Feedthrough assembly and implantable medical device including same

Abstract

Various embodiments of a feedthrough ferrule and a feedthrough assembly that includes such ferrule are disclosed. The ferrule includes an outer surface and an inner surface, at least one via defined by the ferrule extending between the outer surface and the inner surface of the ferrule along a via axis that is substantially orthogonal to the outer surface of the ferrule, and a retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the retainer is electrically connected to the ferrule. The retainer is configured to retain at least a portion of a solder wire.

Description

FEEDTHROUGH ASSEMBLY AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

[0001] This application claims the benefit of U.S. Provisional Patent Application Serial No. 63 / 647,204, filed May 14, 2024, the entire content of which is incorporated herein by reference.TECHNICAL FIELD

[0002] This disclosure generally relates to a feedthrough assembly and more particularly to an implantable medical device that includes such feedthrough assembly.BACKGROUND

[0003] Various systems require electrical coupling between electrical devices disposed within a sealed enclosure or housing and devices or systems external to the enclosure. Oftentimes, such electrical coupling needs to withstand various environmental factors such that a conductive pathway or pathways from the external surface of the enclosure to within the enclosure remains stable. For example, implantable medical devices (IMDs), e.g., cardiac pacemakers, defibrillators, neurostimulators, and drug pumps, require an enclosure or housing to contain and seal electronic circuitry and one or more power sources within a body of a patient. Many of these IMDs include one or more additional electrical components such as, for example, feedthrough assemblies to provide electrical connections between the electronic circuitry and power sources contained within the housing and components of the IMD external to the housing. Such external components can include at least one or more sensors, electrodes, or lead wires mounted on an exterior surface of the housing, or electrical contacts housed within a connector header, which is mounted on the housing to provide coupling for one or more implantable leads. A feedthrough assembly can be described as an apparatus that provides electrical coupling between electrical devices disposed within a sealed enclosure or housing and devices or systems external to the enclosure in an electrically insulated and hermetically sealed manner.SUMMARY

[0004] The techniques of this disclosure generally relate to various embodiments of a feedthrough assembly and an implantable medical device (IMD) that includes suchassembly. The assembly can include a feedthrough ferrule that includes one or more retainers disposed on an inner surface of the ferrule and electrically connected to the ferrule. Each retainer can be configured to retain at least a portion of a solder wire or wires during the manufacturing process such that the solder wire remains in place while other components of the assembly such as a filter feedthrough capacitor are disposed on or adjacent the ferrule. After the capacitor is disposed on or adjacent to the inner surface of the ferrule, a reflow process can be utilized to cause solder of the solder wire to flow around an outer sidewall portion of the capacitor such that the solder is disposed between the capacitor and at least one of the inner surface of the ferrule or the retainer and electrically connects the outer sidewall portion of the capacitor to the ferrule.

[0005] This disclosure includes without limitation the following clauses:

[0006] Clause 1 : A feedthrough ferrule that includes an outer surface and an inner surface, at least one via defined by the ferrule extending between the outer surface and the inner surface of the ferrule along a via axis that is substantially orthogonal to the outer surface of the ferrule, and a retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the retainer is electrically connected to the ferrule. The retainer is configured to retain at least a portion of a solder wire.

[0007] Clause 2: The feedthrough ferrule of Clause 1, where the retainer includes a wall that extends from the inner surface of the ferrule. The wall extends along a wall axis.

[0008] Clause 3 : The feedthrough ferrule of Clause 2, where the retainer further includes a channel that is defined by the inner surface of the ferrule adjacent the wall and extends along a direction that is substantially parallel to the wall axis. At least a portion of the channel is disposed between the at least one via and the wall. Further, the channel is configured to receive the solder wire and provide a friction fit with the solder wire.

[0009] Clause 4: The feedthrough ferrule of Clause 2, where a first end portion of the wall is configured to receive a first end of the solder wire and a second end portion of the wall is configured to receive a second end of the solder wire.

[0010] Clause 5: The feedthrough ferrule of Clause 2, where the retainer further includes a plurality of tabs extending from the inner surface of the ferrule and disposed adjacent the wall. The plurality of tabs is configured such that the solder wire is retained between the wall and the plurality of tabs.

[0011] Clause 6: The feedthrough ferrule of Clause 2, where the retainer further includes a groove defined by an inner surface of the wall that is configured to retain the solder wire.

[0012] Clause 7: The feedthrough ferrule of any one of Clauses 2-6, where the retainer is a first retainer. The feedthrough ferrule further includes a second retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the second retainer is electrically connected to the ferrule. The second retainer is configured to retain at least a portion of a second solder wire.

[0013] Clause 8: The feedthrough ferrule of Clause 7, where the second retainer includes a second wall that extends from the inner surface of the ferrule. The second wall extends along a second wall axis. Further, the at least one via is disposed between the wall axis and the second wall axis.

[0014] Clause 9: The feedthrough ferrule of Clause 8, where the second retainer further includes a second channel that defined by the inner surface of the ferrule adjacent the second wall and extends along a direction that is substantially parallel to the second wall axis. At least a portion of the second channel is disposed between the at least one via and the second wall. Further, the second channel is configured to receive the second solder wire and provide a friction fit with the second solder wire.

[0015] Clause 10: The feedthrough ferrule of Clause 8, where a first end portion of the second wall is configured to receive a first end of the second solder wire and a second end portion of the second wall is configured to receive a second end of the second solder wire.

[0016] Clause 11 : The feedthrough ferrule of Clause 8, where the second retainer further includes a second plurality of tabs extending from the inner surface of the ferrule and disposed adjacent the second wall. The second plurality of tabs is configured such that the second solder wire is retained between the second wall and the second plurality of tabs.

[0017] Clause 12: The feedthrough ferrule of Clause 8, where the second retainer further includes a second groove defined by an inner surface of the second wall that is configured to retain the second solder wire.

[0018] Clause 13: The feedthrough ferrule of any one of Clauses 2-12, further including a solder-wettable surface disposed on at least a portion of the inner surface of the ferrule.

[0019] Clause 14: The feedthrough ferrule of Clause 1, where the at least one via includes a plurality of vias disposed along a longitudinal axis. The retainer extends along a retainer axis that is substantially parallel to the longitudinal axis.

[0020] Clause 15: The feedthrough ferrule of Clause 14, where the retainer is a first retainer and the retainer axis is a first retainer axis. The feedthrough ferrule further includes a second retainer that extends along a second retainer axis that is substantially parallel to the first retainer axis.

[0021] Clause 16: A feedthrough assembly that includes a feedthrough ferrule. The feedthrough ferrule includes an outer surface and an inner surface, at least one via defined by the ferrule extending between the outer surface and the inner surface of the ferrule along a via axis that is substantially orthogonal to the outer surface of the ferrule, and a retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the retainer is electrically connected to the ferrule. The retainer is configured to retain at least a portion of a solder wire. The assembly further includes a feedthrough disposed through the ferrule. The feedthrough includes an insulator disposed at least partially within the at least one via along the via axis, and a feedthrough pin including an outer end adjacent the outer surface of the ferrule and an inner end adjacent the inner surface of the ferrule. The feedthrough pin is disposed along the via axis through the at least one via and the insulator. The feedthrough assembly further includes a capacitor disposed adjacent the inner surface of the feedthrough ferrule. The capacitor includes a top portion, a bottom portion, an inner diameter portion, and an outer sidewall portion. The inner diameter portion is electrically connected to the feedthrough pin that extends through the inner diameter portion. Further, the outer sidewall portion is configured to be electrically connected to the feedthrough ferrule by solder that has been reflowed from the solder wire.

[0022] Clause 17: The feedthrough assembly of Clause 16, where the retainer includes a wall that extends from the inner surface of the ferrule. The wall extends along a wall axis.

[0023] Clause 18: The feedthrough assembly of Clause 17, where the outer sidewall portion of the capacitor is configured to be further electrically connected to the wall of the retainer by the solder.

[0024] Clause 19: The feedthrough assembly of any one of Clauses 17-18, where the retainer further includes a channel that is defined by the inner surface of the ferrule adjacent the wall and extends along a direction that is substantially parallel to the wall axis. At least a portion of the channel is disposed between the at least one via and the wall. Further, the channel is configured to receive the solder wire and provide a friction fit with the solder wire.

[0025] Clause 20: The feedthrough assembly of any one of Clauses 17-18, where a first end portion of the wall is configured to receive a first end of the solder wire and a second end portion of the wall is configured to receive a second end of the solder wire.

[0026] Clause 21 : The feedthrough assembly of any one of Clauses 17-18, where the retainer further includes a plurality of tabs extending from the inner surface of ferrule and disposed adjacent the wall. The plurality of tabs is configured such that the solder wire is retained between the wall and the plurality of tabs.

[0027] Clause 22: The feedthrough assembly of any one of Clauses 17-18, where the retainer further includes a groove defined by an inner surface of the wall that is configured to retain the solder wire.

[0028] Clause 23: The feedthrough assembly of any one of Clauses 17-22, where the retainer is a first retainer, where the feedthrough ferrule further includes a second retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the second retainer is electrically connected to the ferrule. The second retainer is configured to retain at least a portion of a second solder wire.

[0029] Clause 24: The feedthrough assembly of Clause 23, where the second retainer includes a second wall that extends from the inner surface of the ferrule. The second wall extends along a second wall axis. Further, the at least one via is disposed between the wall axis and the second wall axis.

[0030] Clause 25: The feedthrough assembly of Clause 24, where the second retainer further includes a second channel that is defined by the inner surface of the ferrule adjacent a second wall of the second retainer and extends along a direction that is substantially parallel to a second wall axis along which the second wall extends. At least a portion of the second channel is disposed between the at least one via and the second wall. Further, the second channel is configured to receive the second solder wire and provide a friction fit with the second solder wire.

[0031] Clause 26: The feedthrough assembly of Clause 24, where a first end portion of the second wall is configured to receive a first end of the second solder wire and a second end portion of the second wall is configured to receive a second end of the second solder wire.

[0032] Clause 27: The feedthrough assembly of Clause 24, where the second retainer further includes a second plurality of tabs extending from the inner surface of the ferrule and disposed adjacent the second wall. The second plurality of tabs is configured such thatthe second solder wire is retained between the second wall and the second plurality of tabs.

[0033] Clause 28: The feedthrough assembly of Clause 24, where the second retainer further includes a second groove defined by an inner surface of the second wall that is configured to retain the second solder wire.

[0034] Clause 29: The feedthrough assembly of any one of Clauses 17-28, further including a solder-wettable surface layer disposed on at least a portion of the inner surface of the ferrule.

[0035] Clause 30: The feedthrough assembly of Clause 17, where the at least one via includes a plurality of vias disposed along a longitudinal axis. The retainer extends along a retainer axis that is substantially parallel to the longitudinal axis.

[0036] Clause 31 : The feedthrough assembly of Clause 30, where the retainer is a first retainer and the retainer axis is a first retainer axis. The feedthrough ferrule further includes a second retainer that extends along a second retainer axis that is substantially parallel to the second retainer axis.

[0037] Clause 32: A method of forming a feedthrough assembly, including disposing a feedthrough through a ferrule, disposing a retainer on an inner surface of the ferrule adjacent a via of the feedthrough ferrule such that the retainer is electrically connected to the ferrule, and disposing a solder wire on or adjacent to the inner surface of the ferrule, where at least a portion of the solder wire is retained by the retainer.

[0038] Clause 33: The method of Clause 32, where disposing the retainer includes disposing a wall on the inner surface of the ferrule adjacent the via. The wall extends along a wall axis.

[0039] Clause 34: The method of Clause 33, where disposing the retainer further includes disposing a channel in the inner surface of the ferrule adjacent the wall and extending along a direction that is substantially parallel to the wall axis. At least a portion of the channel is disposed between the via and the wall. Further, disposing the solder wire includes disposing the solder wire at least partially within the channel.

[0040] Clause 35: The method of Clause 33, where disposing the solder wire includes disposing a first end of the solder wire in a first end portion of the wall and disposing a second end of the solder wire in a second end portion of the wall.

[0041] Clause 36: The method of Clause 33, where disposing the retainer further includes disposing a plurality of tabs on the inner surface of the ferrule adjacent the wall such that each tab extends from the inner surface of the ferrule. Further, disposing the solder wire includes disposing the solder wire between the plurality of tabs and the wall.

[0042] Clause 37: The method of Clause 33, where disposing the retainer further includes disposing a groove in an inner surface of the wall. Further, disposing the solder wire includes disposing the solder wire in the groove.

[0043] Clause 38: The method of any one of Clauses 32-37, where the retainer is a first retainer. The method further includes disposing a second retainer on the inner surface of the ferrule adjacent the via such that the second retainer is electrically connected to the ferrule, and disposing a second solder wire on or adjacent to the inner surface of the ferrule. At least a portion of the second solder wire is retained by the second retainer.

[0044] Clause 39: The method of Clause 38, where disposing the second retainer further includes disposing a second channel in the inner surface of the ferrule adjacent a second wall of the second retainer and extending along a direction that is substantially parallel to a second wall axis along which the second wall extends. At least a portion of the second channel is disposed between the via and the second wall. Further, disposing the solder wire includes disposing the second solder wire at least partially within the second channel.

[0045] Clause 40: The method of Clause 39, where disposing the second solder wire includes disposing a first end of the second solder wire in a first end portion of the second wall and disposing a second end of the second solder wire in a second end portion of the second wall.

[0046] Clause 41 : The method of Clause 39, where disposing the second retainer further includes disposing a second groove in an inner surface of the second wall, where disposing the second solder wire includes disposing the second solder wire in the second groove.

[0047] Clause 42: The method of any one of Clauses 32 41 , wherein disposing the feedthrough includes disposing an insulator at least partially within the via along a via axis, disposing a feedthrough pin along the via axis and through the via and the insulator such that the feedthrough pin extends beyond an outer surface and the inner surface of the feedthrough ferrule, and disposing a capacitor adjacent the inner surface of the feedthrough ferrule. The capacitor includes a top portion, a bottom portion, an inner diameter portion, and an outer sidewall portion.

[0048] Clause 43 : The method of Clause 42, further including electrically connecting the inner diameter portion of the capacitor to the feedthrough pin that extends through the capacitor.

[0049] Clause 44: The method of any one of Clauses 42 43, further including electrically connecting the outer sidewall portion of the capacitor to the ferrule.

[0050] Clause 45: The method of Clause 44, where electrically connecting the outer sidewall portion of the capacitor to the ferrule includes reflowing the solder wire such that solder from the solder wire is disposed between the outer sidewall portion of the capacitor and at least one of the inner surface of the ferrule or the retainer to electrically connect the outer sidewall portion of the capacitor and the ferrule.

[0051] Clause 46: The method of Clause 45, where the outer sidewall portion of the capacitor is electrically connected to the retainer.

[0052] Clause 47: An implantable medical device including a housing, electronic components disposed within the housing, and a feedthrough assembly connected to the housing to form a portion of the housing. The feedthrough assembly includes a feedthrough ferrule including an outer surface and an inner surface, at least one via defined by the ferrule extending between the outer surface and the inner surface of the ferrule along a via axis that is substantially orthogonal to the outer surface of the ferrule, and a retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the retainer is electrically connected to the ferrule. The retainer is configured to retain at least a portion of a solder wire. The feedthrough assembly further includes a feedthrough disposed through the ferrule. The feedthrough includes an insulator disposed at least partially within the at least one via along the via axis, and a feedthrough pin including an outer end adjacent the outer surface of the ferrule and an inner end adjacent the inner surface of the ferrule. The feedthrough pin is disposed along the via axis through the at least one via and the insulator. The feedthrough assembly further includes a capacitor disposed adjacent the inner surface of the feedthrough ferrule. The capacitor includes a top portion, a bottom portion, an inner diameter portion, and an outer sidewall portion. The inner diameter portion is electrically connected to the feedthrough pin that extends through the inner diameter portion. Further, the outer sidewall portion is configured to be electrically connected to the feedthrough ferrule by solder that has been reflowed from the solder wire.

[0053] All headings provided herein are for the convenience of the reader and should not be used to limit the meaning of any text that follows the heading, unless so specified.

[0054] The terms “comprises” and variations thereof do not have a limiting meaning where these terms appear in the description and claims. Such terms will be understood to imply the inclusion of a stated step or element or group of steps or elements but not the exclusion of any other step or element or group of steps or elements.

[0055] The words “preferred” and “preferably” refer to embodiments of the disclosure that may afford certain benefits, under certain circumstances; however, other embodiments may also be preferred, under the same or other circumstances.Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, and is not intended to exclude other embodiments from the scope of the disclosure.

[0056] In this application, terms such as “a,” “an,” and “the” are not intended to refer to only a singular entity but include the general class of which a specific example may be used for illustration. The terms “a,” “an,” and “the” are used interchangeably with the term “at least one.” The phrases “at least one of’ and “comprises at least one of’ followed by a list refers to any one of the items in the list and any combination of two or more items in the list.

[0057] As used herein, the term “or” is generally employed in its usual sense including “and / or” unless the content clearly dictates otherwise.

[0058] The term “and / or” means one or all of the listed elements or a combination of any two or more of the listed elements.

[0059] As used herein in connection with a measured quantity, the term “about” refers to that variation in the measured quantity as would be expected by the skilled artisan making the measurement and exercising a level of care commensurate with the objective of the measurement and the precision of the measuring equipment used.Herein, “up to” a number (e.g., up to 50) includes the number (e.g., 50).

[0060] Also herein, the recitations of numerical ranges by endpoints include all numbers subsumed within that range as well as the endpoints (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, 5, etc.).

[0061] The details of one or more aspects of the disclosure are set forth in the accompanying drawings and the description below. Other features, objects, andadvantages of the techniques described in this disclosure will be apparent from the description and drawings, and from the claims.BRIEF DESCRIPTION OF DRAWINGS

[0062] FIG. 1 is a schematic perspective view of one embodiment of an implantable medical device (IMD) implanted in a patient.

[0063] FIG. 2 is a schematic perspective view of the IMD of FIG. 1.

[0064] FIG. 3 is a schematic exploded view of the IMD of FIG. 1.

[0065] FIG. 4 is a schematic perspective view of another embodiment of a feedthrough assembly that can be utilized with the IMD of FIGS. 1-3.

[0066] FIG. 5 is a schematic perspective view of a feedthrough ferrule of the feedthrough assembly of FIG. 4.

[0067] FIG. 6 is a schematic plan view of an outer surface of the feedthrough ferrule of FIG. 5.

[0068] FIG. 7 is a schematic plan view of an inner surface of the feedthrough ferrule of FIG. 5 and a retainer of the ferrule that is disposed on the inner surface.

[0069] FIG. 8 is a schematic cross-section view of the feedthrough assembly of FIG. 4.

[0070] FIG. 9 is a schematic cross-section view of a portion of the feedthrough assembly of FIG. 4.

[0071] FIG. 10 is a schematic cross-section view of the feedthrough of FIG. 9 with solder wires of the assembly having been reflowed to electrically connect an outer sidewall portion of a capacitor of the assembly to at least one of the inner surface of the ferrule or the retainer.

[0072] FIG. 11 is a schematic perspective view of another embodiment of a feedthrough ferrule that can be utilized with the feedthrough assembly of FIG. 4.

[0073] FIG. 12 is a schematic perspective view of another embodiment of a feedthrough ferrule that can be utilized with the feedthrough assembly of FIG. 4.

[0074] FIG. 13 is a schematic perspective view of another embodiment of a feedthrough ferrule that can be utilized with the feedthrough assembly of FIG. 4.

[0075] FIG. 14 is a schematic perspective view of another embodiment of a feedthrough ferrule that can be utilized with the feedthrough assembly of FIG. 4.

[0076] FIG. 15 is a flowchart of one embodiment of a method of manufacturing the feedthrough assembly of FIG. 4.DETAILED DESCRIPTION

[0077] The techniques of this disclosure generally relate to various embodiments of a feedthrough assembly and an implantable medical device (IMD) that includes such assembly. The assembly can include a feedthrough ferrule that includes one or more retainers disposed on an inner surface of the ferrule and electrically connected to the ferrule. Each retainer can be configured to retain at least a portion of a solder wire or wires during the manufacturing process such that the solder wire remains in place while other components of the assembly such as a filter feedthrough capacitor are disposed on or adjacent the ferrule. After the capacitor is disposed on or adjacent to the inner surface of the ferrule, a reflow process can be utilized to cause solder of the solder wire to flow around an outer sidewall portion of the capacitor such that the solder is disposed between the capacitor and at least one of the inner surface of the ferrule or the retainer and electrically connects the outer sidewall portion of the capacitor to the ferrule.

[0078] Atypical brazed feedthrough assembly includes a filter capacitor that is soldered to a ferrule of the assembly using a solder wire or ribbon in a gap between an outer sidewall portion of the capacitor and a ferrule wall disposed on an inner surface of the ferrule. The solder wire or ribbon is brazed to the capacitor and ferrule to hold the capacitor in place and electrically connect the outer sidewall portion of the capacitor to the ferrule. Brazed feedthroughs, however, undergo substantial grain growth in material of the ferrule due to extreme high temperatures of the brazing process. This is especially the case with ferrules that include titanium material. During such processes, the ferrule wall can become distorted such that it may be difficult to position the solder material in the gap between the ferrule wall and the outer sidewall portion of the capacitor. As dimensions of feedthrough ferrules increase and include more therapy pins, more distortion of the ferrule during the ferrule post brazing process would be expected. Filter capacitor connections to the ferrule for providing a ground connection could, therefore, be difficult to achieve.

[0079] One or more embodiments of feedthrough assemblies described herein can provide various advantages over currently-available assemblies. For example, each capacitor of the assembly can be electrically connected to the ferrule by solder that is reflowed from one ormore solder wires that are disposed between the capacitor and the inner surface of the ferrule. Such solder wires can be retained on or adjacent to the inner surface of the ferrule by one or more retainers of the feedthrough ferrule. Each retainer can include any suitable element or component that can be configured to retain at least a portion of a solder wire. For example, in one or more embodiments, the retainer can include one or more channels defined by the inner surface of the ferrule adjacent to a wall of the retainer that are configured to receive the solder wire to retain the solder wire at least during manufacture of the feedthrough assembly. The channels can assist in preventing the solder wire from being displaced during manufacturing by, for example, providing a friction fit with the solder wire. The capacitor can be disposed over or on top of the solder wire during assembly. During solder reflow, the solder wire disposed in the channel can flow between the outer sidewall portion of the capacitor and at least one of the inner surface of the ferrule or the retainer to electrically connect the outer sidewall portion to the ferrule. In one or more embodiments, the retainer can alternatively or additionally include a groove defined by the wall of the retainer that is configured to retain at least a portion of the solder wire. Further, one or more embodiments of a retainer can include a plurality of tabs extending from the inner surface of the ferrule that are configured such that the solder wire is retained between the wall of the retainer and the plurality of tabs. Additionally, one or more embodiments of a retainer can include a wall that has a first end portion configured to receive a first end of the solder wire and a second end portion of the wall configured to receive a second end of the solder wire.

[0080] FIG. l is a schematic perspective view of one embodiment of an implantable medical device (IMD) 10 implanted in a patient 2. The IMD 10 includes a housing 12, which can also be referred to as a case or enclosure. The housing 12 can define an internal volume of the IMD 10 and can house one or more internal components, such as one or more power sources, electronic components, circuitry, and the like.

[0081] The IMD 10 can be configured to be electrically connectable with one or more external components, such as a medical lead 14. The one or more external components can be electrically connected to the one or more internal components via a feedthrough, which can be positioned in a connector header 16. The connector header 16 can form a unitary part with, or can be coupled to, the housing 12. The connector header 16 can be configured to receive the one or more external components, such as the lead 14. For example, theconnector header 16 can define a bore into which a portion of the lead 14 can be inserted. The lead 14 can have electrical contacts that electrically couple with respective electrical contacts in the connector header 16 when the lead is inserted into the bore. The electrical contacts in the connector header 16 can be electrically coupled to the electrical components of the IMD 10 through one or more feedthroughs.

[0082] Various schematic views of an illustrative embodiment of the implantable medical device 10 (without the connector header 16) that can utilize one or more embodiments of feedthrough assemblies described herein are shown in FIGS. 2-3. The IMD 10 can include the housing 12 and a feedthrough assembly 30 connected to the housing using any suitable technique. The housing 12 can include an inner surface 18 and an outer surface 20. The IMD 10 can also include one or more internal components 22 disposed in the housing 12, such as at least one electronic device 24 and / or a power source 26. In one or more embodiments, the electronic device 24 and the power source 26 can be disposed within an internal volume 28 of the housing 12. The power source 26 can include one or more power source contacts that can be operatively coupled to at least one of the electronic device 24 or one or more feedthrough pins 32 of feedthrough assembly 30.

[0083] The IMD 10 can include any suitable electronic components 22, e.g., sensing circuitry for sensing electrical activity via electrodes and therapy generation circuitry for delivering electrical stimulation therapy via the electrodes. The electronic components 22 can include any discrete and / or integrated electronic circuit components that implement analog and / or digital circuits capable of producing the functions attributed to the IMD 10. In one or more embodiments, the electronic components 22 can include one or more sensors for sensing other physiological parameters, such as acceleration, pressure, sound, and / or impedance. Additionally, the housing 12 can also house a memory that includes instructions that, when executed by processing circuitry housed within the housing or external to the housing, cause the IMD 10 to perform various functions attributed to the device herein. In one or more embodiments, the housing 12 can house communication circuitry that enables the IMD 10 to communicate with other electronic devices, such as a medical device programmer. In one or more embodiments, the housing 12 can also house an antenna for wireless communication.

[0084] The feedthrough assembly 30 can include a ferrule 34 and one or more feedthroughs 36 disposed through the ferrule. Each feedthrough 36 is disposed within avia 38 defined by the ferrule 34, and includes an insulator 46 and the feedthrough pin 32. The IMD 10 can include any suitable feedthrough assembly 30 that is connected to the housing 12 of the IMD using any suitable technique, e.g., welding, bonding, diffusion bonding, laser assisted diffusion bonding, adhering, mechanically fastening, etc.

[0085] The IMD 10 can include any suitable feedthrough assembly 30. For example, FIGS. 4-10 are various views of another embodiment of a feedthrough assembly 130. All design considerations and possibilities described herein regarding the feedthrough assembly 30 of FIGS. 2-3 apply equally to the feedthrough assembly 130 of FIGS. 4-10 to the extend they do not conflict. The assembly 130 includes a feedthrough ferrule 134 having an outer surface 145 and inner surface 144, at least one via 138 defined by the ferrule extending between the outer surface and the inner surface of the ferrule along a via axis 102 (FIG. 9) that is substantially orthogonal to the outer surface of the ferrule, and one or more retainers 140 (FIG. 5) disposed on the inner surface of the ferrule adjacent the at least one via such that the retainer is electrically connected to the ferrule. The retainer 140 is configured to retain at least a portion of a solder wire 142.

[0086] The assembly 130 further includes one or more feedthroughs 136 (FIG. 9) each disposed through the ferrule 134. One or more of the feedthroughs 136 includes an insulator 146 disposed at least partially within the at least one via 138 along the via axis 102, and a feedthrough pin 132 including an outer end 150 (FIG. 4) adjacent the outer surface 145 of the ferrule 134 and an inner end 152 adjacent the inner surface 144 of the ferrule. The feedthrough pin 132 is disposed along the via axis 102 through the at least one via 138 and the insulator 146. The feedthrough 136 can be defined by the insulator 146 and the feedthrough pin 132.

[0087] The assembly 130 also includes a capacitor 154 disposed adjacent the inner surface 144 of the feedthrough ferrule 134, where the capacitor includes a top portion 156, a bottom portion 158, an inner diameter portion 160, and an outer sidewall portion 162. The inner diameter portion 160 is electrically connected to the feedthrough pin 132 that extends through the inner diameter portion. Further, the outer sidewall portion 162 is configured to be electrically connected to at least one of the feedthrough ferrule 134 or the retainer 140 by solder 164 that has been reflowed from the solder wire 142.

[0088] The feedthrough ferrule 134 of the assembly 130 can take any suitable shape and have any suitable dimensions. Further, each of the inner surface 144 and the outer surfaceexamples the designation of inner and outer surfaces 144, 145 of the ferrule 134 may refer to the orientation within the assembled IMD 10 such that the inner surface of the ferrule is sealed within the housing 12. In one or more embodiments, the outer surface 145 can include a flange 166 that can take any suitable shape and have any suitable dimensions. In one or more embodiments, one or more of the vias 138 can be disposed through the flange 166 on the outer surface 145 and through the inner surface 144.

[0089] Further, the ferrule 134 can include any suitable material, e.g., at least one of an inorganic (e.g., metallic or ceramic) material or a polymeric material. In one or embodiments, the ferrule 134 can include a metallic material such as titanium, niobium, aluminum, tantalum, zirconium, hafnium, or combinations thereof. Still further examples of suitable feedthrough ferrule materials can include metal alloys, such as an alloy of aluminum or alloys of suitable feedthrough ferrule materials described herein.

[0090] Each via 138 that is defined by the ferrule 134 and extends between the outer surface 145 and the inner surface 144 of the ferrule along the via axis 102 can take any suitable shape and have any suitable dimensions. In one or more embodiments, the via 138 can take an elliptical shape (e.g., circular) in a plane substantially orthogonal to the via axis 102. The via 138 can have a constant cross-sectional area in the plane substantially orthogonal to the via axis 102 or a cross-sectional area that varies along the via axis. At least a portion of each via 138 can be defined by a sidewall 168 (FIG. 9) of the ferrule 134 that extends between the outer surface 145 and the inner surface 144 of the ferrule.

[0091] The ferrule 134 can include any suitable number of vias 138. In one or more embodiments, the at least one via 138 includes a plurality of vias disposed along a longitudinal axis 104 (FIG. 7).

[0092] Disposed on the inner surface 144 of the ferrule 134 adjacent the at least one via 138 is the retainer 140. The assembly 130 can include any suitable number of retainers 140 disposed on any suitable portion or portions of the ferrule 134. As shown in FIG. 5, the feedthrough ferrule 134 includes a first retainer 140-1 and a second retainer 140-2 (referred to collectively herein as retainer or retainers 140).

[0093] The retainer 140 can be disposed on the inner surface 144 of the ferrule 134 using any suitable technique, e.g., adhering, bonding, welding (e.g., laser welding), press fitting into one or more grooves disposed in the ferrule, etc. In one or more embodiments, theretainer 140 can be formed such that is unitary with the ferrule 134, i.e., manufactured as one piece with the ferrule. Any suitable technique can be utilized to form the unitary retainer 140 and ferrule 134, e.g., machining, molding, injection molding, 3D printing, casting, etching a blank, etc. In one or more embodiments, the retainer 140 is electrically connected to the ferrule 134 such that the outer sidewall portion 162 of the capacitor 154 can be electrically connected to the ferrule via the retainer and solder 164 that electrically connects the capacitor to the retainer as is shown in FIG. 10. In one or more embodiments, the outer sidewall portion 162 of the capacitor 154 can be electrically connected to the ferrule 134 by the solder 164 directly and not by the retainer 140. Further, in one or more embodiments, the outer sidewall portion 162 of the capacitor 154 can be electrically connected to both the ferrule 134 and the retainer 140.

[0094] As is also shown in FIG. 10, a dielectric layer 163 can be disposed on one or more portions of the capacitor 154. Such dielectric layer 163 can include any suitable material, e.g., an epoxy. In one or more embodiments, the dielectric layer 163 can be disposed on at least one or more portions of the top portion 156 or one or more portions of the bottom portion 158 of the capacitor 154.

[0095] The retainer 140 can include any suitable material, e.g., one or more of the same materials described herein regarding the ferrule 134. In one or more embodiments, the retainer 140 can include a material that is different from the material of the ferrule 134.

[0096] The retainer 140 can take any suitable shape and having any dimensions. In one or more embodiments, the retainer 140 is configured to retain at least a portion of the solder wire 142 (FIG. 9). Further, the retainer 140 can be configured to retain any suitable portion or portions of the solder wire 142. In one or more embodiments, the retainer 140 is configured to retain at least a portion of the solder wire 142 until the wire is reflowed to provide solder 164 that can flow between the ferrule 134 and the outer sidewall portion 162 of the capacitor 154 such that the capacitor is electrically connected to the ferrule. As a result, the retainer 140 can be utilized to retain the solder wire 142 in place during manufacture of the feedthrough assembly 130 such that the wire isn’t displaced from its desired position prior to reflow of the solder wire.

[0097] As shown in FIGS. 5 and 7, the retainer 140 includes a wall 170 that extends from the inner surface 144 of the ferrule 134. The wall 170 extends along a wall axis 106 (FIG. 7). The wall 170 can be segmented as shown in FIGS. 5 and 7 into any suitable number ofsegments or portions each having any suitable dimensions. In one or more embodiments, the wall 170 can be a continuous wall that extends along the wall axis 106 (e.g., an axis that runs parallel to the plane of inner surface 144). For example, FIG. 11 is a schematic perspective view of another embodiment of a feedthrough ferrule 234. All design considerations and possibilities described herein regarding feedthrough ferrule 134 of FIGS. 4-10 apply equally to feedthrough ferrule 234 of FIG. 11 to the extent they do not conflict. One difference between feedthrough ferrule 234 and feedthrough ferrule 134 is that ferrule 234 includes one or more retainers 240 each including a wall 270 that extends continuously along a wall axis 206. Such wall 270 can take any suitable shape and have any suitable dimensions. The retainer 240 further includes a channel 272 that is defined by an inner surface 244 of the ferrule adjacent the wall 270 and extends along a direction that is substantially parallel to the wall axis 206.

[0098] Returning to FIGS. 4-10, the retainer 140 can also include a channel 172 that is defined by the inner surface 144 of the ferrule 134. In one or more embodiments, the channel 172 is disposed adjacent the intersection between the inner surface 144 of the ferrule 134 adjacent the wall 170 (e.g., disposed in the inner surface 144). The retainer 140 can include any suitable number of channels 172 that can each retain a solder wire. The channel 172 can be disposed any suitable distance from the wall 170. In one or more embodiments, the channel 172 can be disposed at a distance of greater than 0 mm and no greater than 2 mm from the wall 170. Further, the channel 172 can take any suitable shape and have any suitable dimensions. The channel 172 extends along a direction that is substantially parallel to the wall axis 106. Further, at least a portion of the channel 172 is disposed between the at least one via 138 and the wall 170. The channel 172 can be configured to receive the solder wire 142 such that the channel at least partially inhibits the free movement of the solder wire. Additionally, or alternatively, the channel 172 can provide a friction fit with the solder wire 142 to retain the solder wire in the channel with the movement of the ferrule 134 during manufacturing of the assembly 130.

[0099] As mentioned herein, the feedthrough ferrule 134 can include any suitable number of retainers. For example, the ferrule 134 includes the first retainer 140-1 and the second retainer 140-2. The second retainer 140-2 can be the same as or different from the first retainer 140-1. As shown in FIGS. 5 and 7, the second retainer 140-2 is disposed on the inner surface 144 of the ferrule 134 adjacent the at least one via 138. Further, the secondretainer 140-2 is electrically connected to the ferrule 134. The second retainer 140-2 is configured to retain at least a portion of a second solder wire 178 (FIG. 5).

[0100] The second retainer 140-2 includes a second wall 174 that extends from the inner surface 144 of the ferrule 134 along a second wall axis 108, and a second channel 176 that is defined by the inner surface of the ferrule adjacent the wall and extends along a direction that is substantially parallel to the wall axis. At least a portion of the second channel 176 of the second retainer 140-2 is disposed between the at least one via 138 and the wall 174. Further, the second channel 176 of the second retainer 140-2 is configured to receive a solder wire 178 (FIG. 5) and provide a friction fit with the solder wire. The second retainer 140-2 can include any suitable second wall 174 (e.g., wall 170 of first retainer 140-1) and any suitable second channel 176 (e.g., channel 172 of first retainer).

[0101] As shown in FIG. 7, the retainer 140 can extend along a retainer axis 141 that is substantially parallel to the longitudinal axis 104. The retainer axis 141 can be substantially parallel to (or colinear with) the wall axis 106 of the wall 170 of the retainer 140. Similarly, in embodiments where the ferrule 134 includes two retainers 140, the first retainer 140-1 can extend along the retainer axis 141 (i.e., the first retainer axis) and the second retainer 140-2 can extend along a second retainer axis 143. In one or more embodiments, the second retainer axis 143 can be substantially parallel to (or colinear with) the second wall axis 108 of the second wall 174 of the second retainer. In one or more embodiments, the first retainer axis 141 is substantially parallel to the second retainer axis 143.

[0102] The feedthrough 136 of the feedthrough assembly 130 can also include the insulator 146 that is disposed at least partially within the at least one via 138 along the via axis 102 (FIG. 9). The insulator 146 can include any suitable dielectric material, e.g., at least one of glass, sapphire, alumina, zirconia, or ceramic. Further, the insulator 146 can take any suitable shape and have any suitable dimensions. In one or more embodiments, the insulator 146 can have a T-shaped or top hat-shaped cross-section in a plane substantially parallel to the via axis 102. Further, the insulator 146 can define a passageway 180 through which the feedthrough pin 132 can be disposed. As a result of this passageway 180, the insulator 146 can take a ring shape in the plane substantially orthogonal to the via axis 102. Such passageway 180 can take any suitable shape and have any suitable dimensions.

[0103] The passageway 180 extends along an insulator axis 181 (FIG. 9) through which the feedthrough pin 132 is disposed. The passageway 180 is defined by the insulator 146 and extends between a first end 182 and the second end 184 of the insulator along the insulator axis 181. In one or more embodiments, the insulator axis 181 can be substantially colinear with the via axis 102 when the insulator 146 is disposed at least partially within the via 138 as shown in FIG. 9. The passageway 180 can take any suitable cross-sectional shape in a plane substantially orthogonal to the insulator axis 181 and have any suitable dimensions. In one or more embodiments, the passageway 180 can have any suitable diameter that is configured to receive the feedthrough pin. In some examples, the diameter of the passageway 180 may be greater than or substantially equal to (e.g., equal to or nearly equal to) a diameter of the feedthrough pin 132.

[0104] Disposed along the via axis 102 through the via 138 and the insulator 146 is the feedthrough pin 132, which extends between its outer end 150 and inner end 152 (FIG. 4). The feedthrough pin 132 can take any suitable shape and have any suitable dimensions. Further, the feedthrough pin 132 can include any suitable conductive material, e.g., at least one of titanium, niobium, aluminum, tantalum, zirconium, or hafnium. In one or more embodiments, the feedthrough pin 132 can include a metal alloy such as an alloy of aluminum or alloys of suitable feedthrough pin materials described herein.

[0105] The feedthrough pin 132 can be configured to electrically connect one or more of the electronic components 22 disposed in the internal volume 28 of the IMD 10, (e.g., electronic circuitry, one or more power sources, etc.) with a component (e.g., one or more implantable leads 14) in communication with an environment external to the IMD. Although not shown, the IMD 10 can further include at least a second component, such as an electrical contact in the connector header 16 (FIG. 1) in communication with the external environment. The electrical contact in the connector header 16 (i.e., the second component) may be electrically coupled to a respective feedthrough pin 132. For example, the second component may be electrically coupled, or electrically couplable, to the lead 14 or to an electrical contact of a lead. In other words, a component 22 disposed, or positioned, in the internal volume 28 of the IMD 10 (i.e., an internal component) may be electrically coupled to a respective component disposed, or positioned, outside of the internal volume of the IMD (e.g., in the connector header 16 or in the external environment) via a respective feedthrough pin 132.

[0106] Although not shown, the feedthrough 136 can further include a dielectric material (e.g., potting material) disposed at least partially within the via 138 between the sidewall 168 of the ferrule 134 and the feedthrough pin 132 to provide a glassed feedthrough, where the dielectric material hermetically seals the feedthrough. The dielectric material can take any suitable shape and have any suitable dimensions. In one or more embodiments, the dielectric material forms a tubular structure that is configured to seal the via 138 and fix the feedthrough pin 132 relative to the ferrule 134. Further, in one or more embodiments, the dielectric material can define a minimum radial thickness between the insulator 146 and the sidewall 168 of the ferrule.

[0107] The dielectric material can include any suitable dielectric material, e.g., a polymeric material such as an epoxy, adhesive, thermoplastic, or rubber, an inorganic material such glass or sapphire, etc. Further, the material of the dielectric material and the insulator 146 can each be selected such that the dielectric material provides a hermetic seal with the insulator. In one or more embodiments, the dielectric material can include a glass and the insulator 146 can include a ceramic. The dielectric material can be disposed at least partially within the via 138 using any suitable technique.

[0108] In one or more embodiments, one or more feedthroughs 136 of the assembly 130 can be a brazed feedthrough, where one or more braze joints can be utilized to seal the insulator to at least one of the ferrule 134 or the feedthrough pin 132. Any suitable braze material can be utilized to provide one or more brazed feedthroughs 136, e.g., gold. Further, any suitable technique can be utilized to dispose the braze at least partially within the via 138 (e.g., a ceramic insulator 146 brazed to the ferrule pin 132 and the ferrule 134 respectively). Further, the assembly 130 can include any suitable combination of glassed feedthroughs and brazed feedthroughs.

[0109] Disposed adjacent the inner surface 144 of the feedthrough ferrule 134 is the capacitor 154. The capacitor 154 can be configured to suppress and / or transfer electromagnetic interference signals that may be collected by one or more components of the IMD 10, e.g., one or more lead wires exterior to the IMD that are electrically connected to feedthrough pin 132. To suppress such EMI signals, the capacitor 154 can be electrically connected to the ferrule 134 of the feedthrough assembly 130. In one or more embodiments, the capacitor 154 can be disposed around and electrically coupled to thefeedthrough pin 132 and the ferrule 134 using any suitable technique as is further described herein.

[0110] The capacitor 154 can include any suitable capacitor or capacitors. As illustrated, the capacitor 154 includes the top portion 156, the bottom portion 158, the inner diameter portion 160, and the outer sidewall portion 162. The inner diameter portion 160 defines an aperture 186 (FIG. 9) that extends between the top portion 156 and the bottom portion 158, through which the feedthrough pin 132 extends. The inner diameter portion 160 of the capacitor 154 is electrically connected to the feedthrough pin 132 using any suitable technique, e.g., with the solder or conductive epoxy (not shown). Further, the outer sidewall portion 162 of the capacitor 154 is electrically connected to the ferrule 134 using any suitable technique, e.g., utilizing solder or conductive epoxy. In one or more embodiments, the outer sidewall portion 162 is configured to be electrically connected to the feedthrough ferrule 134 by solder 164 that has been re-flowed from one or both solder wires 142, 178 as is shown in FIG. 10. Further, in one or more embodiments, the outer sidewall portion 162 of the capacitor 154 is configured to be further electrically connected to one or both of the first wall 170 of the first retainer 140-1 or the second wall 174 of the second retainer 140-2 by the solder 164. Although not shown, in one or more embodiments, the inner diameter portion 160 and the outer sidewall portion 162 can be electrically connected with one or more sets of electrode plates disposed within the capacitor 154 that are electrically isolated from one another and form such capacitor.

[0111] Any suitable technique can be utilized to assist in reflowing the solder 164 from one or both of the first and second solder wires 142, 178 such that the solder flows between at least a portion of the outer sidewall portion 162 of the capacitor 154 and at least one of the ferrule 134 or the retainer 140 (at least one of first retainer 140-1 or second retainer 140-2). In one or more embodiments, a solder-wettable surface or layer can be disposed on one or more portions of at least one of the inner surface 144 of the ferrule 134 or the retainer 140 where subsequent solder reflow is desired. In some examples, a solder-wettable surface may be disposed along at least a portion of the channels 142, 178. Additionally, or alternatively, a solder-wettable surface may be disposed along the corresponding surface of the capacitor 154 to promote direct joining. Any suitable technique can be utilized to provide the solder wettable surfaces. In one or more embodiments, at least one of titanium, nickel vanadium, or gold can be disposed onat least a portion of the inner surface 144 of the ferrule 134 and / or the retainer 140 using any suitable technique, e.g., coating, sputtering, plating (e.g., electroless nickel immersion gold plating or electroless nickel electroless palladium immersion gold platting), etc.

[0112] As mentioned herein, the one or more retainers 140 can include any suitable elements or components that can be utilized to retain solder wires 142, 178. For example, FIG. 12 is a schematic perspective view of another embodiment of a feedthrough ferrule 334. All design considerations and possibilities described herein regarding feedthrough ferrule 134 of FIGS. 4-10 apply equally to feedthrough ferrule 334 of FIG. 12 to the extent that they do not conflict. One difference between feedthrough ferrule 334 and feedthrough ferrule 134 is that ferrule 334 includes one or more retainers 340 each having a plurality of tabs 388 extending from an inner surface 344 of the ferrule and that are disposed adjacent a wall 370 of the retainer. The plurality of tabs 388 is configured such that a solder wire 342 is retained between the wall 370 and the plurality of tabs. The retainer 340 can include any suitable number of tabs disposed in any suitable arrangement or position adjacent the wall 370 of the retainer. Further, each tab of the plurality of tabs 388 can take any suitable shape and have any suitable dimensions.

[0113] Further, for example, FIG. 13 is a schematic perspective view of another embodiment of a feedthrough ferrule 434 that can be utilized with the feedthrough assembly 130 of FIGS. 4-10. All design considerations and possibilities described herein regarding feedthrough ferrule 134 of FIGS. 4-10 apply equally to feedthrough ferrule 434 of FIG. 13 to the extent they do not conflict. One difference between feedthrough ferrule 434 of FIG. 13 and feedthrough ferrule 134 FIGS. 4-10 is that a wall 470 of retainer 440 that extends from an inner surface 444 of the ferrule 434 includes a first end portion 492 that is configured to receive a first end 496 of a solder wire 442, and a second end portion 494 of the wall that is configured to receive a second end 498 of the solder wire. The first end portion 492 and the second end portion 494 of the wall 470 can take any suitable shape and have any suitable dimensions. In one or more embodiments, each of the first and second end portions 492, 494 of the wall 470 can take a hooked or J shape that is configured to receive first and second ends 496, 498 of the solder wire 442.

[0114] Another embodiment of a feedthrough ferrule 534 that can be utilized with the feedthrough assembly 130 of FIGS. 4-10 is illustrated in FIG. 14. All design considerations and possibilities described herein regarding feedthrough ferrule 134 ofFIGS. 4-10 apply equally to feedthrough ferrule 534 of FIG. 14 to the extent they do not conflict. Feedthrough ferrule 534 includes one or more retainers 540. Each retainer 540 includes a wall 570 and one or more grooves 510 defined by an inner surface 512 of the wall, where each groove is configured to retain a solder wire 542. The groove 510 can take any suitable shape and have any suitable dimensions. Further, solder wire 542 can be disposed within the groove 510 using any suitable technique. In one or more embodiments, at least a portion of the solder wire 542 is friction fit within the groove 510 such that it is releasably retained by the groove during the manufacturing process of the feedthrough assembly.

[0115] The various embodiments of feedthrough assemblies and feedthrough ferrules described herein can be manufactured using any suitable technique. For example, FIG. 15 is a flowchart of one embodiment of a method 600 of manufacturing the feedthrough assembly 130 of FIGS. 4-10. Although described regarding feedthrough assembly 130 of FIGS. 4-10, the method 600 can be utilized to manufacture any suitable feedthrough assembly.

[0116] At 602, one or more feedthroughs 136 can be disposed through the ferrule 134 using any suitable technique. For example, the ferrule 134 can be disposed in a fixture, and one or more feedthrough pins 132 can be disposed through one or more of the vias 138 and the insulator 146 can be disposed over one or more of the feedthrough pins and at least partially within the via 138 using any suitable technique. For glassed feedthroughs 136, any suitable dielectric material (e.g., a glass preform) can be disposed in one or more vias using any suitable technique. The feedthrough assembly 130 can be heated using any suitable technique such that the dielectric material flows between each feedthrough pin 132 and the inner surface 144 of the via to form a hermetic feedthrough 136. The dielectric material can also hermetically seal the insulator 146 to the via 138. For brazed feedthroughs 136, one or more portions of the insulator 146 can be metallized using any suitable technique and material (e.g., niobium). One or more braze preforms (e.g., gold) can be disposed in the via 138, and the feedthrough assembly 130 can be heated in a vacuum oven to form a gold braze hermetically sealed feedthrough 136.

[0117] The insulator 146 can be disposed at least partially within the at least one via 138 along the via axis 102 using any suitable technique. Further, the feedthrough pin 132 can be disposed along the via axis 102 using any suitable technique such that the feedthroughpin extends beyond the outer surface 145 and the inner surface 144 of the feedthrough ferrule 134. In one or more embodiments, the feedthrough pin 132 is first disposed through the at least one via 138, and the insulator 146 can be disposed over the feedthrough pin such that the pin extends through the passageway 180 of the insulator. The capacitor 154 can be disposed adjacent the inner surface 144 of the feedthrough ferrule 134 using any suitable technique.

[0118] One or more retainers 140 can be disposed on the inner surface 144 of the ferrule 134 adjacent the at least one via 138 at 604 using any suitable technique such that the retainers are electrically connected to the ferrule. In one or more embodiments, the retainers 140 can be machined into the ferrule 134 by removing portions of a ferrule blank. In one or more embodiments, the walls 170 of the retainers 140 can be made separately and press fit into grooves that are disposed in the ferrule 134 or laser welded to the ferrule.

[0119] At 606, one or more solder wires 142, 178 can be disposed on or adjacent to the inner surface 144 of the ferrule 134 using any suitable technique. At least a portion of one or more of the solder wire 142 can be retained by one or more of the retainers 140. For example, the solder wire 142 can be disposed at least partially within the channel 172 of first retainer 140-1.

[0120] The second retainer 140-2 can optionally be disposed on the inner surface 144 of the ferrule 134 adjacent the at least one via 138 at 608 using any suitable technique such the second retainer is electrically connected to the ferrule. The second retainer 140-2 is configured to retain at least a portion of the second solder wire 178. The second solder wire 178 can optionally be disposed on or adjacent to the inner surface of the ferrule at 610 using any suitable technique, where at least a portion of the second solder wire is retained by the second retainer 140-2.

[0121] At 612, the inner diameter portion 160 of the capacitor 154 can optionally be electrically connected to the feedthrough pin 132 using any suitable technique. For example, a conductive braze can be disposed between the feedthrough pin 132 and the inner diameter portion 160 of the capacitor 154 and reflowed using any suitable technique. Further, for example, a conductive epoxy or conductive polyimide can be utilized to electrically connect the inner diameter portion 160 of the capacitor 154 to the feedthrough pin 132. At 614, the outer sidewall portion 162 of the capacitor 154 can optionally be electrically connected to the ferrule 134 using any suitable technique. In one or moreembodiments, this electrical connection can be formed by reflowing one or more of the solder wires 142, 178 such that solder 164 (FIG. 10) from the solder wires is disposed between the outer sidewall portion 162 of the capacitor 154 and at least one of the inner surface 144 of the ferrule 134 or one or more of the retainers 140 to electrically connect the outer sidewall portion of the capacitor and the ferrule.

[0122] It should be understood that various aspects disclosed herein may be combined in different combinations than the combinations specifically presented in the description and accompanying drawings. It should also be understood that, depending on the example, certain acts or events of any of the processes or methods described herein may be performed in a different sequence, may be added, merged, or left out altogether (e.g., all described acts or events may not be necessary to carry out the techniques). In addition, while certain aspects of this disclosure are described as being performed by a single module or unit for purposes of clarity, it should be understood that the techniques of this disclosure may be performed by a combination of units or modules associated with, for example, a medical device.

[0123] In one or more examples, the described techniques may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored as one or more instructions or code on a computer-readable medium and executed by a hardware-based processing unit. Computer-readable media may include computer-readable storage media, which corresponds to a tangible medium such as data storage media (e.g., RAM, ROM, EEPROM, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and that can be accessed by a computer).

[0124] Instructions may be executed by one or more processors, such as one or more digital signal processors (DSPs), general purpose microprocessors, application specific integrated circuits (ASICs), field programmable logic arrays (FPGAs), or other equivalent integrated or discrete logic circuitry. Accordingly, the term “processor” as used herein may refer to any of the foregoing structure or any other physical structure suitable for implementation of the described techniques. Also, the techniques could be fully implemented in one or more circuits or logic elements.

[0125] All references and publications cited herein are expressly incorporated herein by reference in their entirety into this disclosure, except to the extent they may directlycontradict this disclosure. Illustrative embodiments of this disclosure are discussed and reference has been made to possible variations within the scope of this disclosure. These and other variations and modifications in the disclosure will be apparent to those skilled in the art without departing from the scope of the disclosure, and it should be understood that this disclosure is not limited to the illustrative embodiments set forth herein. Accordingly, the disclosure is to be limited only by the claims provided below.

Claims

WHAT IS CLAIMED IS:

1. A feedthrough ferrule comprising: an outer surface and an inner surface; at least one via defined by the ferrule extending between the outer surface and the inner surface of the ferrule along a via axis that is substantially orthogonal to the outer surface of the ferrule; and a retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the retainer is electrically connected to the ferrule, wherein the retainer is configured to retain at least a portion of a solder wire.

2. The feedthrough ferrule of claim 1, wherein the retainer comprises a wall that extends from the inner surface of the ferrule, wherein the wall extends along a wall axis.

3. The feedthrough ferrule of claim 2, wherein the retainer further comprises a channel that is defined by the inner surface of the ferrule adjacent the wall and extends along a direction that is substantially parallel to the wall axis, wherein at least a portion of the channel is disposed between the at least one via and the wall, and further wherein the channel is configured to receive the solder wire and provide a friction fit with the solder wire.

4. The feedthrough ferrule of any one of claims 2-3, wherein the retainer is a first retainer, wherein the feedthrough ferrule further comprises a second retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the second retainer is electrically connected to the ferrule, wherein the second retainer is configured to retain at least a portion of a second solder wire.

5. The feedthrough ferrule of claim 4, wherein the second retainer comprises a second wall that extends from the inner surface of the ferrule, wherein the second wall extends along a second wall axis, and further wherein the at least one via is disposed between the wall axis and the second wall axis.

6. The feedthrough ferrule of claim 1, wherein the at least one via comprises a plurality of vias disposed along a longitudinal axis, wherein the retainer extends along a retainer axis that is substantially parallel to the longitudinal axis.

7. The feedthrough ferrule of claim 6, wherein the retainer is a first retainer and the retainer axis is a first retainer axis, wherein the feedthrough ferrule further comprises a second retainer that extends along a second retainer axis that is substantially parallel to the first retainer axis.

8. A feedthrough assembly comprising: a feedthrough ferrule comprising: an outer surface and an inner surface; at least one via defined by the ferrule extending between the outer surface and the inner surface of the ferrule along a via axis that is substantially orthogonal to the outer surface of the ferrule; and a retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the retainer is electrically connected to the ferrule, wherein the retainer is configured to retain at least a portion of a solder wire; a feedthrough disposed through the ferrule, the feedthrough comprising: an insulator disposed at least partially within the at least one via along the via axis; and a feedthrough pin comprising an outer end adjacent the outer surface of the ferrule and an inner end adjacent the inner surface of the ferrule, wherein the feedthrough pin is disposed along the via axis through the at least one via and the insulator; and a capacitor disposed adjacent the inner surface of the feedthrough ferrule, wherein the capacitor comprises a top portion, a bottom portion, an inner diameter portion, and an outer sidewall portion, wherein the inner diameter portion is electrically connected to the feedthrough pin that extends through the inner diameter portion, and further wherein the outer sidewall portion is configured to be electrically connected to the feedthrough ferrule by solder that has been reflowed from the solder wire.

9. The feedthrough assembly of claim 8, wherein the retainer comprises a wall that extends from the inner surface of the ferrule, wherein the wall extends along a wall axis.

10. The feedthrough assembly of any one of claims 8-9, wherein the retainer is a first retainer, wherein the feedthrough ferrule further comprises a second retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the second retainer is electrically connected to the ferrule, wherein the second retainer is configured to retain at least a portion of a second solder wire.

11. The feedthrough assembly of claim 10, wherein the second retainer comprises a second wall that extends from the inner surface of the ferrule, wherein the second wall extends along a second wall axis, and further wherein the at least one via is disposed between the wall axis and the second wall axis.

12. The feedthrough assembly of claim 8, wherein the at least one via comprises a plurality of vias disposed along a longitudinal axis, wherein the retainer extends along a retainer axis that is substantially parallel to the longitudinal axis.

13. The feedthrough assembly of claim 12, wherein the retainer is a first retainer and the retainer axis is a first retainer axis, wherein the feedthrough ferrule further comprises a second retainer that extends along a second retainer axis that is substantially parallel to the second retainer axis.

14. An implantable medical device comprising: a housing; electronic components disposed within the housing; and the feedthrough assembly of any one of claims 8-13 connected to the housing to form a portion of the housing.

15. A method of forming a feedthrough assembly, comprising: disposing a feedthrough through a ferrule;disposing a retainer on an inner surface of the ferrule adjacent a via of the feedthrough ferrule such that the retainer is electrically connected to the ferrule; and disposing a solder wire on or adjacent to the inner surface of the ferrule, wherein at least a portion of the solder wire is retained by the retainer.

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