering process, of at least three enclosure-forming printed circuit board elements.

[0049] According to an advantageous embodiment, the circumferential connection lines are coated with solder paste, and the respective printed circuit board elements can be subjected to heat treatment in a temperature-controlled oven, particularly according to a temperature curve corresponding to a conventional soldering temperature profile. This allows the connection technology for creating the housing cavity or the housing to be implemented or provided using methods that correspond at least approximately or even exactly to those of a conventional soldering process, thus enabling automation in a very simple manner, especially without having to take special precautions or measures to protect the other printed circuit board components. In other words, the housing can also be created together with the printed circuit board manufacturing process.Separate manufacturing for the housing is not required, nor is a separate logistics chain. This enables further process simplifications and cost savings.

[0050] The respective circuit board elements to be joined can advantageously be arranged in a solid block, in particular in a metallic frame, especially a milled aluminum frame, for bonding the connection lines.

[0051] The aforementioned problem is also solved by using a plurality of printed circuit board elements, in particular at least three printed circuit board elements of a printed circuit board housing device described above, to form a printed circuit board housing device for enclosing at least one printed circuit board component from the following group: conductor track, sensor unit, contact point, microchip unit; wherein the enclosing is carried out exclusively by means of the printed circuit board elements, wherein the printed circuit board elements are irreversibly connected to each other in planar pairwise contacting in the respective printed circuit board plane along completely circumferential connection lines and thereby sealed.and wherein at least one of the printed circuit board elements defines a housing cavity between external planar printed circuit board elements; in particular for housing at least one sensor unit and / or microchip unit for providing temperature and / or humidity measurement functionality, in particular also for providing a mounting / fastening function by means of at least one of the printed circuit board elements, in particular for an arrangement of the printed circuit board housing device in a control cabinet or in a vehicle, or with the printed circuit board housing device in a mounted arrangement in a control cabinet or in a vehicle, in particular for providing at least one enclosed measuring point by means of the printed circuit board housing device. This provides advantages as described above,This also offers cost advantages with regard to the respective measuring point. At least one of the components arranged on the top-side printed circuit board element remains contactable on the outer top surface of the top-side printed circuit board element, with electronic contact to further printed circuit board components being realized on the inner underside of the top-side printed circuit board element. An electromagnetic shielding function is integrated into the housing formed by the at least three printed circuit board elements.

[0052] The aforementioned problem is also solved by using at least one frame-like intermediate circuit board element to define a housing cavity between two planar circuit board elements, wherein the planar circuit board elements are irreversibly connected and sealed together as a sandwich stack with the at least one frame-like intermediate circuit board element arranged between them along completely circumferential connection lines, in particular by complete soldering, to form a circuit board housing device with at least one circuit board component arranged in the housing cavity from the following group: conductor track, sensor unit, contact point, microchip unit;in particular for forming a printed circuit board housing device described above, in particular for providing temperature and / or humidity measurement functionality by means of the enclosed printed circuit board component(s), in particular for mounting / fastening the printed circuit board housing device in a control cabinet or in a vehicle, or in an already mounted arrangement in a control cabinet or in a vehicle. This provides advantages described above. At least one of the components arranged on the top-side printed circuit board element is / remains contactable on the outer top surface of the top-side printed circuit board element, with electronic contact to further printed circuit board components being realized on the inner underside of the top-side printed circuit board element. An electromagnetic shielding function is integrated into the housing formed by the at least three printed circuit board elements.

[0053] The aforementioned problem is also solved by a printed circuit board housing device comprising a housing formed from at least three printed circuit board elements and at least one printed circuit board component arranged in the housing from the following group: conductor track, sensor unit, contact point, microchip unit; in particular by a printed circuit board housing device described above, wherein the printed circuit board housing device is manufactured by a two-stage joining process of paired printed circuit board elements, namely first by joining a top-side printed circuit board element comprising the at least one printed circuit board component arranged thereon with a frame-like intermediate printed circuit board element along a completely circumferential connecting line in the form of a solder track, which each extend geometrically correspondingly on the printed circuit board elements.in particular, fully along the edge in the respective circuit board plane, and subsequently connecting a housing-internal surface of a lower circuit board element with the exposed side of the intermediate circuit board element also along a fully circumferential connection line in the form of a solder track, in particular by applying heat from the housing-outer surface of the lower circuit board element; wherein the connection is carried out in such a way,that the lower printed circuit board element, together with the at least one intermediate printed circuit board element and the upper printed circuit board element, forms the housing for the enclosure of the at least one printed circuit board component on at least one side; wherein, by means of the at least one frame-like intermediate printed circuit board element, a housing cavity for receiving the at least one printed circuit board component is formed due to the frame-like design and the fully circumferential connection line on both sides. This offers advantages described above, in particular with regard to minimized material consumption and with regard to the use of established robust connection technology, which can fulfill numerous other functions in the housing arrangement, e.g., a shielding function. At least one of the components arranged on the upper printed circuit board element is / remains contactable on the outer top surface of the upper printed circuit board element.wherein electronic contact to further printed circuit board components is realized on the inner underside of the upper printed circuit board element. An electromagnetic shielding function is integrated into the housing formed by the at least three printed circuit board elements.

[0054] The invention is described in more detail in the following drawings, whereby reference numerals not explicitly described in a particular drawing are made to the other drawings. They show: Fig. 1A, Fig. 1B, Fig. 1C in perspective views individual printed circuit board elements of a printed circuit board housing device according to an exemplary embodiment; Fig. 1D in a top view of a bottom surface, a top-side printed circuit board element according to Fig. 1C; Fig. 2A, Fig. 2B, Fig. 2C, Fig. 2D in two side views as well as in a top view and in a perspective view a printed circuit board housing device according to an exemplary embodiment; Fig. 3 and Fig. 4 each in schematic representation one or more mounting positions for a printed circuit board housing device according to an exemplary embodiment, in specific application cases;

[0055] The characters are initially described together. Specific features are then explained individually, referring to particular reference points in relation to each character.

[0056] A printed circuit board housing device 10 defines a housing 10a by several printed circuit board elements 11, wherein the individual printed circuit board elements 11 are connected to each other in pairs in a printed circuit board plane xy, in a sandwich-like construction. The printed circuit board housing device 10 has, for example, three or four printed circuit board elements, namely a bottom printed circuit board element 11.1 and a top printed circuit board element 11.3, as well as one or two or more intermediate printed circuit board elements 11.2. Printed circuit board components are provided, for example, exclusively on the top printed circuit board element 11.3, in particular components from the following group: conductor tracks 12, sensor units 13 (sensors in particular for temperature and / or humidity measurement), contact points 14, microchip / microcontroller units 15.The printed circuit board components are preferably arranged substantially on a lower surface of the upper printed circuit board element 11.3 (facing the housing cavity in the assembled state). Preferably, at least one sensor 13 is provided, which is arranged in the upper printed circuit board element 11.3 such that measurement communication with the environment takes place via the outer upper surface of the upper printed circuit board element 11.3, and that electronic contact with further printed circuit board components is realized on the inner lower surface of the upper printed circuit board element 11.3. Optionally, one or more connector sockets 16 can be provided for wired connection of the microcontroller and / or sensor.

[0057] The printed circuit board elements 11 provide a sealed and optionally also electromagnetically shielded housing cavity 17. The individual printed circuit board elements 11 are connected to each other in pairs at fully circumferential connection lines 17.1 (in particular solder traces) in the respective printed circuit board plane xy, in particular by soldering.

[0058] Optionally, an additional sensor cavity 13.1 can be created, particularly for the purpose of mechanically protecting external components of the sensor 13. For this purpose, for example, a circuit board cover 18 can be provided, which is connected to the top surface of the upper circuit board element 11.3 via one or more circuit board spacers 19. This additional optional structure made of circuit board material ( Fig. 2B) A connection technique can be used in accordance with the circumferential connection lines described here, in particular also with a shielding function.

[0059] The printed circuit board device 10 can be mounted in a mounting position 1 for a specific application in the field, for example on fastening means 11a, in particular fastening tabs with holes, which are preferably provided on the underside of the printed circuit board element 11.1, in particular to provide a cost-optimized measuring point protected with regard to moisture, electromagnetic interference fields or the like, for example in a control cabinet 2 or in a vehicle 3.

[0060] In the Fig. 1. The individual printed circuit board elements 11 are described.

[0061] In Fig. 1A is a lower printed circuit board element 11.1 shown, on which a fastening function 11a is also provided for mounting the printed circuit board housing device, e.g. at a respective desired measuring point in a vehicle.

[0062] Fig. Figure 1B shows a frame-like intermediate circuit board element 11.2.

[0063] Fig. 1C and Fig. Figure 1D shows an upper circuit board element 11.3 with circuit board components provided on it (in particular at least one sensor 13 and at least one µchip 15) and connector sockets 16.

[0064] In the Fig. Figure 2 shows an already assembled printed circuit board housing device 10, wherein the housing cavity 17 is formed here by two frame-like intermediate printed circuit board elements 11.2 according to Fig. 1B is defined.

[0065] Fig. Figure 2A illustrates the sandwich-like structure of the printed circuit board housing device 10, here comprising four printed circuit board elements 11.1, 11.2, 11.3 lying flat on top of each other and connected to each other by three pairs of contacted connection lines in a material-bonded manner.

[0066] In Fig. Figure 2A shows that the described embodiment has two intermediate circuit board elements 11.2; in other words, a housing cavity with a height corresponding to twice the thickness of a circuit board is formed. Optionally, only one intermediate circuit board element 11.2 can be provided, but optionally, more than two intermediate circuit board elements 11.2 can also be provided. The invention is based, on the one hand, on the concept of defining the volume of the housing cavity 17 by means of the intermediate circuit board element(s), and on the other hand, on the concept of ensuring good electromagnetic shielding of the housing cavity 17 or of a sensor and / or microcontroller unit arranged therein. Depending on the radiation exposure in the specific installation situation for the sensor, it may therefore be advantageous to provide several intermediate circuit board elements 11.2.This scalability can advantageously be ensured even at minimized costs, with the same manufacturing process and using the same components.

[0067] Fig. 2B describes an optional arrangement of a sensor 13 between two plug sockets 16 (advantageous for series arrangement of several measuring points or several printed circuit board housing devices 10), wherein external components of the sensor 13 can additionally be protected against mechanical impact.

[0068] The concept of minimizing the number of components used can optionally be further implemented, particularly for the purpose of mechanically protecting the sensor unit 13. For example, a circuit board cover 18 (dotted line) can be provided as mechanical protection for the sensor (only in Fig. 2B indicated), wherein, for example, holes are provided in the circuit board cover 18 to allow air exchange with the environment. The circuit board cover 18 is also flat and can be supported on the top surface of the upper circuit board element 11.3 (in particular also by means of spacer elements 19 (dotted line) made of circuit board material, especially if the sensor is relatively flat, i.e., has no high structures).

[0069] Fig. 2C or Fig. Figure 2D illustrates the minimalist design concept of the printed circuit board housing device 10, which requires minimal space and essentially consists of the housing enclosed by printed circuit board elements and the mounting tabs projecting from it. The connector socket configurations are optional, depending on the application.

[0070] Fig. Figure 3 illustrates the use of a single printed circuit board housing device 10 to provide a single measuring point in a control cabinet 2. A sensor of the printed circuit board housing device 10 can, for example, be read via a wired connection, where, for example, only a connector socket 16 is provided on the upper printed circuit board element.

[0071] Fig. Figure 4 illustrates a series connection of several printed circuit board housing devices 10 along a measuring section (dashed line), e.g. in a refrigerated vehicle with numerous compartments, each of which is to be equipped with measuring equipment. Reference symbol list 1 Mounting position, especially in a control cabinet or vehicle 2 Control cabinet 3 vehicles 10 Printed circuit board housing device 10a Housing 11 printed circuit board element 11a Fasteners, in particular fastening tabs with holes 11.1 Underside printed circuit board element 11.2 Intermediate circuit board element 11.3 Top-side printed circuit board element 12 conductor tracks 13 Sensor unit (sensor, in particular temperature and / or humidity sensor) 13.1 Sensor cavity 14 Contact point 15 µChip / µC unit 16 plug sockets 17 sealed housing cavities 17.1 (Completely) circumferential connecting line, in particular metallic, in particular solder track 18 circuit board covers 19 PCB spacer xy PCB level

Claims

[1] Printed circuit board housing device (10) with at least three printed circuit board elements (11), namely a bottom printed circuit board element (11.1) and a top printed circuit board element (11.3) and at least one intermediate printed circuit board element (11.2) arranged between them, wherein the at least three printed circuit board elements (11) are arranged in a planar arrangement, wherein at least on the top printed circuit board element (11.3) a plurality of interconnected components from the following group are provided: conductor tracks (12), sensor units (13), contact points (14), microchip units (15); characterized by, that the lower printed circuit board element (11.1) together with the at least one intermediate printed circuit board element (11.2) and the upper printed circuit board element (11.3) form a housing (10a) for the enclosure of at least one of the components provided on the upper printed circuit board element (11.3) on at least one side; wherein a housing cavity (17) is formed by means of the at least one intermediate printed circuit board element (11.2), which is sealed by the upper and lower printed circuit board elements (11.3, 11.1) in such a way that the housing is formed exclusively by the interconnected printed circuit board elements (11.1, 11.2, 11.3).3) is formed and sealed, wherein the housing (10a) is sealed against the environment by a permanent irreversible fully circumferential connection of the printed circuit board elements (11) to each other, with the housing cavity (17) in a hermetic seal against moisture and dust, wherein at least one of the components arranged on the upper printed circuit board element (11.3) is / remains contactable on the outer top surface of the upper printed circuit board element (11.3), wherein the permanent irreversible connection of the printed circuit board elements (11.3) to each other is a metallic connection along one / the respective circumferential connection line (17.1), wherein an electromagnetic shielding function is integrated into the housing (10a) formed by the at least three printed circuit board elements (11). [2] Printed circuit board housing device (10) with at least three housing-forming printed circuit board elements (11), namely a lower printed circuit board element (11.1) and a upper printed circuit board element (11.3) and at least one intermediate printed circuit board element (11.2) arranged between them, wherein the at least three printed circuit board elements (11) are arranged in a planar arrangement, wherein at least one of the printed circuit board elements (11.3) a plurality of interconnected components from the following group are provided: conductor tracks (12), sensor units (13), contact points (14), microchip units (15); wherein the at least three printed circuit board elements (11) form a housing (10a) for the at least one-sided enclosure of at least one of the components and are interconnected in such a housing-forming manner that the at least one enclosed component is shielded from the environment, at least with regard to moisture, and preferably also protected against electromagnetic influences, wherein at least one of the components arranged on the upper printed circuit board element (11.3), comprising a sensor unit (13), can be contacted via a connector socket (16) provided on the outer side of the upper printed circuit board element (11.3), wherein the upper printed circuit board element (11.3) a through-hole plating housing wall is provided, wherein the housing (10a) is sealed from the environment by a permanent irreversible fully circumferential connection of the printed circuit board elements (11) to each other, wherein the permanent irreversible connection of the printed circuit board elements (11) to each other is a metallic connection along a respective circumferential connection line (17.1), wherein an electromagnetic shielding function is ensured for the housing cavity by means of the housing-forming printed circuit board elements (11) by means of a fully circumferential metallic connection line (17.1) connecting pairwise adjacent printed circuit board elements (11) to each other in a metallurgical bond. [3] Printed circuit board housing device (10) according to one of the preceding claims, wherein the permanent irreversible connection of the printed circuit board elements to each other is a soldering, in particular with circumferential solder traces previously applied to the respective printed circuit board. [4] Printed circuit board housing device (10) according to claim 1, wherein the top printed circuit board element is contactable on both sides; and / or wherein the top printed circuit board element provides a through-hole housing wall, in particular with a sensor unit (13) and connector socket (16) arranged on the outer top side, which are contacted on the underside of the top printed circuit board element. [5] Printed circuit board housing device (10) according to one of the preceding claims, wherein an electromagnetic shielding function is integrated into the housing formed by the at least three printed circuit board elements, namely by means of a connection realized by circumferential solder traces by means of congruent solder traces;and / or wherein an electromagnetic shielding function is ensured for the housing cavity by means of the housing-forming circuit board elements, in that pairs of superimposed circuit board elements are each connected to each other in a materially bonded manner at a fully circumferential metallic connection line, with the at least two fully circumferential metallic connection lines of the at least three circuit board elements in an identical arrangement one above the other, in particular with the at least two fully circumferential metallic connection lines in a plane-parallel orientation to each other at a distance at least approximately corresponding to the thickness of one / the corresponding intermediate circuit board element.; [6] Printed circuit board housing device (10) according to one of the preceding claims, wherein at least one connector socket is provided on the outer side of the top printed circuit board element, in particular a connector socket contacted to at least one sensor unit; or wherein at least two connector sockets are provided on the outer side of the top printed circuit board element, in particular in opposite plug-in orientations. [7] Printed circuit board housing device (10) according to one of the preceding claims, wherein at least one sensor unit is provided on the upper printed circuit board element which is in metrological communication with the environment, in particular a sensor unit for measuring temperature and / or humidity, wherein the sensor unit is connected to at least one further component by means of conductor tracks arranged inside the housing cavity. [8] Printed circuit board housing device (10) according to one of the preceding claims, wherein at least one mounting tab or bore or other fastening means for mounting the printed circuit board housing device is provided on the underside printed circuit board element, in particular integrated into the printed circuit board plane of the underside printed circuit board element. [9] Printed circuit board housing device (10) according to one of the preceding claims, wherein the intermediate circuit board element is designed in a frame-like manner, in particular with a circumferential width that is at least approximately constant, in particular with a width that is at most a factor of 2 of the width of the circumferential connecting lines or the circumferential solder traces; and / or wherein the intermediate circuit board element exclusively defines a spacer function for defining or clamping the housing cavity, in particular with the thickness of the intermediate circuit board element as a specification for the height of the housing cavity. [10] Printed circuit board housing device (10) according to one of the preceding claims, wherein the at least three printed circuit board elements are each housing-constituting printed circuit board elements, such that each installed printed circuit board element fulfills a housing function, wherein the upper and lower printed circuit board elements each form a housing wall arranged in the corresponding printed circuit board plane, and wherein the intermediate printed circuit board elements provided for defining the height of the clamped housing cavity each form a lateral plane section of the housing, and wherein all printed circuit board elements are materially bonded to each other in pairs along completely circumferential connection lines, wherein the connection lines consist of an electromagnetically shielding material, in particular a metallic material, in particular solder material. [11] Method for manufacturing a printed circuit board housing device (10), comprising a housing (10a) formed from at least three printed circuit board elements (11), comprising the steps: -Providing a bottom printed circuit board element (11.1) and a top printed circuit board element (11.3) and at least one frame-like intermediate printed circuit board element (11.2) that can be arranged between them, wherein the bottom printed circuit board element (11.1) and the top printed circuit board element (11.3) each have a fully circumferential connecting line (17.1) on the inner side which is the inner side in the intended use and wherein the frame-like intermediate printed circuit board element (11.2) has a geometrically corresponding fully circumferential connecting line (17.1) on both sides, wherein at least on the top printed circuit board element (11.1) a plurality of interconnected components from the following group are provided: conductor tracks (12), sensor units (13), contact points (14), microchip units (15); -Arrangement of the intermediate circuit board element (11.2) on the inside of the top circuit board element (11.3); -Connecting the intermediate circuit board element (11.2) to the upper circuit board element (11.3) along the now overlapping circumferential connection lines (17.1); - Arranging the inside of the bottom printed circuit board element (11.1) on the second side of the intermediate printed circuit board element (11.2); -Connecting the intermediate circuit board element (11.2) to the lower circuit board element (11.1) along the now superimposed circumferential connection lines (17.1); wherein the connection is carried out in such a way that the lower circuit board element (11.1) together with the at least one intermediate circuit board element (11.2) and the upper circuit board element (11.3) form the housing (10a) for the at least one-sided enclosure of at least one of the components provided on the upper circuit board element (11.3); wherein the intermediate arrangement of the at least one intermediate circuit board element (11.2) forms a housing cavity, which is connected by the upper and lower circuit board elements (11.1, 11.3) along the circumferential connection lines (17.1) is sealed, so that the housing (10a) is formed and sealed exclusively by the interconnected printed circuit board elements (11) and is also electromagnetically shielded, wherein at least one of the components arranged on the top printed circuit board element (11.3) is / remains contactable on the outer top surface of the top printed circuit board element (11.3), wherein electronic contact to further printed circuit board components is realized on the inner underside of the top printed circuit board element (11.3), wherein the permanent irreversible connection of the printed circuit board elements (11) to each other is a metallic connection along one / the respective circumferential connection line (17.1), wherein an electromagnetic shielding function is integrated into the housing (10a) formed by the at least three printed circuit board elements (11). [12] Method according to the preceding method claim, wherein the respective printed circuit board elements (11) are subjected to heat treatment in a temperature-controlled oven, in particular according to a temperature curve corresponding to a conventional temperature profile in soldering. [13] Use of a plurality of printed circuit board elements (11, 11.1, 11.2, 11.3) to form a printed circuit board housing device (10) for enclosing at least one printed circuit board component from the following group: conductor track (12), sensor unit (13), contact point (14), microchip unit (15); wherein the enclosing is carried out exclusively by means of the printed circuit board elements (11), wherein the printed circuit board elements (11) are irreversibly connected and thereby sealed in planar pairwise contacting in the respective printed circuit board plane (xy) along fully circumferential connection lines (17.1), and wherein at least one of the printed circuit board elements (11.2) defines a housing cavity (17) between outer planar printed circuit board elements (11.1, 11.3); wherein at least one of the components arranged on the top-side printed circuit board element (11.3) is located on the outer top side of the top-side printed circuit board element (11.3) is contactable, wherein electronic contact to further printed circuit board components is realized on the inner underside of the upper printed circuit board element (11.3), wherein the permanent irreversible connection of the printed circuit board elements (11) to each other is a metallic connection along the respective circumferential connection line (17.1), wherein an electromagnetic shielding function is integrated into the housing (10a) formed by the at least three printed circuit board elements (11). [14] Use of at least one frame-like intermediate circuit board element (11.2) for defining a housing cavity between two planar circuit board elements (11.1, 11.3), wherein the planar circuit board elements (11.1, 11.3) are irreversibly connected and thereby sealed together as a sandwich stack with the at least one frame-like intermediate circuit board element (11.2) arranged between them along fully circumferential connection lines (17.1), to form a circuit board housing device (10) with at least one circuit board component arranged in the housing cavity from the following group: conductor track (12), sensor unit (13), contact point (14), microchip unit (15); wherein at least one of the components arranged on the top-side circuit board element (11.3) is located on the outer top surface of the top-side circuit board element (11.3) is contactable, wherein electronic contact to further printed circuit board components is realized on the inner underside of the upper printed circuit board element (11.3), wherein the permanent irreversible connection of the printed circuit board elements (11) to each other is a metallic connection along one / the respective circumferential connection line (17.1), wherein an electromagnetic shielding function is integrated into the housing (10a) formed by the at least three printed circuit board elements (11). [15] Printed circuit board housing device (10) comprising a housing (10a) formed from at least three printed circuit board elements (11) and at least one printed circuit board component arranged in the housing (10a) from the following group: conductor track (12), sensor unit (13), contact point (14), microchip unit (15); manufactured by a two-stage joining process of printed circuit board elements (11) in pairs, namely first by joining a top-side printed circuit board element (11.3) comprising the at least one printed circuit board component arranged thereon with a frame-like intermediate printed circuit board element (11.2) along a completely circumferential connection line (17.1) in the form of a solder track, which each extend geometrically correspondingly on the printed circuit board elements (11), and then by joining a housing-internal surface of a bottom-side printed circuit board element (11.1) with the exposed side of the intermediate circuit board element (11.2) also along a fully circumferential connection line (17.1) in the form of a solder track; wherein the connection is made such that the lower circuit board element (11.1) together with the at least one intermediate circuit board element (11.2) and the upper circuit board element (11.3) form the housing (10a) for the at least one-sided enclosure of the at least one circuit board component; wherein, by means of the at least one frame-like intermediate circuit board element (11.2), a housing cavity for receiving the at least one circuit board component is formed due to the frame-like design and the fully circumferential connection line (17.1) on both sides, wherein at least one of the components arranged on the upper circuit board element (11.3) is located on the outer top side of the upper circuit board element (11.3) is contactable, wherein electronic contact to further printed circuit board components is realized on the inner underside of the upper printed circuit board element (11.3), wherein the permanent irreversible connection of the printed circuit board elements (11) to each other is a metallic connection along one / the respective circumferential connection line (17.1), wherein the at least three Printed circuit board elements ( 11) formed housing (10a) an electromagnetic shielding function is integrated.

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