Photosensitive resin composition and photoresist

By compounding two photosensitive resins and introducing initiators and photopolymerizable monomers, the problems of insufficient adhesion and developability of photosensitive resins in black matrix photoresist are solved, and a black matrix material with high sensitivity and uniform CD is achieved.

CN112578632BActive Publication Date: 2025-09-05CHANGZHOU TRONLY NEW ELECTRONICS MATERIALS CO LTD +2
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Patent Information

Application Number
CN201910937146.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-09-29
Publication Date
2025-09-05
Estimated Expiration
2039-09-29

AI Technical Summary

Technical Problem

Existing photosensitive resins are difficult to achieve both high adhesion and high developability in black matrix photoresists, resulting in the photoresist being easily peeled off or having an excessively high residual film rate after alkaline washing and development.

Method used

A compounding scheme of two photosensitive resins is adopted, one of which is a high molecular weight photosensitive resin (weight average molecular weight of 6300-7800) and the other is a low molecular weight photosensitive resin (weight average molecular weight of 5000-5500). Initiators and photopolymerizable monomers are added, and their proportion and composition are optimized to improve adhesion and developability.

Benefits of technology

A high-sensitivity, CD-uniform black matrix is ​​achieved, which improves the light-curing performance, adhesion and alkali solvent resistance, and reduces the residual film rate.

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Abstract

The present invention provides a photosensitive resin composition and a photoresist. The photosensitive resin composition comprises a resin, wherein the resin comprises at least two photosensitive resins, each of the two photosensitive resins independently having a structure represented by structural formula I, wherein one of the photosensitive resins is a high molecular weight photosensitive resin having a weight average molecular weight of 6300 to 7800, and the other is a low molecular weight photosensitive resin having a weight average molecular weight of 5000 to 5500, and the structural formula I is: #imgabs0#. The photosensitive resin having structural formula I has high photocuring performance, substrate adhesion, alkali solvent resistance, and solvent resistance. By compounding the two photosensitive resins having the above advantages, the molecular weight of each photosensitive resin is further controlled. The high molecular weight photosensitive resin can improve resolution and adhesion while the low molecular weight photosensitive resin can improve developability and reduce residual film rate, thereby producing a black matrix with high sensitivity and uniform CD.
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