Heat pump
The heat pump's innovative distribution unit structure with a lower second cover and through-holes for water pipes addresses spatial utilization and pipe management challenges, enabling efficient heating water distribution in low-ceiling indoor spaces.
US20250297775A1Pending Publication Date: 2025-09-25SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- US19/173314
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- Priority Date
- 2024-03-21
- Filing Date
- 2025-04-08
- Publication Date
- 2025-09-25
AI Technical Summary
Technical Problem
Existing heat pumps face challenges in spatial utilization and management of water pipes, particularly in indoor spaces with low ceiling heights.
Method used
The heat pump design includes a distribution unit with a cabinet forming a machine room, a first cover on the upper side, and a second cover positioned lower than the first cover, allowing for the passage of water pipes through through-holes, and a piping space formed by the extension portion, side panels, and the second cover, enabling efficient installation in low-ceiling indoor spaces.
Benefits of technology
This design enhances spatial utilization and facilitates easy management of water pipes, ensuring effective distribution of heating water to multiple units even in spaces with limited ceiling height.
✦ Generated by Eureka AI based on patent content.
Abstract
A heat pump is provided. The heat pump includes an outdoor unit including a heat exchanger and configured to heat heating water through the heat exchanger, and a distribution unit connected to the outdoor unit through a water pipe and configured to receive the heating water and distribute the received heating water to a heating unit, wherein the distribution unit includes a cabinet forming a machine room therein, a first cover including a cover portion installed on an upper side of the cabinet and configured to cover a part of the machine room, and a second cover connected to the water pipe, the second cover including a second cover body configured to cover another part of the machine room, and wherein the second cover is configured to be connected to the first cover such that the second cover body is positioned lower than the cover portion.
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