Method for burying power supply equipment
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- OHBAYASHI GUMI LTD
- Filing Date
- 2026-04-03
- Publication Date
- 2026-06-11
AI Technical Summary
【0014】 本発明によれば、共振コンデンサを収納した保護ケースに、繰り返し伝達される移動体などの鉛直荷重を低減できるため、給電装置を走行路の路面近傍に長期共用性を確保しつつ埋設することが可能となる。
Smart Images

Figure 2026095667000001_ABST
Abstract
Claims
1. A method for burying a power supply device in a track, comprising a parallel two-line system and a resonant capacitor housed in a protective case, which non-contactly supplies power to a power receiving device installed on a moving body that moves along a track, The process of providing an installation area for the protective case in the asphalt pavement layer of the aforementioned roadway, The process includes filling a filler material between the protective case installed in the installation area and the asphalt pavement layer, A method for burying a power supply device, characterized in that the width of the transverse groove of the travel path in the installation area is formed to a width that does not exceed the minimum tire width used for the mobile body.
2. In the method for burying a power supply device according to claim 1, A method for burying a power supply device, characterized in that the protective case has sufficient strength and waterproofness to withstand the filling pressure.