Edge-to-edge display device and related methods

Abstract

This document discloses edge-to-edge display devices and related methods. An example display device includes a display screen and a backlight, the backlight including a light guide frame defining holes therein. The example display device includes an integrated circuit mounted to the display screen. The example display device includes a flexible printed circuit communicating with the integrated circuit. At least a portion of the flexible printed circuit is disposed in the holes of the light guide frame.

Description

Technical Field

[0001] This disclosure relates generally to displays, and more specifically to edge-to-edge display devices and related methods. Background Technology

[0002] Personal computing (PC) devices, such as laptops or tablets, include a display screen that allows users to interact with content displayed on the screen via a graphical user interface. A PC device's display screen typically includes a bezel or frame placed around the edges of the screen. The bezel, along with the cover or lid that houses the display screen, structurally supports the display screen when, for example, the screen is coupled to another component (such as a laptop keyboard). The bezel also protects electronic components associated with and located near the display screen (e.g., printed circuit boards, source drivers, etc.) from external exposure.

[0003] The screen-to-body ratio (STR) represents the ratio of the surface area of ​​the display screen to the surface area of ​​the main body of a PC device. PC devices with a high STR typically include a bezel that defines a narrow boundary around the display screen, thereby defining a larger display area compared to devices with a lower STR. Summary of the Invention

[0004] One aspect of this disclosure provides a display device comprising: a display screen; a backlight including a light guide frame defining holes therein; an integrated circuit coupled to the display screen; and a flexible printed circuit communicating with the integrated circuit and including electronic components coupled to the flexible printed circuit, the electronic components being at least partially disposed in the holes of the light guide frame.

[0005] Another aspect of this disclosure provides a display device comprising: a display screen; a cover including a cavity defined in the cover, the display screen being coupled to the cover; a flexible printed circuit; an integrated circuit coupled to the flexible printed circuit, a first portion of the flexible printed circuit being disposed in the cavity; and a bezel disposed around the display screen, the bezel being used to cover a second portion of the flexible printed circuit.

[0006] Another aspect of this disclosure provides an electronic device comprising: a base; a display screen; a housing for supporting the display screen, the housing being coupled to the base; a flexible printed circuit disposed within the housing; an integrated circuit coupled to either the display screen or the flexible printed circuit; and a bezel disposed around the display screen, the bezel being used to cover at least a portion of the flexible printed circuit. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of a known display device for a PC.

[0008] Figure 2 This is a schematic diagram of an example display device of a PC device constructed in accordance with the teachings of this disclosure.

[0009] Figure 3 yes Figure 2 Example display device along Figure 2 A side view with 3-3 lines.

[0010] Figure 4 yes Figure 2 and Figure 3 Example display device along Figure 2 A partial cross-sectional view of line 4-4.

[0011] Figure 5 This is another example of a schematic diagram of a PC device constructed in accordance with the teachings of this disclosure.

[0012] Figure 6 This is a schematic diagram of a known backlight for a PC device.

[0013] Figure 7 This is a schematic diagram of an example backlight of a PC device constructed in accordance with the teachings of this disclosure.

[0014] Figure 8 This is a schematic diagram of another example of a backlight for a PC device constructed in accordance with the teachings of this disclosure.

[0015] Figure 9 It is manufacturing Figures 2 to 4 The example displays a flowchart of an example method for the device.

[0016] Figure 10 It is manufacturing Figure 5 The example displays a flowchart of an example method for the device.

[0017] These figures are not to scale. Instead, the thickness of layers or regions may be enlarged in the figures. Generally, the same reference numerals are used throughout the figures and the following description to refer to the same or similar parts.

[0018] As used herein, “comprising” and “including” (and all their forms and tenses) are open-ended terms. Therefore, whenever a claim uses any form of “comprising” or “including” (e.g., including, containing, having, containing, etc.) as a reference or preamble to any kind of claim, it should be understood that additional elements, terms, etc., may be present without falling outside the scope of the corresponding claim or reference. As used herein, when the phrase “at least” is used as a transitional term, for example, in the preamble of a claim, it is an open-ended term in the same way as the terms “comprising” and “including” are open-ended terms. The term “and / or” as used in the form, for example, A, B, and / or C, refers to any combination or subset of A, B, and C, for example, (1) including only A; (2) including only B; (3) including only C; (4) A and B; (5) A and C; (6) B and C; and (7) A and B and C. Detailed Implementation

[0019] The display screen of a PC device, such as a laptop or tablet, allows users to interact with content (such as user applications installed on the PC, media accessed via the Internet, etc.) presented on the screen through a graphical user interface. The display screen (e.g., an LCD panel) is generally surrounded by a frame, border, or bezel that defines the perimeter of the display. For example, when the display screen is coupled to a PC device (e.g., including a laptop keyboard), the bezel helps to structurally support the display screen. In some examples, the bezel covers one or more electronic components associated with the display screen, such as one or more timing controller (TCON) chips, backlight drivers, source drivers, etc., arranged on a printed circuit board (PCB) near the display screen. Therefore, the bezel helps protect the electronic components of the display screen from external exposure, thereby preventing damage to the electronic components from debris.

[0020] The bezel includes sidewalls extending along the right side of the display (e.g., relative to the user viewing the display), the left side of the display, the top of the display, and the bottom of the display. The screen-to-body ratio represents the ratio of the amount of surface area of ​​the display to the amount of surface area of ​​the main body of the PC device. The screen-to-body ratio can be increased by reducing the width of one or more sidewalls surrounding the display bezel, thereby increasing the amount of the display visible to the user. For example, the width of the top, right, and left sidewalls of the bezel can be reduced to give the user the appearance of edge-to-edge extension of the display, or otherwise substantially make the bezel smaller or the border smaller.

[0021] As described above, the lower sidewall of the bezel can cover the electronic components of the display screen, which may be, for example, one or more source driver integrated circuits (ICs) that can be integrated into the TCON PCB and the glass substrate of the display panel. The TCON PCB can be placed near the lower sidewall of the bezel to facilitate efficient communication coupling with, for example, the motherboard of a laptop computer (which may be located at the base of a laptop computer) or a portion including the keyboard. A bezel with a narrow lower sidewall may not be sufficient to cover the electronic components of the display screen. Therefore, some known bezels include narrow upper, right, and left sidewalls, but have a wider lower sidewall to cover the electronic components. A wider lower sidewall limits the screen-to-body ratio that can be achieved using such a bezel.

[0022] In some known PC devices, the TCON PCB is placed on the PC's motherboard, which may be located at the PC's base (e.g., in the case of a laptop). Removing the TCON PCB from the portion of the device that includes the display allows for a narrower bezel around the display. However, moving the TCON PCB introduces complexity in routing signals between the TCON PCB and one or more source driver ICs. For example, cables may need to be routed through the PC's hinge, which couples the TCON PCB to the display and / or one or more source drivers. This routing method can affect signal integrity and may introduce electromagnetic interference issues.

[0023] Another known product design for increasing the screen-to-body ratio and edge-to-edge appearance of a display involves adjusting the size of the TCON PCB and / or moving the TCON PCB behind the display. The size and / or configuration of the TCON PCB can be adjusted, for example, by mounting the TCON PCB behind the display or reducing the width of the TCON PCB placed near the lower sidewall bezel. However, while the size and / or configuration of the flexible TCON PCB can be adjusted, the number of components coupled to the TCON PCB remains unchanged. Therefore, it may be necessary to increase the thickness of the TCON PCB to accommodate active components (e.g., one or more TCON chips) and passive components (e.g., resistors, capacitors) coupled to the PCB. Increasing the PCB thickness may increase the thickness of the display's side profile, thus affecting the physical dimensions of the PC device.

[0024] This document discloses example bezels with reduced width arranged around the display screen of a display device to increase the screen-to-body ratio. In some of the examples disclosed herein, integrated circuits (ICs) including timing controllers and source drivers (i.e., TCON embedded driver (TED) ICs) are mounted on the glass substrate of the display screen using glass wafer (COG) bonding technology. Compared to display devices including a TCON PCB, the use of TED ICs reduces the number of PCB components in the display device. In some examples, flexible printed circuits (FPCs) including passive components (e.g., resistors, capacitors) can be placed within the display device without increasing the thickness of the display device's side profile. Therefore, bezels with narrow lower sidewalls can be used to increase the visible display area without adversely affecting the physical dimensions of the PC device and / or the electrical operation of the device.

[0025] In other examples disclosed herein, the IC (e.g., a TED IC) is mounted to the FPC using flexible die bonding technology. In such examples, at least a portion of the FPC is placed in a cover or housing of the PC device that receives a hinge for coupling the display to the PC device's base (e.g., a laptop computer portion including a motherboard, keyboard, etc.). Therefore, the amount of FPC covered by the lower sidewall of the bezel is reduced compared to known display devices that include a TCON PCB. As a result, the width of the lower sidewall of the bezel can be reduced, and the screen-to-body ratio of the PC device can be increased.

[0026] This document also discloses an example backlight that improves the uniformity of light distribution from, for example, LED light sources while reducing (e.g., minimizing) the distance of light travel from one light source and combining with light from other light sources. When reducing the gap between the light source and the display screen, the thickness of the side profile of the display device can be reduced. Therefore, a bezel can be used where the thickness of the side portion along which the bezel covers or partially covers the side profile of the display device is reduced.

[0027] Although the examples disclosed herein are discussed in the context of PC devices such as laptop computers, the display devices disclosed herein can be used in other applications, such as televisions, smartphones, etc. Therefore, the discussion of display devices for PC devices is for illustrative purposes only and does not limit this disclosure to PC devices.

[0028] Figure 1 A display device 100 known in the art is illustrated. The known display device 100 can be used in PC devices such as notebook computers or tablet computers. The known display device 100 includes a display screen 102 (e.g., an LCD panel). A bezel 104 is disposed around the display screen 102. The bezel 104 includes a first sidewall 106 (in... Figure 1In the indicated orientation, the right side wall relative to the user viewing the display screen 102, the second or left side wall 108, the third or upper side wall 110, and the fourth or lower side wall 112.

[0029] Display screen 104 includes multiple source drivers 114 mounted to a glass substrate 115 of display screen 102 via glass wafer bonding technology. For example... Figure 1 As shown, the source driver 114 is positioned near a portion 116 of the display screen 102 covered by the lower sidewall 112 of the bezel 104. The display device 100 includes a timing controller (TCON) PCB board 118. The TCON PCB board 118 is communicatively coupled to the source driver 114 via one or more flexible printed circuits (FPCs) 120. The TCON PCB board 118 is communicatively coupled to the motherboard of a PC device including the display device 100 via cables.

[0030] like Figure 1 As shown, the sidewalls 106, 108, 110, and 112 of the bezel 104 cover a portion 116 of the display screen, which includes the source driver 114 and the right, left, and top edges of the display screen 102. Additionally, as... Figure 1 As shown, the lower sidewall 112 has a wider width w than the right sidewall 106, left sidewall 108, and upper sidewall 110, thus covering a larger portion of the display 104 compared to the other sidewalls 106, 108, and 110. The increased width of the lower sidewall 112 compared to the other sidewalls 106, 108, and 110 allows it to cover the source driver 114, FPC 120, TCON PCB 118, etc. The width w of the lower sidewall 112 is between 7 nm and 18 mm. Figure 1 As shown. The thickness t of the side portion 118 of the bezel 104 (i.e., the portion that at least partially covers the side profile of the display device) is approximately 4.5 mm. The side portion 118 (one or more) at least partially covers the TCON PCB 118 and backlight (e.g., including LED light source, light guide, optical film) of the known display device 100.

[0031] Figure 2 An example PC device 200 is shown, including an example display device 201 constructed in accordance with the teachings of this disclosure. The example PC device 200 may be implemented as a notebook computer or an electronic tablet (e.g., an electronic tablet that can be coupled to one or more keyboards or docking stations, etc.). Figure 2 Example display device 201 includes display screen 202 (e.g., LCD panel). Bezel 204 is positioned around display screen 202. Figure 2 Example border 204 includes a first sidewall 206 (i.e., in Figure 2The directions shown are relative to the right side wall of the user viewing the display screen 202, the second or left side wall 208, the third or upper side wall 210, and the fourth or lower side wall 212. Figure 2 As shown, sidewalls 206, 208, 210, and 212 form a frame around the display screen 202. The bezel 204 includes a side portion 209 extending along at least a portion of the side profile of the display device 201.

[0032] exist Figure 2 In the example, bezel 204 may (e.g., via mechanical fasteners) be coupled to a cover or housing that houses the display device 201 and serves as a protective cover for the display device 201. Example display device 201 may be coupled to a base 211 (e.g., a laptop computer) via one or more hinges 213. Figure 2 As shown, the frame 204 includes an opening to accommodate the hinge 213. In other examples, the frame 204 does not include an opening for the hinge (e.g., when used in some electronic tablets).

[0033] exist Figure 2 In this example, one or more integrated circuits (ICs) 214 are mounted on the glass substrate 215 of the display screen 202. Figure 2 In the example, (one or more) IC 214s are TCON embedded drivers that include a TCON driver and a source driver. For example... Figure 2 As shown in the example, one or more TED ICs 214 are coupled to a portion 216 of the lower sidewall 212 adjacent to the frame 204 of the glass substrate 215. Figure 2 In the example, glass-on-gold (COG) bonding technology is used to mount or bond one or more TED ICs 214 onto a glass substrate 215. For example, an anisotropic conductive film can be used to bond one or more TED ICs 214 to the glass substrate 215.

[0034] Figure 2 The example display device 201 includes one or more flexible printed circuits (FPCs) 218. Figure 2 In the example, one or more FPC 218s include passive components such as resistors and capacitors. These passive components can have any function such as power delivery, power regulation, facilitating communication between the PC device motherboard and other electronic components of the TED IC and / or display device 201. Therefore, compared to Figure 1 The known display device 100's TCON PCB 118, in Figure 2 In the example, (one or more) FPC 218s do not include the TCON chip. Therefore, Figure 2 The size of (one or more) FPC 118 and Figure 1The TCON PCB 118 is smaller compared to this. Therefore, the width w of the lower sidewall 212 of the frame 204 is less than that of the TCON PCB 118. Figure 1 The width of the lower sidewall 112 of the bezel 104 in the known display device 100, because compared to Figure 1 The electronic components covered by the lower sidewall 112 are fewer and / or smaller. For example, the width w of the lower sidewall 212 of the frame 204 can be approximately 5 mm. Figure 2 In the example, compared to Figure 1 The COG bonding of the bezel 104 (one or more) of TED ICs 214 to the display glass substrate 215 in the known display device 100 reduces the number of PCB components, thereby helping to reduce the width of the lower sidewall 212 of the bezel 204. Therefore, the display 202 relative to... Figure 2 The increase in the border size by 204 is visible to the user. Figure 2 The reduction in the width of the lower sidewall 212 of the bezel 204 increases the screen-to-body ratio of the PC device 200 and improves the appearance of the edge-to-edge display.

[0035] Figure 3 yes Figure 2 Example display device 201 along Figure 2 A side view with 3-3 lines. For illustrative purposes. Figure 3 Border 204 is not shown. Figure 3 As shown, the example display device 201 includes a backlight 302 arranged adjacent to the rear surface 304 of the display screen 202 or on a side not visible to the user. Additionally, as... Figure 3 As shown, Figure 2 One of the TED IC 214 is coupled to the display 202 via COG bonding technology.

[0036] As discussed above, in Figure 2 In the example, one or more FPCs 218 include passive components such as resistors and capacitors, but do not include a TCON chip (which is instead included in one or more TED ICs 214). The thickness of the side profile of the display device 201 may be affected by the location and / or size of one or more PCBs, one or more FPCs, etc. Figure 2 and Figure 3 In some examples, one or more FPC 118s are placed adjacent to the light guide frame of the backlight 302 to reduce the thickness of the side profile of the display device. In some examples, a portion of the bezel 204 extends along the side of the display device 201. Therefore, reducing the thickness of the side profile of the display device can reduce the thickness of one or more side portions 209 of the bezel 204.

[0037] Figure 4 It is along Figure 2 4-4 lines and include Figure 3 Part of the backlight 302 Figure 2 and Figure 3 A partial cross-sectional view of an example display device 201. An example backlight 302 includes a light guide frame 400 that houses a light source 402 (e.g., an LED). The backlight 302 includes a light guide tube 404 and a plurality of optical films 406 to distribute the light emitted by the light source 402 to illuminate the display screen 202.

[0038] exist Figure 4 In the example, the light guide frame 400 includes a cavity 408 defined within the light guide frame. The cavity 408 may be formed in the light guide frame 400, for example, during the manufacturing process of the light guide frame 400, such as by die casting. Figure 4 As shown, the FPC 218 is arranged relative to the backlight 302 such that one or more PCB components 410 of the FPC 218 (e.g., resistors, capacitors) are at least partially placed in the cavity 408. Therefore, the PCB components 410 of the FPC 218 are essentially stored in the example backlight 302 without occupying other space in the display device 201. Therefore, the thickness t of the side profile of the display device is related to... Figure 1 Compared to the known display device 100, the thickness is reduced. Correspondingly, the thickness required for the side portions 209 of the bezel 204 to cover the components of the display device 201 (such as the FPC 218) is... Figure 1 The bezel 104 of the known display device 100 is reduced compared to that of the existing display device 100. For example, regarding one or more side portions 209 of the bezel 204, the bezel 204 may have a thickness of 2 mm or less. Therefore, Figure 2 The example display device 201 features a reduction in the width of the lower sidewall 212 of the bezel 204 and a reduction in the thickness of one or more side portions 209 of the bezel 204 that at least partially cover the side profile of the display device 201. The reduction in the width of the lower sidewall 212 increases the area of ​​the display screen 202 visible to the user. Furthermore, the reduction in the width of the lower sidewall 212 and the reduction in the thickness of the side portions 209 of the bezel 204 results in a reduction in the physical size of the display device.

[0039] In some examples, the light source 402 is coupled to the FPC 412. For example... Figure 4 As shown, FPC 412 can be a separate FPC, different from FPC 218, which includes passive PCB assembly 410. Figure 4In one example, FPC 412 is positioned relative to backlight 302, with light source 402 positioned adjacent to light guide tube 404 to illuminate display screen 202. In other examples, light source 402 is coupled to FPC 218 in addition to being coupled to passive PCB assembly 410. In these examples, the length of FPC 218 can be relative to... Figure 4 The example shown is extended so that the light source 402 is coupled to the FPC 218 and placed adjacent to the light guide tube 404.

[0040] Figure 5 An example PC device 500, including another example display device 501, is shown in accordance with the teachings of this disclosure. Figure 5 In the example, the PC device can be implemented as a laptop computer. Figure 5 Example display device 501 includes display screen 502 (e.g., LCD panel). Bezel 504 is positioned around display screen 502. Figure 5 The border of 504 can be basically similar to Figure 2 Example border 204. For example. Figure 5 The frame 504 includes a first sidewall 506 (i.e., in Figure 5 In the indicated orientation, the right side wall (relative to the user viewing the display screen 502), the second or left side wall 508, the third or upper side wall 510, and the fourth or lower side wall 512. For example... Figure 5 As shown, sidewalls 506, 508, 510, and 512 form a frame around the display screen 502.

[0041] exist Figure 5 In the example, bezel 504 (e.g., via mechanical fasteners) is coupled to a cover or cover 511 of the PC device 500 that houses the display device 501 and serves as a protective cover for the display device 501 (e.g., when the laptop is folded). Cover 511 includes a hinged housing area 513. Figure 5 In this configuration, display device 501 is coupled to base 514 of PC device (e.g., the motherboard portion of PC device) via hinge 515. At least a portion of hinge 515 is received in hinge receiving area 513 of cover 511 to couple display device 501 to base 514.

[0042] exist Figure 5 In the example, one or more integrated circuits (ICs) 515 are mounted on the FPC 516 of the display device 501. Figure 5 In the example, IC 515 is a TCON embedded driver that includes a TCON driver and a source driver. Figure 5In the example, flexible die-on-flight (COF) bonding technology is used to mount one or more TED ICs 515 onto an FPC 516. For example, COF bonding technology may include die-attachment processing to attach the TED ICs 515 to the flexible substrate of the FPC 516 and wire bonding processing to provide electrical connections between one or more TED ICs 514 and the FPC 516.

[0043] like Figure 5 As shown, the FPC 516 is placed adjacent to the lower sidewall 512 of the frame 504. Figure 5 In the example, at least a portion of the FPC 216 is placed in a cavity 518 that forms the hinge housing region 513 of the display device cover 511. A cable 520 extends from the cavity 518 of the hinge housing region 513 of the cover 511 to communicatively couple the FPC 516 to the motherboard of the PC device 500 located on the base 514 of the PC device 500.

[0044] Because a portion of the FPC 216 is placed within the hinge reception area 513 of the cover 511, the amount of FPC 216 covered by the lower sidewall 512 of the frame 504 is reduced compared to the case where the entire or substantially all area of ​​the FPC 216 is covered by the lower sidewall 512 of the frame 504. For example, the lower sidewall 512 covers the portion of the FPC 216 that is outside the cavity 518 of the hinge reception portion 513 or not placed within the cavity 518 of the hinge reception portion 513. Therefore, Figure 5 The width w of the lower sidewall 512 and Figure 1 The width of the lower sidewall 112 of the bezel 104 of a known display device 100 is reduced compared to that of the previous device. In some examples, Figure 5 The width w of the lower sidewall 512 is approximately 3 mm. Therefore, Figure 5 The example display device 501 provides an increased screen-to-body ratio for the PC device 500.

[0045] therefore, Figures 2 to 5 Example display devices 201, 501 include bezels with substantially reduced lower sidewalls compared to known bezels. Due to the use of one or more TED ICs 214, 514 and combined processing such as COG and COF, the number of PCB components in display devices 201, 501 is reduced, which increases the flexibility of adjusting the FPC position and correspondingly reduces the width of the lower sidewalls 212, 512 of the bezels 204, 504. In some examples, such as in... Figure 5 In example display device 501, components of a PC device, such as a laptop computer cover 515, are used to help reduce the width of the lower sidewall 512 of the bezel 504 by storing a portion of the FPC 516. In other examples, such as in Figures 2 to 4In display device 201, components of the display device itself (e.g., light guide frame 400) are used to position the FPC components and reduce the thickness of the display outline. Example display devices 201 and 501 facilitate edge-to-edge display design.

[0046] In some examples, besides combining Figures 2 to 5 In addition to PCB assembly adjustments that reduce the width of the lower sidewall of the bezel (e.g., using a TED IC, positioning an FPC) discussed above, or as an alternative to the aforementioned PCB assembly adjustments, the backlight source can be modified to further reduce the bezel size (e.g., the thickness of the bezel at least partially covers the side portion of the side profile of the display device). Figure 6 As shown, the backlight 600 includes a gap 602 disposed between a light guiding panel 603 (including an LED light source 604) and a display screen 606. The gap 602 provides an area on the gap 602 where the light from the LED light source 604 merges together and becomes uniform before illuminating an effective area 608 of the display screen 606 (e.g., to reduce irregularities or hot spots in the light distribution). In the example disclosed herein, compared to Figure 6 Given the known width w of the backlight gap 602, the gap width can be reduced. As discussed herein, reducing the gap size helps to reduce the bezel size by reducing the thickness of the display contour. Furthermore, in the examples disclosed herein, the reduced gap size and LED light source increase the effective area of ​​the LCD display.

[0047] Figure 7 This is an example backlight 700 that includes a light guiding panel 704 and multiple LED light sources 702. The example backlight 700 may include... Figure 7 The diagram shows more or fewer LED light sources 702. The backlight 700 includes a gap 706 disposed between the light guiding panel 704 and the display screen 708 (e.g., an LCD panel). Figure 7 In the example, spacers 710 are placed between LED light sources 702. Example spacers 710 include a reflective coating (e.g., white paint) to help diffuse light, thereby improving the uniformity of light emitted by the LED light sources 708. Therefore, compared to backlights that do not include spacers 710 to help distribute light (such as...),... Figure 6 As shown in the example), the width w of the gap 706 is reduced. Furthermore, because the size of the gap 708 is reduced, the effective area 712 of the display screen 708 is increased. Specifically, compared to placing the light source at a position farther from the display screen (e.g., ... Figure 6 (In the known backlight), the distribution of light at the edge 714 of the display screen 708 is improved. Figure 7The example LED light source 702 increases the light density at the edge 714. In examples of PC devices with narrow bezels (e.g., in edge-to-edge screens), the increased effective area of ​​the display 708 improves the viewing experience.

[0048] Figure 8 This is an example backlight 800 that includes a light guiding panel 804 and multiple 2-chip (or n-chip) LED light sources 802. The example backlight 800 may include... Figure 8 The number of LED light sources 802 may be more or less. Figure 8 The backlight 800 includes a gap 806 disposed between the light guiding panel 804 and the display (e.g., LCD panel) 808. Figure 8 In the example, spacers 810, including a reflective material (e.g., white paint), are placed between the LED light sources 802. (As described above...) Figure 7 As discussed, the spacer 810 helps to diffuse light and improve the uniformity of light emitted by the LED light source 802. As a result, the width w of the gap 806 is reduced compared to a backlight without the spacer 810. In addition, since the use of a 2-chip LED light source increases the light density at the edge 814, the effective area 812 of the display screen 808 is increased to the vicinity of the edge 814 of the display screen 808.

[0049] Figure 8 and / or Figure 9 Example backlighting is not limited to Figure 8 and Figure 9 The light sources 702, 802 and / or spacers 710, 810. Other light sources, such as custom-made small LED light strings, can be used to improve light distribution, reduce gap width, and thus reduce the outline of the display device.

[0050] Figure 9 It is used to manufacture such as Figures 2 to 4 The flowchart illustrates an example method 900 for the display device 201. In block 902, one or more ICs 214 (e.g., one or more TCON embedded (TED) ICs) are incorporated into the glass substrate 215 of the display screen 202 of the example display device 201. Figure 9 In Example Method 900, one or more TED ICs 214 are bonded to a glass substrate 215 using a glass wafer bonding technique.

[0051] At block 904, a passive PCB assembly 410, such as resistors and capacitors, is coupled to a flexible printed circuit (FPC) 218. The FPC 218 and the passive PCB assembly 410 facilitate communication between one or more TED ICs 214 and the motherboard of a PC device including the example display device 201.

[0052] In block 906, Figures 2 to 4 In the example display device 201, holes 408 are formed in the light guide frame 400 of the backlight 302. In some examples, the holes 408 of the light guide frame 400 are formed before, for example, a light source 402 is coupled to the light guide frame 400. The holes 408 can be formed in the light guide frame 400 during the manufacture of the light guide frame by, for example, a die-casting process.

[0053] In block 908, the passive component 410 of FPC 218 is placed in cavity 408, thereby reducing the outline (e.g., side outline) and / or physical size of example display device 201.

[0054] In block 910, a bezel 204 is placed around the display screen 202 to frame the display screen 202 (e.g., by coupling the bezel to a cover or housing of the PC device 200). As discussed above, the lower sidewall 212 of the bezel 204 is reduced compared to the bezels of known display devices, thereby increasing the viewable area of ​​the display screen 202 and the screen-to-body ratio of the PC device including the display device 201.

[0055] Figure 10 It is used to manufacture such as Figure 5 The flowchart illustrates an example method 1000 for a display device, specifically example display device 501. In block 1002, one or more ICs 515 (e.g., one or more TCON embedded (TED) ICs) are incorporated into the flexible printed circuit (FPC) 516 of example display device 501. Figure 10 In Example Method 1000, flexible wafer bonding technology is used to bond (one or more) TED IC 515 to FPC 516.

[0056] In block 1004, at least a portion of the FPC 216 is placed in a cavity 520 in the hinge housing region 513 of the cover 511 of the PC device 500. In block 1006, a cable 522 is routed through the hinge housing region 513 for communicatively coupling the FPC 216 to the motherboard of the PC device 500.

[0057] At block 1008, a bezel 504 may be placed around the display 502 to frame the display 502 (e.g., by coupling the bezel 504 to the cover 511 of the PC device 500). As discussed above, the lower sidewall 512 of the bezel 504 is reduced compared to the bezels of known display devices, thereby increasing the viewable area of ​​the display 502.

[0058] Although reference Figure 9 and Figure 10 The flowcharts shown illustrate example methods 900 and 1000, but manufacturing can be used alternatively. Figures 2 to 4Example display device 201 and / or Figure 5 The example demonstrates many other methods of device 501. For example, the execution order of these blocks can be changed, and / or some of the described blocks can be changed, removed, or combined. Similarly, in Figure 9 and / or Figure 10 Additional operations may be included in the manufacturing process before, between, or after the blocks shown.

[0059] As will become clear from the foregoing, this document discloses example apparatuses, articles of manufacture, and methods for reducing the width of the bezel or frame around the display screen of a PC device, thereby increasing the screen-to-body ratio of the PC device. In the examples disclosed herein, bonding techniques such as COG and COF bonding are used to mount one or more TED ICs on a substrate such as a glass substrate of a flexible printed circuit or display screen (e.g., an LCD panel). The examples disclosed herein reduce the number of PCB components in the display device and reduce the impact of the PCB components on the width of the bezel boundaries covering the display screen (e.g., the lower boundary of the bezel). Because the bezel sizes usable by the example display devices disclosed herein are reduced, an edge-to-edge display is essentially achieved relative to each bezel boundary.

[0060] The following paragraphs provide various examples disclosed in this article.

[0061] Example 1 includes a display device comprising a display screen and a backlight, the backlight including a light guide frame defining holes therein. The example display device includes an integrated circuit mounted to the display screen. The example display device includes a flexible printed circuit in communication with the integrated circuit. At least a portion of the flexible printed circuit is disposed within a hole in the light guide frame.

[0062] Example 2 includes the display device described in Example 1, and also includes a bezel placed around the display screen.

[0063] Example 3 includes a display device comprising a display screen and a cover. The display screen is coupled to the cover. The cover includes cavities. The display device includes a flexible printed circuit. The display device includes an integrated circuit mounted to the flexible printed circuit. At least a portion of the flexible printed circuit is disposed within the cavities.

[0064] Example 4 includes the display device of claim 3, and further includes a bezel that covers the remaining portion outside the cavity of the flexible printed circuit board.

[0065] Although certain example methods, apparatuses, and articles of manufacture are disclosed herein, the scope of this patent is not limited thereto. Rather, this patent covers all methods, apparatuses, and articles of manufacture that fall entirely within the scope of the claims of this patent.

Claims

1. A display device, comprising: Display screen; A backlight includes a frame, a light guide plate arranged in the frame, and a plurality of light sources coupled to the light guide plate, wherein the frame further includes holes, and wherein gaps are arranged between the light guide plate and the display screen. The timing controller embedded driver TED integrated circuit is coupled to the glass substrate of the display using glass wafer COG bonding technology; A flexible printed circuit communicating with the TED integrated circuit and including electronic components disposed on the flexible printed circuit, the electronic components being at least partially disposed in the holes of the frame; and A bezel, which is placed around the display screen. The backlight further includes spacers disposed between adjacent light sources of the plurality of light sources, and the spacers include a reflective coating to promote the distribution of light emitted by the plurality of light sources. By coupling the TED integrated circuit to the glass substrate of the display screen using COG bonding technology, the number of PCB components is reduced, thereby reducing the width of the lower sidewall of the bezel of the display device. In this method, by placing the electronic components of the flexible printed circuit within the cavities of the frame, the side profile thickness of the display device is reduced, and The spacer includes a reflective coating, which allows the width of the gap to be reduced, thereby further reducing the side profile thickness of the display device.

2. The display device of claim 1, wherein, The frame includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall, each of which has the same width.

3. The display device as claimed in claim 2, wherein, The display device is coupled to the base of the user device via one or more hinges.

4. The display device as claimed in claim 1, wherein, The flexible printed circuit is a first flexible printed circuit, and the backlight includes a second flexible printed circuit placed near the first flexible printed circuit and the frame.

5. The display device as claimed in claim 1, wherein, A portion of the flexible printed circuit is located outside the cavity.

6. The display device as claimed in claim 1, wherein, The electronic components include one or more resistors or capacitors.

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