Film adhesive, dicing die-bonding film, semiconductor device, and production method for same
A film-like adhesive with specific viscosity and resin composition addresses undivided portions in semiconductor wafers, enhancing cooling and discontinuity to improve yield and efficiency in semiconductor manufacturing.
Patent Information
- Application Number
- PCT/JP2025/032189
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-09-13
- Filing Date
- 2025-09-11
- Publication Date
- 2026-03-19
AI Technical Summary
Conventional dicing-die bonding integrated films exhibit undivided portions in the adhesive layer when applied to semiconductor wafers undergoing cooled expansion, leading to decreased yield and production efficiency, particularly as wafer thickness reduces to 15 μm or less.
A film-like adhesive with a thermosetting resin component, elastomer, and optional inorganic filler, having a shear viscosity of 10,000 Pa·s or less at 120°C, and a content of inorganic filler between 0 to 5% by mass, is used to enhance cooling and discontinuity, with a storage modulus of 20 MPa or more after curing.
The adhesive provides excellent cooling and discontinuity, reducing undivided portions and improving yield and production efficiency in semiconductor manufacturing processes.