Heat dissipation component combination structure

Abstract

The present invention provides a heat dissipation element combination structure, comprising: a temperature averaging plate and at least one heat pipe; the temperature averaging plate has a first plate body and a second plate body, the first and second plate bodies correspond to each other and cover and jointly define a chamber, the first plate body has at least one through hole connected to the chamber, and the inner side of the through hole has a groove portion, and a first capillary structure is arranged on a side of the first and second plate bodies opposite to the chamber; the heat pipe has a closed end and an open end, a convex portion extends from the open end, the heat pipe is passed through the through hole, and is combined with the groove portion through the convex portion, and the inner wall of the heat pipe has a second capillary structure. The present invention can improve the two-phase flow circulation efficiency between the heat pipe and the temperature averaging plate.

Description

Technical Field

[0001] The invention relates to a heat dissipation element combination structure, in particular to a heat dissipation element combination structure which improves the two-phase flow circulation between a heat pipe and a temperature equalizing plate by combination. Background Art

[0002] Heat pipes and vapor chambers are the most commonly used heat conduction elements in the field of heat dissipation. Although heat pipes and vapor chambers use the same technical principles, their heat conduction characteristics are different. Heat pipes are far-end axial heat conduction, while vapor chambers are large-area surface-to-surface heat conduction. Therefore, if only heat pipes or vapor chambers are used, both far-end axial heat conduction and large-area surface-to-surface heat conduction cannot be achieved simultaneously.

[0003] Currently, some manufacturers combine heat pipes with temperature-averaging plates to connect the airtight chambers of the two. Figure 1 As shown in the figure, the temperature equalizing plate 4 is provided with a hole 42 on the upper plate body 41 for the heat pipe 5 to be plugged in, and the open end of the heat pipe 5 is abutted against the lower plate body 43 of the temperature equalizing plate 4, and the heat pipe 5 is accommodated in the portion of the chamber 44 of the temperature equalizing plate 4. In order to make the chamber 51 of the heat pipe 5 and the chamber 44 of the temperature equalizing plate 4 communicate with each other for vapor-liquid circulation, a slot 52 is radially opened in the portion, so that the heat pipe 5 and the capillary structures 53, 45 in the chamber 44 of the temperature equalizing plate 4 and the chamber 44 can be communicated with each other for vapor-liquid circulation.

[0004] Although the above-mentioned prior art has the heat conduction characteristics of both the temperature equalizing plate 4 and the heat pipe 5, it is not without disadvantages. When the open end of the heat pipe 5 extends to the lower plate 43 of the temperature equalizing plate 4, it will occupy the space of the chamber 44 of the temperature equalizing plate 4, increasing the resistance to the flow of steam. Moreover, if the heat pipe 5 is not extended to abut the lower plate 43 of the temperature equalizing plate 4, in addition to making it impossible for the capillary structures 53 and 45 inside the heat pipe 5 and the temperature equalizing plate 4 to be connected, thereby making it impossible for the condensed working liquid to flow back, the heat pipe 5 has no support and is prone to deflection and detachment. Therefore, how to improve the existing deficiencies has become the primary goal of people in this field. Summary of the invention

[0005] Thus, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a heat dissipation element combination structure that improves the combination of the heat pipe and the temperature homogenizing plate and the two-phase flow circulation efficiency.

[0006] To achieve the above-mentioned purpose, the present invention provides a heat dissipation element combination structure, characterized in that it comprises:

[0007] A temperature equalizing plate, comprising a first plate body and a second plate body, wherein the first plate body and the second plate body correspond to each other and define a chamber together, wherein the first plate body has at least one through hole connected to the chamber, and the through hole has a groove inside, and a first capillary structure is arranged on a side of the first plate body and the second plate body opposite to the chamber;

[0008] At least one heat pipe has a closed end and an open end, a convex portion extends from the open end, the heat pipe is passed through the through hole and combined with the groove portion through the convex portion, and the inner wall of the heat pipe has a second capillary structure.

[0009] The heat dissipation element combination structure, wherein: the first plate body and the second plate body are made of metal or non-metal material, the metal material is any one of gold, silver, copper, aluminum, stainless steel, copper alloy, aluminum alloy, titanium, titanium alloy or a combination thereof, the non-metal material is any one of graphite and ceramic, and the first plate body and the second plate body are made of the same or different materials.

[0010] The heat dissipation element combining structure, wherein: the protruding portion is a flange.

[0011] The heat dissipation element combining structure, wherein: the protruding portion is radial.

[0012] The heat dissipation element combining structure, wherein: the first capillary structure and the second capillary structure are connected to each other.

[0013] The heat dissipation element combination structure, wherein: the first capillary structure and the second capillary structure are any one of a grid body, a sintered powder, a fiber body, and a corrugated plate.

[0014] The heat dissipation element combination structure, wherein: the inner wall of the heat pipe is aligned with or connected to the first side of the first plate body relative to the chamber.

[0015] The heat dissipation element combination structure, wherein: the chamber has a plurality of support columns, and the two ends of the plurality of support columns respectively abut against the first plate body and the second plate body.

[0016] The heat dissipation element combination structure, wherein: the outer side of the through hole has a first flange, and the first flange is in contact with the outer wall of the heat pipe.

[0017] The present invention can improve the two-phase flow circulation efficiency between the heat pipe and the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cross-sectional composite diagram of the existing structure;

[0019] Figure 2 is a perspective exploded view of a first embodiment of the heat dissipation element combination structure of the present invention;

[0020] Figure 3a is a combined cross-sectional view of a first embodiment of the heat dissipation element combination structure of the present invention;

[0021] Figure 3b is a combined cross-sectional view of a first embodiment of the heat dissipation element combination structure of the present invention;

[0022] Figure 4 is a perspective exploded view of a second embodiment of the heat dissipation element combination structure of the present invention;

[0023] Figure 5 It is a combined cross-sectional view of a third embodiment of the heat dissipation element combining structure of the present invention.

[0024] Explanation of the accompanying drawings: temperature equalizing plate 1; first plate body 11; first side 111; second side 112; through hole 113; groove 1131; first flange 1132; second plate body 12; third side 121; fourth side 122; chamber 13; first capillary structure 14; heat pipe 2; inner wall 21; outer wall 22; closed end 23; open end 24; protrusion 25; second capillary structure 26; support column 3; temperature equalizing plate 4; upper plate body 41; hole 42; lower plate body 43; chamber 44; capillary structure 45; heat pipe 5; chamber 51; groove 52; capillary structure 53. DETAILED DESCRIPTION

[0025] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0026] See also Figure 2 , Figure 3a , Figure 3b , is a three-dimensional exploded and combined cross-sectional view of the first embodiment of the heat dissipation element combination structure of the present invention. As shown in the figure, the heat dissipation element combination structure of the present invention comprises: a temperature homogenizing plate 1, at least one heat pipe 2;

[0027] The temperature plate 1 has a first plate body 11 and a second plate body 12, and the first and second plate bodies 11 and 12 correspond to cover and jointly define a chamber 13. The first plate body 11 has a first side 111 and a second side 112, and the second plate body 12 has a third side 121 and a fourth side 122. The first side 111 and the third side 121 are opposite to the chamber 13. The first plate body 11 has at least one through hole 113 connected to the chamber 13, and the inner side of the through hole 113 has a groove 1131. A first capillary structure 14 is provided on one side of the first and second plate bodies 11 and 12 relative to the chamber 13, that is, the surface of the first and third sides 111 and 121. The inner wall 21 of the heat pipe 2 is cut flush (such as Figure 3a ) or link (such as Figure 3b) The first side 111 of the first plate 11 relative to the chamber 13, that is, the surface of the first side 111, the outer side of the through hole 113 has a first flange 1132, and the first flange 1132 is in contact with the outer wall 22 of the aforementioned heat pipe 2.

[0028] The first and second plates 11 and 12 are made of metal or non-metal. The metal material is any one of gold, silver, copper, aluminum, stainless steel, copper alloy, aluminum alloy, titanium, titanium alloy or a combination thereof. The non-metal material is any one of graphite and ceramic. The first and second plates 11 and 12 are made of the same or different materials.

[0029] The heat pipe 2 has a closed end 23 and an open end 24, and a protrusion 25 extends from the open end 24. The heat pipe 2 is inserted into the through hole 113 and combined with the groove 1131 through the protrusion 25. The inner wall 21 of the heat pipe 2 has a second capillary structure 26, and the protrusion 25 is a flange formed by the open end 24 of the heat pipe 2 extending outward. The first and second capillary structures 14 and 26 are any one of a grid body, a sintered powder, a fiber body, and a corrugated plate. The first and second capillary structures 14 and 26 are connected to each other.

[0030] See also Figure 4 , is a three-dimensional exploded view of the second embodiment of the heat dissipation element combination structure of the present invention. As shown in the figure, this embodiment has some technical features identical to those of the aforementioned first embodiment, so they will not be described in detail here. However, the difference between this embodiment and the aforementioned first embodiment is that the protrusion 25 is radial, and the groove 1131 of the protrusion 25 corresponding to the first side 111 of the first plate body 11 has the same shape for corresponding embedding.

[0031] See also Figure 5 , is a combined cross-sectional view of a third embodiment of the heat dissipation element combination structure of the present invention. As shown in the figure, this embodiment has some technical features identical to those of the aforementioned first embodiment, so they will not be described in detail herein. However, the difference between this embodiment and the aforementioned first embodiment is that a plurality of support columns 3 are provided in the chamber 13, and the two ends of the plurality of support columns 3 respectively abut against the first and third sides 111 and 121 of the first and second plate bodies 11 and 12, and the support columns 3 may be solid copper columns, sintered copper columns, or sintered copper rings.

[0032] The main purpose of the present invention is to improve the combination of the heat pipe and the temperature equalizing plate, so as to avoid the heat pipe occupying the steam channel of the temperature equalizing plate chamber to hinder the diffusion of the vaporized working liquid, and to increase the efficiency of the reflux of the condensed working liquid by connecting the heat pipe and the temperature equalizing plate through the capillary structure.

Claims

1. A heat dissipation element combination structure, characterized in that: Include: A temperature equalizing plate, comprising a first plate body and a second plate body, wherein the first plate body and the second plate body correspond to each other and define a chamber together, wherein the first plate body has at least one through hole connected to the chamber, and the through hole has a groove inside, and a first capillary structure is arranged on a side of the first plate body and the second plate body opposite to the chamber; At least one heat pipe has a closed end and an open end, a convex portion extends from the open end, the convex portion is a flange or is radial, the heat pipe is passed through the through hole and is combined with the groove portion through the convex portion, and the inner wall of the heat pipe has a second capillary structure; The first capillary structure and the second capillary structure are connected to each other, the inner wall of the heat pipe is aligned with or connected to the first side of the first plate relative to the chamber, and the outer side of the through hole has a first flange, which contacts the outer wall of the heat pipe.

2. The heat dissipation element combination structure according to claim 1, characterized in that: The first plate body and the second plate body are made of metal or non-metal material. The metal material is any one of gold, silver, copper, aluminum, stainless steel, copper alloy, aluminum alloy, titanium, titanium alloy or a combination thereof. The non-metal material is any one of graphite and ceramic. In addition, the first plate body and the second plate body are made of the same or different materials.

3. The heat dissipation element combination structure according to claim 1, characterized in that: The first capillary structure and the second capillary structure are any one of a grid body, a sintered powder, a fiber body, and a corrugated plate.

4. The heat dissipation element combination structure according to claim 1, characterized in that: The chamber is provided with a plurality of support columns, and two ends of the plurality of support columns respectively abut against the first plate body and the second plate body.

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