Power module
The power module design with overlapping conductive layers and pins addresses inductance and compactness issues, achieving reduced inductance and a compact form factor.
JP2026096215APending Publication Date: 2026-06-15SHINKO ELECTRIC IND CO LTD
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Patent Information
- Application Number
- JP2024209874
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2026-06-15
AI Technical Summary
Technical Problem
Existing power modules with overlapping semiconductor elements face challenges in reducing inductance and achieving a compact design.
Method used
A power module configuration with overlapping conductive layers and conductive pins, utilizing insulating films and flexible wiring boards to connect semiconductor elements, reducing the distance between conductive layers and minimizing inductance while maintaining a compact size.
Benefits of technology
The solution effectively reduces inductance and allows for a more compact power module design, enhancing electrical performance and reliability.
✦ Generated by Eureka AI based on patent content.
Abstract
We provide a power module that reduces inductance. [Solution] In the power module, the semiconductor package 20 includes a first semiconductor element 100, a second semiconductor element 200, a first insulating substrate 411 and a second insulating substrate 421, a first conductive member 416, a second conductive member 611, a third conductive member 426, a fourth conductive member 621, a fifth conductive member 60, an insulating film 50 provided between the first conductive member 416 and the second conductive member 611 and the third conductive member 426 and the fourth conductive member 621, a first conductive layer 121 electrically connected to the second conductive member 611, and a second conductive layer 222 electrically connected to the third conductive member 426, wherein the first conductive layer 121 and the second conductive layer 222 overlap in a plan view.
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