Preparation method of nano copper-polyamide composite
By reducing copper compounds in polyamide monomers, nano-copper-polyamide composite materials are generated, which solves the problems of easy oxidation and uneven dispersion of metal nanomaterials, achieves performance improvement and process simplification, and has good industrial application prospects.
Patent Information
- Application Number
- CN201310295266.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2013-07-15
- Publication Date
- 2013-10-02
- Estimated Expiration
- 2033-07-15
AI Technical Summary
When preparing polymer-based nanocomposites in the existing technology, metal nanomaterials are easily oxidized and difficult to disperse uniformly, resulting in poor performance and complex processes that are not conducive to industrial application.
A method for preparing nano-copper-polyamide composite materials is adopted. By adding copper compounds and catalysts to polyamide monomers, a reduction reaction is performed under specific temperature and pressure conditions to generate nano-copper particles, which are protected from oxidation by nitrogen gas. Achieve uniform dispersion and chemical stability of nano-copper.
The process is simplified, the agglomeration and oxidation of nano-copper particles are avoided, the uniform dispersion and chemical stability of nano-copper in the polyamide matrix are achieved, and it has good industrial application prospects.