Pressure output control method of chip mounter and chip mounter
By obtaining and comparing the pressure data output from the patch machine in real time, the problem of inconsistent pressure of the suction nozzle output is solved, and an accurate and efficient pressure output control method is provided, ensuring the precise pick-up and positioning of the wafer and the use of the equipment. Convenience.
Patent Information
- Application Number
- CN201910953486.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-10-09
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2039-10-09
AI Technical Summary
The nozzle output pressure of existing patch machines is fixed, resulting in damage to the wafer or unable to pick up position if the actual moving distance is inconsistent with the expected one.
By obtaining the pressure data information output by the patch machine in real time and comparing it with the preset pressure threshold, the driver outputs a control signal based on the result to adjust the output pressure.
Accurate and efficient pressure output control is achieved, ensuring accurate pick-and-position of the nozzle under different wafer and ambient conditions, avoiding chip damage and pick-up failure.
Smart Images

Figure CN110707025B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip mounters, and in particular to a pressure output control method of a chip mounter and a chip mounter. Background Art
[0002] With the continuous development of science and technology, industrial automation technology has been more and more widely used. Among them, in the production and manufacturing of integrated circuits, the placement machine is used to realize the pick-up and positioning of the wafer, which improves the efficiency of integrated circuit production and manufacturing and reduces labor costs.
[0003] However, since the working mode of the SMT machine in the prior art is: setting the moving distance of the SMT nozzle and setting a fixed output power of the motor according to the moving distance, and the pressure output by the SMT nozzle is controlled by the motor, the pressure output by the SMT nozzle is fixed corresponding to the moving distance of the SMT nozzle, that is, the actual moving distance of the SMT nozzle determines its output of a fixed pressure. As a result, when picking up and positioning different chips or the actual moving distance of the SMT nozzle is inconsistent with the expected moving distance of the SMT nozzle due to changes in the external environment, the chip may be damaged or the chip cannot be picked up and positioned. Summary of the invention
[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, one object of the present invention is to provide an accurate and efficient pressure output control method for a chip mounter.
[0005] To this end, the second object of the present invention is to provide a placement machine with high precision and easy use.
[0006] The technical solution adopted by the present invention is:
[0007] In a first aspect, the present invention provides a pressure output control method for a chip mounter, comprising:
[0008] Acquire the pressure data information output by the placement machine in real time;
[0009] Comparing the pressure data information with a preset pressure threshold;
[0010] The output pressure of the placement machine is controlled according to the comparison result.
[0011] Furthermore, the pressure data information output by the placement machine is obtained as follows:
[0012] The pressure data information is obtained through a pressure sensor.
[0013] Further, controlling the output pressure of the placement machine according to the comparison result specifically includes:
[0014] Transmitting the pressure data information to a driver of the placement machine;
[0015] The preset pressure threshold is stored in the driver;
[0016] The driver compares the pressure data information with the preset pressure threshold and then outputs a control signal to the driving device of the placement machine;
[0017] The driving device controls the output pressure of the placement machine according to the control signal.
[0018] In a second aspect, the present invention provides a chip mounter, comprising:
[0019] A pressure data information acquisition module, used for acquiring the output pressure data information of the placement machine in real time;
[0020] A driver connected to the output end of the pressure sensor, configured to receive the pressure data information, compare the pressure data information with a preset pressure threshold, and output a control signal according to the comparison result;
[0021] A driving device, connected to the output end of the driver, for receiving the control signal and outputting pressure control information according to the control signal;
[0022] The pressure output module is connected to the input end of the pressure data information acquisition module and the output end of the driving device respectively, and is used to transmit the output pressure data information of the placement machine to the pressure data information acquisition module, and output the corresponding pressure according to the pressure control information.
[0023] Furthermore, the pressure data information acquisition module is a pressure sensor, the input end of the pressure sensor is connected to the pressure output module, and the output end of the pressure sensor is connected to the input end of the driver.
[0024] Furthermore, the driving device includes a voice coil motor, the output end of the driver is connected to the input end of the voice coil motor, and the output end of the voice coil motor is connected to the input end of the pressure output module.
[0025] Furthermore, the pressure output module includes a wafer suction nozzle, and the output end of the voice coil motor is connected to the input end of the wafer suction nozzle.
[0026] Furthermore, the patch machine also includes a motion patch control module; the motion patch control module includes: a bracket, a first fixed structure, a second fixed structure and a third fixed structure; the first fixed structure is used to fix the pressure output module on the bracket, the second fixed structure is used to fix the pressure data information acquisition module on the bracket, and the third fixed structure is used to fix the drive device on the bracket.
[0027] The beneficial effects of the present invention are:
[0028] The present invention provides a pressure output control method for a chip mounter, which obtains pressure data information output by the chip mounter in real time, compares the obtained pressure data information with a preset pressure threshold, and finally controls the output pressure of the chip mounter according to the comparison result; it solves the technical problem in the prior art that the output pressure of a nozzle of the chip mounter is fixedly corresponding to the moving distance of the nozzle of the chip mounter, and when the actual moving distance of the nozzle of the chip mounter is inconsistent with the expected moving distance, the pressure output by the nozzle of the chip mounter is inconsistent with the expected pressure, which may cause damage to the chip or make it impossible to pick up and position the chip, and provides an accurate and efficient pressure output control method for a chip mounter.
[0029] The second beneficial effect of the present invention is:
[0030] The present invention discloses a chip mounter, which acquires pressure data information in real time by being provided with a pressure data information acquisition module, and transmits the pressure data information to a driver, which outputs control information to a driving device after comparing the received pressure data information with a set pressure threshold, and the driving device controls the pressure output module to output a corresponding pressure. The present invention solves the problem that the output pressure of a chip mounter nozzle is fixedly corresponding to the moving distance of the chip mounter nozzle in the prior art, and when the actual moving distance of the chip mounter nozzle is inconsistent with the expected moving distance, the pressure output by the chip mounter nozzle is inconsistent with the expected pressure, which may cause damage to the chip or make it impossible to pick up and position the chip, and provides a high-precision and easy-to-use chip mounter. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Figure 1 It is a flow chart of a specific embodiment of a pressure output control method of a chip mounter in the present invention;
[0032] Figure 2 It is a module block diagram of a specific embodiment of a chip mounter in the present invention;
[0033] Figure 3 It is a structural schematic diagram of a specific embodiment of a motion patch control module in a patch machine in the present invention. DETAILED DESCRIPTION
[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.
[0035] Embodiment 1:
[0036] Reference Figure 2 The embodiment of the present invention provides a chip placement machine, which specifically includes: a pressure data information acquisition module, a driver, a driving device and a pressure output module; wherein the output end of the pressure output module is connected to the input end of the pressure data information acquisition module, and is used to transmit the real-time pressure data information output by the chip placement machine to the pressure data information acquisition module, and the output end of the pressure data information acquisition module is connected to the input end of the driver to transmit the real-time acquired pressure data information to the driver, and the driver compares the received pressure data information with a preset pressure threshold, and sends a control signal to the driving device connected thereto, and the driving device is connected to the pressure output module, and outputs pressure control information according to the received control signal to control the pressure output module to output the corresponding pressure, thereby providing a chip placement machine with high precision and convenient use.
[0037] In the embodiment of the present invention, the pressure data information acquisition module includes a pressure sensor, the driving device includes a voice coil motor, the pressure output module includes a wafer nozzle, and the chip mounter also includes a motion chip control module. Figure 3The motion patch control module includes a bracket 100, a first fixed structure 110, a second fixed structure 120 and a third fixed structure 130. The bracket 100 is in a "Z" shape as a whole, and the first fixed structure 110 fixes the chip suction nozzle 200 at the end position of the bottom of the bracket 100 (the very end of the "Z" shape structure), so that when the motion patch control module is working, the chip suction nozzle 200 is in the lowest horizontal position, which is beneficial to the operation of the placement machine and convenient for the user to observe the placement machine when it is working. The first fixed structure 110 can be realized by a combination of snap-on structures and screws. The second fixed structure 120 fixes the pressure sensor 300 on the horizontal support at the bottom of the bracket 100 (the bottom horizontal part of the "Z"-shaped structure). Placing the pressure sensor 300 at this part is beneficial to the fact that the pressure sensor 300 will not fall off easily due to the shaking of the bracket 100 when the patch machine is working. The second fixed structure 120 is also composed of a snap-fit structure and a screw, and the snap-fit structure surrounds the pressure sensor 300 in the internal space formed by it, so that the pressure sensor 300 will not be easily damaged when it is hit. The third fixed structure 130 fixes the voice coil motor 400 on the support rod of the bracket 100 in the vertical direction. Placing the voice coil motor 400 on the support rod of the bracket 100 in the vertical direction is beneficial to the overall balance of the entire motion patch control module, and allows each functional device (including the voice coil motor 400, the pressure sensor 300 and the wafer suction nozzle 200) to be independently arranged, which saves time and is convenient when troubleshooting and repairing.
[0038] The actual working process of the chip mounter provided by the embodiment of the present invention is as follows: the chip suction nozzle 200 outputs pressure to pick up and position the chip, and the pressure data information output by the chip suction nozzle 200 is obtained in real time through the pressure sensor 300. The pressure sensor 300 transmits the real-time obtained pressure data information to the driver of the chip mounter. The driver compares the received pressure data information with the preset pressure threshold and then outputs a control signal to the voice coil motor 400. The voice coil motor 400 outputs the corresponding power (i.e., pressure control information) according to the received control signal so that the chip suction nozzle outputs the corresponding pressure, thereby outputting precise pressure to the chip to pick up and position it. Moreover, in the chip mounter provided by the embodiment of the present invention, since there is inconsistency in the pressure to be output for picking up and positioning different chips, it is only necessary to change the specific value of the preset pressure threshold in the driver to enable the chip mounter to pick up and position different chips. To summarize, the present invention solves the technical problem that the output pressure of the nozzle of the placement machine is fixedly corresponding to the moving distance of the nozzle of the placement machine in the prior art, and when the actual moving distance of the nozzle of the placement machine is inconsistent with the expected moving distance, the pressure output by the nozzle of the placement machine is inconsistent with the expected pressure, which may cause damage to the chip or make it impossible to pick up and position the chip, thereby providing a high-precision and easy-to-use placement machine.
[0039] Embodiment 2:
[0040] Reference Figure 2 The present invention provides a pressure output control method for a chip mounter, which comprises the steps of:
[0041] S01, real-time acquisition of pressure data information output by the placement machine;
[0042] S02, comparing the pressure data information with a preset pressure threshold;
[0043] S03. Control the output pressure of the placement machine according to the comparison result.
[0044] Specific:
[0045] The specific information of the pressure data output by the placement machine is as follows:
[0046] Obtain pressure data information through the pressure sensor.
[0047] Controlling the output pressure of the placement machine according to the comparison results specifically includes:
[0048] Transmit pressure data information to the driver of the placement machine;
[0049] A preset pressure threshold is stored in the driver;
[0050] The driver compares the pressure data information with the preset pressure threshold and then outputs a control signal to the driving device of the placement machine;
[0051] The driving device controls the output pressure of the placement machine according to the control signal.
[0052] The pressure output control method of the placement machine in the embodiment of the present invention corresponds to the control process and implementation principle of the output pressure of the placement machine in the above-mentioned embodiment 1, and will not be described in detail here.
[0053] A pressure output control method for a chip mounter in an embodiment of the present invention obtains pressure data information output by the chip mounter in real time, compares the obtained pressure data information with a preset pressure threshold, and finally controls the output pressure of the chip mounter according to the comparison result; the problem that the output pressure of the chip mounter nozzle is fixedly corresponding to the moving distance of the chip mounter nozzle in the prior art, when the actual moving distance of the chip mounter nozzle is inconsistent with the expected moving distance, the pressure output by the chip mounter nozzle is inconsistent with the expected pressure, which may cause damage to the chip or make it impossible to pick up and position the chip is solved, and an accurate and efficient pressure output control method for a chip mounter is provided.
[0054] The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.
Claims
1. A chip mounter, characterized in that: include: A pressure data information acquisition module, used for acquiring the output pressure data information of the placement machine in real time; wherein the pressure data information acquisition module includes a pressure sensor; A driver connected to the output end of the pressure sensor, configured to receive the pressure data information, compare the pressure data information with a preset pressure threshold, and output a control signal according to the comparison result; A driving device, connected to the output end of the driver, for receiving the control signal and outputting pressure control information according to the control signal; A pressure output module, connected to the input end of the pressure data information acquisition module and the output end of the driving device, respectively, for transmitting the output pressure data information of the placement machine to the pressure data information acquisition module, and outputting the corresponding pressure according to the pressure control information; Motion patch control module, including: A bracket, used to support each module of the placement machine; wherein the bracket is in a "Z" shape as a whole; A first fixing structure, composed of a snap-fit structure and screws, for fixing the pressure output module at an end position of the bottom of the bracket; A second fixing structure, composed of a buckle structure and screws, is used to fix the pressure data information acquisition module on the horizontal bracket at the bottom of the bracket, and the buckle structure surrounds the pressure data information acquisition module in the internal space formed by it; The third fixing structure is used to fix the driving device on the support rod in the vertical direction of the bracket.
2. The chip mounter according to claim 1, characterized in that: The pressure data information acquisition module is a pressure sensor, the input end of the pressure sensor is connected to the pressure output module, and the output end of the pressure sensor is connected to the input end of the driver.
3. The chip mounter according to claim 1 or 2, characterized in that: The driving device comprises a voice coil motor, the output end of the driver is connected to the input end of the voice coil motor, and the output end of the voice coil motor is connected to the input end of the pressure output module.
4. The chip mounter according to claim 3, characterized in that: The pressure output module comprises a wafer suction nozzle, and the output end of the voice coil motor is connected to the input end of the wafer suction nozzle.
5. A pressure output control method for a chip mounter, characterized in that: Applicable to the placement machine described in any one of claims 1 to 4, comprising: Acquire the pressure data information output by the placement machine in real time; Comparing the pressure data information with a preset pressure threshold; The output pressure of the placement machine is controlled according to the comparison result.
6. The pressure output control method of the chip mounter according to claim 5, characterized in that: The pressure data information output by the placement machine is obtained as follows: The pressure data information is obtained through a pressure sensor.
7. The pressure output control method of the chip mounter according to claim 6, characterized in that: Controlling the output pressure of the placement machine according to the comparison result specifically includes: Transmitting the pressure data information to a driver of the placement machine; The preset pressure threshold is stored in the driver; The driver compares the pressure data with the preset pressure threshold and then outputs a control signal to the driving device of the placement machine; The driving device controls the output pressure of the placement machine according to the control signal.
