Terminal device, display screen and display screen manufacturing method

Abstract

The present application relates to a terminal device and a display screen and a method for preparing the display screen, wherein the display screen includes a cover layer, a touch layer, a polarization layer, an encapsulation layer, a pixel layer and a circuit driving layer from top to bottom. In particular, the display screen also includes a microlens layer formed on and disposed above the pixel layer, wherein the microlens layer corresponds to each of the gaps between the pixels in the pixel layer, and is used to converge light to each of the gaps before the light passes through the pixel layer through the gaps, so as to increase the light transmittance of the display screen.

Description

Technical Field

[0001] The present application relates to a terminal device, in particular to a terminal device with a full screen, a display screen thereof, and a method for preparing the display screen. Background Art

[0002] In recent years, full-screen terminal devices (e.g., full-screen mobile phones) have gradually been sought after by the majority of users. Existing full-screen terminal devices refer to ultra-large screen terminal devices whose screen exceeds a preset proportion (e.g., 90%) of the front of the device, and do not truly achieve a 100% screen ratio.

[0003] At present, in the technical solution to increase the screen-to-body ratio, the camera module set on the same side of the terminal device together with the screen is the biggest obstacle. However, for terminal devices, their camera function is often an indispensable functional requirement. Therefore, it is necessary to optimize the structural configuration of the screen and the camera module to increase the screen-to-body ratio of the terminal device. Summary of the invention

[0004] The main purpose of the present application is to provide a terminal device, a display screen and a method for preparing the display screen, wherein the display screen has a relatively high light transmittance so that, on the one hand, a camera module disposed under the display screen can collect sufficient light for imaging, and on the other hand, the screen ratio of the terminal device can be increased.

[0005] Another object of the present application is to provide a terminal device, its display screen and display screen preparation method, wherein the camera module is configured as an under-screen camera module, which is installed at a different height position from the display screen of the terminal device, so that the camera module is prevented from becoming an obstacle to increasing the screen-to-body ratio.

[0006] Another object of the present application is to provide a terminal device, a display screen and a method for preparing the display screen, wherein the display screen includes a microlens layer arranged above a pixel layer to converge light entering the display screen through the microlens layer to the gaps between pixels in the pixel layer, thereby improving the light transmittance of the display screen.

[0007] Another object of the present application is to provide a terminal device, a display screen and a method for manufacturing the display screen, wherein the display screen used in the present application does not require significant adjustments to the existing structure of the existing display screen, and only requires an additional layer of the microlens layer corresponding to the pixel gaps in the pixel layer to be provided above the pixel layer of the display screen.

[0008] Another object of the present application is to provide a terminal device, a display screen and a method for manufacturing the display screen, wherein the refractive index of the material forming the microlens layer is greater than the refractive index of the material used to form the encapsulation layer to enhance the transmittance of the display screen.

[0009] Other advantages and features of the present application will become apparent from the following description, and may be achieved by the means and combinations particularly pointed out in the claims.

[0010] To achieve at least one of the above purposes or advantages, the present application provides a display screen, which includes, from top to bottom: a cover layer, a touch layer, a polarizing layer, an encapsulation layer, a pixel layer and a circuit driving layer; the circuit driving layer is formed on the bottom side of the pixel layer and is electrically connected to the pixel layer for driving the pixel layer to work; the encapsulation layer is formed on the top side of the pixel layer for encapsulating the pixel layer; the pixel layer includes pixels distributed in an array, each of which has a gap between the pixels, so that light that sequentially passes through the cover layer, the touch layer, the polarizing layer and the encapsulation layer can pass through the pixel layer through the gap; wherein the display screen also includes a microlens layer arranged above the pixel layer, wherein the microlens layer corresponds to each of the gaps between the pixels, and is used to converge the light to each of the gaps before the light passes through the pixel layer through the gaps, so as to increase the transmittance of the display screen.

[0011] In an embodiment of the present application, the microlens layer includes microlens units distributed in an array, wherein each of the microlens units corresponds to each of the gaps.

[0012] In one embodiment of the present application, the microlens layer is integrally formed in each of the gaps between the pixels in the pixel layer, and the encapsulation layer is integrally formed on the microlens layer and the pixel layer to encapsulate the pixel layer and the microlens layer.

[0013] In one embodiment of the present application, the microlens layer is integrally formed on the top surface of the packaging layer.

[0014] In one embodiment of the present application, the microlens layer is integrally formed in a recessed manner on the top surface of the packaging layer.

[0015] In an embodiment of the present application, the height dimension of the microlens unit is less than or equal to the height dimension of the packaging layer.

[0016] In an embodiment of the present application, a lateral dimension of the microlens unit is greater than a dimension of the gap.

[0017] In an embodiment of the present application, a longitudinal dimension of the microlens unit is greater than or equal to a dimension of a gap between adjacent pixels.

[0018] In one embodiment of the present application, the material forming the encapsulation layer is a light-transmissive rigid material.

[0019] In an embodiment of the present application, the material forming the encapsulation layer is a light-transmissive flexible material.

[0020] In one embodiment of the present application, the display screen further includes a backplane layer having an opening, wherein the opening corresponds to the gap between adjacent pixels in the pixel layer.

[0021] According to another aspect of the present application, the present application also provides a method for preparing a display screen, which includes:

[0022] A microlens layer is formed on the pixel layer of the display screen, wherein the microlens layer corresponds to the gap between each pixel in the pixel layer, wherein a circuit driving layer is provided on the bottom side of the pixel layer, and the circuit driving layer is electrically connected to the pixel layer for driving the pixel layer to work; and

[0023] A packaging layer is formed on the microlens layer and the pixel layer to encapsulate the microlens layer and the pixel layer through the packaging layer, wherein a polarizing layer, a touch layer and a cover layer are sequentially arranged on the packaging layer.

[0024] In one embodiment of the present application, the microlens layer is integrally formed in the gap between the pixels in the pixel layer.

[0025] In one embodiment of the present application, the encapsulation layer is integrally formed on the microlens layer and the pixel layer through a deposition process.

[0026] In one embodiment of the present application, the refractive index of the material forming the microlens layer is greater than the refractive index of the material forming the encapsulation layer.

[0027] According to another aspect of the present application, the present application provides a method for preparing a display screen, which includes:

[0028] Integrally forming a microlens layer on the packaging layer;

[0029] The encapsulation layer is disposed above the pixel layer, wherein the microlens layer corresponds to the gaps between the pixels in the pixel layer, wherein a circuit driving layer is disposed on the bottom side of the pixel layer, and the circuit driving layer is electrically connected to the pixel layer for driving the pixel layer to operate; and

[0030] A polarizing layer, a touch layer and a cover layer are sequentially arranged on the packaging layer.

[0031] In one embodiment of the present application, the microlens layer is integrally formed on the top surface of the packaging layer.

[0032] In one embodiment of the present application, the microlens layer is integrally formed in a recessed manner on the top surface of the packaging layer.

[0033] According to another aspect of the present application, a terminal device is also provided, which includes: a terminal body, a camera module and the display screen as described above, wherein the display screen is installed on the terminal body, and the camera module is arranged on the bottom side of the display screen, so that the camera module can receive imaging light that sequentially passes through the cover layer, the touch layer, the polarization layer, the encapsulation layer and the microlens layer of the display screen, the gap of the pixel layer and the circuit driving layer.

[0034] In one embodiment of the present application, the camera module is installed at the opening of the back panel layer located at the bottom of the display screen.

[0035] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0036] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 The figure shows a schematic structural diagram of an existing display screen for terminal equipment.

[0038] Figure 2 The figure shows a schematic structural diagram of a display screen according to an embodiment of the present application.

[0039] Figure 3A A modified implementation of the display screen according to an embodiment of the present application is illustrated.

[0040] Figure 3B A schematic diagram of a process for preparing the display screen according to an embodiment of the present application is illustrated.

[0041] Figure 3C A schematic diagram of a process for preparing the display screen according to an embodiment of the present application is illustrated.

[0042] Figure 3D A schematic diagram of a process for preparing the display screen according to an embodiment of the present application is illustrated.

[0043] Figure 3E A schematic diagram of a process for preparing the display screen according to an embodiment of the present application is illustrated.

[0044] Figure 3F A schematic diagram of a process for preparing the display screen according to an embodiment of the present application is illustrated.

[0045] Figure 3G A schematic diagram of a process for preparing the display screen according to an embodiment of the present application is illustrated.

[0046] Figure 4AA schematic diagram of a microlens array in the display screen according to an embodiment of the present application is shown.

[0047] Figure 4B Another schematic diagram of the microlens array in the display screen according to an embodiment of the present application is illustrated.

[0048] Figure 5 Another variant implementation of the display screen according to an embodiment of the present application is illustrated.

[0049] Fig. 6A Another variant implementation of the display screen according to an embodiment of the present application is illustrated.

[0050] Figure 6B Another variant implementation of the display screen according to an embodiment of the present application is illustrated.

[0051] Figure 7 The figure shows another variant implementation of the display screen according to the embodiment of the present application.

[0052] Fig. 8A The figure shows another variant implementation of the display screen according to the embodiment of the present application.

[0053] Figure 8B Another variant implementation of the display screen according to an embodiment of the present application is illustrated.

[0054] Fig. 9 The figure shows another variant implementation of the display screen according to the embodiment of the present application.

[0055] Fig.10 A schematic diagram of a process for preparing the display screen according to an embodiment of the present application is illustrated.

[0056] Fig.11 A schematic diagram of another preparation process of the display screen according to an embodiment of the present application is illustrated.

[0057] Fig.12 The figure shows another schematic diagram of a preparation process of the display screen according to an embodiment of the present application.

[0058] Fig.13 The figure shows another schematic diagram of a preparation process of the display screen according to an embodiment of the present application.

[0059] Fig.14 The figure shows another schematic diagram of a preparation process of the display screen according to an embodiment of the present application.

[0060] Fig.15 The figure shows another schematic diagram of a preparation process of the display screen according to an embodiment of the present application.

[0061] Fig.16The figure shows another schematic diagram of a preparation process of the display screen according to an embodiment of the present application.

[0062] Fig.17 A specific example of a terminal device according to an embodiment of the present application is illustrated.

[0063] Fig.18 The figure shows a schematic diagram of the imaging path of the camera module in the terminal device according to an embodiment of the present application.

[0064] Fig.19 Another schematic diagram of the terminal device according to an embodiment of the present application is illustrated.

[0065] Fig. 20 FIG21 illustrates another schematic diagram of the terminal device according to an embodiment of the present application. FIG21 illustrates a specific example of the camera module according to an embodiment of the present application.

[0066] Fig. 22 Another specific example of a camera module according to an embodiment of the present application is illustrated.

[0067] Fig.23 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0068] Fig.24 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0069] Fig.25 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0070] Fig.26 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0071] Fig. 27 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0072] Fig.28 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0073] Fig.29 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0074] Fig.30 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0075] Fig.31 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0076] Fig.32The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0077] Fig.33 The figure illustrates another specific example of a camera module according to an embodiment of the present application.

[0078] Fig.34 The figure shows a schematic diagram of an existing camera module based on a molding process.

[0079] Fig.35 The figure shows a specific schematic diagram of the photosensitive chip of the camera module

[0080] Fig.36 The figure shows another specific schematic diagram of the photosensitive chip of the camera module. DETAILED DESCRIPTION

[0081] The following description is used to disclose the present application so that those skilled in the art can implement the present application. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present application defined in the following description can be applied to other embodiments, variations, improvements, equivalent solutions, and other technical solutions that do not deviate from the spirit and scope of the present application.

[0082] Those skilled in the art should understand that, in the disclosure of the present application, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present application.

[0083] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0084] Although ordinals such as "first," "second," and the like will be used to describe various components, those components are not limited herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and likewise, a second component may be referred to as a first component without departing from the teachings of the inventive concept. The term "and / or" as used herein includes any and all combinations of one or more associated listed items.

[0085] The terms used herein are only used for the purpose of describing various embodiments and are not intended to be limiting. As used herein, singular forms are intended to also include plural forms, unless the context clearly indicates an exception. In addition, it will be understood that the terms "including" and / or "having" when used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0086] The terms used herein, including technical and scientific terms, have the same meaning as those generally understood by those skilled in the art, unless the terms are defined differently. It should be understood that the terms defined in commonly used dictionaries have the same meaning as those in the prior art.

[0087] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments:

[0088] Application Overview

[0089] As mentioned above, in the technical solution to increase the screen-to-body ratio, the camera module that is set on the same side of the terminal device together with the screen is the biggest obstacle. In order to truly realize the full screen and reduce the impact of the camera module on the screen-to-body ratio, there is an existing technical solution: using a retractable camera module to hide and use the camera module. Specifically, when shooting is required, the camera module is extended out of the shell of the terminal device to shoot; after shooting is completed, the camera module is retracted into the shell of the terminal device.

[0090] However, this technical solution has many defects in practical application. First, the camera module is easily damaged by external impact during the process of continuous extension and retraction into and / or extension of the terminal device housing. Second, once damaged, it is difficult to replace the camera module and the retractable mechanism.

[0091] In recent years, a technical concept of an under-screen camera module has been proposed, that is, the camera module is placed under the display screen. However, since the camera module is placed under the display screen, it cannot collect enough imaging light from the outside, making it difficult to realize the imaging function of the camera module.

[0092] In detail, Figure 1 The figure shows a schematic diagram of the structure of an existing display screen for terminal equipment. Figure 1As shown, the display screen is an OLED display screen, which includes a cover layer 21P, a touch layer 22P, a polarizing layer 23P, an encapsulation layer 24P, a pixel layer 25P, a circuit driving layer 26P and a back layer 27P from top to bottom, wherein the cover layer 21P is bonded to the top side of the touch layer 22P by an adhesive; the polarizing layer 23P is arranged on the bottom side of the touch layer 22P; the encapsulation layer 24P is arranged on the bottom side of the polarizing layer 23P, which is used to encapsulate the pixel layer 25P, so that the pixel layer 25P is in a sealed environment, so that the organic material in the pixel layer 25P is not contaminated or volatilized by the outside world; a circuit driving layer 26P is arranged on the bottom side of the pixel layer 25P, which is used to drive the pixel layer 25P to work, so that the display screen can display images; and a back layer 27P is also arranged on the bottom side of the circuit driving layer 26P, which is used to strengthen the structural strength of the display screen.

[0093] In other words, when the camera module is disposed below the display screen, the imaging light from the outside must sequentially pass through the cover layer 21P, the touch layer 22P, the polarization layer 23P, the encapsulation layer 24P, the pixel layer 25P, the circuit driving layer 26P and the back layer 27P of the display screen before being sensed by the camera module disposed below the display screen. Those skilled in the art should know that the transmittance of existing display screens is generally low, and the main reason is that the pixel layer 25P has a high light blocking rate, and the imaging light mostly passes through the pixel layer 25P through the gaps between pixels.

[0094] Theoretically, in order to improve the transmittance of the existing display screen, the size ratio between the gaps between pixels in the pixel layer can be increased, for example, by reducing the unit pixel size or increasing the size of the gaps between pixels. However, reducing the unit pixel size will lead to a decrease in the pixel luminous intensity and a reduction in the pixel life, while increasing the pixel gap will directly lead to a decrease in screen resolution. In other words, the technical solution of increasing the size ratio of the pixel gap will damage the performance of the display screen itself in the specific implementation, which is not conducive to the development of display technology.

[0095] In response to the above technical problems, the basic concept of the present application is to provide a microlens layer on the pixel layer of the display screen, so as to converge the imaging light that sequentially passes through the cover layer, the touch layer, the polarization layer and the encapsulation layer through the microlens layer to the gaps between the pixels in the pixel layer. In this way, the transmittance of the display screen is enhanced so that the camera module arranged under the display screen can collect sufficient imaging light for imaging.

[0096] Based on this, the present application proposes a terminal device, which includes: a terminal body, a camera module and a display screen, wherein the display screen is installed on the terminal body, and the camera module is arranged on the bottom side of the display screen, wherein the display screen includes from top to bottom: a cover layer, a touch layer, a polarization layer, an encapsulation layer, a pixel layer and a circuit driving layer, wherein the circuit driving layer is formed on the bottom side of the pixel layer and is electrically connected to the pixel layer for driving the pixel layer to work; the encapsulation layer is formed on the top side of the pixel layer for encapsulating the pixel layer; the pixel layer includes pixels distributed in an array, each There are gaps between the pixels, so that the light that passes through the cover layer, the touch layer, the polarization layer and the encapsulation layer in sequence can pass through the pixel layer through the gaps; wherein the display screen also includes a microlens layer, and the microlens layer is formed in the encapsulation layer, wherein the microlens layer corresponds to the gaps between each of the pixels, and is used to converge the light to the gaps before the light passes through the pixel layer through the gaps, so that more light can pass through the pixel layer through the gaps between each of the pixels in the pixel layer, and reach the camera module through the circuit drive layer. In other words, by arranging the microlens layer in the display screen, the transmittance of the display screen is improved, so that when the camera module is arranged below the display screen, the camera module can still collect sufficient imaging light for imaging. That is, through the optimized display screen, the technical solution of the under-screen camera module can be realized to truly realize the full-screen design of the terminal device.

[0097] After introducing the basic principles of the present application, various non-limiting embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0098] Example display screen

[0099] Figure 2 FIG. 1 is a schematic diagram of the structure of a display screen according to an embodiment of the present application. Figure 2 As shown, the display screen 20 according to the embodiment of the present application is used to realize a full-screen configuration of a terminal device (for example, a smart phone), and includes: a cover layer 21, a touch layer 22, a polarizing layer 23, an encapsulation layer 24, a pixel layer 25 and a circuit driving layer 26 distributed from top to bottom, wherein the circuit driving layer 26 is formed on the bottom side of the pixel layer 25 and is electrically connected to the pixel layer 25, and is used to drive the pixel layer 25 to work; the encapsulation layer 24 is formed on the top side of the pixel layer 25, and is used to encapsulate the pixel layer 25; and the pixel layer 25 includes pixels 251 distributed in an array, and each of the pixels 251 has a gap 250, so that light that sequentially passes through the cover layer 21, the touch layer 22, the polarizing layer 23 and the encapsulation layer 24 can pass through the pixel layer 25 through the gap 250.

[0100] In particular, the display screen 20 further includes a microlens layer 28 disposed above the pixel layer 25, wherein the microlens layer 28 corresponds to each of the gaps 250 between the pixels 251 in the pixel layer 25, and is used to converge light to each of the gaps 250 before the light passes through the pixel layer 25 through the gaps 250, so that a relatively larger number of light rays can pass through the pixel layer 25 through the gaps 250. In this way, the overall light transmittance of the display screen 20 can be effectively improved.

[0101] like Figure 2 As shown, in the embodiment of the present application, the display screen 20 is implemented as an OLED (Organic Light-emitting Diode) display screen 20. Those skilled in the art should know that the OLED display screen 20 has the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, high response speed, full color, etc. However, the existing OLED display screen 20 generally has low light transmittance.

[0102] The following is a "layer-by-layer" analysis of the existing OLED display screen 20 to explain the reasons why the existing OLED display screen has low light transmittance. As mentioned above, the existing OLED display screen 20 includes a cover layer 21P, a touch layer 22P, a polarization layer 23P, an encapsulation layer 24P, a pixel layer 25P, a circuit driving layer 26P and a backplane layer 27P from top to bottom.

[0103] First, the cover layer 21P is usually implemented as a glass layer, which is located at the top layer of the display screen and is used to protect the layer structure located below the cover layer 21P. It should be understood that the glass layer is made of glass material, which is a material with high light transmittance. In other words, the cover layer 21P will not have an adverse effect on the light transmittance of the display screen.

[0104] The layer structure below the cover layer 21P is the touch layer 22P, and the two are usually connected by an adhesive. Those skilled in the art should know that the touch layer 22P is an indispensable configuration for realizing the touch function of the display screen. In other words, the influence of the touch layer 22P on the light transmittance of the display screen is almost inevitable.

[0105] The layer structure below the touch layer 22P is a polarizing layer 23P, which is usually implemented as a circular polarizer, etc. It should be understood that the polarizing layer 23P, such as a circular polarizer, is an optical element itself and has a good light transmittance. Therefore, the polarizing layer 23P has little effect on the light transmittance of the display screen.

[0106] The layer structure below the polarizing layer 23P is an encapsulation layer 24P, and the function of the encapsulation layer 24P is to encapsulate the pixel layer 25P below it, so that the pixel layer 25P is in a sealed environment, so that the organic material in the pixel layer 25P is not polluted or volatilized by the outside world. Specifically, there are two types of encapsulation layers 24P. When the display screen is a rigid screen, the encapsulation layer 24P is made of a rigid light-transmitting material, such as glass or plastic; when the display screen is a flexible screen, the encapsulation layer 24P is made of a flexible light-transmitting material, such as a PI film (Polyimide Film). It should be observed that, whether it is a rigid screen or a flexible screen, the encapsulation layer 24P is made of a light-transmitting material, which has little effect on the overall light transmittance of the display screen.

[0107] The layer structure covered by the encapsulation layer 24P and located below the encapsulation layer 24P is a pixel layer 25P. For an OLED display screen, the pixel unit in the pixel layer 25 is implemented as an OLED (Organic Light-emitting Diode). Those skilled in the art should know that the organic light-emitting diode has a high light blocking rate, that is, the light passing through the cover layer 21P, the touch layer 22P, the polarizing layer 23P, the encapsulation layer 24P and reaching the pixel layer 25 is difficult to pass through the organic light-emitting diode to reach the other side of the pixel layer 25. Accordingly, this part of the light can only pass through the gap between each pixel and pass through the pixel layer 25P. In other words, the pixel layer 25P has a light-transmitting area and a non-light-transmitting area, wherein the light-transmitting area is defined by the gap between the pixels, and the non-light-transmitting area is defined by the pixels. However, the pixel gap accounts for a small proportion of the total area of ​​the pixel layer 25P, so a large amount of light is blocked in the pixel layer 25P, resulting in a low light transmittance of the entire display screen.

[0108] The layer structure located below the pixel layer 25P is the circuit driving layer 26P, which is used to be electrically connected to the pixel layer 25P and drive the pixel layer 25P to work. The circuit driving layer 26P includes a driving circuit and a packaging layer for encapsulating the driving circuit, wherein the packaging layer is made of a material with good light transmittance, which has little effect on the overall light transmittance of the display screen, but if the driving circuit is improperly set, it will affect the propagation of light. Specifically, if the electronic components of the driving circuit correspond to the pixel gap, this part of the driving circuit will have an adverse effect on the light passing through the display screen; if the components of the driving circuit are located below the pixel, this part of the drive will not affect the light propagation.

[0109] The layer structure below the circuit driving layer 26P is the backplane layer, which mainly serves to strengthen the overall structural strength of the display screen. When the display screen is an OLED display screen, the backplane layer has a high light transmittance, and when the display screen is an LCD display screen, the backplane layer is used to provide a light source and has a low light transmittance.

[0110] In summary, the reasons for the low overall light transmittance of existing OLED display screens are: first, the light-transmitting area of ​​the pixel layer 25P accounts for a low proportion, that is, the pixel gap accounts for a low proportion, and only a small amount of light can pass through the pixel layer 25P through the pixel gap; second, part of the driving circuit in the circuit driving layer 26P (when the components of the driving circuit correspond to the pixel gap) will affect the light transmittance performance of the display screen.

[0111] Accordingly, in the embodiment of the present application, the display screen 20 is provided with the microlens layer 28, which is provided above the pixel layer 25 and corresponds to each of the gaps 250 between the pixels 251 in the pixel layer 25. The microlens layer 28 has the function of converging light, so as to converge the light to each of the gaps 250 between the pixels 251, thereby effectively allowing more light to pass through the pixel layer 25 through the gaps 250 between the pixels 251 without changing the size ratio of the pixel gaps 250.

[0112] Furthermore, since the backplane layer is a non-essential functional layer of the display screen 20, in the embodiment of the present application, the backplane layer 27P can be directly removed. Alternatively, an opening 270 is provided at a position of the backplane layer 27 where light needs to be transmitted.

[0113] Through the above optimization, the overall light transmittance of the display screen 20 is effectively improved, so that external light can pass through the cover layer 21, the touch layer 22, the polarizing layer 23, the encapsulation layer 24, the microlens layer 28 and the circuit driving layer 26 from one side of the display screen 20 (set as the front side) in sequence, and reach the other side of the display screen 20 (set as the back side).

[0114] Figure 3A A modified implementation of the display screen 20 according to an embodiment of the present application is illustrated. As shown in FIG3 , in this modified implementation, the display screen 20 further includes a backplane layer 27 supported on the bottom side of the circuit driving layer 26, so as to strengthen the structural strength of the display screen 20 through the backplane layer 27. In particular, the backplane layer 27 is provided with at least one opening 270 at a location where the display screen 20 needs to be transparent, wherein the opening 270 corresponds to the gap 250 between the pixels 251 in the pixel layer 25, so that the light passing through the pixel layer 25 through the gap 250 of the pixel layer 25 can reach the back of the display screen 20 through the opening 270.

[0115] It is worth mentioning that in the embodiment of the present application, the opening 270 optionally has a size consistent with the camera module installed under the display screen 20, so that the opening 270 itself can be used as a reference hole for the installation and positioning of the camera module, which is conducive to the installation and calibration of the camera module. In addition, when the camera module is installed in the opening 270, the light passing through the display screen 20 through the opening 270 can directly enter the camera module for imaging reaction.

[0116] In order to further improve the light transmittance of the display screen 20, in the embodiment of the present application, the circuit driving layer 26 may be optimized. Specifically, the arrangement of the driving circuit in the circuit driving layer 26 is adjusted to: avoid arranging the components in the driving circuit below the pixel gap 250 as much as possible, so as to effectively avoid the driving circuit from causing adverse effects on the overall light transmittance of the display screen 20.

[0117] It should be understood that, in the embodiment of the present application, the configuration of the microlens layer 28 is a core factor affecting the transmittance of the display screen 20. Specifically, in the embodiment of the present application, the microlens layer 28 includes a series of microlens units 280. Preferably, the microlens units 280 are distributed in an array, and each of the microlens units 280 corresponds to each of the gaps 250 between the pixels 251. Each of the microlens units 280 has a light-gathering effect, that is, the light radiated to each of the microlens units 280 is refracted at each of the microlens units 280 to converge toward the corresponding pixel gap 250, so that compared with the existing display screen 20, the number of light passing through each of the gaps 250 is increased, that is, the overall transmittance of the display screen 20 is improved.

[0118] More specifically, in the embodiment of the present application, each of the microlens units 280 is implemented as a convex lens with a light-converging effect, wherein the convex surface of the convex lens faces the front of the display screen 20, and the bottom surface of the convex lens faces each pixel gap 250, so that when the external light reaches the convex lens, the external light is refracted at the convex surface of the convex lens and converges to the gap 250 between the pixels 251, so that more external light can pass through the pixel layer 25 through the gap 250 between the pixels 251. In a specific implementation, the convex lens can be implemented as a spherical convex lens, an aspherical convex lens, or a cylindrical lens (wherein the convex surface of the cylindrical lens can be implemented as a spherical surface or an aspherical surface), as shown in FIG. 4A and FIG. Figure 4B This is not limited by the present application.

[0119] Preferably, the microlens layer 28 of the present invention is formed on the encapsulation layer 24, that is, the encapsulation layer 24 is used to encapsulate the pixel layer 25, and the encapsulation layer 24 itself has a light-transmitting function. In the prior art, the encapsulation layer 24 is basically implemented as a glass cover plate or a light-transmitting encapsulation film, and in the present invention, refer to the attached Figure 5 As shown, the encapsulation layer 24 has a light-transmitting area and a light-collecting area. The light-transmitting area is used to allow the light emitted by the pixel layer 25 to be transmitted and displayed on the screen and imaged; and the light-collecting area is implemented as the microlens layer 28 for collecting light. It is further explained that during the manufacturing process of the encapsulation layer 24, the microlens layer 28 is formed in a light-transmitting area. For example, when the encapsulation layer 24 is formed by a process such as injection molding, the mold corresponding to the light-transmitting area is designed to be in the shape of the microlens layer 28, thereby obtaining the microlens layer 28 of the encapsulation layer 24.

[0120] More specifically, a preset position of the encapsulation layer 24 is configured to be convex downward and upward respectively to form at least one microlens unit 280. The encapsulation layer 24 has an upper surface and a lower surface, wherein at least a portion of the upper surface protrudes from other upper surface portions, and at least a portion of the lower surface protrudes from other lower surface portions, and the protruding upper surface portion and the protruding lower surface portion correspond to each other to form the light focusing area, thereby forming at least one microlens unit 280, and then the microlens layer 28 is integrally formed on the encapsulation layer 24.

[0121] Furthermore, in the embodiment of the present application, the microlens layer 28 can be integrally formed in each of the gaps 250 between the pixels 251 in the pixel layer 25, so that each of the microlens units 280 of the microlens layer 28 directly corresponds to each of the gaps 250 between the pixels 251, respectively, for converging more light to each of the gaps 250 between the pixels 251, so as to improve the light transmittance of the display screen 20.

[0122] For example, the microlens layer 28 involved in the present application can be prepared by a preparation process such as forming a microlens layer 28 on a photosensitive chip. Of course, other preparation processes can also be used to form the microlens layer 28 on the pixel layer 25, which is not limited to the present application. Accordingly, the bottom surface of each microlens unit 280 of the microlens layer 28 after molding is attached to the gap 250 between each pixel 251 to cover the gap 250, and the convex surface of each microlens unit 280 protrudes upward relative to the gap 250 to converge external light to the gap 250. Accordingly, the encapsulation layer 24 is integrally formed on the microlens layer 28 and the pixel layer 25 to encapsulate the pixel layer 25 and the microlens layer 28. For example, the encapsulation layer 24 can be formed above the microlens layer 28 and the pixel layer 25 by a deposition process. The display screen described in this embodiment can also be made by an etching method.

[0123] Reference Figure 3B As shown, it is based on the attached Figure 3A A method for manufacturing the display screen 20 shown in is explained. First, an encapsulation layer 24, a pixel layer 25 and a circuit driving layer 26 are obtained, wherein the encapsulation layer 24 is supported on the pixel layer 25, and the pixel layer 25 is supported on the circuit driving layer. The encapsulation layer 24 includes a first encapsulation layer portion 241 and a second encapsulation layer portion 242, wherein the first encapsulation layer portion 241 is made of a material with a larger refractive index, and the second encapsulation layer portion 242 is made of a material with a smaller refractive index. The first encapsulation layer portion 241 of the encapsulation layer 24 corresponds to the gap between the adjacent pixels 251 of the pixel layer 25, so that light can pass through the first encapsulation layer portion 241 of the encapsulation layer 24 and then pass through the gap between the adjacent pixels 251 of the pixel layer 25.

[0124] Furthermore, the microlens layer 28 is integrally formed on the encapsulation layer 24. Specifically, the first encapsulation layer portion 241 of the encapsulation layer 24 is etched to form the microlens unit 280, and the thickness of the microlens unit 280 may be equal to the second encapsulation layer portion 242 of the encapsulation layer 24, or the thickness of the microlens unit 280 may be less than the first encapsulation layer portion 241 of the encapsulation layer 24.

[0125] In this example, the thickness of the microlens unit 280 is smaller than the first encapsulation layer portion 241 of the encapsulation layer 24, and then the same material as the second encapsulation layer portion 242 of the encapsulation layer 24 can be filled above the microlens unit 280, and then the polarizing layer 23, the touch layer 22 and the cover layer 21 are sequentially arranged above the encapsulation layer 24, and the backplane layer 27 with the opening is arranged below the circuit driving layer 26 to obtain the complete display screen.

[0126] Reference Figure 3C As shown, it is based on the attached Figure 3B Another implementation of the manufacturing method. In this embodiment, the thickness of the microlens layer 28 is lower than the thickness of the second encapsulation layer portion 242 of the encapsulation layer 24, and then the polarization layer 23 is directly disposed above the encapsulation layer 24, and the light passes through the polarization layer 23, then through the gap between the polarization layer 23 and the microlens unit 280, then through the microlens layer 28, and then through the gap between the adjacent pixels 251 of the pixel layer 25 to reach the circuit driving layer 26.

[0127] It is worth noting that the microlens unit 280 formed by etching may also be coated or sprayed with an anti-reflection film or a material with a higher refractive index to increase the transmittance and refractive index of light at this position.

[0128] Reference Figure 3D As shown, it is based on the attached Figure 3B Another embodiment of the manufacturing method. In this embodiment, the thickness of the microlens layer 28 is lower than the thickness of the second encapsulation layer portion 242 of the encapsulation layer 24, and then a light-transmitting material is filled between the microlens unit 280 and the encapsulation layer 24, so that the microlens layer 28 and the encapsulation layer 24 are flush, and the refractive index of the filling material and the material of the second encapsulation layer portion 242 of the encapsulation layer 24 are different. Then, the polarizing layer 23 is arranged above the encapsulation layer 24, and the light passes through the polarizing layer 23, then through the gap between the encapsulation layer 24 and the microlens unit 280, then through the microlens layer 28, and then through the gap between the adjacent pixels 251 of the pixel layer 25 to reach the circuit driving layer 26.

[0129] It is worth noting that the microlens unit 280 formed by etching may also be coated or sprayed with an anti-reflection film or a material with a higher refractive index to increase the transmittance and refractive index of light at this position.

[0130] Reference Figure 3E As shown, it is based on the attached Figure 3BAnother implementation of the manufacturing method. In this embodiment, the encapsulation layer 24 is first obtained, and the encapsulation layer 24 includes two parts, one part is a first encapsulation layer part 241, and the other part is a second encapsulation layer part 242, wherein the first encapsulation layer part 241 and the second encapsulation layer part 242 are arranged to be spaced apart from each other. It is worth noting that the size of the interval between the first encapsulation layer part 241 and the second encapsulation layer part 242 can be determined by the size of the pixel 251 and the gap value of the pixel 251. The refractive index of the first encapsulation layer part 241 is greater than the refractive index of the second encapsulation layer part 242.

[0131] Then, the microlens unit 280 is formed on the first encapsulation layer portion 241 by etching, so that the microlens layer 28 is integrally formed on the encapsulation layer 24. The thickness of the microlens unit 280 may be less than the thickness of the encapsulation layer 24, or may be equal to the thickness of the encapsulation layer 24.

[0132] In this example, the thickness of the microlens unit 280 is equal to the thickness of the packaging layer 24, and specifically, an upper light-incoming surface of the microlens unit 280 and an upper surface of the packaging layer 24 are on the same surface, and a lower light-emitting surface of the microlens unit 280 and a lower surface of the packaging layer 24 are on the same surface.

[0133] In some embodiments of the present invention, the thickness of the microlens unit 280 is less than the thickness of the encapsulation layer 24, an upper light-incoming surface of the microlens unit 280 is lower than an upper surface of the encapsulation layer 24, and a lower light-emitting surface of the microlens unit 280 and a lower surface of the encapsulation layer 24 are on the same surface. In another embodiment of the present invention, the upper light-incoming surface of the microlens layer 28 is lower than the upper surface of the encapsulation layer 24 and the lower light-emitting surface of the microlens layer 28 is higher than the lower surface of the encapsulation layer 24.

[0134] Then, a filling material is filled between the micro lens unit 280 and the encapsulation layer 24 , and the filling material is the same as the material of the second encapsulation layer portion 242 of the encapsulation layer 24 .

[0135] The pixel layer 25 and the circuit driving layer 26 are then installed below the packaging layer 24 , and the microlens units 280 of the microlens layer 28 are aligned with the gaps between the adjacent pixels 251 of the pixel layer 25 .

[0136] Then, the polarizing layer 23, the touch layer 22 and the cover layer 21 are installed to obtain the display screen.

[0137] Reference Figure 3F, is another implementation of the method for manufacturing the display screen according to an embodiment of the present application. The main difference is that the thickness of the microlens is less than the thickness of the encapsulation layer 24, and the upper light-incoming surface of the microlens is lower than the upper surface of the encapsulation layer 24, and the lower light-emitting surface of the microlens is equal to the lower surface of the encapsulation layer 24.

[0138] The material filled between the encapsulation layer 24 and the microlens unit 280 has a refractive index greater than that of the material of the second encapsulation layer portion 242 of the encapsulation layer 24 , and is filled above the microlens layer 28 and flush with the encapsulation layer 24 .

[0139] Then, other layers are mounted on the packaging layer 24 to obtain the display screen.

[0140] Reference Figure 3G , is another implementation of the method for manufacturing the display screen according to an embodiment of the present application. The main difference is that the thickness of the microlens is less than the thickness of the encapsulation layer 24, the upper light-incoming surface of the microlens is lower than the upper surface of the encapsulation layer 24, and the lower light-emitting surface of the microlens is higher than the lower surface of the encapsulation layer 24.

[0141] Then, other layers are directly mounted on the packaging layer 24 to obtain the display screen.

[0142] In this example, the light passes through the gap between the polarization layer 23 and the microlens layer 28, then passes through the microlens layer 28, and then passes through the gap between the microlens layer 28 and the pixel layer 25, and the gaps between adjacent pixels 250 of the pixel layer 25, and finally reaches the circuit driving layer 26.

[0143] Fig. 6A FIG. 2 shows another variant implementation of the display screen 20 according to an embodiment of the present application. Fig. 6A As shown, in this modified embodiment, the microlens layer 28 has a membrane structure, which is first prefabricated and then attached to the pixel layer 25, wherein the attachment position of the microlens layer 28 and the arrangement of the microlens units 280 of the microlens layer 28 are such that when the microlens layer 28 is attached to the pixel layer 25, each of the microlens units 280 of the microlens layer 28 corresponds to each of the gaps 250 between the pixels 251, respectively, so as to improve the light transmittance of the display screen 20. Correspondingly, the encapsulation layer 24 is integrally formed on the microlens layer 28 and the pixel layer 25 to encapsulate the pixel layer 25 and the microlens layer 28. For example, the encapsulation layer 24 can be formed above the microlens layer 28 and the pixel layer 25 by a deposition process. Figure 3B , Attachment Figure 3C or attached Figure 3D The manufacturing method of integrally forming the microlens layer on the pixel layer described in the specification can also be applied to this embodiment.

[0144] It should be noted that in Figure 4B and Fig. 6A In the specific example of the display screen 20 shown, the microlens layer 28 is located in the encapsulation layer 24. In other words, the height dimension H of the microlens unit 280 (i.e., the height dimension of the microlens unit 280) is less than or equal to the height dimension of the encapsulation layer 24. When the height dimension of the cylindrical lens is equal to the height dimension of the encapsulation layer 24, the microlens layer 28 is tangent to the top surface of the encapsulation layer 24.

[0145] In particular, if the microlens unit 280 is implemented as a cylindrical lens, preferably, the bottom width W of the cylindrical lens (i.e., the lateral dimension of the microlens unit 280) is greater than the dimension of the gap 250 between the pixels 251, so that the cylindrical lens can fully cover the gap 250 between the pixels 251. It should be understood that when the cylindrical lens fully covers the gap 250 between the pixels 251, the light originally falling outside the gap 250 can be redirected to the gap 250 between the pixels 251 through the focusing effect of the cylindrical lens, so that part of the light can pass through the pixel layer 25 through the gap 250.

[0146] Furthermore, preferably, the bottom length L of the cylindrical lens (i.e., the longitudinal dimension of the microlens unit 280) is greater than or equal to the gap between adjacent pixels 251, so that the cylindrical lens can completely cover the gap 250 between each pixel 251 to increase the amount of light converged to the pixel gap 250. More preferably, the bottom length L of the cylindrical lens is an integer multiple of the size of a single gap between adjacent pixels 251. For example, the bottom length of the cylindrical lens can be set to the size of one gap, so that the array formed by the cylindrical lens can perfectly correspond to the array formed by the pixels 251.

[0147] In order to further enhance the light convergence effect of the microlens layer 28, preferably, in the application embodiment, the refractive index of the molding material of the microlens layer 28 is greater than the refractive index of the molding material of the encapsulation layer 24. It should be understood that the higher the refractive index, the stronger the bending ability of the light. Therefore, when the microlens layer 28 has a larger refractive index, a relatively larger range of light that originally falls outside the gap 250 can be redirected to the gap 250 between the pixels 251 through the focusing effect of the cylindrical lens. It should be understood that the light convergence effect increases with the increase of the difference in refractive index between the microlens layer 28 and the encapsulation layer 24.

[0148] Figure 6B FIG. 2 shows another variant implementation of the display screen 20 according to an embodiment of the present application. Figure 6B As shown, in this modified embodiment, the microlens layer 28 is a film structure.

[0149] Specifically, first, a recessed structure is etched in the encapsulation layer 24 corresponding to the gap between the adjacent pixels 251, and then a film is plated on the recessed structure, that is, the lower surface of the encapsulation layer 24 that is recessed inward is plated to form a film structure, and the film structure can play a role in converging light.

[0150] A certain gap may be left between the membrane structure and the pixel layer 25. In this example, a preset distance is left between the membrane structure and the pixel layer 25. That is, the membrane structure does not directly contact the pixel layer 25. After passing through the polarizing layer 23, the light passes through the encapsulation layer 24, then passes through the membrane structure of the microlens layer 28, then passes through the gap between the membrane structure and the pixel layer 25, and then passes through the pixel layer 25.

[0151] Figure 7 FIG. 2 shows another variant implementation of the display screen 20 according to an embodiment of the present application. Figure 7 As shown, in this modified implementation, the microlens layer 28 has a film structure, which is first prefabricated and then attached to the packaging layer 24, wherein the attachment position of the microlens layer 28 and the arrangement of the microlens units 280 of the microlens layer 28 are such that when the microlens layer 28 is attached to the packaging layer 24, each of the microlens units 280 of the microlens layer 28 corresponds to each of the gaps 250 between the pixels 251, so as to improve the light transmittance of the display screen 20.

[0152] It is noteworthy that the polarizing layer 23 is configured to have at least one accommodating space, wherein the accommodating space corresponds to the microlens unit 280 of the microlens layer 28, and the accommodating space is configured to match the microlens unit 280 having a membrane structure, and at least a portion of the microlens unit 280 can be accommodated in the accommodating space of the polarizing layer 23.

[0153] A lower surface of the polarizing layer 23 and an upper surface of the microlens layer 28 are configured to match each other. In this example, the lower surface of the polarizing layer 23 is configured to be at least partially concave inward, and at least a portion of the upper surface of the microlens layer 28 is configured to be at least partially convex outward, and the lower surface of the polarizing layer 23 can be attached to the upper surface of the microlens layer 28.

[0154] It can be seen that compared with Figure 5 and Fig. 6A , 6B In the display screen 20 shown in the figure, in this modified embodiment, the microlens layer 28 is not in direct contact with the pixel layer 25, that is, a layer of the encapsulation layer 24 is separated from the microlens layer 28 and the pixel layer 25, however, each of the microlens units 280 of the microlens layer 28 still corresponds to each of the gaps 250 between the pixels 251, therefore, the microlens layer 28 can still make more light converge to each of the gaps 250 between the pixels 251, so as to improve the light transmittance of the display screen 20.

[0155] Fig. 8A FIG. 2 shows another variant implementation of the display screen 20 according to an embodiment of the present application. Fig. 8A As shown, in this modified implementation, the microlens layer 28 is concavely formed integrally on the top surface of the encapsulation layer 24 (for example, by an etching process). Specifically, at least a portion of the polarizing layer 23 may be etched so that a bottom surface of the polarizing layer 23 is concave inwardly, and then the concave position of the bottom surface of the polarizing layer 23 is filled to form the microlens unit 280. The filling material may be a transparent material with a high refractive index.

[0156] Furthermore, by adjusting the amount of the filling material, the micro-projection mirror unit 280 and the polarization layer 23 can be made flush.

[0157] The molding position of the microlens layer 28 and the arrangement of the microlens units 280 of the microlens layer 28 enable, when the microlens layer 28 is integrally molded on the top surface of the encapsulation layer 24, the microlens units 280 of the microlens layer 28 respectively correspond to the gaps 250 between the pixels 251, so as to improve the light transmittance of the display screen 20.

[0158] It is worth mentioning that in this modified implementation, the microlens layer 28 and the encapsulation layer 24 have an integrated structure, and such a structural feature is conducive to the preparation of the display screen 20. For example, during the preparation process, the microlens layer 28 and the encapsulation layer 24 can be prepared as one element in the same process, so as to reduce the preparation process and preparation cost of the display screen 20.

[0159] Figure 8B FIG. 2 shows another variant implementation of the display screen 20 according to an embodiment of the present application. Figure 8B As shown, in this modified implementation, the microlens layer 28 is a film structure and is disposed on the polarization layer 23 .

[0160] Specifically, first, a recessed structure is etched in the polarization layer 23 corresponding to the gap between the adjacent pixels 251, and then a film is coated on the recessed structure, that is, the inwardly recessed lower surface of the polarization layer 23 is coated to form a film structure, and the film structure can play a role in converging light.

[0161] A certain gap may be left between the membrane structure and the pixel layer 25. In this example, a preset distance is left between the membrane structure and the pixel layer 25. That is, the membrane structure does not directly contact the pixel layer 25. After passing through the polarizing layer 23, the light passes through the membrane structure of the microlens layer 28, then passes through the gap between the membrane structure and the encapsulation layer 24, and then passes through the encapsulation layer 24 to reach the pixel layer 25.

[0162] Fig. 9 FIG. 2 shows another variant implementation of the display screen 20 according to an embodiment of the present application. Fig. 9 As shown, in this modified implementation, the microlens layer 28 is protrudingly integrally formed on the top surface of the packaging layer 24 (for example, through a deposition process), wherein the molding position of the microlens layer 28 and the arrangement of the microlens units 280 of the microlens layer 28 are such that when the microlens layer 28 is integrally formed on the top surface of the packaging layer 24, each of the microlens units 280 of the microlens layer 28 corresponds to each of the gaps 250 between the pixels 251, so as to improve the light transmittance of the display screen 20.

[0163] It is worth mentioning that in this modified implementation, the microlens layer 28 and the encapsulation layer 24 have an integrated structure, and such a structural feature is conducive to the preparation of the display screen 20. For example, during the preparation process, the microlens layer 28 and the encapsulation layer 24 can be prepared as one element in the same process, so as to reduce the preparation process and preparation cost of the display screen 20.

[0164] In summary, the display screen 20 used in the present application does not require a substantial adjustment to the existing structure of the existing display screen 20, and only requires an additional layer of the microlens layer 28 corresponding to each pixel gap 250 in the pixel layer 25 to be provided above the pixel layer 25 of the display screen 20. Accordingly, the process for preparing the microlens layer 28 is relatively simple, with high preparation efficiency and low cost.

[0165] Exemplary display screen manufacturing method

[0166] According to another aspect of the present application, the present application also provides a display screen manufacturing method for manufacturing a display screen with relatively high light transmittance.

[0167] Fig.10 FIG. 1 is a schematic diagram showing a process for preparing the display screen 20 according to an embodiment of the present application. Fig.10 As shown, in the preparation process, the circuit driving layer 26 is first prefabricated, and the pixel layer 25 is formed on the circuit driving layer 26, wherein the circuit driving layer 26 is electrically connected to the pixel layer 25 to drive the pixel layer 25 to work. Those skilled in the art should know that the mainstream production process of the pixel layer 25 in the current OLED display screen is the evaporation process. In simple terms, the evaporation process is to evaporate the evaporated material into atoms or molecules in a vacuum through methods such as electric current heating, electron beam bombardment heating and laser heating. They then move in a straight line with a large free path, collide with the surface of the substrate and condense to form a thin film. In addition, in addition to using the evaporation process to "evaporate" each pixel 251 in the OLED screen, a printing process can also be used, that is, the organic material film of the display is prepared by printing.

[0168] Furthermore, if Fig.10 As shown, the microlens layer 28 is integrally formed on the pixel layer 25, wherein each microlens unit 280 of the microlens layer 28 corresponds to the gap 250 between each pixel 251 in the pixel layer 25. For example, the microlens units 280 can be formed on the gap 250 between each pixel 251 of the pixel layer 25 by a deposition process, and in this way, the microlens layer 28 is integrally formed on the pixel layer 25.

[0169] Furthermore, if Fig.10As shown, the encapsulation layer 24 is formed on the microlens layer 28 and the pixel layer 25, so that the microlens layer 28 and the pixel layer 25 are encapsulated by the encapsulation layer 24. For example, the encapsulation layer 24 can also be integrally formed on the pixel layer 25 and the microlens layer 28 by a deposition process, so that the pixel layer 25 and the microlens layer 28 are encapsulated by the encapsulation layer 24. Further, the polarization layer 23, the touch layer 22 and the cover plate 21 are sequentially formed on the encapsulation layer 24 to form the display screen 20 in combination.

[0170] Optionally, a backplane layer 27 with openings 270 may be further mounted on the bottom side of the circuit driving layer 26 to strengthen the structural strength of the display screen 20 through the backplane layer 27. In particular, the openings 270 of the backplane layer 27 are opened at the light-transmitting portion of the display screen 20.

[0171] It should be understood that the microlens layer 28 is formed in the packaging layer 24 and corresponds to the gap 250 between each pixel 251, so that when light sequentially passes through the cover layer 21, the touch layer 22, the polarization layer 22 and the packaging layer 24 and reaches the microlens layer 28, the microlens layer 28 converges the light to the gap 250 between each pixel 251, so that a relatively large number of light can pass through the pixel layer 25 through the gap 250. Furthermore, the light passing through the pixel layer 25 can further pass through the circuit driving layer 26 to reach the bottom side of the display screen 20. In this way, the overall light transmittance of the display screen 20 can be effectively improved.

[0172] Particularly, in the above manufacturing method, the refractive index of the material forming the microlens layer 28 is greater than the refractive index of the material forming the encapsulation layer 24 .

[0173] Fig.11 FIG. 2 is a schematic diagram showing another process for preparing the display screen 20 according to an embodiment of the present application. Fig.11As shown, in the preparation process, the circuit driving layer 26 is first prefabricated, and the pixel layer 25 is formed on the circuit driving layer 26, wherein the circuit driving layer 26 is electrically connected to the pixel layer 25 to drive the pixel layer 25 to work. Those skilled in the art should know that the mainstream production process of the pixel layer 25 in the OLED display screen is the evaporation process. In simple terms, the evaporation process is to evaporate the evaporated material into atoms or molecules in a vacuum by methods such as electric current heating, electron beam bombardment heating and laser heating. They then move in a straight line with a large free path, collide with the surface of the substrate and condense to form a thin film. In addition, in addition to using the evaporation process to "evaporate" each pixel 251 in the OLED screen, a printing process can also be used, that is, the organic material film of the display is prepared by printing.

[0174] like Fig.11 As shown, further, the microlens layer 28 having a film structure is prefabricated, and the microlens layer 28 is attached to the pixel layer 25. In particular, in the embodiment of the present application, the attachment position of the microlens layer 28 and the arrangement of the microlens units 280 of the microlens layer 28 enable each of the microlens units 280 of the microlens layer 28 to correspond to each of the gaps 250 between the pixels 251 when the microlens layer 28 is attached to the pixel layer 25, so as to improve the light transmittance of the display screen 20.

[0175] like Fig.11 As shown, further, the encapsulation layer 24 is formed on the microlens layer 28 and the pixel layer 25, so that the microlens layer 28 and the pixel layer 25 are encapsulated by the encapsulation layer 24. For example, the encapsulation layer 24 can be integrally formed on the pixel layer 25 and the microlens layer 28 by a deposition process, so that the pixel layer 25 and the microlens layer 28 are encapsulated by the encapsulation layer 24. Further, the polarization layer 23, the touch layer 22 and the cover plate 21 are sequentially formed on the encapsulation layer 24 to form the display screen 20 in combination.

[0176] Optionally, a backplane layer 27 with openings 270 may be further mounted on the bottom side of the circuit driving layer 26 to strengthen the structural strength of the display screen 20 through the backplane layer 27. In particular, the openings 270 of the backplane layer 27 are opened at the light-transmitting portion of the display screen 20.

[0177] It should be understood that the microlens layer 28 is located in the encapsulation layer 24 and the microlens unit 280 corresponds to the gap 250 between each pixel 251 in the pixel layer 25, so that when light sequentially passes through the cover layer 21, the touch layer 22, the polarization layer 23 and the encapsulation layer 24 to reach the microlens layer 28, the microlens layer 28 converges the light to the gap 250 between each pixel 251, so that a relatively large number of light can pass through the pixel layer 25 through the gap 250. Furthermore, the light passing through the pixel layer 25 can further pass through the circuit driving layer 26 to reach the bottom side of the display screen 20. In this way, the overall light transmittance of the display screen 20 can be effectively improved.

[0178] Particularly, in the above manufacturing method, the refractive index of the material forming the microlens layer 28 is greater than the refractive index of the material forming the encapsulation layer 24 .

[0179] Fig.12 FIG. 2 is a schematic diagram showing another process for preparing the display screen 20 according to an embodiment of the present application. Fig.12 As shown, in the preparation process, the circuit driving layer 26 is first prefabricated, and the pixel layer 25 is formed on the circuit driving layer 26, wherein the circuit driving layer 26 is electrically connected to the pixel layer 25 to drive the pixel layer 25 to work. Those skilled in the art should know that the mainstream production process of the pixel layer 25 in the OLED display screen is the evaporation process. In simple terms, the evaporation process is to evaporate the evaporated material into atoms or molecules in a vacuum by methods such as electric current heating, electron beam bombardment heating and laser heating. They then move in a straight line with a large free path, collide with the surface of the substrate and condense to form a thin film. In addition, in addition to using the evaporation process to "evaporate" each pixel 251 in the OLED screen, a printing process can also be used, that is, the organic material film of the display is prepared by printing.

[0180] like Fig.12 As shown, further, an encapsulation layer 24 is integrally formed on the pixel layer 25, so as to encapsulate the pixel layer 25 by the encapsulation layer 24. Further, a microlens layer 28 is integrally formed on the top surface of the encapsulation layer 24, wherein the microlens layer 28 includes microlens units 280 arranged in an array, and each microlens unit 280 corresponds to the gap 250 between the pixels 251 of the pixel layer 25.

[0181] Specifically, during the preparation process, the microlens layer 28 is integrally formed on the top surface of the encapsulation layer 24 by a process such as deposition. Fig.12As shown, the microlens layer 28 after molding protrudes from the top surface of the packaging layer 24 , and each of the microlens units 280 of the microlens layer 28 corresponds to each of the gaps 250 between the pixels 251 .

[0182] It is worth mentioning that since the microlens layer 28 is integrally formed on the top surface of the encapsulation layer 24, that is, the microlens layer 28 and the encapsulation layer 24 have an integrated structure, during the preparation process, the microlens layer 28 can be pre-integrated on the top surface of the encapsulation layer 24, and then the encapsulation layer 24 with the microlens layer 28 is attached to the top of the pixel layer 25, as shown in FIG. Fig.13 shown.

[0183] like Fig.12 As shown, further, the polarization layer 23 , the touch layer 22 and the cover plate 21 are sequentially formed on the microlens layer 28 to form the display screen 20 in combination.

[0184] Optionally, a backplane layer 27 with openings 270 may be further mounted on the bottom side of the circuit driving layer 26 to strengthen the structural strength of the display screen 20 through the backplane layer 27. In particular, the openings 270 of the backplane layer 27 are opened at the light-transmitting portion of the display screen 20.

[0185] It should be understood that the microlens layer 28 is formed on the top side of the encapsulation layer 24 and the microlens unit 280 corresponds to the gap 250 between each pixel 251 in the pixel layer 25, so that when the light sequentially passes through the cover layer 21, the touch layer 22 and the polarization layer 23 to reach the microlens layer 28, the microlens layer 28 gathers the light and passes through the encapsulation layer 24 to reach the gap 250 between each pixel 251, so that a relatively large number of light can pass through the pixel layer 25 through the gap 250. Furthermore, the light passing through the pixel layer 25 can further pass through the circuit driving layer 26 to reach the bottom side of the display screen 20. In this way, the overall light transmittance of the display screen 20 can be effectively improved.

[0186] Particularly, in the above manufacturing method, the refractive index of the material forming the microlens layer 28 is greater than the refractive index of the material forming the encapsulation layer 24 .

[0187] Fig.14 FIG. 2 is a schematic diagram showing another process for preparing the display screen 20 according to an embodiment of the present application. Fig.14As shown, in the preparation process, the circuit driving layer 26 is first prefabricated, and the pixel layer 25 is formed on the circuit driving layer 26, wherein the circuit driving layer 26 is electrically connected to the pixel layer 25 to drive the pixel layer 25 to work. Those skilled in the art should know that the mainstream production process of the pixel layer 25 in the OLED display screen is the evaporation process. In simple terms, the evaporation process is to evaporate the evaporated material into atoms or molecules in a vacuum by methods such as electric current heating, electron beam bombardment heating and laser heating. They then move in a straight line with a large free path, collide with the surface of the substrate and condense to form a thin film. In addition, in addition to using the evaporation process to "evaporate" each pixel 251 in the OLED screen, a printing process can also be used, that is, the organic material film of the display is prepared by printing.

[0188] like Fig.14 As shown, further, an encapsulation layer 24 is integrally formed on the pixel layer 25, so as to encapsulate the pixel layer 25 by the encapsulation layer 24. Further, a microlens layer 28 is integrally formed on the top surface of the encapsulation layer 24, wherein the microlens layer 28 includes microlens units 280 arranged in an array, and each microlens unit 280 corresponds to the gap 250 between the pixels 251 of the pixel layer 25.

[0189] Specifically, during the preparation process, the microlens layer 28 is integrally formed on the top surface of the encapsulation layer 24 by a process such as etching. Fig.14 As shown, the microlens layer 28 after molding is formed concavely on the top surface of the packaging layer 24 , and each of the microlens units 280 of the microlens layer 28 corresponds to each of the gaps 250 between the pixels 251 .

[0190] It is worth mentioning that since the microlens layer 28 is integrally formed on the top surface of the encapsulation layer 24, that is, the microlens layer 28 and the encapsulation layer 24 have an integrated structure, during the preparation process, the microlens layer 28 can be pre-integrated on the top surface of the encapsulation layer 24, and then the encapsulation layer 24 with the microlens layer 28 is attached to the top of the pixel layer 25, as shown in FIG. Fig.15 shown.

[0191] like Fig.14 As shown, further, the polarization layer 23 , the touch layer 22 and the cover plate 21 are sequentially formed on the microlens layer 28 to form the display screen 20 in combination.

[0192] Optionally, a backplane layer 27 with openings 270 may be further mounted on the bottom side of the circuit driving layer 26 to strengthen the structural strength of the display screen 20 through the backplane layer 27. In particular, the openings 270 of the backplane layer 27 are opened at the light-transmitting portion of the display screen 20.

[0193] It should be understood that the microlens layer 28 is formed on the top side of the packaging layer 24 and the microlens unit 280 corresponds to the gap 250 between each pixel 251 in the pixel layer 25, so that part of the light sequentially passes through the cover layer 21, the touch layer 22 and the polarization layer 23 to reach the microlens layer 28, and when part of the light sequentially passes through the cover layer 21, the touch layer 22, the polarization layer 23, the gap between the polarization layer 23 and the microlens layer 28, and the microlens layer 28, the microlens layer 28 gathers the light and passes through the packaging layer 24 to reach the gap 250 between each pixel 251, so that a relatively large number of light can pass through the pixel layer 25 through the gap 250. Furthermore, the light passing through the pixel layer 25 can further pass through the circuit driving layer 26 to reach the bottom side of the display screen 20. In this way, the overall light transmittance of the display screen 20 can be effectively improved.

[0194] Particularly, in the above manufacturing method, the refractive index of the material forming the microlens layer 28 is greater than the refractive index of the material forming the encapsulation layer 24 .

[0195] Fig.16 FIG. 2 is a schematic diagram showing another process for preparing the display screen 20 according to an embodiment of the present application. Fig.16 As shown, in the preparation process, the circuit driving layer 26 is first prefabricated, and the pixel layer 25 is formed on the circuit driving layer 26, wherein the circuit driving layer 26 is electrically connected to the pixel layer 25 to drive the pixel layer 25 to work. Those skilled in the art should know that the mainstream production process of the pixel layer 25 in the OLED display screen is the evaporation process. In simple terms, the evaporation process is to evaporate the evaporated material into atoms or molecules in a vacuum by methods such as electric current heating, electron beam bombardment heating and laser heating. They then move in a straight line with a large free path, collide with the surface of the substrate and condense to form a thin film. In addition, in addition to using the evaporation process to "evaporate" each pixel 251 in the OLED screen, a printing process can also be used, that is, the organic material film of the display is prepared by printing.

[0196] like Fig.16As shown, further, an encapsulation layer 24 is integrally formed on the pixel layer 25, so as to encapsulate the pixel layer 25 by the encapsulation layer 24. Further, the microlens layer 28 having a film structure is prefabricated, and the microlens layer 28 is attached to the top surface of the encapsulation layer 24. In particular, in the embodiment of the present application, the attachment position of the microlens layer 28 and the layout of each microlens unit 280 of the microlens layer 28 make it possible for each microlens unit 280 of the microlens layer 28 to correspond to each gap 250 between the pixels 251 when the microlens layer 28 is attached to the encapsulation layer 24, so as to improve the light transmittance of the display screen 20.

[0197] like Fig.16 As shown, further, the polarization layer 23 , the touch layer 22 and the cover plate 21 are sequentially formed on the microlens layer 28 to form the display screen 20 in combination.

[0198] Optionally, a backplane layer 27 with openings 270 may be further mounted on the bottom side of the circuit driving layer 26 to strengthen the structural strength of the display screen 20 through the backplane layer 27. In particular, the openings 270 of the backplane layer 27 are opened at the light-transmitting portion of the display screen 20.

[0199] It should be understood that the microlens layer 28 is formed on the top side of the encapsulation layer 24 and the microlens unit 280 corresponds to the gap 250 between each pixel 251 in the pixel layer 25, so that when the light sequentially passes through the cover layer 21, the touch layer 22 and the polarization layer 23 to reach the microlens layer 28, the microlens layer 28 gathers the light and passes through the encapsulation layer 24 to reach the gap 250 between each pixel 251, so that a relatively large number of light can pass through the pixel layer 25 through the gap 250. Furthermore, the light passing through the pixel layer 25 can further pass through the circuit driving layer 26 to reach the bottom side of the display screen 20. In this way, the overall light transmittance of the display screen 20 can be effectively improved.

[0200] Particularly, in the above manufacturing method, the refractive index of the material forming the microlens layer 28 is greater than the refractive index of the material forming the encapsulation layer 24 .

[0201] Exemplary terminal equipment

[0202] According to another aspect of the present application, the present application also provides a terminal device, which can be in various forms. For example, the terminal device described in the present application can include mobile terminals such as mobile phones, smart phones, laptops, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), navigation devices, smart watches, etc., as well as fixed terminals such as digital TVs and desktop computers. In the following, the terminal device is set to be a mobile terminal, and it is assumed that the mobile terminal is a smart phone (such as Fig.17 As shown), the present application is described. However, it will be understood by those skilled in the art that, in addition to components specifically used for mobile purposes, the construction according to the embodiments of the present application can also be applied to fixed-type terminals. For ease of understanding and description, the embodiments of the present application are all described using smartphones as examples, and other application scenarios can be referenced to each other.

[0203] Fig.17 A specific example of a terminal device according to an embodiment of the present application is illustrated, wherein in this specific example, the terminal device is implemented as a smart phone. Fig.17 As shown, the terminal device includes a terminal body 10, a camera module 30 and a display screen 20 as described above.

[0204] The terminal body 10 includes a shell 11 that is set to form the outer contour of the terminal device and a mainboard 12 for installing the control circuit and power supply circuit of the terminal device, wherein the size of the mainboard 12 is smaller than the size of the receiving space defined by the shell 11, so that the mainboard 12 can be installed in the shell 11 in a "flat" manner. The display screen 20 is installed in the shell 11 and serves as a display module of the terminal device, wherein the display screen 20 is electrically connected to the mainboard 12 to power the display screen 20 through the mainboard 12 to realize the image display function. In particular, in the embodiment of the present application, the display screen 20 is installed at the top opening of the shell 11 to define the top surface of the terminal setting through the display screen 20, and the camera module 30 is arranged below the display screen 20 and is accommodated in the shell 11, serving as the camera module of the terminal device.

[0205] It should be understood that when the camera module 30 is disposed below the display screen 20, the screen ratio of the terminal device (the ratio of the display screen 20 to the top surface of the terminal device) can be further increased (the limit can be increased to 100%). In other words, in the embodiment of the present application, the camera module 30 is configured as an under-screen camera module 30, which is installed at a different height position from the housing 11 with the display screen 20, so that the camera module 30 is not an obstacle to increasing the screen ratio.

[0206] Preferably, in the embodiment of the present application, the housing 11 adopts a "narrow" frame design, that is, the edge width of the housing 11 can be regarded as negligible relative to the width of the display screen 20. In this way, the screen ratio of the terminal device can be further increased (the limit can be increased to 100%).

[0207] It should be noted that in the embodiment of the present application, the camera module 30 is arranged below the display screen 20. As mentioned above, the core technical problem that the traditional terminal device cannot implement the "under-screen camera module 30" technical solution is that when the camera module 30 is arranged below the display screen 20, it cannot collect a sufficient amount of imaging light from the outside, resulting in the imaging function of the camera module 30 being difficult to achieve. Accordingly, in the embodiment of the present application, the light transmittance of the display screen 20 is effectively increased by additionally providing a layer of microlens layer 28 in the display screen 20, and the position where the camera module 30 is installed below the display screen 20 corresponds to the position of the microlens layer 28 in the display screen 20. In this way, when the camera module 30 is arranged below the display screen 20, the imaging light from the outside can still pass through the display screen 20 (from its front to its back) and reach the camera module 30 for imaging, such as Fig.18 shown.

[0208] Specifically, when the display screen 20 is implemented as Figure 2 When the display screen 20 is shown in FIG6 , the imaging path (or photosensing path) of the camera module 30 is as follows: first, external light passes through the cover layer 21, the touch layer 22, the polarizing layer 23 and the encapsulation layer 24 of the display screen 20 to reach the microlens layer 28 arranged on the pixel layer 25, wherein each of the microlens units 280 of the microlens layer 28 corresponds to the gap 250 between each of the pixels 251 in the pixel layer 25; then, the light reaching the microlens layer 28 is refracted at each of the microlens units 280 and converges toward the gap 250 between the corresponding pixels 251, so that relatively more light can pass through the pixel layer 25 through the gap 250 between the pixels 251; then, the light passing through the pixel layer 25 can further pass through the circuit driving layer 26 to be collected by the camera module 30 arranged below the circuit driving layer 26 for imaging reaction.

[0209] Specifically, when the display screen 20 is implemented as Figures 7 to 9When the display screen 20 is shown, the imaging path (or the photosensitive path) of the camera module 30 is The method is as follows: first, external light passes through the cover layer 21, the touch layer 22 and the polarization layer 23 of the display screen 20 to reach the microlens layer 28 disposed on the encapsulation layer 24, wherein each of the microlens units 280 of the microlens layer 28 corresponds to the gap 250 between each of the pixels 251 in the pixel layer 25 through the encapsulation layer 24; then, the light reaching the microlens layer 28 is refracted at each of the microlens units 280 and converges in the direction of the gap 250 between the corresponding pixels 251; then, this part of the converged light passes through the encapsulation layer 24 and then enters the gap 250 between the corresponding pixels 251, in this way, relatively more light can pass through the pixel layer 25 through the gap 250 between the pixels 251; then, the light passing through the pixel layer 25 can further pass through the circuit driving layer 26 to be collected by the camera module 30 disposed below the circuit driving layer 26 for imaging reaction.

[0210] It is worth mentioning that when the display screen 20 is implemented as the display screen 20 as shown in FIG. 3 (that is, the display screen 20 also includes a backplane layer 27 having an opening 270), the imaging path (or light sensing path) of the camera module 30 is as follows: first, external light passes through the cover layer 21, the touch layer 22, the polarization layer 23 and the encapsulation layer 24 of the display screen 20 to reach the microlens layer 28 disposed on the pixel layer 25, wherein each of the microlens units 280 of the microlens layer 28 corresponds to the gap 250 between each of the pixels 251 in the pixel layer 25; then, the light reaching the microlens layer 28 is refracted at each of the microlens units 280 and converges to the gap 250 between the corresponding pixels 251, so that relatively more light can pass through the pixel layer 25 through the gap 250 between the pixels 251; then, the light passing through the pixel layer 25 The light can further pass through the opening 270 of the circuit driving layer 26 and the backplane layer 27 to be collected by the camera module 30 disposed at the bottom of the display screen 20 for imaging response.

[0211] Alternatively, the imaging path (or photosensing path) of the camera module 30 is as follows: first, external light passes through the cover layer 21, the touch layer 22 and the polarization layer 23 of the display screen 20 to reach the microlens layer 28 arranged on the encapsulation layer 24, wherein each of the microlens units 280 of the microlens layer 28 corresponds to the gap 250 between each of the pixels 251 in the pixel layer 25 through the encapsulation layer 24; then, the light reaching the microlens layer 28 is refracted at each of the microlens units 280 and converges in the direction of the gap 250 between the corresponding pixels 251; then, this part of the converged light passes through the encapsulation layer 24, and then enters the gap 250 between the corresponding pixels 251, in this way, relatively more light can pass through the pixel layer 25 through the gap 250 between the pixels 251; then, through the pixel layer 25 The light can further pass through the opening 270 of the circuit driving layer 26 and the backplane layer 27 to be collected by the camera module 30 disposed at the bottom of the display screen 20 for imaging response.

[0212] In particular, when the display screen 20 includes the back panel layer 27 arranged at the bottom thereof, optionally, the camera module 30 can be installed below the display screen 20 and correspond to the opening 270 of the back panel layer 27; or, when the size of the opening 270 matches the camera module 30, the camera module 30 can be directly installed in the opening 270 of the back panel layer 27, wherein installing the camera module 30 in the opening 270 of the back panel layer 27 can not only make the light passing through the circuit driving layer 26 directly collected by the camera module 30, but also can reduce the overall height size of the terminal device, which will be further elaborated in the subsequent description.

[0213] Although the camera module 30 can be configured as an under-screen camera module 30 due to the relatively high light transmittance of the display screen 20, so that the screen ratio of the terminal device can be further increased. However, in terms of spatial relationship, since the camera module 30 is arranged below the display screen 20 and both are accommodated in the housing 11 of the terminal device, the height dimension of the housing 11 needs to be increased, that is, the overall height dimension of the terminal device needs to be increased, which is contrary to the current trend of terminal devices towards thinning.

[0214] Accordingly, a technical solution for reducing the overall height dimension of the terminal device has been provided above. Specifically, when the display screen 20 is implemented as the display screen 20 as shown in FIG3 , that is, the display screen 20 includes a back panel layer 27 having an opening 270, wherein the opening 270 corresponds to the microlens layer 28. In particular, in order to reduce the overall height dimension of the terminal device, preferably, the opening 270 of the back panel layer 27 has a size that matches the camera module 30, so that the camera module 30 can be directly installed in the opening 270 of the back panel layer 27, as shown in FIG. Fig.19 In other words, in this case, the opening 270 of the back plate layer 27 is not only a light-transmitting hole of the display screen 20, but also a mounting reference hole of the camera module 30. It should be understood that when the camera module 30 is mounted at the opening 270 of the back plate layer 27, the overall height of the display screen 20 and the camera module 30 can be effectively reduced, so that the overall height of the terminal device can be reduced.

[0215] It should be understood that when the opening 270 of the back plate layer 27 does not match the size of the camera module 30, for example, the size of the opening 270 is larger than the size of the camera module 30, in this case, the terminal device may further provide an auxiliary mounting member 13, the auxiliary mounting member 13 is installed in the opening 270 of the back plate, and is used to install the camera module 30 therein, such as Fig. 20 As shown. For example, the auxiliary mounting member 13 may be implemented as a tubular member with a through hole, wherein the outer diameter of the tubular member is equal to the caliber of the opening 270, and the inner diameter of the through hole of the tubular member matches the size of the camera module 30, so that the camera module 30 can still be installed at the opening 270 of the back plate layer 27 by means of the tubular member. Preferably, the height of the tubular member is equal to or slightly smaller than the height dimension of the opening 270, so that when the camera module 30 is installed in the through hole of the tubular member, the overall height dimension of the camera module 30 and the display screen 20 can be reduced, so that the camera module 30 can be directly installed in the opening 270 of the back plate layer 27.

[0216] In order to further reduce the overall height of the terminal device, preferably, in the embodiment of the present application, a camera module 30 with a lower height is adopted.

[0217] Fig.21 FIG. 2 shows a specific example of the camera module 30 according to an embodiment of the present application. Fig.21As shown, in this specific implementation, the camera module 30 includes a circuit board 31, a photosensitive chip 32 and a light-transmitting component 33, wherein the circuit board 31 has a groove 310, the photosensitive chip 32 is disposed in the groove 310 and electrically connected to the circuit board 31, and the light-transmitting component 33 is located on the light-sensing path of the photosensitive chip 32. In this way, the imaging light passing through the display screen 20 first reaches the light-transmitting component 33, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0218] Those skilled in the art should know that in the existing camera module based on COB technology, the circuit board has a flat surface, and the photosensitive chip is directly attached and electrically connected to the flat surface of the circuit board. Since each camera module has a preset optical back focus requirement, the installation reference height of the photosensitive chip directly determines the overall height dimension of the camera module 30.

[0219] Accordingly, compared to the existing camera module based on COB process, in this specific example, the circuit board 31 is provided with the groove 310, so as to reduce the installation reference height of the photosensitive chip 32 through the groove 310. In other words, in the embodiment of the present application, the top surface of the circuit board 31 is a non-flat surface, wherein the area of ​​the circuit board 31 for installing the photosensitive chip 32 is recessed downward, so that the installation reference height of the photosensitive chip 32 can be reduced. It should be understood that, under the premise that the optical back focus requirement remains unchanged, the installation height of the optical lens 332 relative to the circuit board 31 can be reduced, so that the overall height dimension of the camera module 30 can be reduced.

[0220] Preferably, in this specific example, the size of the groove 310 is consistent with the size of the photosensitive chip 32, so that the groove 310 itself can be used to position and limit the photosensitive chip 32. Specifically, in the process of installing the photosensitive chip 32 in the groove 310, the photosensitive chip 32 can be directly and fittingly embedded in the groove 310, without the need to constantly calibrate and locate the installation position of the photosensitive chip on the circuit board as in the existing COB process-based camera module. Furthermore, after the photosensitive chip 32 is installed in the groove 310 and electrically connected to the circuit board 31, the photosensitive chip 32 is "confined" in the groove 310 to prevent the photosensitive chip 32 from detaching from the groove 310 or being offset.

[0221] Furthermore, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is attached to the groove 310 of the circuit board 31, the electrical connection between the photosensitive chip 32 and the circuit board 31 is realized through the leads 34. Specifically, each of the leads 34 extends between the photosensitive chip 32 and the circuit board 31 in a curved manner, so as to connect the photosensitive chip 32 to the circuit board 31 through the leads 34, so that the circuit board 31 can supply power to the photosensitive chip 32 according to the leads 34, and the photosensitive chip 32 can transmit the collected signal according to the leads 34.

[0222] It is worth mentioning that in this specific example, the type of the lead 34 is not limited by the present application, for example, the lead 34 can be a gold wire, a silver wire, or a copper wire. Moreover, the lead 34 can be installed between the circuit board 31 and the photosensitive chip 32 by a "gold wire" process to achieve electrical connection between the two.

[0223] Specifically, the "gold wire punching" process is generally divided into two types: "positive gold wire punching" process and "reverse gold wire punching" process. The "positive gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the circuit board 31, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the photosensitive chip 32. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. The "reverse gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the photosensitive chip 32, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the circuit board 31. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the height of the upward protrusion of the lead 34 formed by the "reverse gold wire punching" process is lower than the height of the upward protrusion of the lead 34 formed by the "forward gold wire punching" process. Therefore, preferably, in this specific implementation, the "reverse gold wire punching" process is used to form the lead 34.

[0224] Furthermore, the camera module 30 further includes a base 35, which is disposed on the circuit board 31 to support the light-transmitting component 33. The light-transmitting component 33 includes a color filter element 331 and an optical lens 332, and the color filter element 331 and the optical lens 332 are sequentially disposed on the light-sensing path of the photosensitive chip 32.

[0225] Specifically, in this specific example, the base 35 can be implemented as a traditional plastic bracket, which is prefabricated and attached to the top surface of the circuit board 31; or, the base 35 can be implemented as a molded base, which can be integrally molded on the corresponding position of the circuit board 31 and / or the photosensitive chip 32 through MOB (Molding on Board) and MOC (Molding on Chip) processes. Those skilled in the art should know that the MOB (Molding on Board) process refers to integrally molding the molded base on the circuit board 31 through a molding process, wherein the molded base after molding integrally covers the circuit board 31 and the electronic components 312 located on the circuit board 31. The MOC process refers to integrally forming the molded base on the circuit board 31 through a molding process, wherein the molded base after molding not only covers the circuit board 31 and the electronic components 312 located on the circuit board 31, but also covers at least a portion of the lead 34, or covers the lead 34 and at least a portion of the photosensitive chip 32 (wherein at least a portion of the photosensitive chip 32 is a non-photosensitive area of ​​the photosensitive chip 32).

[0226] In this specific example, the color filter element 331 is disposed between the optical lens 332 and the photosensitive element, so that the light entering the interior of the camera module 30 from the optical lens 332 can be received and photoelectrically converted by the photosensitive chip 32 only after being filtered by the color filter element 331, so as to improve the imaging quality of the camera module 30. For example, the color filter element 331 can be used to filter the infrared part of the light entering the interior of the camera module 30 from the optical lens 332.

[0227] Those skilled in the art should know that the color filter element 331 can be implemented as different types, including but not limited to the color filter element 331 can be implemented as an infrared cutoff filter, a full spectrum filter and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 32. In this way, when the camera module 30 is used in an environment with sufficient light such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive chip 32, so that the infrared cutoff filter can be used to filter the infrared rays in the light reflected by the object entering the camera module 30. Moreover, when the camera module 30 is used in an environment with darker light such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 32 to allow the infrared rays in the light reflected by the object entering the camera module 30 to be partially transmitted.

[0228] It is worth mentioning that the color filter element 331 can also be arranged at other positions on the photosensitive path of the photosensitive chip 32. For example, the color filter element 331 is arranged at the bottom of the optical lens 332, the bottom of the optical lens 332, etc., which is not limited to this application.

[0229] In addition, it is worth mentioning that in this specific example, the camera module 30 can be implemented as a fixed focus module or a dynamic focus module, wherein, when the camera module 30 is a dynamic focus module, the camera module 30 further includes a driver 36 connected to the circuit board 31, and the driver 36 is used to controllably drive the lens to move to achieve auto-focus (Auto-Focus).

[0230] Fig. 22 Another specific example of the camera module 30 according to an embodiment of the present application is shown in the figure, wherein: Fig. 22 The camera module 30 shown is Fig.21 A modified implementation of the camera module 30 is shown.

[0231] Specifically, if Fig. 22As shown, in this specific example, the camera module 30 includes a circuit board 31, a photosensitive chip 32, a light-transmitting component 33 and a reinforcing plate 37, wherein the circuit board 31 has an opening 310A formed through the circuit board 31, the reinforcing plate 37 is attached to the bottom surface of the circuit board 31, the photosensitive chip 32 is arranged at the opening 310A of the circuit board 31 and attached to the reinforcing plate 37, the photosensitive chip 32 can be conductively connected to the circuit board 31, and the light-transmitting component 33 is arranged on the light-sensing path of the photosensitive chip 32. In this way, the imaging light passing through the display screen 20 first reaches the light-transmitting component 33, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0232] In other words, compared to Fig.21 In the camera module 30 shown in the figure, in this specific example, the circuit board 31 has the opening 310A, which is formed through the circuit board 31, so as to reduce the installation reference height of the photosensitive chip 32 through the opening 310A. In other words, in the embodiment of the present application, the top surface of the circuit board 31 is a non-flat surface, wherein the area of ​​the circuit board 31 for installing the photosensitive chip 32 is recessed downward and penetrates the circuit board 31, so that the installation reference height of the photosensitive chip 32 can be further reduced. It should be understood that each camera module has a preset optical back focus requirement, so that under the premise of keeping the optical back focus requirement unchanged, the installation height of the optical lens 332 relative to the circuit board 31 can be further reduced, so that the overall height dimension of the camera module 30 can be further reduced.

[0233] like Fig. 22 As shown, it should be particularly noted that in this specific example, the bottom surface of the photosensitive chip 32 is flush with the bottom surface of the circuit board 31, that is, the installation reference height of the photosensitive chip 32 is the height of the bottom surface of the circuit board 31. Therefore, under the premise of ensuring the preset optical back focus, the installation position of the photosensitive chip 32 can be further lowered, so that the overall height dimension of the camera module 30 can be further reduced.

[0234] Preferably, in this specific example, the size of the opening 310A is consistent with the size of the photosensitive chip 32, so that the opening 310A itself can be used to position and limit the photosensitive chip 32. Specifically, in the process of installing the photosensitive chip 32 in the opening 310A, the photosensitive chip 32 can be directly embedded in the opening 310A and finally attached to the reinforcement plate 37, without the need to constantly calibrate and locate the installation position of the photosensitive chip 32 on the circuit board 31 as in the existing COB process-based camera module. Furthermore, after the photosensitive chip 32 is installed in the opening 310A and electrically connected to the circuit board 31, the photosensitive chip 32 is "confined" in the opening 310A to prevent the photosensitive chip 32 from detaching from or deviating from the opening 310A.

[0235] Furthermore, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is installed in the opening 310A of the circuit board 31, the electrical connection between the photosensitive chip 32 and the circuit board 31 is realized through the leads 34. Specifically, each of the leads 34 extends between the photosensitive chip 32 and the circuit board 31 in a curved manner, so as to connect the photosensitive chip 32 to the circuit board 31 through the leads 34, so that the circuit board 31 can supply power to the photosensitive chip 32 according to the leads 34, and the photosensitive chip 32 can transmit the collected signal according to the leads 34.

[0236] It is worth mentioning that in this specific example, the type of the lead 34 is not limited by the present application, for example, the lead 34 can be a gold wire, a silver wire, or a copper wire. Moreover, the lead 34 can be installed between the circuit board 31 and the photosensitive chip 32 by a "gold wire" process to achieve electrical connection between the two.

[0237] Specifically, the "gold wire punching" process is generally divided into two types: "positive gold wire punching" process and "reverse gold wire punching" process. The "positive gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the circuit board 31, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the photosensitive chip 32. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. The "reverse gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the photosensitive chip 32, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the circuit board 31. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the height of the upward protrusion of the lead 34 formed by the "reverse gold wire punching" process is lower than the height of the upward protrusion of the lead 34 formed by the "forward gold wire punching" process. Therefore, preferably, in this specific implementation, the "reverse gold wire punching" process is used to form the lead 34.

[0238] Furthermore, the camera module 30 further includes a base 35, which is disposed on the circuit board 31 to support the light-transmitting component 33. The light-transmitting component 33 includes a color filter element 331 and an optical lens 332, and the color filter element 331 and the optical lens 332 are sequentially disposed on the light-sensing path of the photosensitive chip 32.

[0239] Specifically, in this specific example, the base 35 can be implemented as a traditional plastic bracket, which is prefabricated and attached to the top surface of the circuit board 31; or, the base 35 can be implemented as a molded base, which can be integrally molded on the corresponding position of the circuit board 31 and / or the photosensitive chip 32 through MOB (Molding on Board) and MOC (Molding on Chip) processes. Those skilled in the art should know that the MOB (Molding on Board) process refers to integrally molding the molded base on the circuit board 31 through a molding process, wherein the molded base after molding integrally covers the circuit board 31 and the electronic components 312 located on the circuit board 31. The MOC process refers to integrally forming the molded base on the circuit board 31 through a molding process, wherein the molded base after molding not only covers the circuit board 31 and the electronic components 312 located on the circuit board 31, but also covers at least a portion of the lead 34, or covers the lead 34 and at least a portion of the photosensitive chip 32 (wherein at least a portion of the photosensitive chip 32 is a non-photosensitive area of ​​the photosensitive chip 32).

[0240] In this specific example, the color filter element 331 is disposed between the optical lens 332 and the photosensitive element, so that the light entering the interior of the camera module 30 from the optical lens 332 can be received and photoelectrically converted by the photosensitive chip 32 only after being filtered by the color filter element 331, so as to improve the imaging quality of the camera module 30. For example, the color filter element 331 can be used to filter the infrared part of the light entering the interior of the camera module 30 from the optical lens 332.

[0241] Those skilled in the art should know that the color filter element 331 can be implemented as different types, including but not limited to the color filter element 331 can be implemented as an infrared cutoff filter, a full spectrum filter and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 32. In this way, when the camera module 30 is used in an environment with sufficient light such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive chip 32, so that the infrared cutoff filter can be used to filter the infrared rays in the light reflected by the object entering the camera module 30. Moreover, when the camera module 30 is used in an environment with darker light such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 32 to allow the infrared rays in the light reflected by the object entering the camera module 30 to be partially transmitted.

[0242] It is worth mentioning that the color filter element 331 can also be arranged at other positions on the photosensitive path of the photosensitive chip 32. For example, the color filter element 331 is arranged at the bottom of the optical lens 332, the bottom of the optical lens 332, etc., which is not limited to this application.

[0243] It is also worth mentioning that, in this specific example, the camera module 30 can be implemented as a fixed-focus camera module or a dynamic-focus camera module, wherein, when the camera module 30 is a dynamic-focus camera module, the camera module 30 further includes a driver 36 electrically connected to the circuit board 31, and the driver 36 is used to controllably drive the lens to move to achieve auto-focus (Auto-Focus).

[0244] Fig.23 The figure shows another specific schematic diagram of the camera module 30 according to an embodiment of the present application, wherein: Fig.23 The camera module 30 shown is Fig. 22 A modified implementation of the camera module 30 is shown.

[0245] Specifically, compared to Fig. 22 In the camera module 30 shown in the embodiment, the base 35 is directly mounted on the reinforcing plate 37. In other words, in the embodiment, the mounting reference height of the base 35 is reduced, so that the mounting reference height of the optical lens 332 mounted on the base 35 is reduced, so that the overall height of the camera module 30 can be reduced.

[0246] Accordingly, in this specific embodiment, the base 35 can be implemented as a traditional plastic bracket, which is prefabricated and attached to the top surface of the reinforcing plate 37; or, the base 35 can be implemented as a molded base, which can be integrally molded at the corresponding positions of the reinforcing plate 37, the circuit board 31 and / or the photosensitive chip 32 through MOB (Molding on Board) and MOC (Molding on Chip) processes. Those skilled in the art should know that the MOB (Molding on Board) process refers to integrally molding the molded base on the circuit board 31 through a molding process, wherein the molded base after molding integrally covers the reinforcing plate 37, the circuit board 31 and the electronic components 312 located on the circuit board 31. The MOC process refers to integrally forming the molded base on the circuit board 31 through a molding process, wherein the molded base after molding not only covers the reinforcing plate 37, the circuit board 31 and the electronic components 312 located on the circuit board 31, but also covers at least a portion of the lead 34, or covers the lead 34 and at least a portion of the photosensitive chip 32 (wherein at least a portion of the photosensitive chip 32 is a non-photosensitive area of ​​the photosensitive chip 32).

[0247] Fig.24 Another specific example of the camera module 30 according to an embodiment of the present application is shown in the figure, wherein: Fig.24 The camera module 30 shown is Fig. 22 Another variant implementation of the camera module 30 is shown.

[0248] Specifically, compared to Fig. 22 In the camera module 30 shown in the figure, in this specific example, the base 35 has at least two positioning columns 351 extending downward, the circuit board 31 has at least two openings 311, and the positioning columns 351 pass through the openings 311 and are arranged on the reinforcement plate 37. In this way, the installation reference height of the base 35 can be reduced, so that the overall height of the camera module 30 can be reduced.

[0249] Fig.25 and Fig.26 Another specific example of the camera module 30 according to an embodiment of the present application is shown in the figure, wherein: Fig.25 and Fig.26 The camera module 30 shown in FIG. 22 is another modified implementation of the camera module 30 shown in FIG. 22 .

[0250] like Fig.25 and Fig.26 As shown, in this specific example, the reinforcing plate 37 has a boss 371A or a groove 371 at the opening 310A of the circuit board 31, so as to adjust the installation reference height of the photosensitive chip 32 through the boss 371A or the groove 371. In other words, in this specific example, the bottom surface of the photosensitive chip 32 is not flush with the bottom surface of the circuit board 31.

[0251] Specifically, if Fig.25 As shown, when the reinforcing plate 37 has a groove 371 at the opening 310A of the circuit board 31, the installation reference height of the photosensitive chip 32 is further reduced, so that the overall height dimension of the camera module 30 can be further reduced while meeting the design requirements of the preset optical back focus. It should be noted that when the reinforcing plate 37 has a groove 371 at the opening 310A of the circuit board 31, the photosensitive chip 32 is mounted on the reinforcing plate 37, and at that time, the bottom surface of the photosensitive chip 32 is lower than the bottom surface of the circuit board 31.

[0252] Specifically, if Fig.26 As shown, when the reinforcing plate 37 has a boss 371A at the opening 310A of the circuit board 31, the installation reference height of the photosensitive chip 32 is reduced compared to the existing camera module based on the COB process, so that the overall height dimension of the camera module 30 is reduced while meeting the design requirements of the preset optical back focus. It should be noted that when the reinforcing plate 37 has a boss 371A at the opening 310A of the circuit board 31, the photosensitive chip 32 is mounted on the reinforcing plate 37, and then the bottom surface of the photosensitive chip 32 is higher than the bottom surface of the circuit board 31 but lower than the top surface of the circuit board 31.

[0253] Fig. 27 Another specific example of the camera module 30 according to an embodiment of the present application is shown in the figure, wherein: Fig. 27 The camera module 30 shown is Fig.24 A modified implementation of the camera module 30 is shown.

[0254] Specifically, if Fig. 27As shown, in this specific example, the camera module 30 includes a circuit board 31, a photosensitive chip 32, a base 35, an optical lens 332, a color filter element 331 and a reinforcing plate 37, wherein the circuit board 31 has an opening 310A formed through the circuit board 31, the reinforcing plate 37 is attached to the bottom surface of the circuit board 31, the photosensitive chip 32 is arranged at the opening 310A of the circuit board 31 and attached to the reinforcing plate 37, the photosensitive chip 32 can be conductively connected to the circuit board 31, and the color filter element 331 and the optical lens 332 are sequentially arranged on the photosensitive path of the photosensitive chip 32. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0255] In particular, in this specific implementation, the optical lens 332 and the base 35 have an integrated structure, that is, the optical lens 332 and the base 35 have been assembled into a whole before participating in the assembly of the camera module 30. In other words, in this specific example, the optical lens 332 is an integrated lens 333, which is assembled with the base 35 to form a component unit. Further, in this specific example, the base 35 has at least two positioning columns extending downward, and the circuit board 31 has at least two openings. The positioning columns are arranged on the reinforcement plate 37 through the openings. In this way, the integrated lens 333 and the photosensitive chip 32 have the same installation reference surface (that is, the top surface of the reinforcement plate 37). In this way, the overall height dimension of the camera module 30 is reduced while meeting the design requirements of the preset optical back focus.

[0256] It is worth mentioning that in this specific example of application, the integrated lens 333 may further include the color filter unit 331, that is, in this specific implementation, the optical lens 332, the base 35 and the color filter unit 331 have an integrated structure, that is, the optical lens 332, the base 35 and the color filter unit 331 have been assembled into a whole before participating in the assembly of the camera module 30. In this way, the assembly method of the camera module 30 can be made more compact, so that the overall height size of the camera module 30 can be reduced.

[0257] Fig.28 FIG. 2 shows another specific example of the camera module 30 according to an embodiment of the present application. Fig.28As shown, in this specific example, the camera module 30 includes an optical lens 332, a base 35, a color filter element 331, a photosensitive chip 32 and a circuit board 31, wherein the photosensitive chip 32 is conductively arranged on the circuit board 31, the base 35 is arranged on the circuit board 31, the lens and the color filter element 331 are sequentially arranged on the photosensitive path of the photosensitive chip 32, wherein the base 35 is used to support the color filter element 331. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0258] Furthermore, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is attached to the circuit board, the electrical connection between the photosensitive chip 32 and the circuit board 31 is realized through the leads 34. Specifically, each of the leads 34 extends between the photosensitive chip 32 and the circuit board 31 in a curved manner, so as to connect the photosensitive chip 32 to the circuit board 31 through the leads 34, so that the circuit board 31 can supply power to the photosensitive chip 32 according to the leads 34, and the photosensitive chip 32 can transmit the collected signal according to the leads 34.

[0259] It is worth mentioning that in this specific example, the type of the lead 34 is not limited by the present application, for example, the lead 34 can be a gold wire, a silver wire, or a copper wire. Moreover, the lead 34 can be installed between the circuit board 31 and the photosensitive chip 32 by a "gold wire" process to achieve electrical connection between the two.

[0260] Specifically, the "gold wire punching" process is generally divided into two types: "positive gold wire punching" process and "reverse gold wire punching" process. The "positive gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the circuit board 31, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the photosensitive chip 32. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. The "reverse gold wire punching" process refers to the process of laying out the lead 34, first forming one end of the lead 34 on the conductive end of the photosensitive chip 32, then extending the lead 34 in a curved manner, and finally forming the other end of the lead 34 on the conductive end of the circuit board 31. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the height of the upward protrusion of the lead 34 formed by the "reverse gold wire punching" process is relative to the height of the upward protrusion of the lead 34 formed by the "forward gold wire punching" process. Therefore, preferably, in this specific implementation, the "reverse gold wire punching" process is used to form the lead 34.

[0261] A group of electronic components 312 is also provided on the circuit board 31, wherein each of the electronic components 312 can be mounted on the edge area of ​​the circuit board 31 (compared to the mounting position of the photosensitive chip 32) at intervals from each other through processes such as SMT (Surface Mount Technology). The electronic components 312 include but are not limited to resistors, capacitors, inductors, etc. It is worth mentioning that the photosensitive chip 32 and each of the electronic components 312 can be located on the same side or opposite sides of the circuit board 31. For example, the photosensitive chip 32 and each of the electronic components 312 can be located on the same side of the circuit board 31, and each of the electronic components 312 is mounted on the edge area of ​​the circuit board 31 at intervals from each other.

[0262] In particular, if Fig.28 As shown, in this specific example, the base 35 is supported on the top surface of the circuit board 31, and the base 35 includes a main body 352 and a side wall 353 extending downward along the main body 352, and the main body 352 and the side wall 353 define a receiving cavity 354. When the base 35 is set on the circuit board 31, the side wall 353 is supported on the circuit board 31, and the bottom surface of the base 35, the upper surface of the circuit board 31 and the side wall 353 together define the receiving cavity 354, wherein the electronic components 312 set on the circuit board 31 are received in the receiving cavity 354. Preferably, the height dimension of the receiving cavity 354 is less than 0.2 mm, for example, 0.1 mm.

[0263] Furthermore, if Fig.28 As shown, in this specific example, the base 35 also has at least one accommodating hole 355, and the accommodating hole 355 is arranged through the base 35 to connect the accommodating cavity 354 with the external environment. It is worth understanding that in this specific embodiment, the height of the accommodating cavity 354 is lower than the electronic components 312 with higher sizes, such as capacitors. Therefore, when the base 35 is set on the circuit board 31, since the height from the bottom surface of the main body 352 of the base 35 to the top surface of the circuit board 31 is less than the electronic components 312 with higher sizes such as capacitors, if the accommodating hole 355 is not provided, the above-mentioned electronic components 312 cannot be accommodated. In other words, the role of the accommodating hole 355 is to avoid the electronic components 312 with higher sizes, so that when the height of the base 35 is reduced, the electronic components 312 can also be accommodated in the base 35. In other words, by providing the accommodating hole 355 on the base 35 , the overall design height of the base 35 can be lowered, so that the overall height dimension of the camera module 30 can be reduced.

[0264] For example, but not limited to, for example, the height of the capacitor in the electronic component 312 is 0.38 mm, the height of the accommodating cavity 354 is 0.1 mm, and the thickness of the main body 352 of the base 35 is set to 0.4 mm, that is, the height of the accommodating hole 355 is 0.4 mm. In this way, when the base 35 is set on the circuit board 31, the capacitor in the electronic component 312 cannot be completely accommodated in the accommodating cavity 354, and accordingly, the upper end of the capacitor in the electronic component 312 extends into the accommodating hole 355 and is accommodated in the accommodating hole 355. It should be understood that in the embodiment of the present application, the accommodating hole 355 should match the setting of the electronic component 312 of the circuit board 31, and the horizontal size of the electronic component 312 determines the size of the accommodating hole 355, that is, the electronic component 312 should ensure that it can be accommodated in the accommodating hole 355.

[0265] Furthermore, if Fig.28As shown, in this specific example, the base 35 further has a light hole 356, which is formed in the main body 352 of the base 35 and corresponds to the photosensitive chip 32, wherein the light hole 356 is used to place the color filter element 331. Correspondingly, the main body 352 of the base 35 also has a cantilever 357, which extends integrally from the main body 352 and defines the size of the light hole 356, wherein the color filter element 331 is placed on the cantilever 357 and filters the light received by the module. It is particularly noted that in this specific example, when the base 35 is set on the circuit board 31, and then the color filter element 331 is placed on the cantilever 357 of the main body 352, and the upper end of at least one of the electronic components 312 is accommodated in the accommodation hole 355, it can be observed that the top surface of part of the electronic component 312 is higher than the bottom surface of the color filter element 331.

[0266] It is worth mentioning that, in this specific example, the color filter element 331 can be implemented as different types, including but not limited to the color filter element 331 can be implemented as an infrared cutoff filter, a full spectrum filter and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 32. In this way, when the camera module 30 is used in an environment with sufficient light such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive chip 32, so that the infrared cutoff filter can be used to filter the infrared rays in the light reflected by the object entering the camera module 30. Moreover, when the camera module 30 is used in an environment with darker light such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 32 to allow the infrared rays in the light reflected by the object entering the camera module 30 to be partially transmitted.

[0267] Of course, the color filter element 331 can also be arranged at other positions on the photosensitive path of the photosensitive chip 32, for example, the color filter element 331 is arranged at the bottom of the optical lens 332, the bottom of the optical lens 332, etc., which is not limited to this application.

[0268] In particular, if Fig.28As shown, in this specific example, the base 35 can be implemented as a traditional plastic bracket, which is prefabricated and attached to the top surface of the circuit board 31; or, the base 35 can be implemented as a molded base, which can be integrally formed by an injection molding process and attached to the top surface of the circuit board 31. However, due to the limitation of the molding process of the base 35, the receiving hole 355 is set as a through hole, that is, the receiving hole 355 is connected to the receiving cavity 354 and the external environment. It should be conceivable that when assembling the camera module 30, dirt can easily enter through the receiving hole 355, causing stains on the photosensitive chip 32.

[0269] Therefore, if Fig.28 As shown, in this specific example, the camera module 30 further includes a protective member 38, which extends downward from the main body 352 as a whole. When the base 35 is set on the circuit board 31, the protective member 38 surrounds the photosensitive chip 32. The protective member 38, the main body 352 of the base 35 and the color filter element 331 set on the main body 352 form a sealed space to prevent dirt from entering the photosensitive chip 32.

[0270] In a specific implementation, the protective member 38 can be implemented as a part of the main body 352 of the base 35, which extends downward from the main body 352 as a whole, wherein when the base 35 is set on the circuit board 31, the protective member 38 surrounds the photosensitive chip 32, and the protective member 38, the main body 352 of the base 35 and the color filter element 331 set on the main body 352 form a sealed space to prevent dirt from entering the photosensitive chip 32. Alternatively, the protective member 38 and the base 35 are separately set, such as Fig.29 As shown, for example, the protective member 38 is attached to the base 35 by bonding or other processes, thereby reducing the difficulty of molding the base 35 .

[0271] Preferably, the upper end of the receiving hole 355 can be sealed by a film or glue, so as to prevent the electronic components 312 from being damaged on the one hand, and further enhance the sealing effect on the other hand to prevent dirt from entering the photosensitive chip 32.

[0272] It is worth mentioning that in this specific example, the camera module 30 can be implemented as a fixed focus module or a dynamic focus module, wherein, when the camera module 30 is a dynamic focus module, the camera module 30 further includes a driver 36 electrically connected to the circuit board 31 (for example but not limited to, the driver can be implemented as a motor, etc.), and the driver 36 is used to controllably drive the lens to move to achieve auto-focus (Auto-Focus), such as Fig.30 shown.

[0273] In particular, if Fig.30 As shown, the driver 36 includes at least one positioning column 361, which extends from the lower end of the driver 36, and at least one positioning column 361 is formed at a position corresponding to at least one receiving hole 355, so that when the driver 36 is installed on the base 35, the positioning column is engaged with the receiving hole 355 in a latching manner. In this way, the installation accuracy of the driver can be improved through the cooperation between the positioning column 361 and the receiving hole 355, and the cooperation between the positioning column and the receiving hole 355 can also improve the reliability of the driver 36.

[0274] Fig.31 Another specific example of the camera module 30 according to an embodiment of the present application is shown in the figure, wherein: Fig.31 The camera module 30 shown is Fig.28 A modified implementation of the camera module 30 is shown.

[0275] Specifically, if Fig.31 As shown, in this specific example, the protective member 38 is implemented as a protective film, and the protective film is attached to the upper end of the receiving hole 355 (the top surface of the main body 352), so that when the base 35 is set on the circuit board 31, the protective film ensures that the receiving hole 355 and the receiving cavity 354 are a closed space, so that dirt can also be prevented from entering the photosensitive chip 32, and the protective film can also protect the electronic components 312. For example, the protective film can be implemented as a film, or the protective film can be formed on the upper end of the receiving hole 355 by a process such as glue filling to seal the receiving hole 355.

[0276] Fig.32 Another specific example of the camera module 30 according to an embodiment of the present application is shown in the figure, wherein: Fig.32 The camera module 30 shown is Fig.28 The camera module 30 shown is a modified implementation.

[0277] Specifically, if Fig.32 As shown, in this specific example, the electronic components 312 disposed on the circuit board 31 are disposed on both sides of the circuit board 31, that is, the photosensitive chip 32 is disposed on the circuit board 31, and the electronic components 312 are located on both sides of the photosensitive chip 32. Those skilled in the art should know that in the existing camera module, most of the electronic components 312 located on the circuit board 31 are arranged around (or on four sides of) the circuit board 31.

[0278] Furthermore, if Fig.32As shown, in this specific example, the protection member 38 is integrally formed with the main body 352 and extends downward from the main body 352. Preferably, the protection member 38 extends downward from the main body 352 in parallel with the side wall 353 to form a receiving cavity 358 between the side wall 353 and the protection member 38, and the receiving hole 355 is formed between the side wall 353 and the protection member 38 and communicates with the receiving cavity 358.

[0279] In particular, if Fig.32 As shown, in this specific example, the electronic component 312 is arranged at a position on the circuit board 31 so that when the base 35 is attached to the top surface of the circuit board 31, the electronic component 312 is accommodated in the accommodating cavity 358, and the portion of the electronic component 312 that is higher than the height of the accommodating cavity 358 can be accommodated in the accommodating hole 355.

[0280] It should be understood that in this specific example, the positions of the side wall 353 and the protective member 38 should be determined by the arrangement of the electronic components 312 on the circuit board 31. For example, when the electronic components 312 are arranged in a matrix on both sides of the circuit board 31, the protective member 38 extends downward from the main body 352 in parallel with the side wall 353 and is formed between the electronic components 312 and the photosensitive chip 32, so as to isolate the photosensitive chip 32 and prevent dirt from entering the photosensitive chip 32 through the receiving hole 355.

[0281] It is worth pointing out that in this specific example, the protective member 38 only needs to be formed between the photosensitive chip 32 and the electronic component 312 to isolate the photosensitive chip 32, that is, the protective member 38 does not need to be arranged around the photosensitive chip 32, but only needs to be formed on both sides of the photosensitive chip 32. In other words, in this specific example, the camera module 30 has an extremely narrow side, wherein the extremely narrow side is formed on the side of the circuit board 31 where the electronic component 312 is not arranged, and the installation positions of the photosensitive chip 32 and the optical lens 332 are close to the edge of the circuit board 31. In particular, the extremely narrow side allows the camera module 30 to be set at the edge of the smartphone.

[0282] Fig.33 FIG. 2 shows another specific example of the camera module 30 according to an embodiment of the present application. Fig.33As shown, in this specific example, the camera module 30 includes an optical lens 332, a base 35, a color filter element 331, a photosensitive chip 32 and a circuit board 31, wherein the photosensitive chip 32 is conductively arranged on the circuit board 31, the base 35 is integrally formed on the circuit board 31 through a molding process, the optical lens 332 and the color filter element 331 are sequentially arranged on the photosensitive path of the photosensitive chip 32, wherein the base 35 is used to support the color filter element 331. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0283] In particular, this specific example is an optimization solution for the existing camera module based on the molding process. Those skilled in the art should know that in the existing camera module based on the molding process, the photosensitive chip and electronic components are usually mounted on the circuit board first, and then a molding base is formed on the circuit board through the molding process. Then, after the filter is mounted on the lens holder, the lens is mounted on the filter assembly so that the lens is kept on the photosensitive path of the chip. Fig.34 However, this assembly method of the prior art has a great limitation on the height of the camera module.

[0284] In detail, although the lateral size and height of the camera module can be reduced by replacing the traditional lens mount with a molded base, the mold used in the molding process needs to avoid electronic components such as capacitors and resistors on the circuit board (especially capacitors with larger sizes, the current smallest capacitor has a height of 0.38mm), and a certain safety distance must be reserved between the mold and various electronic components. Therefore, the height of the molded base must be at least greater than 0.4mm; on the other hand, the filter is usually combined with a support to form a filter assembly, and then the filter assembly is mounted on the molded base. Since the support is usually made by injection molding, the thickness of the part of the support used to support the filter is required to be basically greater than 0.15mm, and the thickness of the filter itself is usually above 0.21mm. Therefore, the thickness of the filter assembly must be at least greater than 0.36mm.

[0285] That is to say, the distance between the lens and the circuit board 31 is equal to the sum of the height of the molded base and the thickness of the filter assembly (at least greater than 0.76 mm). However, due to the limitations of all the above factors, the distance between the lens and the circuit board 31 of the camera module of the prior art cannot be further reduced. In other words, the height of the camera module of the prior art cannot be further reduced, thereby failing to meet the market demand for thinner and smaller camera modules.

[0286] Accordingly, if Fig.33 As shown, in this specific example, the mold base has a sunken step portion for mounting the color filter element 331 thereon. That is to say, compared with the existing camera module based on the molding process, in this specific example, the top surface of the mold base is a non-flat surface, which has a sunken step portion. Accordingly, by mounting the color filter element 331 on the sunken step portion of the mold base, the color filter element support can be eliminated, and the distance between the color filter element 331 and the circuit board 31 can be reduced, thereby achieving the effect of reducing the height of the module.

[0287] Specifically, if Fig.33 As shown, in this specific example, the mold base has a stepped peripheral groove 350, wherein the color filter element 331 of the light-transmitting component 33 is disposed in the stepped peripheral groove 350 of the mold base. In this way, the distance between the optical lens 332 and the circuit board 31 is no longer limited by the thickness of the color filter element 331 itself, that is, the distance between the optical lens 332 and the circuit board 31 can be reduced to be less than the sum of the thickness of the color filter element 331 and the height of the mold base, so as to reduce the overall height dimension of the camera module 30.

[0288] Fig.35 FIG. 2 shows another specific implementation of the camera module 30 according to an embodiment of the present application. Fig.35 As shown, in this specific example, the camera module 30 is optimized from the perspective of the structure of the photosensitive chip itself to reduce the overall height of the camera module 30. In other words, in this specific implementation, the camera module 30 can be implemented as follows Figures 21 to 33 Any of the camera modules described above and its variations.

[0289] Specifically, in this specific example, the camera module 30 uses a quantum dot film 323A photosensitive chip 32A to replace a traditional CMOS / CCD photosensitive chip. Compared with a traditional CMOS / CCD photosensitive chip, the quantum dot film 323A photosensitive chip 32A has the dual advantages of plane size and height size.

[0290] First, the use of the quantum dot film 323A photosensitive chip 32A can reduce the size of the photosensitive chip in the Z-axis direction. Fig.35As shown, the quantum dot film 323A photosensitive chip 32A includes a color filter 321A, a top electrode 322A, a quantum dot film 323A, a bottom electrode 324A and a pixel circuit 325A from top to bottom, wherein the top electrode 322A, the quantum dot film 323A and the bottom electrode 324A constitute the photosensitive layer of the quantum dot film 323A photosensitive chip 32A, the quantum dot film 323A electrically connects two electrodes, and the current and / or voltage between the two electrodes is related to the intensity of the light received by the quantum dot film 323A; the pixel circuit 325A includes a charge storage and reading circuit. In particular, the color filter can be implemented as a Bayer filter or a Mono filter, which is not limited by the present application.

[0291] During operation, light passing through the color filter 321A irradiates the photosensitive layer, and the photosensitive layer generates charges between the top electrode and the bottom electrode under a given bias voltage, so that the voltage accumulates in the charge storage during the integration period. The pixel circuit 325A reads the electrical signal and transmits it to the chip. The electrical signal reflects the signal of the intensity of light absorbed by the photosensitive layer during the integration period. The electrical signal is the light intensity generated by the light passing through the color filter 321A, so the electrical signal can correspond to the light passed by the color filter 321A, that is, if the color filter 321A is red, indicating that only red light can pass through, then the electrical signal generated by the photosensitive layer corresponding to the color filter 321A represents the intensity of red light in the light at that position.

[0292] Compared with the existing CMOS or CCD chip, the quantum dot film 323A photosensitive chip 32A has a relatively small thickness.

[0293] Fig.36 The figure shows another specific schematic diagram of the photosensitive chip of the camera module 30 according to the embodiment of the present application, wherein: Fig.36 The photosensitive chip shown is Fig.35 A variant implementation of the photosensitive chip is shown.

[0294] Specifically, if Fig.36 As shown, in this specific example, the quantum dot film 323A of the photosensitive layer is configured to respond to light of a selected color or color group. For example, a photoconductive material and a wavelength selective absorption material (such as a material forming a color filter 321A array) can be combined to form a color-sensitive pixel to achieve the sensitivity of the color. Accordingly, the quantum dot film 323A can be configured to be sensitive to the three colors of red (R), green (G), and blue (B), respectively, so that the color filter 321A in the photosensitive chip can be directly eliminated.

[0295] During operation, when light passes through the color-sensitive pixel, the color-sensitive pixel absorbs the corresponding light, converts the light intensity of the wavelength or band of light into an electrical signal, and transmits it to the chip through the pixel circuit 325A to process the image, while the remaining light continues to propagate forward and will not affect the photoelectric conversion of the pixel. Accordingly, this technical solution can not only reduce the Z-direction size of the photosensitive chip, but also, because there is no color filter 321A to filter the light, the photosensitive chip can receive more light, and the imaging of the photosensitive chip is clearer.

[0296] Furthermore, the use of the quantum dot film 323A photosensitive chip 32A can reduce the size of the photosensitive chip in the XY axis direction. Specifically, due to the high light transmittance of the quantum dot film 323A, after being configured as a material that is sensitive to a certain wavelength or waveband, the quantum dot film 323A can only absorb the corresponding light, while other light will pass through the film and continue to propagate forward. Therefore, multiple quantum dot films 323A that are sensitive to a certain wavelength or waveband can be arranged vertically.

[0297] In other words, the light intensity information of multiple wavelengths or bands can be obtained at the same time at a pixel position. For example, the three quantum dot films 323A of red color-sensitive pixels, green color-sensitive pixels, and blue color-sensitive pixels are arranged vertically. When the light passes through the red color-sensitive pixel, the red light is absorbed and converted into an electrical signal, and the remaining light continues to propagate forward. After passing through the green color-sensitive pixel, the green light is absorbed and converted into an electrical signal. The remaining light continues to propagate forward. After reaching the blue color-sensitive pixel, the blue light is also absorbed and converted into an electrical signal. Therefore, the light intensity information of multiple wavelengths or bands of light can be obtained at the same time at a point the size of a pixel.

[0298] It is worth mentioning that the three RGB colors introduced in this specific example of the present application are not limiting. Each layer of quantum dot film 323A can absorb and convert any required light. It is only necessary to configure the quantum dot film 323A to be sensitive to the required light.

[0299] Moreover, in this specific example, since the traditional color filter 321A is not used, not only a stronger light intensity can be obtained, but also a higher resolution can be obtained for a photosensitive chip of the same specification. In other words, at the same resolution, the method adopted in this solution can reduce the XY dimensions of the photosensitive chip, thereby further reducing the planar dimensions of the camera module 30.

[0300] Furthermore, the quantum dot film 323A in the quantum dot film 323A chip involved in the present application can be prepared by the following process.

[0301] In one formation method, the quantum dot material can be processed by melt pool casting to form the quantum dot film 323A. Melt pool casting can include depositing a measured quantum dot material onto a substrate and allowing the solution to evaporate, and the resulting film may or may not be cleaved.

[0302] In one formation method, the quantum dot material may be processed by electrodeposition to form the quantum dot film 323A.

[0303] In one formation method, the quantum dot film 323A may be formed by vapor deposition of quantum dot materials.

[0304] In one formation mode, the quantum dot film 323A can be formed by spraying the quantum dot material. Spraying can include processing from a gas. Spraying can include entrainment in a solvent.

[0305] In one formation mode, the quantum dot material can be processed by growth from a solution to form the quantum dot film 323A. The growth of the film from the solution can include cross-linking. A cross-linking agent can be attached to at least a portion of the substrate to cross-link the quantum dots. When the substrate with the attached cross-linking agent is immersed in the quantum dot solution, the quantum dots can become cross-linked and grow at the position where the cross-linking agent is attached on the substrate, and the growth process can be similar to the process of seed growth. Since the growth occurs at the position where the cross-linking agent has been attached, the formation of a patterned film on the substrate can be achieved by depositing the cross-linking agent along the substrate with the pattern.

[0306] In one formation mode, the quantum dot material can be treated with a hydrophobic system to form a film. The hydrophobic system can enable the deposition of a single layer of quantum dot film 323A, which can be deposited in a pattern.

[0307] In one formation method, the quantum dot film 323A may be formed by accelerating or evaporating a quantum dot material in a gas phase.

[0308] In one formation method, the quantum dot film 323A can be formed by processing the quantum dot material by a photolithography method.

[0309] In one forming method, the quantum dot film 323A may be formed by processing the quantum dot material through an inkjet printing method.

[0310] In summary, the camera module 30 disposed below the display screen can adopt but is not limited to the technical solutions listed above and their variations, so that the size of the camera module 30 in its height direction can be reduced to meet the demand for thin smartphones.

[0311] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A display screen, characterized in that: From top to bottom, it includes: cover layer, touch layer, polarization layer, packaging layer, pixel layer and circuit driving layer; The circuit driving layer is formed on the bottom side of the pixel layer and is electrically connected to the pixel layer to drive the pixel layer to work; The encapsulation layer is formed on the top side of the pixel layer and is used to encapsulate the pixel layer; The pixel layer includes pixels distributed in an array, and there is a gap between each of the pixels, so that light that sequentially passes through the cover layer, the touch layer, the polarization layer and the packaging layer can pass through the pixel layer through the gap; The display screen further comprises a microlens layer disposed above the pixel layer, wherein the microlens layer corresponds to each of the gaps between the pixels in the pixel layer, and is used to converge light to each of the gaps before the light passes through the pixel layer through the gaps, so as to increase the light transmittance of the display screen; At least a portion of a lower surface of the polarizing layer and an upper surface of the microlens layer are arranged to match each other, wherein the microlens layer is a film structure, a concave structure is etched at a position corresponding to a gap between adjacent pixels on the lower surface of the polarizing layer, a film is plated on the concave structure to form the film structure, and light is converged after passing through the film structure; It also includes a backplane layer supported on the bottom side of the circuit driving layer, wherein the backplane layer is provided with at least one opening at a location where the display screen needs to be light-transmissive, and the opening corresponds to the gap between the pixels in the pixel layer, so that light passing through the pixel layer through the gap in the pixel layer can reach the back of the display screen through the opening and enter the camera module below the display screen for imaging response.

2. The display screen according to claim 1, wherein: The microlens layer includes microlens units distributed in an array, wherein each of the microlens units corresponds to each of the gaps.

3. The display screen according to claim 1, wherein: The lateral dimension of the micro lens unit is greater than the dimension of the gap.

4. The display screen according to any one of claims 1 to 3, wherein: The refractive index of the material forming the microlens layer is greater than the refractive index of the material forming the encapsulation layer.

5. The display screen according to claim 4, wherein: The material forming the encapsulation layer is a light-transmissive rigid material.

6. The display screen according to claim 4, wherein: The material forming the encapsulation layer is a light-transmissive flexible material.

7. A method for preparing a display screen, characterized in that: include: The microlens layer is a film structure, a concave structure is etched at a position corresponding to the gap between adjacent pixels on the lower surface of a polarizing layer, a film is plated on the concave structure to form the film structure, and light is converged after passing through the film structure, wherein at least a portion of a lower surface of the polarizing layer and an upper surface of the microlens layer are arranged to match each other; The encapsulation layer is arranged above the pixel layer, wherein the microlens units of the microlens layer correspond to the gaps between the pixels in the pixel layer, wherein a circuit driving layer is arranged on the bottom side of the pixel layer, and the circuit driving layer is electrically connected to the pixel layer for driving the pixel layer to work; and The polarizing layer, the touch layer and the cover layer are sequentially arranged on the packaging layer; A backplane layer with an opening is mounted on the bottom side of the circuit driving layer, the opening of the backplane layer is opened at a light-transmitting portion of the display screen, and the opening corresponds to the gap between the pixels in the pixel layer, so that light passing through the pixel layer through the gap in the pixel layer can reach the back of the display screen through the opening and enter the camera module under the display screen for imaging response.

8. The method for preparing a display screen according to claim 7, wherein: The refractive index of the material forming the microlens layer is greater than the refractive index of the material forming the encapsulation layer.

9. A terminal device, characterized in that: include: Terminal body; Camera module; as well as A display screen as described in any one of claims 1 to 6, wherein the display screen is mounted on the terminal body, and the camera module is arranged on the bottom side of the display screen, so that the camera module can receive light that sequentially passes through the cover layer, the touch layer, the polarization layer, the microlens layer, the packaging layer, the gap between the pixel layers and the circuit driving layer of the display screen.

10. The terminal device according to claim 9, wherein: The camera module is installed at the opening of the back plate layer at the bottom of the display screen.

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