Photoacoustic transducer array and methods of making the same

By employing a dicing-free PCB-based method for fabricating 2D ultrasound transducer arrays, the challenges of high manufacturing cost and complexity in existing photoacoustic imaging technologies are addressed, resulting in scalable, low-cost, and high-performance imaging solutions.

WO2025117580A1 Publication Date: 2025-06-05THE PENN STATE RES FOUND INC
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Patent Information

Application Number
PCT/US2024/057520
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-11-27
Filing Date
2024-11-26
Publication Date
2025-06-05

AI Technical Summary

Technical Problem

Existing photoacoustic imaging technologies face challenges in manufacturing cost, complexity, and scalability due to the need for advanced cleanroom technologies and laborious ultrasound transducer fabrication techniques such as dicing.

Method used

A method for fabricating a 2D ultrasound transducer array using a printed circuit board (PCB) substrate without dicing, which includes a via conductive layer, via-fill material, anisotropic layer, piezoelectric film, and conductive layer, enabling scalable aperture size, element count, and frequency of operation.

Benefits of technology

The approach results in low-cost, high-performance ultrasound transducer arrays that are easier to manufacture and scale, achieving wideband receive sensitivity and improved spatial resolution for photoacoustic imaging.

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Abstract

Embodiments relate to a transducer. The transducer can include a substrate having a front surface, a back surface, and a via extending through the substrate from the front surface to the back surface. The transducer can include a via conductive layer disposed on: a surface of the substrate defined by the via; a front surface region adjacent the via; and a back surface region adjacent the via. The transducer can include a via-fill material disposed within the via and occupying a volume of space formed by the via. The transducer can include an anisotropic layer disposed on the front surface region and the via-fill material located at or near the front surface. The transducer can include a piezoelectric film disposed on the anisotropic layer. The transducer can include a conductive layer disposed on the piezoelectric film.
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