Thermal management system and vehicle

By introducing solid-state refrigeration modules into the thermal management system, the problem of compressors failing to start normally under extreme conditions is solved, achieving high energy efficiency in heating or cooling, and making it suitable for thermal management systems of new energy vehicles and traditional fuel vehicles.

WO2026152295A1 Publication Date: 2026-07-23YINWANG INTELLIGENT TECHNOLOGIES CO LTD
7 Cites 0 Cited by

Patent Information

Application Number
PCT/CN2025/072533
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-01-15
Publication Date
2026-07-23

AI Technical Summary

Technical Problem

Existing thermal management systems are unable to heat or cool efficiently under extreme ambient temperatures (such as excessively cold or hot ambient temperatures), resulting in compressors failing to start normally or operating with low efficiency.

Method used

A solid-state refrigeration module is adopted, including a first metal plate, a solid-state cooler, and a second metal plate. Heat exchange is achieved through flow channels. The solid-state cooler releases or absorbs heat in extreme environments to ensure normal start-up and efficient operation of the compressor.

Benefits of technology

This system enables high-efficiency heating or cooling in extreme environments, ensuring normal compressor startup and improved operating efficiency. It is suitable for thermal management systems in both new energy vehicles and traditional fuel vehicles.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

A thermal management system and a vehicle. The thermal management system comprises a solid-state cooling module (104) and a compressor (101), wherein the solid-state cooling module is used for releasing heat to a thermal management loop in which the compressor is located when the thermal management system is executing a heating function; and / or, the solid-state cooling module is used for absorbing heat from the thermal management loop in which the compressor is located when the thermal management system is executing a cooling function. The solid-state cooling module comprises a first metal plate (201), a solid-state cooler (203) and a second metal plate (202), wherein the first metal plate is internally provided with a flow channel that allows a fluid to flow therethrough, and the solid-state cooler is used for implementing heat exchange between the first metal plate and the second metal plate. By means of such a configuration, the thermal management system can maintain efficient operation even in an overly cold or overly hot environment.
Need to check novelty before this filing date? Find Prior Art