Test methods, devices under test, probe cards, and probe systems for microbump testing

The method addresses the challenges of microbump testing by grouping power and ground microbumps and using identical probes with simulated bumps to ensure consistent contact force, reducing costs and complexity while maintaining probe flatness.

TWI934391BActive Publication Date: 2026-08-01MPI CORP
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Patent Information

Application Number
TW113150750
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2024-01-16
Filing Date
2024-12-25
Publication Date
2026-08-01
Estimated Expiration
2044-12-24

AI Technical Summary

Technical Problem

Current microbump testing methods for 2.5D/3D stacking packages face challenges due to the small dimensions and center-to-center spacing of microbumps, leading to high manufacturing costs, complex designs, and poor probe flatness caused by mixed probe types with different wear amounts.

Method used

A testing method and probe system that groups power and ground microbumps together, using identical probes to contact multiple bumps, and adds simulated microbumps or larger bumps for test signals to ensure consistent probe contact force and prevent probe wear discrepancies.

Benefits of technology

Reduces manufacturing difficulty and cost, simplifies probe card design, and maintains probe flatness by using identical probes with consistent contact force, improving testing accuracy and reliability.

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Abstract

A testing method for microbump testing includes a device under test (DUT) comprising a first bump unit configured to transmit power or ground signals and a second bump unit configured to transmit test signals. Both the first and second bump units have a plurality of clustered microbumps, or one of them may have only a single, larger bump. The second bump unit's plurality of microbumps includes selected microbumps and simulated microbumps. A testing device comprising a stage and a probe card is provided, wherein the probes of the probe card have substantially the same probe body dimensions. The DUT is placed on the stage, and the probes of the probe card are used to test the DUT. This invention reduces the manufacturing difficulty and cost of the probe card, as well as the difficulty of on-machine testing; avoids overly complex DUT designs; and avoids problems with probe flatness caused by varying probe wear.
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