Silicon-based OLED display panel bonding method

Abstract

The present invention discloses a method for bonding a silicon-based OLED display panel, comprising the following steps: S1 coating black glue outside the light-emitting area and PAD area of ​​the silicon base; S2 curing the black glue to form a black glue dam; S3 coating transparent glue on the light-emitting area of ​​the silicon base after the black glue dam is formed; S4 bonding a cover plate to the silicon base coated with the transparent glue; S5 degassing and curing after bonding the cover plate. After bonding the cover plate, a black glue dam is provided on the surface of the cutting area, and during the cutting process, no mirror reflection of the silicon base occurs, and the laser pulse energy concentration effect is good, thereby improving the cutting effect. In addition, black glue is first coated outside the light-emitting area and the PAD area, and then transparent glue is coated on the light-emitting area. The amount of transparent glue used is easy to control, and the risk of glue overflow when bonding the cover plate can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of OLED display manufacturing, and in particular to a method for laminating a silicon-based OLED display panel. Background Art

[0002] The existing silicon-based micro-display products are bonded by directly covering the entire display panel surface with glue, and then bonding the outer protective panel. Since there is no vacuum in the middle, the problem of light refraction can be avoided. This bonding method can also make the screen more realistic with high brightness and high image quality, and even under strong outdoor light, the screen display content can still be clearly seen. However, the traditional mouth-shaped bonding can easily see the overlapping phenomenon like two pieces of glass.

[0003] Specifically, taking 8-inch silicon-based as an example, the existing silicon-based OLED package cover plates mostly adopt the following three methods:

[0004] The glue is dispensed or coated on the 8-inch silicon base, and then the single cover plate is aligned with the corresponding module on the 8-inch silicon base in turn, pressed and leveled, and then cured to complete the bonding product production; this process is for a single cover plate to correspond to the entire silicon base. In this method, each small piece needs to be checked for alignment deviation before bonding, and the overflow of glue will also stick to the bonding machine or bonding fixture from all sides of the cover plate.

[0005] Alternatively, glue is dispensed or coated on the 8-inch silicon base, and then the entire cover plate and the 8-inch silicon base module are aligned and pressed together. After the glue is leveled, it is cured to complete the bonding product production; this process is for the entire cover plate to correspond to the entire silicon base. This method has several light-emitting areas on the 8-inch silicon base, and the silicon base is not flat as a whole. The leveling process of the glue is difficult to control, and local bonding bubbles are prone to occur. It is difficult to remove the bubbles. After the bonding and cutting are completed, the excess glue in the PAD area needs to be removed, which affects the yield.

[0006] Alternatively, the 8-inch silicon substrate and the 8-inch cover plate are cut into small pieces, and then glued and aligned and bonded; this process is a single cover plate corresponding to a single silicon substrate. In this method, each small piece needs to be checked for alignment offset and glue overflow bubbles during the bonding process. In addition, when bonding a single piece, the sharp corners of the cover plate can easily cause damage to the silicon substrate, resulting in low operating efficiency and not suitable for mass production.

[0007] In view of this, it is necessary to provide an improved silicon-based OLED display panel bonding method to solve the above technical problems. Summary of the invention

[0008] An object of the present invention is to provide a method for laminating a silicon-based OLED display panel.

[0009] To achieve the above object, the present invention adopts the following technical solution:

[0010] A method for laminating a silicon-based OLED display panel comprises the following steps:

[0011] S1: Apply black glue outside the light-emitting area and PAD area of ​​the silicon base;

[0012] S2 solidifies the black glue to form a black glue dam;

[0013] After S3 forms the black glue dam, apply transparent glue on the light-emitting area of ​​the silicon base;

[0014] S4 attaches the cover plate to the silicon base coated with transparent adhesive;

[0015] After S5 has attached the cover plate, degassing and curing are performed.

[0016] Furthermore, at least a portion of the black glue is applied to the cutting area of ​​the silicon substrate.

[0017] Furthermore, the black glue is a thermosetting black resin glue, and during the curing process of step S2, the curing temperature is 80°C and the curing process is not less than 80 minutes; or, the black glue is a black UV glue, and during the curing process of step S2, the UV light is ≥60mw / cm 2 .

[0018] Furthermore, the viscosity of the black glue is between 20000cps and 30000cps.

[0019] Furthermore, step S3 further includes forming transparent glue on a portion of the black glue dam close to the light-emitting area.

[0020] Furthermore, the transparent adhesive is UV transparent adhesive. During the curing process in step S5, the wavelength of the UV lamp is 365nm to 400nm, and the irradiation intensity is greater than 80mW / cm 2 ; or, the transparent glue is a transparent thermosetting resin glue, and during the curing process in step S5, the pressure is 6kg, the time is 30min~45min, and the temperature is 80℃.

[0021] Furthermore, the transparent glue is higher than the black glue dam.

[0022] Furthermore, the viscosity of the transparent adhesive is between 2000cps and 5000cps.

[0023] Furthermore, the roughness of the black glue dam is greater than the roughness of the light emitting area.

[0024] Furthermore, the coating process is to coat by spraying using a mask.

[0025] Compared with the prior art, the silicon-based OLED display panel bonding method of the present invention first coats black glue outside the light-emitting area and the PAD area, and then coats transparent glue on the light-emitting area. The amount of transparent glue is easy to control, which can reduce the risk of glue overflow when bonding the cover plate. In addition, after bonding the cover plate, when cutting the cutting area with black glue on the surface, due to the presence of the black glue, no mirror reflection of the silicon base will occur, the laser pulse energy concentration effect is good, and the cutting effect is improved.

[0026] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0028] Figure 1 It is a schematic diagram of coating black glue on a silicon substrate through a mask a;

[0029] Figure 2 yes Figure 1 The structure diagram after applying black glue and curing;

[0030] Figure 3 is Figure 2 Schematic diagram of applying transparent glue on the foundation;

[0031] Figure 4 yes Figure 3 The structure diagram after transparent glue is applied and cured;

[0032] Figure 5 It is a schematic diagram of the structure after the cover plate is attached and before cutting.

[0033] Description of reference numerals:

[0034] 1-silicon base, 11-light emitting area, 12-PAD area, 13-cutting area, 2-black glue dam, 3-transparent glue, 4-cover plate, 5-exhaust channel. DETAILED DESCRIPTION

[0035] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0036] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0037] The black glue and transparent glue used in this article are both glue, and glue is used for explanation in some descriptions.

[0038] Please refer to Figure 1 to Figure 5 As shown, the silicon-based OLED display panel bonding method of the present invention includes the following steps: S1, coating black glue outside the light-emitting area 11 and the PAD area 12 of the silicon base 1; S2, curing the black glue to form a black glue dam 2; S3, after the black glue dam 2 is formed, coating transparent glue 3 on the light-emitting area 11 of the silicon base 1; S4, bonding the cover plate 4 to the silicon base 1 coated with the transparent glue 3; S5, after bonding the cover plate 4, degassing and curing are performed.

[0039] The coating process in the method can adopt any one of the existing technologies, including but not limited to: coating by spraying with a mask plate, the surface glue is uniform, and the glue amount and leveling are easy to control.

[0040] Please refer to Figure 1 and Figure 2 As shown, in step S1, there is a cutting area 13 outside the light-emitting area 11 and the PAD area 12, and at least a portion of the black glue is coated on the cutting area 13 of the silicon base 1, that is, the surface of the cutting area 13 is covered with black glue, and during the cutting process after the cover plate 4 is bonded, mirror reflection of the silicon base 1 will not occur, the laser pulse energy concentration effect is good, and the cutting effect is improved.

[0041] Preferably, the black glue is thermosetting black resin glue or black UV glue.

[0042] The viscosity of the black glue is between 20000cps and 30000cps. The use of high-viscosity black glue will not easily form tunnels. The height of the black glue can be controlled within any desired height range, for example, between 0.02mm and 0.04mm.

[0043] The curing process of step S2 is as follows: the black glue is a thermosetting black resin glue, the curing temperature is 80°C, and the curing time is not less than 80 minutes; or the black glue is a black UV glue, and the UV light is ≥60mw / cm 2 .

[0044] The height of the cured black glue dam 2 is between 0.02 mm and 0.04 mm, which is higher than the OLED device in the light-emitting area 11 .

[0045] First, black glue is applied to the outside of the light-emitting area 11 and the PAD area 12, and then transparent glue 3 is applied to the light-emitting area 11. The amount of transparent glue 3 is easy to control, which can reduce the risk of glue overflow when fitting the cover plate 4; and there is no need to remove excess transparent glue in the PAD area 12 after subsequent cutting, which is efficient and has a high yield.

[0046] Also, please refer to Figure 3 and Figure 4 As shown, step S3 also includes forming transparent glue 3 on the portion of the black glue dam 2 close to the light-emitting area 11, and the light-emitting area 11 and the transparent glue 3 above the portion of the black glue dam 2 are integrally formed; it can also be understood that: the two portions of the transparent glue 3 are actually one structure, the transparent glue 3 completely covers the light-emitting area 11, and its edge covers the portion of the black glue dam 2 close to the light-emitting area 11, while the portion of the black glue dam 2 away from the light-emitting area 11 is not covered by the transparent glue 3.

[0047] Specifically, the transparent glue 3 is UV transparent glue 3 or transparent thermosetting resin glue, and the viscosity of the transparent glue 3 is between 2000cps and 5000cps.

[0048] Preferably, the transparent glue 3 is higher than the black glue dam 2, and the transparent glue 3 here includes the transparent glue 3 located above the light-emitting area 11, and also includes the part of the transparent glue 3 covering the black dam 2 close to the light-emitting area 11; an exhaust channel 5 is formed between the silicon base 1 and the entire bonding cover plate 4, and the exhaust channel 5 is located between the PAD area 12 and the part of the black glue dam 2 area away from the light-emitting area 11 and the cover plate 4, so that the degassing effect of the entire product is better and bubbles are not easily generated.

[0049] In a specific embodiment, the height of the black glue dam 2 is between 0.02 mm and 0.04 mm, and the height of the transparent glue 3 is between 0.05 mm and 0.07 mm.

[0050] In addition, the roughness of the black glue dam 2 is greater than the roughness of the light-emitting area 11; therefore, the leveling property of the transparent glue 3 above the black glue dam 2 will be lower than the leveling property of the transparent glue 3 on the light-emitting area 11; and the transparent glue 3 is sprayed with a mask plate, the transparent glue 3 on the surface is evenly distributed, the amount of glue is easy to control, and the risk of glue overflow when fitting the cover plate 4 is reduced.

[0051] In a specific embodiment, the water drop contact angle of the black rubber dam 2 is between 120° and 150°.

[0052] When the transparent adhesive 3 is UV transparent adhesive, during the curing process in step S5, the wavelength of the UV lamp is 365nm to 400nm, and the irradiation intensity is greater than 80mW / cm 2 When the transparent glue 3 is a transparent thermosetting resin glue, during the curing process in step S5, the pressure is 6 kg, the time is 30 min to 45 min, and the temperature is 80°C.

[0053] Please refer to Figure 5 As shown, step S5 of laminating the cover plate 4 is specifically to laminat the entire cover plate 4 to the entire silicon base 1, by which the transparent glue 3 is higher than the black glue dam 2; an exhaust channel 5 is formed between the silicon base 1 and the entire laminating cover plate 4, and the exhaust channel 5 is convenient for removing bubbles during the laminating process, and the degassing effect of the entire product is better, and bubbles are not easy to generate; and there is no need to remove excess transparent glue in the PAD area 12 after subsequent cutting, so the efficiency is fast and the yield is high.

[0054] In addition, after the silicon-based OLED display panel is bonded, the bonded product can also be cut. The cutting process is: cutting with a laser machine, as a non-contact cutting method, can effectively control the defects caused by uneven stress during contact; specifically, the laser power is 25W~30W, the cutting speed is 100mm / s~150mm / s, the laser pulse frequency is 40kHz~60kHz, and the laser slicing width is 5μm~10um; the wafer utilization rate is high. It should be noted that the surface of the cutting area 13 is covered with black glue, and no mirror reflection will occur during cutting. The laser pulse energy concentration effect is good, which improves the cutting effect.

[0055] The following will take the lamination of the cover plate 4 of the 8-inch silicon-based 1 as an example to describe in detail the lamination method of the silicon-based OLED display panel of the present invention, which includes the following steps:

[0056] like Figure 1 and Figure 2 As shown, black UV glue or black thermosetting resin glue is sprayed on the 8-inch silicon base 1 through a mask plate a to form black glue, and the PAD area 12 and the light-emitting area 11 are prohibited from being covered by the black glue; the properties of the black glue, the coating process, etc. refer to the above description and will not be repeated here.

[0057] The silicon base 1 sprayed with black glue is cured. The curing method is described above and will not be repeated here.

[0058] like Figure 3 and Figure 4 As shown, UV transparent glue or transparent thermosetting resin glue is sprayed on the 8-inch silicon base 1 forming the black glue dam 2 through the mask plate b to form transparent glue 3 used for bonding, wherein the performance, position and other parameters of the transparent glue 3 are referred to the above description and will not be repeated here.

[0059] like Figure 5 As shown, after the transparent glue 3 is sprayed, the cover plate 4 is bonded, and after completion, degassing and curing are performed. The height of the transparent glue 3 used for bonding is higher than the height of the black glue dam 2, so that an exhaust channel 5 is formed between the silicon base 1 and the entire bonding cover plate 4, which is convenient for removing bubbles during the bonding process, so that the degassing effect of the entire product is better and bubbles are not easily generated.

[0060] The bonded products are cut by laser machine to form independent OLED light-emitting devices. Figure 5 Indicated by the arrow.

[0061] Also, please refer to Figure 5 As shown, the present invention further provides an OLED display panel, including an OLED device, a cover plate 4, and a packaging component for packaging the OLED device and the cover plate 4.

[0062] The OLED device includes a silicon substrate 1 , a light-emitting region 11 located on the silicon substrate 1 , a PAD region 12 located on the outer periphery of the light-emitting region 11 , and a segmentation region 13 .

[0063] The functional devices (not shown) of the OLED device are located in the light-emitting area 11, and the functional devices include an anode, a hole injection layer (HIL), a hole transport layer (HTL), an organic light-emitting layer (EML), an electron transport layer (ETL), an electron injection layer (EIL), a cathode, etc., for emitting light outward.

[0064] The control circuit (not shown) of the OLED device is located in the PAD area 12 , and the segmentation area 13 is located outside the light-emitting area 11 and the PAD area 12 . After segmentation, each display unit includes a light-emitting area 11 and a PAD area 12 .

[0065] The packaging component includes a black glue dam 2 located outside the light-emitting area 11 and the PAD area 12 of the silicon base, and a transparent glue 3 located in the light-emitting area 11 of the silicon base; the cover plate is attached to the side of the transparent glue 3 away from the silicon base.

[0066] Specifically, the black glue is black UV glue or thermosetting black resin glue, and the transparent glue 3 is UV transparent glue 3 water or transparent thermosetting resin glue.

[0067] The transparent glue 3 is higher than the black glue dam 2, so an exhaust channel 5 is formed between the silicon base 1 and the entire bonding cover plate 4. The exhaust channel 5 is located between the PAD area 12 and the part of the black glue dam 2 away from the light-emitting area 11 and the cover plate 4, so that the degassing effect of the entire product is better and bubbles are not easily generated.

[0068] In a specific embodiment, the height of the black glue dam 2 is between 0.02 mm and 0.04 mm, and the height of the transparent glue 3 is between 0.05 mm and 0.07 mm.

[0069] In addition, the packaging component further includes a transparent glue 3 on the portion of the black glue dam 2 near the light-emitting area 11. The light-emitting area 11 and the transparent glue 3 above the portion of the black glue dam 2 are integrated; it can also be understood that: the two portions of the transparent glue 3 are actually one structure, the transparent glue 3 completely covers the light-emitting area 11, and its edge covers the portion of the black glue dam 2 near the light-emitting area 11, while the portion of the black glue dam 2 away from the light-emitting area 11 is not covered by the transparent glue 3.

[0070] The roughness of the black glue dam 2 is greater than the roughness of the light-emitting area 11; therefore, the leveling property of the transparent glue 3 above the black glue dam 2 will be lower than the leveling property of the transparent glue 3 on the light-emitting area 11; and the transparent glue 3 is sprayed with a mask plate, the transparent glue 3 on the surface is evenly distributed, the amount of glue is easy to control, and the risk of glue overflow when fitting the cover plate 4 is reduced.

[0071] In a specific embodiment, the water drop contact angle of the black rubber dam 2 is between 120° and 150°.

[0072] In summary, the surface of the cutting area 13 located outside the light-emitting area and the PAD area has a black glue dam 2. During the cutting process, no mirror reflection of the silicon base 1 occurs, the laser pulse energy concentration effect is good, and the cutting effect is improved. In addition, black glue is first applied to the outside of the light-emitting area 11 and the PAD area 12, and then transparent glue 3 is applied to the light-emitting area 11. The amount of transparent glue 3 is easy to control, which can reduce the risk of glue overflow when the cover plate 4 is fitted.

[0073] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A method for laminating a silicon-based OLED display panel, characterized in that: The steps include: S1: Apply black glue outside the light-emitting area and PAD area of ​​the silicon base; S2 solidifies the black glue to form a black glue dam; S3 After forming the black glue dam, a transparent glue is applied to the light emitting area of ​​the silicon substrate, and a transparent glue is formed on the portion of the black glue dam close to the light emitting area; the black glue dam and the transparent glue are arranged along the horizontal plane direction of the silicon substrate; the transparent glue completely covers the light emitting area, and its edge covers the portion of the black glue dam close to the light emitting area, while the portion of the black glue dam far from the light emitting area is not covered by the transparent glue; S4 attaches the cover plate to the silicon base coated with transparent adhesive; After S5 has attached the cover plate, degassing and curing are performed.

2. The method for bonding a silicon-based OLED display panel according to claim 1, characterized in that: At least a portion of the black glue is applied to the cutting area of ​​the silicon substrate.

3. The method for bonding a silicon-based OLED display panel according to claim 1, characterized in that: The black glue is a thermosetting black resin glue. During the curing process of step S2, the curing temperature is 80° C. and the curing process lasts no less than 80 minutes. Alternatively, the black glue is black UV glue, and during the curing process of step S2, the UV light is ≥60mw / cm 2 .

4. The method for bonding a silicon-based OLED display panel according to claim 1, characterized in that: The viscosity of the black glue is between 20000cps and 30000cps.

5. The method for bonding silicon-based OLED display panels according to claim 1, characterized in that: The transparent adhesive is UV transparent adhesive. During the curing process in step S5, the wavelength of the UV lamp is 365nm-400nm, and the irradiation intensity is greater than 80mW / cm 2 ; Alternatively, the transparent adhesive is a transparent thermosetting resin adhesive, and during the curing process in step S5, the pressure is 6 kg, the time is 30 min to 45 min, and the temperature is 80°C.

6. The method for bonding a silicon-based OLED display panel according to claim 1, characterized in that: The transparent glue is higher than the black glue dam.

7. The method for bonding a silicon-based OLED display panel according to claim 1, characterized in that: The viscosity of the transparent adhesive is between 2000cps and 5000cps.

8. The method for bonding silicon-based OLED display panels according to claim 1, characterized in that: The roughness of the black glue dam is greater than the roughness of the light emitting area.

9. The method for bonding a silicon-based OLED display panel according to claim 1, characterized in that: The coating process is to use a mask plate to perform coating by spraying.

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