A beauty device

Abstract

The present invention relates to a beauty instrument, with a hair removal instrument as the main body, including a housing, in which a light source assembly, a power supply unit and a control circuit board are arranged; the light source assembly is powered by the power supply unit and generates pulsed light under the control of the control circuit board; the front end face of the beauty instrument is the working face; the beauty instrument is further provided with a display module electrically connected to the control circuit board.

Description

Technical Field

[0001] The present invention relates to the field of portable beauty instrument devices, and in particular to a beauty instrument. Background Art

[0002] Current beauty instruments on the market have relatively single functions and are turned on and off by button operations. Among them, hair removal instruments generally only have the function of hair removal and only set button on / off. Their function settings are basically realized by physical buttons, which is inconvenient to operate. Summary of the Invention

[0003] The purpose of the present invention is to provide a beauty instrument to solve the problems of single function and inconvenient operation of existing beauty instruments.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A beauty instrument, with a hair removal instrument as the main body, includes a housing, a light source component, a power supply unit and a control circuit board are arranged in the housing; the light source component is powered by the power supply unit and is controlled by the control circuit board to generate pulsed light; the front end face of the beauty instrument is the working face; the beauty instrument is also provided with a display module electrically connected to the control circuit board.

[0006] Further, a control unit is arranged on the control circuit board, and the display module includes a display module and a touch control module electrically connected to the control unit to realize touch control and display; the touch control module is used for touch control to set the function mode of the beauty instrument, and / or for setting the voltage or gear of the power supply unit.

[0007] In some embodiments, the light source assembly includes an IPL lamp tube, and the power supply unit is a charging capacitor for supplying power to the IPL lamp tube. An IPL lamp tube triggering module electrically connected to the control unit is provided on the control circuit board. The IPL lamp tube triggering module is electrically connected to the IPL lamp tube, and the control unit controls the IPL lamp tube triggering module to light the IPL lamp tube to generate pulsed light. A power cord is connected to the main body to access an external power supply to supply power to the beauty device. A power boost module electrically connected to the control unit is provided on the control circuit board. The power boost module is electrically connected to the charging capacitor, and the voltage output by the power cord is boosted by the power boost module and then used to charge the charging capacitor. The voltage output by the power cord is boosted by the power boost module and then used to supply power to the IPL lamp tube triggering module. The function modes of the beauty device include two or more of the following function modes: facial hair removal mode, leg hair removal mode, underarm hair removal mode, intimate area hair removal mode, skin rejuvenation mode, whitening mode, summer cooling mode, winter cooling mode, iontophoresis mode, and EMS mode. The voltage of the charging capacitor corresponding to the function mode of the beauty device is preset. The voltage of the charging capacitor corresponding to each gear is preset. Multiple gears can be set, each corresponding to a different voltage value of the charging capacitor to obtain different IPL pulsed light intensities. For example, six gears can be set, and the preset voltages of the charging capacitor corresponding to them are 270V, 290V, 320V, 340V, 360V, and 380V. According to different requirements, experiences, skin colors, or body parts of users, the user can adjust and set different gears, and the gear information is sent to the control unit through the key unit or the display component. The control unit controls the power boost module to provide the corresponding gear voltage to the charging capacitor, thereby adjusting or controlling the IPL light intensity. The user sets different function modes (or working modes) through the display component, and the control unit controls the power boost module to provide the preset voltage corresponding to the function mode to the charging capacitor to achieve the corresponding IPL pulsed light intensity.

[0008] In some embodiments, a DC power supply module electrically connected to the control unit is provided on the control circuit board. The power cord is connected to a power adapter to supply power to the beauty device, and the power adapter output includes two paths:

[0009] One path is output to the power boost module to supply power to the charging capacitor and the IPL lamp tube triggering module in parallel;

[0010] One path is output to the DC power supply module to supply power to the control unit and the electrical appliances connected to the control unit;

[0011] The voltage of the charging capacitor is 270~380V; the power adapter has a low-voltage output; the low-voltage output of the power adapter is 12~32V.

[0012] In some embodiments, the beauty device is further provided with at least one of a fan, a refrigeration module, a skin sensing module, a filter detection module, a skin color detection module, etc. that are electrically connected to the control unit; the refrigeration module is a thermoelectric cooler, and its positive and negative poles are electrically connected to the control unit; the skin sensing module is a sensor connected to the control unit, which is used to sense the contact area between the working surface and the skin, or sense whether the skin is approaching the working surface, so as to control the switching of the IPL lamp tube; the filter detection module is electrically connected to the control unit to detect the filter component used in the beauty device, so as to determine the wavelength characteristics of the filter in the filter component, and thus determine the beauty effect of the beauty device; the skin color detection module is electrically connected to the control unit to detect the skin color or hair color of the skin in contact with the working surface of the beauty device, so as to adjust or control the IPL light intensity; the power boost module is set by the control unit according to the current gear or function mode, controls the cut-off voltage of the power boost module, charges the charging capacitor for energy storage, and obtains the output voltage of the corresponding charging capacitor; the beauty device is further provided with a key unit electrically connected to the control unit, which is used for power on / off and / or controlling the switching of the IPL lamp tube.

[0013] When the control unit receives the switch signal sent by the key unit or the display component, it executes two judgment conditions:

[0014] Condition 1: Whether the skin sensing module senses the approach of the skin, or whether the contact area between the working surface of the beauty device and the skin reaches a preset condition;

[0015] Condition 2: Whether the voltage of the charging capacitor meets the preset voltage corresponding to the current mode or gear;

[0016] When both conditions are met, the control unit controls the IPL lamp tube trigger module to light up the IPL lamp tube to generate intense pulsed light.

[0017] In some embodiments, the beauty device further includes a thermoelectric cooler; the thermoelectric cooler includes a PN thermocouple particle layer, a cold surface and a hot surface; a hot-end circuit or a metal conductor is provided on the hot surface of the thermoelectric cooler, and a cold-end circuit or a metal conductor is provided on the cold surface of the thermoelectric cooler; the PN thermocouple particle layer includes P-type / N-type semiconductor particles; the cold-end circuit or metal conductor and the hot-end circuit or metal conductor respectively electrically connect the two ends of the P-type / N-type semiconductor particles to form a series circuit; a pair of electrodes are provided at both ends of the series circuit and are electrically connected to the control circuit board; the cold surface of the thermoelectric cooler is directly used as the working surface of the beauty device or cools the working surface.

[0018] In some embodiments, a light-emitting cavity is provided between the light source assembly and the working surface to transmit the pulsed light generated by the light source assembly to the working surface. A sealed light transmission channel is defined inside the structure of the light-emitting cavity; both the front and rear ends of the light transmission channel are open; the front end surface of the light cavity structure abuts against the thermoelectric cooler, and the front opening of the light transmission channel is covered by the thermoelectric cooler, which is adapted to the light-transmitting area of the thermoelectric cooler, and the pulsed light generated by the light source assembly is transmitted through the light transmission channel to the light-transmitting area of the thermoelectric cooler.

[0019] The rear end surface of the light cavity structure abuts against the light-emitting surface of the light source assembly, and the rear opening of the light transmission channel is covered by the light-emitting surface of the light source assembly. The pulsed light generated by the light source assembly is transmitted to the light transmission channel after being transmitted from the light-emitting surface.

[0020] In some embodiments, the thermoelectric cooler has a light-transmitting area for the pulsed light generated by the light source assembly to be transmitted through for beauty treatment; the working surface is formed of a transparent crystal material to form a transparent crystal working surface, thereby obtaining an ice compress effect; or the cold surface of the thermoelectric cooler is formed of a transparent crystal material to form a transparent crystal cold surface, and the transparent crystal cold surface is used as the working surface.

[0021] In some embodiments, the thermoelectric cooler uses a transparent crystal as the cold surface, and the transparent crystal is fixedly connected to one or more groups of the PN thermoelectric couple particle layers and the hot surface connected to the PN thermoelectric couple particle layers; the transparent crystal cold surface forms a light-transmitting area for the pulsed light generated by the light source assembly to be transmitted through for beauty treatment; or

[0022] The hot surface of the thermoelectric cooler is annular; the PN thermoelectric couple particle layer is annular or the P-type / N-type semiconductor particles are arranged in an annular shape and are correspondingly fixed on the annulus of the hot surface; the transparent crystal cold surface is a monolithic crystal that covers the hot surface and the PN thermoelectric couple particle layers, and the annular hollow area serves as the light-transmitting area for the pulsed light generated by the light source assembly to be transmitted through; or

[0023] The hot surface of the thermoelectric cooler is annular; the PN thermoelectric couple particle layer is annular or the P-type / N-type semiconductor particles are arranged in an annular shape; the cold surface is annular and is made of a transparent or opaque material, and the annular hot surface and cold surface are respectively welded to both ends of the PN thermoelectric couple particle layer or the P-type / N-type semiconductor particles, and the annular hollow area forms the light-transmitting area.

[0024] In some embodiments, a plurality of air inlets and air outlets are provided on the housing; a heat dissipation component is provided in the main body of the host for dissipating heat from the semiconductor refrigeration chip; the heat dissipation component includes a heat pipe and a radiator connected to the heat pipe; a fan is further provided in the housing; an air path is communicated among the air inlets, the radiator, the fan, and the air outlets to form a first heat dissipation air duct for air-cooling the radiator; by starting the fan, cold air is inhaled from the air inlets, the heat on the surface of the radiator is taken away, and hot air is discharged from the air outlets by the fan; the hot surface of the semiconductor refrigeration chip is connected to the radiator by the heat pipe, and a refrigerant is accommodated inside the heat pipe. The radiator includes a plurality of heat dissipation fins; the heat dissipation fins are metal heat dissipation fins, and the heat dissipation fins are connected and fixed by a connection structure.

[0025] In other embodiments, the plurality of heat dissipation fins are graphene radiators integrally formed of graphene material.

[0026] An air path is communicated among the air inlets on the housing, the space of the heat dissipation surface of the light source assembly, the fan, and the air outlets to form a second heat dissipation air duct. By starting the fan, cold air is inhaled from the air inlets, the heat on the surface of the light source assembly is taken away, and hot air is discharged from the air outlets by the fan for air-cooling the light source assembly.

[0027] In other embodiments, the light source assembly is connected to a radiator by a heat pipe for heat dissipation.

[0028] In some embodiments, the hot surface of the semiconductor refrigeration chip forms a VC heat conduction plate hot surface by using a VC heat conduction plate, and a refrigerant is accommodated inside; the hot surface of the semiconductor refrigeration chip is connected to a heat pipe, and the heat pipe is connected to the radiator; the inside of the heat pipe is communicated with the inside of the heat conduction plate to form a connected sealed space; the refrigerant circulates in the sealed space; the heat conduction plate surface is provided with the hot end circuit or a metal conductor, which is electrically connected and fixedly connected to one end of the P-type / N-type semiconductor particles.

[0029] In some embodiments, a card slot for inserting a filter component is provided between the light source assembly and the working surface in the main body of the host, and the filter component is inserted in a pluggable and replaceable manner to filter the pulsed light generated by the light source assembly before it is transmitted through the working surface to obtain pulsed light of a predetermined wavelength, so as to achieve different beauty or treatment effects; the filter component includes a filter, a frame bracket for fixing the filter, and a filter component circuit; the filter component circuit is arranged on a circuit board and installed on the frame bracket; the filter component and the card slot are further elastically tightened by an elastic element; the filter component circuit includes a resistor, and the wavelength characteristic of the filter in the corresponding filter component is identified by detecting the resistance value of the resistor in the filter component, or detecting the voltage across the resistor, or detecting the current flowing through the resistor; the wavelength characteristic of the filter is preset to correspond to the resistance value.

[0030] The beauty instrument is provided with an electrode assembly electrically connected to the main control circuit board. The electrode assembly includes a pair of counter electrodes, which are respectively electrically connected to the two ends of the resistor in the filter component circuit to detect and identify the filter in the corresponding filter component.

[0031] In some embodiments, the main body is divided by a pair of cross-sections inside into a first main body and a second main body that can rotate relative to each other. The first main body and the second main body are connected by a rotating connection structure; the front end face of the first main body is the working face, and the light source assembly is located inside the first main body.

[0032] With the cooperation of the pair of cross-sections and the rotating connection structure, when the first main body rotates relative to the second main body, the first main body and the second main body are in a straight plate type or side-standing type state at different angles; the cross-sections respectively serve as the connection end faces of the first main body and the second main body.

[0033] The beneficial effects of the present invention are as follows:

[0034] The beauty instrument of the present invention is provided with a display module, which can realize multi-functional settings and information display, facilitating operation and information display.

[0035] The following further describes the present invention in detail with reference to the accompanying drawings. Description of the Drawings

[0036] Figure 1 is a perspective view of the beauty instrument according to the first embodiment of the present invention.

[0037] Figure 2 is a perspective view of the beauty instrument according to the first embodiment of the present invention from another perspective.

[0038] Figure 3 is the beauty instrument according to the first embodiment of the present invention in the Figure 2 exploded view corresponding to the shown perspective.

[0039] Figure 4 is a schematic diagram of the internal structure of the beauty instrument according to the first embodiment of the present invention.

[0040] Figure 5 is a perspective view of the beauty instrument according to the first embodiment of the present invention with some housings removed.

[0041] Figure 6 is a schematic diagram of the structure and heat dissipation air duct of the internal light source assembly of the beauty instrument according to the first embodiment of the present invention.

[0042] Figure 7 is a schematic diagram of the heat dissipation air duct of the internal radiator of the beauty instrument according to the first embodiment of the present invention.

[0043] Figure 8 is an exploded view of the beauty instrument according to the second embodiment of the present invention.

[0044] Figure 9 It is the circuit diagram of the beauty instrument according to the embodiment of the present invention.

[0045] Figure 10 It is the perspective view of the first embodiment of the semiconductor refrigeration chip of the present invention.

[0046] Figure 11 It is the exploded view of the first embodiment of the semiconductor refrigeration chip of the present invention.

[0047] Figure 12 It is the front view of the first embodiment of the semiconductor refrigeration chip of the present invention.

[0048] Figure 13 It is the side view of the first embodiment of the semiconductor refrigeration chip of the present invention.

[0049] Figure 14 It is the perspective view of the refrigerating surface of the first embodiment of the semiconductor refrigeration chip of the present invention.

[0050] <* Figure 15 It is the perspective view of the second embodiment of the semiconductor refrigeration chip of the present invention.

[0051] Figure 16(a) - 16(f) It is the schematic diagram of the heat dissipation system in the second embodiment of the semiconductor refrigeration chip of the present invention.

[0052] Figure 17 It is the perspective view of the third embodiment of the semiconductor refrigeration chip of the present invention.

[0053] Figure 18(a) - 18(c) It is the schematic diagram of the heat dissipation system in the third embodiment of the semiconductor refrigeration chip of the present invention. [[ID=*39]]

[0054] Figure 19 It is the perspective view of the fourth embodiment of the semiconductor refrigeration chip of the present invention.

[0055] Figure 20(a) - 20(d) It is the schematic diagram of the heat dissipation system in the fourth embodiment of the semiconductor refrigeration chip of the present invention.

[0056] Figure 21 It is the perspective view of the fifth embodiment of the semiconductor refrigeration chip of the present invention.

[0057] Figure 22(a) - 22(e) It is the schematic diagram of the heat dissipation system in the fifth embodiment of the semiconductor refrigeration chip of the present invention.

[0058] Figure 23 It is the exploded view of the refrigeration structure according to the embodiment of the invention, and Figures (a) and (b) are two schematic structures.

[0059] Figure 24 It is the perspective view of the refrigeration structure according to the embodiment of the invention.

[0060] Figure 25(a) - 25(e) Note: There seems to be a repeated tag Figure 15 in the original text, and a repeated tag in the translation. Also, it's not clear if these are actual errors or just something specific to the patent text format. The translation has been done as accurately as possible while following the rules.It is the process flow diagram of the refrigeration structure of the invention embodiment.

[0061] Figure 26 It is the schematic circuit diagram of the semiconductor refrigerating sheet of the invention embodiment.

[0062] Figure 27 It is the schematic diagram of the refrigeration structure of the invention embodiment.

[0063] Figure 28 It is the three-dimensional view of the straight plate state of the rotatable beauty instrument of the invention embodiment.

[0064] Figure 29 It is the three-dimensional view of the side standing state of the rotatable beauty instrument of the invention embodiment.

[0065] Figure 30 It is the top view of several rotation states of the rotatable beauty instrument of the invention embodiment.

[0066] Figure 31 It is the exploded view of the rotatable beauty instrument of the invention embodiment.

[0067] Figure 32 In (a) - (c), it is the cross-sectional view of the side standing structure of the rotatable beauty instrument of the invention embodiment. Detailed implementation manners

[0068] It should be noted that, without conflict, the embodiments and features in the embodiments of the present invention can be combined with each other. The present invention will be further described in detail below with reference to the drawings and specific embodiments.

[0069] Beauty instrument embodiment

[0070] Refer to Figures 1 - 9 And Figures 28 - 32, the present invention relates to a beauty device 1000, which generally takes a hair removal device as the main body and can be configured with a filter component to obtain pulsed light of different wavelengths, corresponding to different beauty effects for different beauty treatments. In the figure, the structure of the beauty device of the present invention is specifically described by taking the hair removal device as an example. Both the hair removal device / beauty device are represented by the reference numeral 1000, and include a housing 6 and a heat dissipation component 2, a light source component 3, a power supply unit 4, a control circuit board 5, etc. installed inside the housing 6. The front end face of the beauty device 1000 is the working surface, which can be in direct contact with the skin to perform beauty treatments or hair removal on the contacted skin. The power supply unit 4 is electrically connected to the light source component 3 to supply power, and is controlled by the control circuit board 5 to generate pulsed light. A semiconductor refrigeration chip 1 is installed on the working surface of the hair removal device 1000. The cold surface 10 of the semiconductor refrigeration chip 1 can directly serve as the working surface or be used to cool the working surface. The control circuit board 5 controls the power supply unit 4 to start the light source component 3 to work to generate pulsed light, and the pulsed light penetrates the working surface for hair removal or other beauty treatments. The heat dissipation component 2 is used to cool the semiconductor refrigeration chip 1. An air inlet 60 and an air outlet 66 are provided on the housing 6. The hair removal device 1000 is connected to an external power supply through a power cord and / or a charging interface to access the external power supply. The power supply unit 4 is generally a charging capacitor, all represented by the reference numeral 4. The power cord accesses the external power supply to charge the charging capacitor 4 and supply power to the control circuit board 5 and other electronic components. The power supply element 4 can also be a conversion module.

[0071] The beauty device is further provided with a display module 9, which is used for displaying the function information of the beauty device and can also be used for function switching selection settings, etc. Preferably, the display module 9 is a touch screen, including a touch control module and a display module, which are used for touch control of the settings of the beauty device and display relevant information, and can specifically be used for operations such as switching the working mode (function mode) of the beauty device or setting the gear (controlling and adjusting the energy level of the light source). The display module 9 is electrically connected to the control circuit board 5, and corresponding functions are realized under the control of the control circuit board 5. Windows or openings are provided at appropriate positions on the housing 6, and the display module 9 is installed in the windows or openings provided on the housing. A transparent protective layer (not marked) can be further provided on the outermost layer. The display module 9 is electrically connected to the control circuit board 5 through a connector such as an FPC. The display module 9 can adopt a liquid crystal module and other existing technologies to configure the functions and gear settings of the beauty device.

[0072] Specifically refer to Figure 9 As shown in the circuit schematic diagram of the beauty device, a power adapter can be provided on the power cord of the beauty device, and the power adapter supplies power to the main body 1000 through a power output line. As an embodiment, the power adapter adopts a single-channel low-voltage output. In some embodiments, the preset voltage after the charging capacitor 4 is charged and stores energy is DC270~380V. The output line of the power adapter is a single-channel low-voltage output, for example, the output voltage is 12~32V, and the socket at its input end can access a power supply of 90V - 264V.

[0073] Specifically, a control unit is provided on the control circuit board. The display module 9 includes a display module and a touch control module electrically connected to the control unit to achieve touch control and display. The touch control module is used to set the function mode of the beauty device through touch control, and / or to set the voltage or gear of the power supply unit.

[0074] The light source assembly 3 includes an IPL lamp tube 31, and the power supply unit 4 is a charging capacitor that supplies power to the IPL lamp tube 31.

[0075] An IPL lamp tube trigger module electrically connected to the control unit is provided on the control circuit board 5; the IPL lamp tube trigger module is electrically connected to the IPL lamp tube 3, and the control unit controls the IPL lamp tube trigger module to light up the IPL lamp tube 3 to generate pulsed light. After the capacitor 4 completes energy storage and reaches the preset voltage, the control circuit board controls the IPL trigger module to light up the lamp tube.

[0076] A power boost module electrically connected to the control unit is provided on the control circuit board. The power boost module is electrically connected to the charging capacitor 4, and the voltage output by the power cord is boosted by the power boost module and then used to charge the charging capacitor 4. At the same time, the voltage output by the power cord is boosted by the power boost module and then used to supply power to the IPL lamp tube trigger module.

[0077] The control unit controls the cut-off voltage of the power boost module according to the current gear or function mode setting, charges and stores energy in the charging capacitor, and obtains the output voltage of the corresponding charging capacitor.

[0078] A DC power module electrically connected to the control unit is provided on the control circuit board 5; the power cord is connected to a power adapter to supply power to the beauty device, and the power adapter output includes two paths:

[0079] One path is output to the power boost module to supply power to the charging capacitor and the IPL lamp tube trigger module in parallel;

[0080] One path is output to the DC power module to supply power to the control unit and the electrical appliances connected to the control unit;

[0081] The voltage of the charging capacitor 4 is 270 - 380V.

[0082] The beauty device is further provided with at least one of modules such as a fan, a refrigeration module, a skin sensing module, a filter detection module, and a skin color detection module that are electrically connected to the control unit.

[0083] The refrigeration module is a thermoelectric cooler 1, and its positive and negative electrodes 113 are electrically connected to the control unit.

[0084] The control unit is a processor, such as an MCU.

[0085] The skin sensing module is a sensor 84 connected to the control unit, which is used to sense the contact area between the working surface and the skin, or sense whether the skin is approaching the working surface, so as to control the switch of the IPL lamp tube 3.

[0086] The filter detection module is electrically connected to the control unit and is used to detect the filter component 8 used in the beauty instrument to determine the wavelength characteristics of the filter in the filter component.

[0087] The skin color detection module is electrically connected to the control unit and is used to detect the skin color or hair color of the skin in contact with the working surface of the beauty instrument, so as to adjust or control the intensity of the IPL pulsed light.

[0088] The beauty instrument is also provided with a key unit electrically connected to the control unit, which is used to turn on and off and / or control the switch of the IPL lamp tube, and can also be used for function setting.

[0089] In a preferred embodiment, when the control unit receives a switch signal sent by the key unit or the display component 9, two judgment conditions are executed:

[0090] Condition 1: Whether the skin sensing module senses that the skin is approaching, or whether the contact area between the working surface of the beauty instrument and the skin reaches a preset condition; the preset condition is, for example, detecting that the skin surface can cover 70% or 90% of the working surface;

[0091] Condition 2: Whether the voltage of the charging capacitor meets the preset voltage corresponding to the current mode or gear;

[0092] When both conditions are met, the control unit controls the IPL lamp tube trigger module to light up the IPL lamp tube to generate pulsed light.

[0093] Among them, the function modes of the beauty instrument include: two or more of the function modes of facial hair removal mode, leg hair removal mode, underarm hair removal mode, intimate hair removal mode, skin rejuvenation mode, whitening mode, summer cooling mode, winter cooling mode, import and export mode, and EMS mode.

[0094] The output voltage of the charging capacitor 4 corresponding to different function modes of the beauty instrument is a preset value; the output voltage of the charging capacitor corresponding to the gear is also a preset value.

[0095] The beauty device can be set to multiple gears, which respectively correspond to different voltage values of the charging capacitor to obtain different IPL pulse light intensities. For example, six gears can be set, and the preset output voltages corresponding to the charging capacitor are 270V, 290V, 320V, 340V, 360V, and 380V. According to different requirements, experiences, skin colors, or body parts of users, the user can adjust and set different gears. The gear information is sent to the control unit through the key unit or the display component. The control unit controls the power boost module to provide the corresponding gear voltage to the charging capacitor, thereby adjusting or controlling the IPL light intensity. The user sets different function modes (or working modes) through the display component, and the control unit controls the power boost module to provide the preset voltage in the corresponding function mode to achieve the corresponding IPL pulse light intensity.

[0096] The heat dissipation component 2 is mainly used for dissipating the heat of the semiconductor refrigeration sheet 1, and includes a heat pipe 21, a radiator 23 connected to the heat pipe, and a fan 25. The heat pipe 21 is connected to the refrigeration sheet 1, so as to conduct the heat generated by the refrigeration sheet 1 to the heat dissipation component 2 for heat dissipation. The fan 25 is installed in a cavity 28, and one side of the cavity 28 extends to form an air outlet channel 280, and the end of the air outlet channel 280 is connected to the air outlet 66.

[0097] An air path is connected between the first air inlet 60, the heat dissipation air duct on the surface of the radiator, the fan 25, the air outlet channel 280 and the air outlet 66 to form the heat dissipation air duct of the radiator ( Figure 4 the arrow in it) that is the first heat dissipation air duct; by starting the fan to work, the first air inlet 60 sucks in cold air to the surface of the radiator 23 to take away heat, and the fan 25 discharges the hot air to the outside of the air outlet channel 280 and the air outlet 66, thereby realizing the air-cooled heat dissipation of the radiator. The fan 25 is electrically connected to the control circuit board 5, and its operation is controlled by the control circuit board 5.

[0098] The semiconductor refrigeration sheet 1 is installed in the working head, which can simultaneously serve as the working surface at the front end of the main body of the beauty device. The heat dissipation component 2 cools the refrigeration sheet; alternatively, the semiconductor refrigeration sheet 1 is used to cool the working surface of the beauty device. As a preferred embodiment, the working head directly uses the cold surface of the semiconductor refrigeration sheet 1 as the working surface of the beauty device. More preferably, the semiconductor refrigeration sheet 1 directly uses a transparent crystal as the cold surface 10 and simultaneously serves as the working surface in contact with the skin, obtaining a better ice application effect and pre-cooling effect, which will be specifically described later. The heat pipe 21 is connected to the hot surface 12 of the semiconductor refrigeration sheet 1, and conducts the heat of the semiconductor refrigeration sheet 1 from the hot surface 12 to the heat dissipation component 2 for heat dissipation.

[0099] The housing 6 includes an upper housing 61 and a lower housing 62 (relatively in the up and down direction, only for convenience of description here), and also includes a working head housing 63. In the first embodiment of the hair remover, a second air inlet 65 is provided at a position corresponding to the light source assembly 3 on the upper housing 61 and / or the lower housing 62. Preferably, the second air inlet 65 is provided on both the upper and lower housings. The second air inlet 65 is in spatial air path communication with the heat dissipation surface of the light source assembly 3, and is used to suck cold air (cold air) from the outside inward to perform air cooling on the light source assembly 3.

[0100] The lower housing 62 is provided with an opening 69, and the radiator 23 is located at a position behind the opening; a baffle 64 is covered outside the opening 69, and the baffle 64 is buckled on the opening 69 of the lower housing. Air holes 68 are provided on the baffle, and the air holes 68 can be a group or multiple groups of densely arranged through holes. The air holes 68 are used to connect the external environment with the internal air path of the housing, specifically to connect with the space air path on the surface of the radiator, and are used to suck ambient cold air into the surface of the radiator 23 for air cooling.

[0101] As an embodiment, the gap between the edge of the baffle 64 and the edge of the opening 69 of the lower housing is used as an air outlet 66 and a lateral air inlet 67. The air outlet 66 is connected to the end of the air outlet channel 280, and the lateral air inlet 67 is used to form a lateral air inlet for the surface of the radiator. Combined Figure 1 and Figure 6 As shown, a gap is formed between the baffle 64 and the four peripheral edges of the opening 69 of the lower housing 62. The gap between one of the edges forms the air outlet 66, and the gaps between the other edges form the lateral air inlet 67. The lateral air inlet 67 is in air path communication with the heat dissipation air duct on the surface of the radiator 23 behind the lower housing 62, and is used to perform lateral air inlet on the surface of the radiator 23 to increase the amount of cold air entering and the air inlet speed. The lateral air inlet can also effectively avoid the control circuit board 5 being eroded by water mist or water droplets easily formed by the way of air inlet from the front of the lower housing. The air holes 68 on the housing can be used for forward air inlet. Combined with the lateral air inlet 67 for lateral air inlet, a first air inlet 60 with multi-directional air inlet is thus formed to perform air cooling on the surface of the radiator and improve the heat dissipation efficiency. The first air inlet 60 is used to introduce cold air to the surface of the radiator, and can include the lateral air inlet 67 formed by the gap between the baffle 64 and the edge of the opening of the lower housing, and can also include a group or multiple groups of air holes 68 on the baffle. In other embodiments, the first air inlet 60 is not limited to the lateral air inlet 67 and the air holes 68.

[0102] The upper housing 61 is assembled with a key unit and a touch screen / display screen 9. Of course, it can also be installed on the lower housing 62. The control circuit board 5 is installed on the inner side of the upper housing 61.

[0103] The light source assembly 3 includes a light source 31 and a reflecting cup 32 provided outside the light source. The light source 31 uses an IPL lamp tube, which can generate pulsed light. The control circuit board 5 controls the power supply unit 4 to supply power to the light source. The pulsed light is emitted from the light source assembly and transmitted to the working head to act on the skin surface, thereby performing ablative hair removal or beauty treatment. In this embodiment, the heat generated by the operation of the light source assembly 3 is also dissipated through the heat dissipation assembly 2. The reflecting cup 32 is made of a heat-conducting material, and the heat generated by the light source 31 is conducted to the reflecting cup 32 for heat dissipation. The power supply unit 4 can use a charging capacitor or a power conversion module.

[0104] In the first embodiment of the present invention, the light source assembly 3 is installed on the light source bracket 7. The light source bracket 7 is installed in the housing 6 and is located behind the working head. The working head and the light source bracket 7 are connected by a mirror cover 71. The pulsed light generated by the light source assembly 3 is transmitted through the mirror cover 71 to the working head for hair removal treatment. Both ends of the light source assembly 3 are installed on the light source bracket 7, and the light source bracket 7 is respectively provided with light-shielding sleeves 72( Figure 6 ) to block both ends of the light source assembly; the surface of the light-shielding sleeve 72 facing the reflecting cup 32 of the light source is inclined, so as to direct the cold air sucked into the second air inlet 65 to the surface of the reflecting cup for heat dissipation. In addition to guiding the cold air, the light-shielding sleeve 72 is also used to block light and prevent light leakage at the two installation ends of the light source assembly. The light-shielding sleeve 72 can be a plate, and the plate surface is inclined towards the surface of the reflecting cup 32. The light-shielding sleeve 72 can also be a sealing sleeve, which is sleeved outside both ends of the light source assembly.

[0105] In a preferred embodiment, the light generated by the light source assembly 3 is transmitted to the working surface through the light-emitting cavity structure 70. The light-emitting cavity structure is connected between the semiconductor refrigeration sheet 1 and the light-emitting surface of the light source assembly 3, and a sealed and heat-insulated light transmission channel is defined inside. Both the front and rear ends of the light transmission channel are open. The front end surface of the light cavity structure abuts against the semiconductor refrigeration sheet, and the front opening of the light transmission channel is covered by the semiconductor refrigeration sheet, which is adapted to the light-transmitting area 102 of the semiconductor refrigeration sheet 1. The pulsed light generated by the light source assembly is transmitted to the light-transmitting area of the semiconductor refrigeration sheet through the light transmission channel. The rear end surface of the light cavity structure abuts against the light-emitting surface of the light source assembly 3, and the rear opening of the light transmission channel is covered by the light-emitting surface of the light source assembly 3. The pulsed light generated by the light source assembly is transmitted to the light transmission channel after being transmitted from the light-emitting surface.

[0106] Refer to Figure 3 、 7, specifically, the light output cavity structure 70 includes a mirror cover bracket 79, a mirror cover 71, a sealing ring 73, a sealing ring pressing plate 75, and also includes a white glass or a highly transparent dielectric plate 76. The mirror cover 71 is cylindrical with openings at both ends, and a light transmission channel is defined inside. The shape and size of its front end are adapted to the light transmission area 102 of the semiconductor refrigerating sheet 1. Preferably, the light generated by the light source assembly is just transmitted to the light transmission area of the refrigerating sheet 1, that is, the port of the mirror cover 71 has the same shape and size as the light transmission area 102, isolating the hot surface of the semiconductor refrigerating sheet outside the mirror cover 71. The mirror cover 71 is installed on the mirror cover bracket 79; the mirror cover bracket 79 is made of heat-insulating material, used to fix the mirror cover 71 and for heat insulation. Its front end is an annular cavity adapted to the mirror cover 71, and the mirror cover 71 can be sleeved inside or outside the mirror cover bracket 79. In this embodiment, it is sleeved in the front-end annular cavity of the mirror cover bracket 79; on the rear end surface of the mirror cover bracket 79, a white glass or a highly transparent dielectric plate 76 is arranged to cover and seal. The white glass or the highly transparent dielectric plate 76 has high light transmittance. A sealing ring 73 is sleeved on its edge, which is combined with the sealing ring 73 for light transmission (as the light output surface of the light source assembly) and for sealing the other end of the refrigerating sheet cavity and as the light output surface of the light source assembly 3, so as to form a closed light transmission channel between the refrigerating sheet 1 and the light output surface of the light source assembly 3, prevent water droplets from forming inside the refrigerating sheet 1 due to the temperature difference during refrigeration, and can also play a heat insulation effect, isolating the hot surface of the semiconductor refrigerating sheet outside the mirror cover bracket 79, and the heat generated by the hot surface will not be introduced into the internally sealed light transmission channel of the light cavity assembly 70, making the refrigeration effect of the cold surface of the refrigerating sheet better. Outside the white glass or the highly transparent dielectric plate 76, a pressing plate 75 is further arranged, which is an annular frame adapted to the shape of the white glass or the highly transparent dielectric plate 76, and presses the white glass or the highly transparent dielectric plate 76. A slot for installing a filter can also be arranged on the pressing plate 75, which can be used to insert the filter assembly 8. One or more white glasses or highly transparent dielectric plates 76 can be arranged on the light output surface of the light source assembly 3. The pulsed light generated by the light source assembly 3 is transmitted through the white glass or the highly transparent dielectric plate 76 and then transmitted to the light transmission area 102 or the working surface of the semiconductor refrigerating sheet through the sealed light transmission channel.

[0107] Figures 3 - 6 In the present embodiment shown, at least one ventilation pipeline 78 is arranged inside the light source bracket 7. Each ventilation pipeline 78 runs through up and down from the second air inlet 65 to the surface of the reflecting cup of the light source, and is communicated with the space on the surface of the light source assembly, that is, the air path of the following air-cooled cavity 33. The end of the ventilation pipeline 78 is communicated with the second air inlet 65 arranged on the housing, guiding the cold air inhaled by the second air inlet 65 to the surface of the light source assembly for heat dissipation. Preferably, at least one ventilation pipeline 78 is respectively arranged in the upper and lower parts of the light source bracket 7. Correspondingly, second air inlets 65 are arranged at corresponding positions of the upper and lower housings 61, 62 and are connected to the ventilation pipeline 78.

[0108] In this embodiment, an air guide cover 30 is provided outside the light source assembly 3. The spaced space between the air guide cover 30 and the surface of the light source assembly 3 forms an air-cooled cavity 33 for dissipating heat from the light source assembly. The air-cooled cavity 33 corresponds to the space on the surface of the light source assembly mentioned above. The air-cooled cavity 33 is in gas communication with the ventilation pipeline 78 provided in the light source bracket 7, and thus is in gas communication with the second air inlet 65 provided on the housing 6. The air-cooled cavity 33 is in gas communication with the cavity 28 where the fan is installed (or with the air duct of the fan). The inner side of the air guide cover 30 covers the outside of the reflector cup 32 of the light source. The air-cooled cavity 33 is the space defined between the air guide cover 30 and the surface of the reflector cup 32 of the light source. The cold air inhaled into the air-cooled cavity cools the reflector cup 32 of the light source. The shape and size of the air guide cover 30 are adapted to the reflector cup 32 of the light source and an air-cooled cavity 33 is formed between the air guide cover and the outer wall of the reflector cup. This configuration reduces the height of the gap and maximizes the surface area of the opposite surfaces, so as to facilitate the formation of a strong negative pressure in the air-cooled cavity 33 when the fan starts, thereby increasing the intensity of the cold air inhaled from the second air inlet 65. Preferably, one side of the air guide cover 30 covers the outside of the reflector cup 32, and the other side is provided with a hollow connection end 34 communicating with the air-cooled cavity 33 and is in gas communication with the fan 25.

[0109] The second air inlet 65 on the housing 6, the space on the surface of the light source assembly, i.e., the air-cooled cavity 33, the cavity 28 where the fan is installed, the air outlet channel 280, and the air outlet 66 are in gas communication to form a heat dissipation air duct for the light source assembly 3, i.e., the second heat dissipation air duct. By starting the fan 25 to work, cold air is inhaled from the second air inlet 65 to the surface of the light source assembly, taking away the heat on the surface of the light source assembly to form hot air. The hot air is inhaled into the cavity 28 and is discharged by the fan to the air outlet channel 280, and finally discharged from the air outlet 66, thereby realizing the air-cooled heat dissipation of the light source assembly 3.

[0110] A seal 35 can also be provided in the main body of the beauty instrument to seal the air inlet hole at one end of the fan 25 and / or the edge of the end of the air outlet channel 280 to prevent lateral air leakage.

[0111] In this embodiment, the fan 25 is installed inside the cavity 28. The cavity 28 includes an annular cavity part, which is buckled with the pressing plate 29 to fix the fan 25 in the cavity. One side of the cavity 28 extends obliquely towards the air outlet 66 to form an inclined air outlet channel 280, so as to isolate the heat dissipation air duct from the main board. The air outlet hole 250 of the fan, the air outlet channel 280 defined by the cavity 28, and the air outlet 66 are in gas communication.

[0112] The air outlet channel 280 can also be defined by a partition provided inside the main body of the host, so that the hot air discharged by the fan is only led out of the air outlet through the air outlet channel 280, and is isolated from internal components such as the control circuit board.

[0113] In this embodiment, an air path is connected between the air inlet 60, the radiator 23, the fan 25, and the air outlet 66 to form a first heat dissipation air duct for air-cooling the radiator 25. By starting the fan, cold air is inhaled from the air inlet, and the heat on the surface of the radiator is taken away to form hot air, which is discharged from the air outlet. The hot surface 12 of the thermoelectric cooler 1 is connected to the radiator 23 by a heat pipe 21.

[0114] An air path is connected between the air inlet 65 on the housing 6, the space on the heat dissipation surface of the light source assembly, the fan 25, and the air outlet 66 to form a second heat dissipation air duct. By starting the fan, cold air is inhaled from the air inlet 78, and the heat on the surface of the light source assembly is taken away to form hot air, which is discharged from the air outlet by the fan for air-cooling the light source assembly.

[0115] The radiator 23 includes a plurality of heat dissipation fins. The heat dissipation fins are metal heat dissipation fins, and the heat dissipation fins are connected and fixed by a connection structure; alternatively, the plurality of heat dissipation fins are integrally formed of graphene to form a graphene radiator.

[0116] In other embodiments of the beauty instrument, refer to Figure 8, the light source assembly 3 dissipates heat through the heat pipe 21' and the radiator 23', and the second air inlet 65 and the ventilation pipeline 78 in the above embodiment may not be provided. The air guide cover 30 is replaced by a heat conduction cover 30', which is made of a high heat conduction material and is adapted to the shape of the reflector cup 32, and is tightly wrapped on the back of the reflector cup 32. Thermal conductive silicone grease may be pasted or coated between the reflector cup 32 and the heat conduction cover 30' to quickly transfer the heat of the reflector cup 32 to the heat conduction cover 30'. One side of the heat conduction cover 30' is provided with a cover body 35', which is tightly wrapped on the back of the reflector cup 32, and the other side is provided with a tubular slot 34' for riveting / welding / attaching the heat pipe 21' (i.e., a copper tube radiator or a capillary copper tube) to conduct heat to the heat pipe 21'. For easy assembly and fixation, the heat conduction cover 30' further includes a fixing plate 36. For example, the cover body 35' and the tubular slot 34' are arranged on the front and back sides of the fixing plate 36. One end of the heat pipe 21' is inserted into the tubular slot 34' of the heat conduction cover 30', and the surfaces between the two are in close contact and fit together. Thermal conductive silicone grease may be pasted or coated between them to transfer the heat of the reflector cup 32 to the heat pipe 21' through the heat conduction cover 30'. There is a refrigerant inside the heat pipe 21'. In this embodiment, the heat pipe 21' is bent into a U shape or an L shape, and one end (or a section) 26 of it is inserted into the tubular slot 34' of the heat conduction cover 30' and is riveted / welded / attached to the inner wall of the tubular slot 34'. The other end or both ends of the heat pipe 21' are connected to the radiator 23'. The heat is transferred to the radiator 23' through the heat pipe 21' (copper tube). The position of the radiator 23' at the other end of the heat pipe 21' is set between the air outlet hole 250 of the fan 25 and the air outlet channel 280 or installed in the air outlet channel 280, so that the air can take away the heat of the radiator 23' of the reflector cup. In other alternative embodiments, a tubular slot 34' is provided on the back of the reflector cup, and one end or a section of the light source heat dissipation heat pipe is sleeved and attached to the tubular slot 34' to conduct heat to the light source heat dissipation heat pipe; at this time, the heat conduction cover 30' may be omitted.

[0117] Embodiment of a thermoelectric cooler

[0118] Refer to simultaneously Figures 10 - 14 , in combination with Figures 26 - 27 , the thermoelectric cooler 1 provided in the first embodiment of the present invention is used with its working surface in contact with the skin. Among them, the thermoelectric cooler 1 directly uses a transparent crystal as the cold surface 10 and at the same time uses it as the working surface in contact with the skin. The heat pipe 21 of the heat dissipation assembly 2 is connected to the hot surface 12 of the thermoelectric cooler 1 to conduct the heat of the thermoelectric cooler 1 from the hot surface 12 to the heat dissipation assembly 2 for heat dissipation. The thermoelectric cooler 1 is fixedly assembled by the working head housing 63. The working head housing 63 is tightly assembled with the front ends of the upper and lower housings 61 and 62 and is tightly assembled with the light source bracket 7. The working head housing 63 and the upper and lower housings 61 and 62 as well as the light source bracket 7 can be further assembled by fasteners such as screws, positioning posts or snap structures.

[0119] The control circuit board 5 controls the light source assembly 3 to work to generate pulsed light that penetrates the semiconductor refrigeration sheet 1 for hair removal or other beauty treatments. The control circuit board 5 can also be used to control the semiconductor refrigeration sheet 1 to perform refrigeration work. It can be understood that the semiconductor refrigeration sheet 1 can also be provided with an independent power supply or an independent control circuit board to separately control the operation of the semiconductor refrigeration sheet 1.

[0120] One end of the heat pipe 21 is provided with a heat conducting member 22, and the heat conducting member 22 is attached to the hot surface 12 of the semiconductor refrigeration sheet 1, and is used to conduct the heat of the hot surface 12 of the semiconductor refrigeration sheet to the heat pipe 21 through the heat conducting member 22, and the heat pipe 21 and the radiator 23 dissipate the heat.

[0121] The heat conducting member 22 is generally a metal member, preferably copper. The shape of the heat conducting member 22 is adapted to the shape of the hot surface 12 of the semiconductor refrigeration sheet 1, and is in contact with the hot surface 12 of the semiconductor refrigeration sheet 1 in a fitting manner, so as to facilitate rapid heat transfer. There is a refrigerant circulating inside the heat pipe 21, and the heat pipe is fixed on the surface or inside of the fin radiator 23. The heat pipe 21 is preferably a copper pipe. One end or a section of the heat pipe 21 connected to the semiconductor refrigeration sheet 1 is wound to form a ring 24, and the ring 24 is adapted to the shape and size of the hot surface of the semiconductor refrigeration sheet 1. The ring 24 of the heat pipe 21 is consistent with the contour of the heat conducting member 22, and the heat conducting member 22 and the ring 24 of the heat pipe 21 are sleeved with each other and annularly fitted. In this embodiment, the heat conducting member 22 is a metal ring.

[0122] The semiconductor refrigeration sheet 1 of the embodiment of the present invention includes a cold surface 10, a semiconductor electric couple layer 11 formed by electrically connecting P-type / N-type semiconductor particles with a metal conductor, and a hot surface 12. The semiconductor electric couple layer 11 is located between the cold surface 10 and the hot surface 12. Among them, the cold surface 10 of the semiconductor refrigeration sheet is composed of a transparent crystal, so as to form a transparent crystal cold surface; the inner surface of the transparent crystal cold surface 10 is fixedly connected to the metal conductor of the semiconductor electric couple layer 11. The hot surface 12 of the semiconductor refrigeration sheet is composed of ceramics or other suitable substrates, and the inner surface of the hot surface substrate is fixedly connected to the metal conductor of the semiconductor electric couple layer 11. The ceramic substrate hot surface 12 and the transparent crystal cold surface 10 sandwich the semiconductor electric couple layer 11 inside to form the semiconductor refrigeration sheet 1. The ends of the semiconductor electric couple layer 11 are connected with positive and negative electrodes 113. The transparent crystal is a transparent material with high light transmittance, high thermal conductivity coefficient, and high heat resistance, such as natural spar or gemstone. The metal conductor can be formed on the hot surface and the cold surface through a metallization process, and the semiconductor particles are connected in series to form the internal circuit of the semiconductor refrigeration sheet.

[0123] The fixed connection between the semiconductor electric couple layer 11, the cold surface 10 of the transparent crystal, and the hot surface 12 of the ceramic substrate can be achieved by means applicable in the prior art. For example, first, the inner surfaces of the cold surface 10 of the transparent crystal and the hot surface 12 of the ceramic substrate are metallized to form metal conductors or form a cold-end circuit and a hot-end circuit, and then they are respectively welded and serially electrically connected to both ends of the P-type / N-type semiconductor particles of the semiconductor electric couple layer 11. Alternatively, the semiconductor electric couple layer 11, the cold surface 10 of the transparent crystal, and the hot surface 12 of the ceramic substrate are further bonded by a heat-conducting adhesive to form a bonded fixation.

[0124] In this embodiment, the semiconductor electric couple layer 11 is annular or the P-type / N-type semiconductor particles are arranged in an annular shape. Its annular region 111 is used to arrange electronic components, and the internal hollow region 112 allows light to penetrate. The semiconductor electric couple layer 11 is formed by electrically connecting a metal conductor or a cold-end circuit / hot-end circuit to both ends of the P-type / N-type semiconductor particles to form a series circuit of the P-type / N-type semiconductor particles. Utilizing the Peltier effect of semiconductor materials, when direct current passes through an electric couple formed by two different semiconductor materials, N and P, connected in series, heat transfer will occur between the two ends, and heat will transfer from one end to the other, thereby generating a temperature difference to form a cold end and a hot end. The cold end uses a transparent crystal to form the cold surface of the semiconductor refrigeration sheet, and the hot end can use a ceramic substrate to form the hot surface 12 of the semiconductor refrigeration sheet. Of course, other suitable materials can also be used as the hot surface.

[0125] The semiconductor electric couple layer of the semiconductor refrigeration sheet 1 is the PN electric couple particle layer, all denoted by the label 11. The cold surface 10 and the hot surface 12 are respectively arranged at the cold end and the hot end of the PN electric couple particle layer, and the PN electric couple particle layer is provided with positive and negative electrodes 113.

[0126] The PN electric couple particle layer 11 includes P-type / N-type semiconductor particles. In some embodiments, the P-type / N-type semiconductor particles can be directly in granular form and arranged in a predetermined cold-end and hot-end circuit layout, and directly welded to the cold surface 10 and the hot surface 12 of the semiconductor refrigeration chip to form a sandwich structure between the cold surface 10 and the hot surface 12 of the semiconductor refrigeration chip. During assembly, one end of the P-type / N-type semiconductor particles can be welded to one of the cold surface 10 or the hot surface 12 first. For example, the P-type / N-type semiconductor particles are first welded to the hot surface, so as to weld and fix the P-type / N-type semiconductor particles, and then the cold surface 10 is welded to the other end of the P-type / N-type semiconductor particles, thereby forming a semiconductor refrigeration chip structure. In other embodiments, the P-type / N-type semiconductor particles can be fixed into an integral structure of a predetermined shape, and corresponding circuits or electrical connection points are formed at both ends. The PN electric couple particle layer 11 is made into a predetermined shape, such as a ring shape, and corresponding circuits or electrical connection and welding points (not shown) are formed on both end faces, and are respectively welded and electrically connected to the metal conductors or circuits on the cold surface 10 and the hot surface 12. The setting of the PN electric couple particle layer 11 can adopt the setting of the semiconductor electric couple layer (PN electric couple particle layer) of the semiconductor refrigeration chip in the prior art.

[0127] A circuit 122 is formed on the hot surface 12 of the semiconductor refrigeration chip as a hot-end circuit (or metal conductor); a cold surface circuit 110 (or metal conductor) is formed on the transparent crystal cold surface. The cold surface circuit 110 and the hot-end circuit 122 are respectively electrically connected to both ends of the P-type / N-type semiconductor particles to form a series circuit, and are connected to the control main board by positive and negative electrodes 113.

[0128] Among them, one end of the P-type / N-type semiconductor particles of the PN electric couple particle layer 11 is welded to the hot-end circuit 122 and is connected in series by the hot-end circuit 122. Figure 26 As shown in the figure, the particle distribution diagram of the hot surface 12 of the semiconductor refrigeration chip, where the bar-shaped box is the circuit 122 formed on the hot surface, which can be a circuit obtained after etching or metallization for welding P / N-type semiconductor particles. Metal conductive points are formed on the surface of the hot surface 12 of the heat conducting plate, corresponding to welding and connecting the P-type / N-type semiconductor particles in series. During welding, the P-type semiconductor particles and the N-type semiconductor particles can be welded in two times. When loading the P-type semiconductor particles, the position of the N-type semiconductor particles is blocked by a tooling fixture.

[0129] The other end of the P-type / N-type semiconductor particles in the PN electric couple particle layer is welded to the cold surface 10 of the semiconductor refrigeration chip, and a cold-end circuit 110 is arranged on the cold surface and is electrically connected to the other end of the P-type / N-type semiconductor particles. The cold-end circuit 110 can be formed into a conductive solder joint by solder paste according to a predetermined circuit distribution diagram or solder paste can be printed according to the circuit distribution diagram for welding the other end of the P-type / N-type semiconductor particles.

[0130] After the cold surface 10 is assembled on the hot surface 12 where P / N type semiconductor particles are welded, all the P / N type semiconductor particles are in series.

[0131] The shape of the ceramic substrate hot surface 12 is annular. The annular region 126 serves as a heat dissipation surface, and the internal hollow region 127 allows light to penetrate. The annulus of the semiconductor thermocouple layer 11 is adapted to the annulus of the ceramic substrate hot surface 12, and the internal hollow regions communicate with each other and the edges are aligned.

[0132] The transparent crystal cold surface 10 covers the entire surface of the semiconductor thermocouple layer 11. The transparent crystal cold surface 10 is a single piece or a whole crystal with a continuous surface. Preferably, the thickness of the transparent crystal cold surface is not less than 1 mm to improve the strength of the semiconductor refrigeration chip 1, reduce the risk of damage during assembly, and extend the service life. The transparent crystal material in this embodiment has high light transmittance and high thermal conductivity, so as to facilitate the pulsed light to penetrate the transparent crystal for hair removal operation, and the high thermal conductivity is beneficial to improve the refrigeration efficiency and effect.

[0133] The middle region of the transparent crystal cold surface 10 is a light-transmitting region 102, and the peripheral annular region 101 is adapted to the annulus of the semiconductor thermocouple layer 11 / hot surface 12. Correspondingly, the light-transmitting region 102 of the transparent crystal cold surface covers the internal hollow region of the semiconductor thermocouple layer 11 / hot surface 12, thus covering the hollow region and allowing light to penetrate. The entire surface refrigeration region of the transparent crystal cold surface 10 includes the light-transmitting region 102 and the annular region 101 outside the light-transmitting region. The whole surface of the crystal is refrigerated, increasing the refrigeration area and providing a better experience.

[0134] Refer to Figure 10 , after the surface of the annular region 101 of the transparent crystal cold surface 10 is subjected to a light-shielding treatment, an annular light-shielding region (the shaded part in Figure 10 ) is formed to shield the internal electronic components. Specifically, the light-shielding treatment can be to coat a light-shielding film on one or both sides of the transparent crystal, and then remove the light-shielding film at the corresponding position of the middle light-transmitting region; or directly print a light-shielding layer on the annular region of the transparent crystal, avoiding the light-transmitting region. The light-shielding region is formed by surface treatment of the transparent crystal cold surface 10, and can be treated on both sides or any one side of the crystal, and can be treated by coating, spraying, printing and other methods.

[0135] The four peripheral edges of the transparent crystal cold surface 10 can be further processed to form an assembly position 103 (refer to Figure 11 ) for fixed assembly with an external housing (such as the housing of the working head). In a more specific example, the assembly position 103 can be a bevel or a stepped surface, which can form a clamping fit with the working head housing 63. It can be understood that the transparent crystal cold surface 10 of the semiconductor refrigeration chip 1 of the present invention is the working surface in contact with the skin, which produces an ice compress or pre-cooling effect on the skin and improves the user experience.

[0136] Other embodiments of the semiconductor refrigerating sheet

[0137] Referring to Figures 15 - 22(e) , in other embodiments, the semiconductor refrigerating sheet 1 includes a semiconductor electric couple layer (PN electric couple particle layer) 11, and a hot surface 12 and a cold surface 10 at both ends of the semiconductor electric couple layer (PN electric couple particle layer). The cold surface 10 is formed of a transparent crystal to form a transparent crystal cold surface. A group or multiple groups of the semiconductor electric couple layers (PN electric couple particle layers) 11 and the hot surface 12 fixedly connected to the semiconductor electric couple layer (PN electric couple particle layer) are fixedly connected to the surface of the transparent crystal. The semiconductor refrigerating sheet has a light-transmitting area 102 provided by the transparent crystal.

[0138] Wherein, the group or multiple groups of semiconductor electric couple layers (PN electric couple particle layers) and the hot surface fixedly connected to the semiconductor electric couple layer (PN electric couple particle layer) are arranged on one side, opposite sides or multiple sides of the transparent crystal.

[0139] A hot-end circuit or a metal conductor is arranged on the hot surface 12 of the semiconductor refrigerating sheet, and a cold-end circuit or a metal conductor is arranged on the cold surface 10 of the semiconductor refrigerating sheet. The PN electric couple particle layer 11 includes series-connected P-type / N-type semiconductor particles. The cold-end circuit or the metal conductor and the hot-end circuit or the metal conductor electrically connect both ends of the P-type / N-type semiconductor particles respectively to form a series circuit. Both ends of the series circuit are connected to a pair of electrodes 113 and are electrically connected to the control circuit board 5.

[0140] Referring to Figure 15 , for the semiconductor refrigerating sheet 1 of the second embodiment of the present invention, the cold surface 10 is a square (not limited to square) transparent crystal, and a group of semiconductor electric couple layers (PN electric couple particle layers) 11 and the hot surface 12 fixedly connected to the semiconductor electric couple layer (PN electric couple particle layer) are arranged on one side surface, such as the left side surface, of the transparent crystal. A pair of electrodes (not shown) are arranged on the semiconductor electric couple layer (PN electric couple particle layer) 11. The other two pairs of surfaces of the transparent crystal, such as the front and back (or up and down) surfaces, can be used as the light-transmitting area 102 for pulse light to transmit for hair removal or beauty treatment for other effects. The arrow direction in the figure indicates the incident direction of the pulse light.

[0141] Further referring to Figure 16(a) - 16(f), the arrow direction in the figure indicates the incident direction of the pulsed light. The thermoelectric cooler 1 of these embodiments is connected to the heat dissipation component 2, and the heat of the thermoelectric cooler is conducted from the hot surface 12 to the heat dissipation component for heat dissipation. The heat dissipation component 2 includes a heat pipe 21 and a radiator 23 connected to the heat pipe 21. The heat pipe is installed on the surface or inside of the radiator. One end 26 of the heat pipe 21 is in direct contact with the hot surface 12 of the thermoelectric cooler 1 or is in contact with the hot surface through a heat conducting member. In this embodiment, one end 26 of the heat pipe is adapted to the shape of the hot surface 12 of the thermoelectric cooler and is in close contact therewith; for facilitating the close contact between one end 26 of the heat pipe and the hot surface 12, the end of the heat pipe 21 can be bent, and various bending designs shown in the figure are, for example, L-shaped. The heat pipe 21 can be a capillary copper pipe with a refrigerant circulating inside. The radiator is one or a combination of a fin radiator, a heat sink, or a heat conducting plate. Among the various radiator structures shown in the figure, the radiators 23 shown in FIGS. 16(a) and 16(e) are heat sinks. For example, one or more groups of heat sinks are arranged in parallel, and the heat pipe 21 is fixedly arranged through the parallel heat sinks. In FIGS. 16(b), 16(c), 16(d), and 16(f), the radiator 23 includes a heat conducting plate 230 and a group of parallel heat sinks 231 fixed to one side surface of the heat conducting plate 230. One end 26 of the heat pipe 21 is bent and then in close contact with the hot surface 12 of the thermoelectric cooler, and they can have the same shape and size. The heat pipe 21 is fixed to the other side surface of the heat conducting plate 230, or is arranged through one or more groups of parallel heat sinks 231 or on their surfaces. The heat sink can be a metal thin sheet with high thermal conductivity or a heat sink integrally formed of graphene material.

[0142] Refer to Figure 17, the cold surface 10 of the thermoelectric cooler 1 according to the third embodiment of the present invention is a square (not limited to square) transparent crystal. On the opposite two side surfaces of the transparent crystal, for example, on the left and right sides, a set of semiconductor thermocouple layers (PN thermocouple particle layers) 11 and a hot surface 12 fixedly connected to the semiconductor thermocouple layer (PN thermocouple particle layer) are provided. Each semiconductor thermocouple layer (PN thermocouple particle layer) 11 is provided with a pair of electrodes (not shown). The other two pairs of surfaces of the transparent crystal, for example, the front and rear surfaces (or the upper and lower surfaces), can be used as a light-transmitting area 102 for pulsed light to transmit for hair removal or other efficacy beauty treatments. The arrow direction in the figure indicates the incident direction of the pulsed light. In a specific example, the hot surfaces 12 of the two thermoelectric coolers are made of a ceramic substrate to form a ceramic substrate hot surface. The inner surface of each ceramic substrate hot surface forms a hot-end circuit or a metal conductor by means of metallization / etching / printing / electroplating / spraying or other methods of the prior art. The opposite two side surfaces of the transparent crystal form a cold-end circuit or a metal conductor by means of metallization / etching / printing / electroplating / spraying or other methods of the prior art; one set of hot surfaces is fixedly and electrically connected to one end of the P-type / N-type semiconductor particles in the corresponding semiconductor thermocouple layer (PN thermocouple particle layer) 11, and the other end of the P-type / N-type semiconductor particles is fixedly and electrically connected to the hot-end circuit or the metal conductor on the corresponding side surface of the transparent crystal. The semiconductor thermocouple layer (PN thermocouple particle layer) 11 is sandwiched between the ceramic substrate hot surface 12 and the side surface of the transparent crystal cold surface 10. The two hot surfaces 12 and the left and right side surfaces of the transparent crystal cold surface 10 are respectively fixedly connected to the opposite ends of the corresponding semiconductor thermocouple layer (PN thermocouple particle layer) 11.

[0143] Further referring to Figure 18(a) - 18(c), in the third embodiment of the present invention, the semiconductor refrigeration chip 1 is connected to the heat dissipation component 2, and the heat of the semiconductor refrigeration chip is conducted from the hot surface 12 to the heat dissipation component for heat dissipation. In this embodiment, the heat dissipation component 2 includes two heat pipes 21 and a radiator 23 connected to the heat pipes 21. The heat pipes are installed on the surface or inside of the radiator 23. The heat pipe 21 is directly in contact with the hot surface 12 of the semiconductor refrigeration chip 1 or in contact with the hot surface through a heat conducting member. For example, one end 26 of each heat pipe is adapted to the shape of the hot surface 12 of the semiconductor refrigeration chip and is in close contact with each other; to facilitate the close contact between one end 26 of the heat pipe and the hot surface 12, the end of the heat pipe 21 can be bent as needed, referring to various bending designs shown in the figure, such as L-shaped. The heat pipe 21 can be a capillary copper pipe with a refrigerant circulating inside. The radiator can be one or a combination of a fin radiator, a heat sink, or a heat conducting plate. In the various radiator structures shown in the figure, the radiator 23 shown in Fig. 18(a) is one or more groups of parallel heat sinks, and two heat pipes 21 are fixedly arranged through one or more groups of parallel heat sinks. In Fig. 18(b) and Fig. 18(c), the radiator 23 includes a heat conducting plate 230 and one or more groups of parallel heat sinks 231 fixed on one side surface of the heat conducting plate 230. One end 26 of each heat pipe 21 is bent and in close contact with a hot surface 12 of the semiconductor refrigeration chip, with the same shape and size. The heat pipe 21 is fixed on the other side surface of the heat conducting plate 230 or arranged through one group of parallel heat sinks 231 or on their surfaces.

[0144] The heat sink 231 can be a metal thin sheet with high thermal conductivity, or a graphene radiator 23 formed by integrally molding a heat sink 231 made of graphene. Two heat conducting plates 230 can be provided, respectively used to fix one heat pipe 21. The heat conducting plate 230 can also be a graphene heat conducting plate integrally molded by graphene, and can be integrally molded with the graphene heat sink 231 to form an integral structure.

[0145] Refer to Figure 19In the fourth embodiment of the present invention, a semiconductor cooling plate 1 comprises a cold surface 10 of a square (not limited to square) transparent crystal. One side of the transparent crystal, such as the top surface, is provided with a semiconductor electric double layer (PN electric double particle layer) 11 and a hot surface 12 fixedly connected to the semiconductor electric double layer (PN electric double particle layer). The semiconductor electric double layer (PN electric double particle layer) 11 is provided with a pair of electrodes (not shown). The other two pairs of surfaces of the transparent crystal, such as the front and back (or left and right) surfaces, can serve as light-transmitting areas 102 for transmitting pulsed light for hair removal or other cosmetic treatments. The arrows in the figure indicate the incident direction of the pulsed light. In a specific example, the hot surface 12 of the semiconductor cooling plate is made of ceramic or another substrate. The inner surface of the ceramic hot surface 12 and the top surface of the transparent crystal are metallized, etched, printed, or electroplated to form a hot-end circuit or metal conductor and a cold-end circuit or metal conductor, respectively. These circuits are welded to and electrically connected to the corresponding ends of the semiconductor electric double layer (PN electric double particle layer) 11.

[0146] Further references Figure 20(a) - 20(d) In a fourth embodiment of the present invention, a semiconductor cooling fin 1 is connected to a heat dissipation assembly 2, transferring heat from the semiconductor cooling fin's hot surface 12 to the heat dissipation assembly for dissipation. The heat dissipation assembly 2 includes a heat pipe 21 and a heat sink 23 connected to the heat pipe 21. Among the various heat sink structures shown in the figures, the heat sink 23 shown in Figures 20(a) and 20(b) is a set of parallel fins, with the heat pipe 21 threaded through and fixed to the parallel fins. The heat sink 23 in Figures 20(c) and 20(d) includes a heat conducting plate 230 and a set of parallel fins 231 fixed to one side of the heat conducting plate 230. One end 26 of the heat pipe 21 is in contact with the hot surface 12 of the semiconductor cooling fin and can be of the same shape and size. The heat pipe 21 is fixed to the other side of the heat conducting plate 230, or threaded through and fixed to the set of parallel fins 231 or on its surface. The heat pipe 21 is bent into a U-shape or L-shape to form a surface area that is consistent with and in close contact with the hot surface 12.

[0147] Reference Figure 21In the fifth embodiment of the present invention, a semiconductor cooling plate 1 comprises a cold surface 10 of a square (not limited to square) transparent crystal. Two opposing surfaces of the transparent crystal, such as the top and bottom surfaces, are each provided with a semiconductor electric double layer (PN electric double particle layer) 11 and a hot surface 12 fixedly connected to the semiconductor electric double layer (PN electric double particle layer). Each semiconductor electric double layer (PN electric double particle layer) 11 is provided with a pair of electrodes (not shown). The other two pairs of surfaces of the transparent crystal, such as the front and back (or left and right) surfaces, serve as light-transmitting regions 102 for transmitting pulsed light for hair removal or other cosmetic treatments. The arrows in the figure indicate the direction of incident pulsed light. In a specific example, the hot surfaces 12 of the two semiconductor cooling plates are made of ceramic or other substrates. The inner surfaces are metallized to form metal conductors or hot-end circuits, which are welded to and electrically connected to the corresponding semiconductor electric double layer (PN electric double particle layer) 11. Each semiconductor electric double layer (PN electric double particle layer) 11 is sandwiched between a ceramic hot surface 12 and the top or bottom surface of the transparent crystal cold surface 10. The two hot surfaces 12 and the upper and lower surfaces of the transparent crystal cold surface 10 are respectively fixed to opposite ends of the corresponding semiconductor electric double layer (PN electric double particle layer) 11 .

[0148] Further references Figure 22(a) - 22(e) In the fifth embodiment of the present invention, the semiconductor refrigeration plate 1 is connected to the heat dissipation component 2, and the heat of the semiconductor refrigeration plate is transferred from the heating surface 12 to the heat dissipation component for heat dissipation. In this embodiment, the heat dissipation component 2 includes two heat pipes 21 and a radiator 23 connected to the heat pipes 21. The heat pipes are installed on the surface or inside of the radiator. One end 26 of the heat pipe is in close contact with the heating surface 12. The heat pipe 21 can be L-shaped, U-shaped or other suitable shapes to form a regional surface that is consistent with and in close contact with the heating surface 12. Among the various radiator structures shown in the figures, the radiator 23 shown in Figures 22(a), 22(b) and 22(c) is a group or multiple groups of parallel fins, and the two heat pipes 21 are fixed in the parallel fins. The radiator 23 in Figures 22(d) and 22(e) includes a heat conducting plate 230 and a group or multiple groups of parallel fins 231 fixed to one side surface of the heat conducting plate 230. One end 26 of each heat pipe 21 is bent to fit in contact with a hot surface 12 of the semiconductor refrigeration plate, and can be consistent in shape and size. The heat pipe 21 is fixed to the other side of the heat conducting plate 230 or is inserted into or on the surface of one or more groups of parallel heat sinks 231.

[0149] The above second to fifth embodiments ( Figures 15 - 22(e) ) of the semiconductor refrigeration plate 1 and the heat dissipation component 2 are applied to the beauty instrument (hair removal instrument) 1000 ( Figures 1 - 8), the semiconductor refrigeration chip 1 is installed on the working head of the beauty instrument (hair removal instrument), and the transparent crystal cold surface is used as the working surface. The heat dissipation component 2 is installed inside the housing 6. The radiator 23 is installed on one side of the fan 25. The heat dissipation air duct on the surface of the radiator 23 communicates with the cavity 28. The hot air in the space on the surface of the radiator 23 is drawn into the cavity 28 by the fan 25 and discharged to the outside from the air outlet 66. Other structures refer to the foregoing embodiments and will not be elaborated here.

[0150] In other embodiments, in addition to using a ceramic substrate for the hot surface 12 of the semiconductor refrigeration chip 1, other existing available materials can also be used as the hot surface. For example, the hot surface 12 can be covered with a transparent medium at one end of the annular semiconductor thermocouple layer (PN thermocouple particle layer) 11.

[0151] In the foregoing embodiments, the cold surface 10 of the semiconductor refrigeration chip 1 directly uses a transparent medium. Preferably, a transparent crystal is directly used as the cold surface of the semiconductor refrigeration chip and is directly used as the working surface in contact with the skin. The working surface is located on the front end surface of the hair removal instrument, that is, on the front end surface of the working head. Preferably, the transparent crystal cold surface (or transparent medium cold surface) is the entire surface of the working surface, thereby forming a front-end entire surface refrigeration effect. The advantage of entire surface refrigeration is that the next hair removal position can be pre-cooled during hair removal, and the previous hair removal position can maintain a cold feeling to reduce the burning sensation after hair removal, which is equivalent to lengthening the ice compress time.

[0152] In other embodiments, the main difference from the above embodiments is that the working head is different, and a transparent crystal (or transparent medium body) is directly used as the working surface in contact with the skin. Preferably, the transparent crystal (or transparent medium body) is the entire surface of the working surface, thereby forming a front-end entire surface refrigeration effect. The transparent crystal (or transparent medium body) is cooled by the refrigeration chip 1 attached to its back surface. The working head bracket 63 is an annular housing, and the transparent crystal (or transparent medium body) is tightly installed inside the annular edge of the housing. The refrigeration chip 1 is also tightly installed inside the working head bracket 63 and attached to the back surface of the transparent crystal (or transparent medium body). Of course, it can also be installed on one side of the transparent crystal or (or transparent medium body) on multiple sides for refrigeration. The refrigeration chip 1 installed on the working head can use a refrigeration chip applicable in the prior art to cool the working surface of the transparent crystal (or transparent medium body), and the heat dissipation component 2 of the foregoing embodiment is used to dissipate heat from the refrigeration chip 1.

[0153] The refrigeration surface of the semiconductor refrigeration chip of the present invention directly replaces the ceramic chip with a transparent crystal. The transparent crystal is directly fixedly connected to the metal conductor / cold and hot end circuits connecting the PN semiconductor thermocouple, forming a new type of semiconductor refrigeration chip as a whole. At the same time, the transparent crystal can be directly in contact with the skin and used as the working surface of the beauty instrument. Using the crystal directly as the refrigeration surface and the working surface of the semiconductor refrigeration chip can achieve the following effects:

[0154] 1) It eliminates the intermediate layer of traditional refrigeration, reduces the loss of refrigeration rate, and improves the refrigeration speed and efficiency.

[0155] 2) When contacting the skin or the contact surface, it cools the entire surface of the crystal, increasing the cooling area and providing a better experience.

[0156] 3) Using the crystal as the cooling surface, the pulsed light can directly pass through the transparent crystal and irradiate the skin. After the light is cooled by the transparent crystal, the pain or discomfort of the light is greatly reduced or eliminated.

[0157] As some embodiments, at least two sensors 84 are installed on the working head of the beauty instrument (hair removal instrument) 1000 to detect whether the entire or almost entire working surface of the transparent crystal is covered by the skin to activate or turn off the light source. Among them, the two sensors 84 are installed at the diagonal or near the diagonal position on the edge of the working surface 10 of the transparent crystal. The sensor 84 is electrically connected to the control circuit board 5.

[0158] Refrigeration structure with self-cooling structure

[0159] Refer to Figures 23 - 27 , in some embodiments, the semiconductor refrigeration chip has a self-cooling structure to form the overall refrigeration structure 20, which includes a semiconductor refrigeration chip 1, a heat pipe 21, and a radiator 23. The heat pipe 21 is connected to the semiconductor refrigeration chip 1 and the radiator 23 to form an overall structure with the semiconductor refrigeration chip having its own radiator. In other embodiments, it can also be directly combining the radiator 23 with the semiconductor refrigeration chip 1 to form the overall structure of the refrigeration structure.

[0160] The semiconductor refrigeration chip 1 includes a PN electric couple particle layer 11, a cold surface 10, and a hot surface 12. The cold surface 10 and the hot surface 12 are respectively arranged at the cold end and the hot end of the PN electric couple particle layer, and the PN electric couple particle layer is provided with positive and negative electrodes.

[0161] The PN electric couple particle layer 11 includes P-type / N-type semiconductor particles (refer to Figure 23 (b) and 26 - 27). In some embodiments, the P-type / N-type semiconductor particles can be directly in granular form and arranged according to a predetermined circuit, and directly welded to the cold surface 10 and the hot surface 12 of the semiconductor refrigeration chip to form an interlayer structure between the cold surface 10 and the hot surface 12 of the semiconductor refrigeration chip. During assembly, one end of the P-type / N-type semiconductor particles can be welded to one of the cold surface 10 or the hot surface 12 first. For example, the P-type / N-type semiconductor particles are first welded to the hot surface to fix the P-type / N-type semiconductor particles, and then the cold surface 10 is welded to the other end of the P-type / N-type semiconductor particles to form the semiconductor refrigeration chip structure, refer to Figure 23 (a), Figure 26and Figure 25(e). In other embodiments, the P-type / N-type semiconductor particles can be fixed into an integral structure of a predetermined shape, and corresponding circuits or electrical connection points are formed at both ends, such as Figure 23 As shown, the PN electric couple particle layer 11 is made into a predetermined shape, such as a ring shape, and corresponding circuits or electrical connection and welding points (not shown) are formed at both end faces, and are welded and electrically connected to the metal conductors or circuits on the cold surface 10 and the hot surface 12 respectively. The setting of the PN electric couple particle layer 11 can adopt the setting of the semiconductor electric couple layer (PN electric couple particle layer) of a semiconductor refrigerating sheet in the prior art.

[0162] The hot end of the PN electric couple particle layer uses a heat conducting plate to form the hot surface 12 of the semiconductor refrigerating sheet. The hot surface 12 of the heat conducting plate is in direct contact with the P-type / N-type semiconductor particles, and the heat conducting plate directly absorbs and conducts the heat at the hot end. The refrigerant is accommodated inside the hot surface 12 of the heat conducting plate. A circuit 122 is formed on the surface of the hot surface 12 of the heat conducting plate as the hot end circuit; the hot end circuit 122 is electrically connected to one end of the P-type / N-type semiconductor particles.

[0163] Refer to again Figure 23 (b), 25(e) and Figures 26 - 27 As shown in the figure, the particle distribution diagram of the heat conducting plate of the semiconductor refrigerating sheet, where the bar-shaped boxes are the circuits formed on the heat conducting plate. For example, the heat conducting plate is a copper plate, and the circuit is obtained after etching and is used for welding the P / N-type semiconductor particles. During welding, the P-type semiconductor particles and the N-type semiconductor particles can be welded in two times. When loading the P-type semiconductor particles, the position of the N-type semiconductor particles is blocked by a jig.

[0164] The other end of the P-type / N-type semiconductor particles in the PN electric couple particle layer is welded to the cold surface 10 of the semiconductor refrigerating sheet. Refer to Figure 23 (b), Figure 26 and Figure 25(e). A cold end circuit 110 is arranged on the cold surface and is electrically connected to the other end of the P-type / N-type semiconductor particles. The cold end circuit 110 can form conductive solder joints with solder paste according to a predetermined circuit distribution diagram or print solder paste according to the circuit distribution diagram for welding the other end of the P-type / N-type semiconductor particles.

[0165] After the cold surface 10 is assembled on the hot surface 12 where the P / N-type semiconductor particles are welded, the circuits at both ends of the P / N-type semiconductor particles or the PN electric couple particle layer 11 are connected in series to form the internal circuit of the semiconductor refrigerating sheet, and are electrically connected to the control circuit board 5 through the positive and negative electrodes 113.

[0166] In some embodiments, the hot surface 12 of the heat conducting plate is a metal plate, such as a copper plate or an aluminum plate. A space is formed inside the hot surface 12 of the heat conducting plate for accommodating a refrigerant. The refrigerant usually adopts a coolant. An insulating layer 123 and a hot end circuit 122 are arranged on the surface of the metal heat conducting plate. The insulating layer 123 is an electrical insulating film covering the surface of the metal heat conducting plate, and the hot end circuit is formed on the surface of the metal heat conducting plate by etching. Preferably, the hot surface 12 of the heat conducting plate is a VC (Vapor Chambers) heat conducting plate. In a specific example, it includes a heat conducting bottom plate 120 and a heat conducting cover plate 121. The heat conducting bottom plate 120 and the heat conducting cover plate 121 are buckled with each other to form a space inside. A circuit 122 is arranged on the surface of the heat conducting bottom plate 120 and is electrically connected to the PN thermoelectric particle layer 11. A hole 124 is arranged on the heat conducting cover plate 121, and the hole 124 is matched with a heat pipe. One end of the heat pipe is inserted into the hole 124 and fixed, and is communicated with the space inside the heat conducting plate.

[0167] Copper powder can be further placed inside the heat conducting plate to increase the heat conduction and heat absorption area; the copper powder can be welded to the inner wall of the space, or the copper powder can be directly placed in the space inside the heat conducting plate. An inner ring sealant 125 can be further arranged inside the heat conducting plate for sealing the connection gap between the heat conducting bottom plate 120 and the heat conducting cover plate 121. Preferably, the heat conducting bottom plate 120 and the heat conducting cover plate 121 are formed into an integral structure or a whole structure by welding or fusing or riveting at the connection.

[0168] The shape of the hot surface 12 of the heat conducting plate is designed according to the overall shape of the refrigerating sheet and its application, and can be an integral plate box structure or other shapes. In the embodiment shown in the figure, the hot surface 12 of the heat conducting plate is integrally annular, and is formed by buckling an annular heat conducting bottom plate 120 and an annular heat conducting cover plate 121. A groove structure is formed inside the heat conducting bottom plate. After being buckled with the cover plate 121, an internal space is correspondingly formed in the groove. A boss support structure can also be arranged in the groove and can be matched with a card slot arranged on the corresponding surface of the cover plate for positioning. A light transmission area for penetrating pulsed light can be defined in the center of the annular structure, so as to use the refrigerating structure as a beauty instrument (such as a hair removal instrument). The annular hot surface 12 of the heat conducting plate forms an annular hot surface, and the PN thermoelectric particle layer 11 / P / N type semiconductor particles are also arranged annularly. The cold surface can adopt an annular material or a whole transparent crystal is welded and assembled with the PN thermoelectric particle layer 11 / P / N type semiconductor particles and the annular hot surface 12 of the heat conducting plate.

[0169] The VC (Vapor Chambers) heat conducting plate of the present invention can adopt metal heat conducting materials such as copper / aluminum. For example, an insulating material is formed (such as spraying) on the surface where the copper plate contacts the conductive layer particles of the refrigerating sheet, and corresponding circuits are formed by means of etching or printing for the electrical connection of P / N semiconductor particles so that charge movement can achieve the effect of heating / cooling. The interior of the heat conducting plate is processed into a three-dimensional space. After the heat conducting bottom plate 120 and the heat conducting cover plate 121 are buckled, a sealed space for accommodating copper powder and refrigerant is formed inside, and it is communicated with the space inside the heat pipe 21. After the heat conducting bottom plate 120, the heat conducting cover plate 121 and the heat pipe 21 are welded at high temperature, the vacuum nozzle reserved on the heat pipe 21 or the hot surface 12 of the heat conducting plate is used to evacuate the air, and finally a connected sealed space is sintered. The hot surface 12 of the heat conducting plate is directly used as the hot end of the refrigerating sheet, and at the same time is communicated with the heat pipe or directly connected to the radiator. As a part of the heat pipe or radiator, the refrigerating sheet and the radiator are combined into one body, and the structure is simpler.

[0170] The refrigerating structure 20 of the present invention can adopt several heat pipes 21; the heat pipes 21 are connected to the hot surface 12 of the heat conducting plate to dissipate heat together; the inside of the heat pipe 21 contains refrigerant; the inside of the heat pipe is communicated with the inside of the heat conducting plate to form a connected sealed space; the refrigerant circulates in the sealed space. Generally, the heat pipe is a metal pipe, such as a copper pipe or an aluminum pipe. In the embodiment shown in the figure, one or two straight pipes are used as the heat pipe 12, one end is connected to the heat conducting plate 21, and the other end is connected to the radiator 23. The two ends of the heat pipe 12 can be welded or fused and fixed between the heat conducting plate 21 and the radiator 12 respectively to form an integral and inseparable structure.

[0171] Vacuum nozzles that can be sintered and closed or fused are provided on the hot surface 12 of the heat conducting plate and / or the heat pipe 21. The closable vacuum nozzles are communicated with the inside of the heat conducting plate and / or the inside of the heat pipe and are used for evacuating the air.

[0172] The heat pipe 21 contains copper powder to increase the heat conducting and heat absorbing area; the copper powder is welded to the inner wall of the pipe, or the copper powder particles are directly placed in the heat pipe and a copper mesh is configured. The heat pipe 21 and the hot surface 12 of the heat conducting plate can be formed into an integral structure by welding, fusing or riveting. Specifically, one end of the heat pipe 21 is welded, fused or riveted and fixed with the hole position 124 provided on the heat conducting plate.

[0173] The radiator 23 is connected to the hot surface 12 of the heat conducting plate or is connected to the hot surface 12 of the heat conducting plate through the heat pipe 21 to form an integral structure for dissipating heat from the heat conducting plate.

[0174] The radiator 23 can be a finned radiator, including a number of heat sinks 231. As some embodiments, the radiator is a finned radiator made of metal and can be assembled by one or more groups of metal heat sinks 231 such as copper plates. One or more groups of heat sinks 231 can be fixedly connected through a connection structure. For example, buckles and card holes are provided on each heat sink, and a clamping fit is formed between the buckles and the card holes, and then each heat sink is further fixed by a heat conducting sheet or a heat pipe 21.

[0175] In the embodiment shown in the figure, the radiator 23 includes one or more groups of heat sinks 231 arranged in parallel; the heat pipe 21 is disposed in a channel 232 provided in one or more groups of heat sinks arranged in parallel and is in close contact and fit, and the heat pipe 21 and the channel 232 can be further welded by solder to increase the contact area and accelerate heat transfer. In other embodiments, the heat pipe 21 can also be fixedly connected and in close contact and fit with a heat conducting sheet (heat conducting member) combined on one or more groups of parallel heat sinks.

[0176] In some other embodiments, the radiator 23 is a graphene radiator, which is an integral structure formed by integrally molding a number of graphene heat sinks 231. The graphene radiator 23 includes an integral and inseparable structure formed by integrally molding one or more groups of graphene heat sinks 231, and the manufacturing process can be directly formed by an injection molding process or a compression molding process. The graphene radiator 23 can be an integrally molded independent radiator, that is, it includes an integral and inseparable structure formed by integrally molding one or more groups of graphene heat sinks 231. The graphene radiator 23 can also be used in combination with other heat dissipating components, such as a heat pipe 21 or a heat conducting member. The heat pipe 21 can be installed on the surface or inside of the graphene radiator 23 and in close contact and fit for rapid heat conduction. The heat conducting member can be installed on the graphene radiator 23. For example, the graphene radiator 23 formed by integrally molding one or more groups of parallel graphene heat sinks 231 is located on or installed on one side of the heat conducting member; or the graphene radiator 23 and other heat conducting plates are integrally formed into an inseparable integral structure, that is, one or more groups of parallel graphene heat sinks 231 and the heat conducting plate are integrally molded. The combination of graphene radiators can be flexible and variable.

[0177] The graphene radiator 23 can also be integrally molded or combined with other structural components of a beauty instrument (such as a hair removal instrument) to form an integral structure. For example, the graphene radiator 23 is integrally molded with structural components inside the beauty instrument (such as a hair removal instrument) such as a bracket, a heat conducting cover, a fan housing, etc., and can also be integrally molded with the inner side of the housing of the beauty instrument (such as a hair removal instrument).

[0178] The graphene heat sink is directly formed into an integral structure through injection molding or compression molding. When integrally molded or combined with other structural components, the other structural components can be placed in a mold during the injection molding or compression molding process. The graphene heat sink is then molded or compressed at the same time, thereby securing the other structural components to the graphene heat sink. In a graphene heat sink, one or more groups of heat sinks are integrally molded to form a single, inseparable structure, eliminating the need for snap-fit connections or alignment mechanisms, resulting in a simple process and structure.

[0179] The integrally formed graphene heat sink 23 can be any shape suitable for the internal space of the beauty instrument shell. The graphene heat sink 23 is a parallel array of graphene heat sinks. The inside of the graphene heat sink can be integrally formed with a channel 232 for installing the heat pipe 21. The heat pipe 21 penetrates into the channel 232 for close contact.

[0180] The shape of the graphene heat sink 23 is unaffected by the internal space of a beauty device. It can be flexibly designed to fit the internal components of a beauty device (such as a hair removal device) based on the device's internal dimensions and curvature. This effectively utilizes the internal space and improves space efficiency. It also increases the heat dissipation area, allowing heat to be extracted and dissipated more quickly, efficiently, and evenly. Compared to traditional heat sinks, graphene heat sinks are smaller and lighter, significantly reducing the weight of beauty devices (such as hair removal devices). The graphene heat sink is manufactured using injection molding or compression molding, enabling one-step molding. This ensures high dimensional accuracy, consistent component consistency, and minimal product deformation. The graphene heat sink fins can be shaped into wavy or curved shapes as desired, with uniform spacing between each fin. This effectively ensures consistent heat dissipation and improves the quality of the finished beauty device. The graphene heat sink's simple manufacturing process offers high production capacity and low defect rates. Its integration into beauty devices (such as hair removal devices) significantly improves production efficiency, improves production capacity, and effectively reduces the cost of beauty devices (such as hair removal devices).

[0181] In other embodiments, the graphene heat sink 23 can be effectively integrated with other components, such as in a two-in-one, three-in-one, or multi-in-one design, to facilitate faster and more even heat dissipation. For example, the graphene heat sink can be integrated with an internal mounting bracket, such as the rear end of bracket 7, or integrally molded with the bracket, or with one side of the seal 35. Alternatively, the graphene heat sink can be integrated with the fan's outer housing, forming a monolithic structure to facilitate faster and more even heat dissipation. The graphene heat sink 23 can also be integrated with the housing or bracket to form a monolithic structure, making installation of beauty devices (such as hair removal devices) more convenient and efficient.

[0182] In other embodiments, the cold surface of the thermoelectric cooler can be made of cold surface materials applicable in the prior art, such as ceramics. When a light-transmitting area needs to be formed on the cold surface according to the usage requirements, when using a cold surface made of an opaque material, a reserved hollow area needs to be set, such as a central through hole in the center of the ring, for transmitting light.

[0183] In some embodiments, the cold end of the PN thermoelectric couple particle layer uses a transparent crystal, thereby forming a transparent crystal cold surface of the thermoelectric cooler, which can transmit pulsed light.

[0184] As described above and as shown in Fig. 25(e) and Figures 26 - 27 As shown, by methods of the prior art such as metallization, etching, electroplating, printing, coating, etc., a cold end circuit 110 or a metal conductor is formed on the transparent crystal cold surface 10, electrically connected to and welded to the PN thermoelectric couple particle layer 11; the PN thermoelectric couple particle layer 11 is arranged in a ring shape; the hot surface 12 of the heat conduction plate is in a ring shape. A light-transmitting area of the thermoelectric cooler is formed in the middle area of the ring.

[0185] The annular PN thermoelectric couple particle layer is welded to the annular hot surface 12 of the heat conduction plate, and further welded to the annular belt 101 at the edge of the transparent crystal cold surface; a light-transmitting area 102 is formed in the middle area of the ring for the pulsed light generated by the power supply assembly 3 to pass through for hair removal treatment or other beauty treatments.

[0186] The PN thermoelectric couple particle layer 11, that is, the semiconductor thermoelectric couple layer, is fixedly connected between the transparent crystal cold surface 10 and the hot surface 12 of the VC heat conduction plate. As some embodiments, it can be realized by a manner applicable in the prior art. For example, first, the inner surfaces of the transparent crystal cold surface 10 and the hot surface 12 of the VC heat conduction plate are metallized to form a cold end circuit 110 and a hot end circuit 122 or metal conductors respectively, and then welded and fixed between the two ends of the P / N type semiconductor particles. Or, the PN thermoelectric couple particle layer 11 is adhesively bonded between the transparent crystal cold surface 10 and the hot surface 12 of the VC heat conduction plate to form an adhesive fixation.

[0187] In this embodiment, the PN thermoelectric couple particle layer 11 is in a ring shape, and its annular area is used to arrange electronic components, and the internal hollow area allows light to penetrate. The PN thermoelectric couple particle layer 11 is a circuit formed by connecting the two ends of the P / N type semiconductor particles in series by a metal conductor / cold end and a hot end circuit. Using the Peltier effect of semiconductor materials, when direct current passes through an electric couple formed by two different semiconductor materials of N and P in series, heat transfer will occur between the two ends, and heat will transfer from one end to the other end, thereby generating a temperature difference to form a cold and a hot end. The cold end uses a transparent crystal to form the cold surface of the thermoelectric cooler, and the hot end still uses a VC heat conduction plate to form the hot surface 12 of the thermoelectric cooler.

[0188] The shape and size of the hot surface 12 of the VC heat conducting plate are adapted to the PN thermocouple particle layer 11, for example, it is also annular, and the hollow area inside the annular area allows light to penetrate.

[0189] As an embodiment, the transparent crystal cold surface 10 covers the entire surface of the PN thermocouple particle layer 11 and the hot surface 12 of the VC heat conducting plate, thereby forming overall surface refrigeration. The transparent crystal cold surface 10 is a single piece or a whole crystal with a continuous surface. Preferably, the thickness of the transparent crystal cold surface is not less than 1 mm to improve the strength of the semiconductor refrigeration sheet 1, reduce the risk of damage during assembly, and extend the service life. The transparent crystal material in this embodiment has high light transmittance and high thermal conductivity, so as to facilitate the pulsed light to penetrate the transparent crystal for hair removal operation, and the high thermal conductivity is beneficial to improving the refrigeration efficiency and effect.

[0190] The middle area of the transparent crystal cold surface 10 is a light-transmitting area, and the annular area is fitted to the PN thermocouple particle layer 11 accordingly. Correspondingly, the light-transmitting area of the transparent crystal cold surface covers the internal hollow area of the PN thermocouple particle layer 11 / the hot surface 12 of the VC heat conducting plate, thereby covering the hollow area and allowing light to penetrate. The overall surface refrigeration area of the transparent crystal cold surface 10 includes the light-transmitting area and the annular area outside the light-transmitting area. The overall surface refrigeration of the crystal surface increases the refrigeration area and provides a better experience.

[0191] Refer again to Figure 25(a) - 25(e) , the assembly principle of the refrigeration sheet with a built-in radiator is as follows:

[0192] Referring to Fig. 25(a), a single heat pipe 21 such as a copper / aluminum pipe is inserted into the corresponding hole 124 provided on the heat conducting cover plate 121 of the refrigeration sheet, waiting for the next processing step; after adding copper powder to the copper / aluminum pipe, it is assembled with the heat conducting plate 21;

[0193] Referring to Fig. 25(b), after processing the heat conducting plate into an uneven three-dimensional space, then place copper powder or copper mesh in this space, and perform high-temperature welding with the heat conducting plate cover 121 + conduit 21 group in the previous process. After filling the internal space with liquid, evacuate through the vacuum nozzle provided at the tail end of the heat pipe or other positions to make it an integral body with a sealed space;

[0194] Referring to Fig. 25(c), after the toothed heat sinks 231 are buckled and connected into the radiator 23 as a whole, it is welded into a whole with the tail end position of the heat pipe, or a graphene radiator is used; the radiator 23 is used in cooperation with a fan in specific applications;

[0195] Referring to Fig. 25(d), after assembling the hot surface 12 of the heat conducting plate with the radiator, then distribute the P-type / N-type semiconductor particles according to the predetermined design circuit and weld the P-type / N-type semiconductor particles to the hot surface 12 of the heat conducting plate of the refrigeration sheet through high temperature, such as 150 - 300 °C;

[0196] Referring to FIG. 25(e), after welding P-type / N-type semiconductor particles to the hot surface 12 of the heat conducting plate of the thermoelectric cooler, they are then welded and fixedly connected to the hot surface 10 of the transparent crystal, and the inner and outer peripheries can be sealed with glue to further form the peripheral sealant 104 of the thermoelectric cooler ( (a)), which mainly seals and fixes the four sides of the PN thermocouple particle layer 11, thus completing the assembly of the refrigeration structure.

[0197] In the thermoelectric cooler with a built-in radiator, the ceramic plate at the hot end of the thermoelectric cooler 1 and the intermediate heat conducting member connecting it to the heat pipe are omitted. The P-type / N-type semiconductor particles are directly welded to the hot surface 12 of the heat conducting plate. The heat generated at the hot end of the thermoelectric cooler 1 is directly conducted by the hot surface 12 of the heat conducting plate to the refrigerant inside. The heat passes through the hot surface 12 of the heat conducting plate - the heat sink 231 - the fan 25. The heat does not need to pass through the ceramic plate and thermal grease, reducing the intermediate links and being not affected by the product shape. The whole surface effectively conducts heat, enabling the heat to be dissipated faster and more directly.

[0198] In some embodiments, a transparent crystal is used as the cold surface of the thermoelectric cooler and directly serves as the working surface of the beauty instrument. The thermal grease and the cold conducting member layer in the thermoelectric cooler are omitted, and it can directly contact the skin surface. It directly acts on the skin through the transparent crystal, improving the refrigeration efficiency and accelerating the cold conduction speed.

[0199] The VC (Vapor Chambers) heat conducting plate in this embodiment can be made of metal heat conducting materials such as copper / aluminum. A layer of insulating material is formed (such as by spraying) on the surface of the copper plate in contact with the conductive layer particles of the thermoelectric cooler, and corresponding circuits are formed by etching or printing, etc. for electrically connecting the P-type / N-type semiconductor particles to make the charge move to achieve the effect of heating / cooling. The other side of the heat conducting bottom plate needs to be processed into a three-dimensional space. After being buckled with the heat conducting cover plate, a sealed space for accommodating copper powder and refrigerant is formed inside, and it is communicated with the space inside the heat pipe. The heat conducting bottom plate 120, the heat conducting cover plate 121 and the heat pipe 21 are welded at high temperature, and then evacuated through the vacuum nozzle reserved on the heat pipe or the heat conducting plate, and finally sintered to form a connected sealed space. In this embodiment, the heat conducting plate is directly used as the hot end of the thermoelectric cooler, and at the same time as the part that penetrates through or is directly connected to the radiator, serving as a part of the heat pipe or radiator, integrating the thermoelectric cooler and the radiator, with a simpler structure.

[0200] The heat dissipating plate of the thermoelectric cooler is in direct contact with the P / N semiconductor particle layer, directly serving as the hot end, with fast heat dissipation efficiency, large area, small loss, omitting the intermediate links and accelerating the heat conduction speed.

[0201] The ceramic plate at the hot end of the thermoelectric cooler and the intermediate heat conducting component connecting it to the heat pipe are omitted. The P-type / N-type semiconductor particles are directly welded to the heat conducting plate, and the heat generated at the hot end of the thermoelectric cooler is directly conducted by the heat conducting plate to the refrigerant inside. The heat is transferred through the heat conducting plate - heat sink - fan. There is no need for the heat to pass through the ceramic plate and thermal grease, reducing intermediate links. Moreover, it is not affected by the product's shape and can conduct heat effectively across the whole surface, enabling the heat to be dissipated more quickly and directly.

[0202] In other embodiments, a transparent crystal cold surface is adopted, omitting the thermal grease and the cold conducting component layer, and directly contacting the skin surface. The transparent crystal acts directly on the skin, improving the refrigeration efficiency and accelerating the cold conduction speed.

[0203] Embodiment of a rotatable beauty device

[0204] Referring to Figure 23 , the rotatable beauty device 1000 of this embodiment usually uses a hair removal device as the main body, which can generate IPL pulsed light for hair removal treatment or other beauty treatments with efficacy. For example, different wavelength filters can be replaceably installed in the main body of the hair removal device. After the IPL pulsed light is filtered by the filter, pulsed light of different wavelengths is obtained and then transmitted to the working surface for light output, enabling different beauty functions or treatment functions. The beauty device of this embodiment includes a first main body 100 and a second main body 200. The first main body 100 can rotate freely relative to the second main body 200, rotating from a straight plate structure to a side-standing structure. In some specific embodiments, the main body of the beauty device is formed by dividing a pair of cross-sections into the first main body 100 and the second main body 200. The pair of cross-sections are connected and limited by a rotational connection structure, enabling the first main body 100 to rotate freely relative to the second main body 200. The pair of cross-sections respectively serve as a connection end face of the first and second main bodies; correspondingly, the front end face of the first main body 100 is the working surface of the beauty device, which can directly contact the skin. The pulsed light generated inside the main body is transmitted to the working surface for transmission and then used for hair removal treatment or other beauty treatments. The rear end face is the said cross-section, serving as the connection end face of the first main body, denoted by the label 64'. The other cross-section serves as the front shell of the second main body 200, corresponding to the connection end face of the second main body, denoted by the label 68'. The pair of cross-sections can be the cross-section of the entire main body of the beauty device; preferably, the pair of cross-sections are the inclined cross-sections of the entire main body of the beauty device, enabling the connection between the first main body 100 and the second main body 200 to rotate from a straight-line type (straight plate shape) connection to an inclined connection at a certain angle (side-standing state). The front end face of the first main body 100 is the working surface, which can contact the skin surface for hair removal treatment or other beauty treatments.

[0205] As an embodiment, when the beauty instrument 1000 is in a straight plate type, the first main body 100 and the second main body 200 are aligned and connected, and the connecting end faces 64' and 68' are aligned and parallel to each other. At this time, the connecting end face is equivalent to the inclined cutting plane (or cross section) of the entire main body. Preferably, the two main bodies 100 and 200 are in a straight line / straight plate type connection state. In other embodiments, when the first main body 100 is freely rotated, the first main body 100 and the second main body 200 are connected at an angle inclined away from the straight plate (or straight line) in the (axial length direction), that is, in a side-standing state; the connecting end faces of the first and second main bodies are misaligned or aligned and attached to each other in parallel, and the connecting end faces support each other, so that the first main body and the second main body can be stabilized at each rotation position.

[0206] In some embodiments, the relative rotation between the first main body 100 and the second main body 200 is implemented by a rotation connection structure 40. The rotation connection structure 40 can be pivot rotation or spherical rolling, and a limit fit is also provided to enable relative rotation between the first main body and the second main body without detachment. For example, a rotating shaft and a shaft hole or a shaft sleeve are provided between the first main body 100 and the second main body 200 to form a rotational fit. Alternatively, the rotation connection structure can also be a universal rotation connection structure such as a universal ball structure. The rotation connection structure 40 can form a pivot rotation between the connection end faces of the first main body 100 and the second main body 200 while providing a limit structure. An axial hole 42 is formed in the housing of one of the connection end faces, and a rotating shaft structure such as a boss 43 is provided on the housing of the other connection end face. The boss 43 passes through the axial hole 42 from one side and the end is clamped on the other side of the axial hole 42, thereby sleeving and limiting the axial hole 42 on the boss 43 and enabling relative rotation. Further, a limit structure is provided on the rotating shaft or the axial hole to prevent the rotating shaft from detaching from the axial hole. In a specific example, a structure such as a flange and / or a locking structure with a size larger than the axial hole 42 can be provided at the end of the boss 43. A rotation position fixing connection plate 41 can be further provided at the end of the boss 43. The size of the rotation position fixing connection plate 41 is larger than the axial hole 42 to prevent the boss 43 from detaching from the axial hole 42. The rotation position fixing connection plate 41 and the boss 43 are fixed by screws, and screw positions 44 are correspondingly provided and fixed by screws, thereby fastening the boss 43 and the rotation position fixing connection plate 41 together. At this time, the axial hole 42 formed on the connection end face 64' is sleeved outside the boss (rotating shaft), and both ends of the axial hole are limited by the connection end face 68' where the boss 43 is located and the rotation position fixing connection plate 41 respectively. In another example, through holes are provided at the centers of the boss 43 and the rotation fixing connection plate 41, and the boss 41 and the rotation fixing connection plate 41 are further locked by screws and studs in the through holes. The nuts of the screws and studs are respectively clamped on the outer sides of the through holes of the boss and the connection plate 41. In other examples, a snap button is provided on one side of the rotation fixing connection plate 41 and is snapped into the through hole inside the boss 43, and the end snap is buckled back on the outer side of the through hole. A riveting structure can also be further provided in the central through hole where the boss 43 and the rotation fixing connection plate 41 are aligned. A hook is provided at the end of the rivet, and the cap portion and the hook of the rivet are respectively clamped on the outer sides of the through holes of the boss 43 and the rotation fixing connection plate 41 to fasten the two together. It can also be that a ball head snap button is provided on one side of the rotation fixing connection plate 41, and a spherical groove is correspondingly provided on the boss 43. The spherical snap button is snapped into the spherical groove and elastically clamped, thereby fastening the boss 43 and the rotation position fixing connection plate 41 together. Preferably, the boss 43 extends forward from the center of the housing of the connection end face along the central axis direction for a certain length.As shown in the figure, a shaft hole 42 is formed at the center of the connecting end face 64' of the housing of the first main body 100, and a boss 43 protrudes outward from the center of the housing of the connecting end face 68' of the second main body 200. The shaft hole 42 is sleeved outside the boss 43, and the boss 43 passes through the shaft hole 42 of the end connection face 64' of the first main body 100, and the rotating position fixing connecting plate 41 is arranged at the end. The rotating position fixing connecting plate 41 is located inside the first main body 100 and inside the connecting end face 64'. It can be understood that the boss 43 and the shaft hole 42 are arranged in a transposed manner.

[0207] In other embodiments, the rotary connection structure may be to respectively provide universal balls on the housings of the connecting end faces of the first main body 100 and the second main body 200 to cooperate with the shaft holes, and a limiting structure is also provided to prevent the balls from disengaging from the shaft holes.

[0208] For the beauty instrument of the present invention, the first main body 100 can rotate left and right relative to the second main body 200 and can stop at any angle according to different angles and usage requirements.

[0209] The advantages of the freely rotatable beauty instrument of the present invention are as follows: when in use, the user can make multi-angle and multi-degree-of-freedom adjustments, which is more convenient to use, the operation is more convenient, the experience is stronger, and it is more user-friendly.

[0210] The beauty instrument of this embodiment includes a heat dissipation component 2, a light source component 3, a power supply unit 4, a control circuit board 5, etc. The heat dissipation component 2, the light source component 3, the power supply unit 4, and the control circuit board 5 are installed in the housing 6. The beauty instrument is separated by a pair of end faces 64' and 68' to form the above-mentioned first main body 100 and the second main body 200. The front end face of the body 100 of the beauty instrument 1000 or the first main body is the working face. The control circuit board 5 inside the beauty instrument 1000 is electrically connected to the light source component 3 and the power supply unit 4. The control circuit board 5 controls the start of the light source component 3 to generate pulsed light, and the pulsed light is transmitted to the working face and transmitted through the working face for hair removal treatment or beauty treatment with other effects. The power supply unit 4 is used to supply power to the light source component 3. The heat dissipation component 2 is used for heat dissipation inside the beauty instrument.

[0211] A semiconductor refrigeration sheet 1 is installed at the head (or front end) of the beauty instrument 1000, and the cold surface of the semiconductor refrigeration sheet 1 is used as the working face or used to cool the working face. The heat dissipation component 2 is connected to the refrigeration sheet 1 to cool the refrigeration sheet 1. A plurality of air inlets 60 and air outlets 66 are provided on the housing 6. A power cord and / or a charging interface may also be provided on the beauty instrument (hair removal instrument) 1000 to connect to an external power supply.

[0212] The heat dissipation component 2 is used for dissipating heat of the semiconductor refrigeration sheet 1 and / or the light source component 3, and includes a heat pipe 21 and a radiator 23 connected to the heat pipe. The heat pipe 21 is connected to the refrigeration sheet 1, so as to conduct the heat generated by the refrigeration sheet 1 to the heat dissipation component 2 for heat dissipation. A fan 25 is installed in a cavity 28, and an air outlet channel 280 extends from one side of the cavity 28, and the end of the air outlet channel 280 is communicated with an air outlet 66.

[0213] An air inlet 60, a heat dissipation space on the surface of the radiator, the fan 25, the air outlet channel 280 and the air outlet 66 are in gas communication to form a heat dissipation air duct of the radiator, that is, a first heat dissipation air duct; by starting the fan to work, cold air is inhaled from the air inlet 60 to the surface of the radiator 23 to take away heat, and the hot air is discharged by the fan 25 to the outside of the air outlet channel 280 and the air outlet 66, so as to realize the air-cooled heat dissipation of the radiator. The fan 25 is electrically connected to a control circuit board 5, and its operation is controlled by the control circuit board 5.

[0214] The refrigeration sheet 1 installed at the front end (head) of the beauty instrument can adopt a refrigeration sheet applicable in the prior art and simultaneously serve as a working surface, and the refrigeration sheet is refrigerated by the heat dissipation component 2. In some embodiments, the semiconductor refrigeration sheet 1 is used to refrigerate the working surface. As a preferred embodiment, the cold surface of the semiconductor refrigeration sheet 1 is directly used as the working surface. The semiconductor refrigeration sheet 1 can directly use a transparent crystal as the cold surface 10 and simultaneously serve as the working surface in contact with the skin, specifically referring to the foregoing embodiments. The heat pipe 21 is connected to the hot surface 12 of the semiconductor refrigeration sheet 1, so as to conduct the heat of the semiconductor refrigeration sheet 1 from the hot surface 12 to the heat dissipation component 2 for heat dissipation. The semiconductor refrigeration sheet 1 can also adopt the refrigeration structure 20 with the foregoing self-cooling structure, so as to form an integral structure of the heat dissipation component 2 and the semiconductor refrigeration sheet 1.

[0215] The housing 6 of the beauty instrument is divided into a rotary head housing (the first main body housing) 61' and a rear housing (the second main body housing) 62' by the pair of cross sections / connection end faces 64' / 68'. In this embodiment, the rotary head housing 61' and the rear housing 62' are sleeve-shaped, and can be respectively an integral housing or assembled from multiple parts into a sleeve shape. The rotary head housing 61' corresponds to the housing of the first main body 100, and the housing 61' is provided with an air inlet 60 and an air outlet 66 for sucking cold air (cold air) from the outside inward to perform air-cooled heat dissipation on the radiator 23 and / or the light source component 3. The air inlet 60 and the air outlet 66 can be one / one opening or a group of openings, and the number, position, shape and arrangement of the air inlet 60 and the air outlet 66 are specifically set according to heat dissipation requirements, or a cover plate can be provided on the opening of the housing, and the gap of the cover plate forms lateral air inlet or air outlet. The rear housing 62' is provided with or not provided with air holes according to needs.

[0216] The radiator 23 is located at a position behind the air inlet 60; the air inlet 60 is used to connect the external environment with the internal air path of the housing, and is connected to the heat dissipation space air path on the surface of the radiator, and is used to suck the ambient cold air into the surface of the radiator 23 for air-cooled heat dissipation.

[0217] A sub-control circuit board 5' can be arranged in the first main body 100 and is electrically connected to the control circuit board 5. The beauty instrument 1000 is provided with a key unit and a display module 9, which can be arranged on the first main body 100 or the second main body 200 and is electrically connected to the sub-control circuit board 5' and / or the control circuit board 5.

[0218] In this embodiment, the heat dissipation component 2, the light source component 3, the fan 23, and the sub-control circuit board 5' are arranged inside the first main body 100; the power supply unit 4 and the control circuit board 5 are arranged inside the second main body 200.

[0219] The circuit of the beauty instrument in this embodiment refers to , which is the same as the circuit in the foregoing beauty instrument embodiment. A sub-control circuit board 5' can be arranged to be connected to the control circuit board 5 to facilitate the electrical connection and wiring of the electronic devices in the first main body and the second main body. A control unit can be arranged on the control circuit board 5, and the sub-control circuit board 5' can be provided with a control unit or not provided with a control unit. Other functional modules can be arranged on the sub-control circuit board 5' or the control circuit board 5. The circuit structure and principle are the same as those in the foregoing embodiment and will not be elaborated here. In this embodiment, similarly, the function modes of the beauty instrument include: two or more function modes among the face hair removal mode, the leg hair removal mode, the armpit hair removal mode, the intimate area hair removal mode, the skin rejuvenation mode, the whitening mode, the summer cooling mode, the winter cooling mode, the import and export mode, and the EMS mode. When the control unit receives a switch signal sent by the key unit or the display component, two judgment conditions are executed:

[0220] Condition 1: Whether the skin sensing module senses that the skin is approaching, or whether the contact area between the working surface of the beauty instrument and the skin reaches a preset condition;

[0221] Condition 2: Whether the voltage of the charging capacitor meets the preset voltage corresponding to the current mode or gear;

[0222] When both conditions are met, the control unit controls the IPL lamp tube trigger module to light up the IPL lamp tube to generate pulsed light.

[0223] The light source assembly 3 is installed on the light source bracket 7. The pulsed light generated by the light source assembly 3 is transmitted through the light output cavity structure 70 to the working surface of the beauty instrument, and after transmission, hair removal or other beauty treatments are performed. The light cavity assembly 70 is the same as the beauty instrument in the foregoing embodiment, and a sealed and heat-insulating light transmission channel is defined inside. The light source bracket 7 is installed inside the housing 6 and is located behind the working head. A light transmission channel is formed by connecting the working head and the light source bracket 7 with a mirror cover 71. The pulsed light generated by the light source assembly 3 is transmitted through the light transmission channel to the working head and then passes through the working surface to perform hair removal treatment or beauty treatment with other effects on the external skin. Both ends of the light source assembly 3 are installed on the light source bracket 7.

[0224] The light generated by the light source assembly 3 is transmitted to the working surface through the light-emitting cavity structure. As an embodiment, the light-emitting cavity structure is connected between the thermoelectric cooler 1 and the light-emitting surface of the light source assembly 3, and a sealed and heat-insulated light transmission channel is defined inside. Specifically, the light-emitting cavity structure 70 includes a mirror cover bracket 79, a mirror cover 71, a sealing ring 73, a sealing ring pressing plate 75, and also includes a white glass or a highly transparent dielectric plate 76. The mirror cover 71 is cylindrical with openings at both ends, and a light transmission channel is defined inside. The shape and size of its front end are adapted to the light-transmitting area 102 of the thermoelectric cooler 1. Preferably, the light generated by the light source assembly is just transmitted to the light-transmitting area of the cooler 1, that is, the port of the mirror cover 71 has the same shape and size as the light-transmitting area 102, isolating the hot surface of the thermoelectric cooler outside the mirror cover 71. The mirror cover 71 is installed on the mirror cover bracket 79; the mirror cover bracket 79 is made of heat-insulating material, used to fix the mirror cover 71 and for heat insulation. Its front end is an annular cavity adapted to the mirror cover 71, and the mirror cover 71 can be sleeved inside or outside the mirror cover bracket 79. In this embodiment, it is sleeved in the front annular cavity of the mirror cover bracket 79; on the rear end face of the mirror cover bracket 79, a white glass or a highly transparent dielectric plate 76 is provided to cover and seal. The white glass or the highly transparent dielectric plate 76 has high light transmittance. Its edge is sleeved with a sealing ring 73, which is combined with the sealing ring 73 for light transmission (as the light-emitting surface of the light source assembly) and sealing the other end of the light transmission channel and serving as the light-emitting surface of the light source assembly 3, so as to form a closed light transmission channel between the cooler 1 and the light-emitting surface of the light source assembly 3, preventing water droplets from forming inside the cooler 1 due to the temperature difference during cooling, and also having a heat insulation effect, isolating the hot surface of the thermoelectric cooler outside the mirror cover bracket 79, and the heat generated by the hot surface will not be introduced into the closed light transmission channel inside the light cavity assembly 70, making the cooling effect of the cold surface of the cooler better. Outside the white glass or the highly transparent dielectric plate 76, a pressing plate 75 is further provided, which is an annular frame adapted to the shape of the white glass or the highly transparent dielectric plate 76, pressing the white glass or the highly transparent dielectric plate 76. A card slot for installing a filter can be provided on the pressing plate 75, which can be used to insert the filter assembly 8. One or more white glasses or highly transparent dielectric plates 76 can be provided at the light-emitting surface of the light source assembly 3. The pulsed light generated by the light source assembly 3 is transmitted through the white glass or the highly transparent dielectric plate 76 and then transmitted to the light-transmitting area 102 or the working surface of the thermoelectric cooler through the sealed light transmission channel.

[0225] The beauty instrument 1000 of the present invention is provided with a storage channel or a card slot for accommodating and installing the filter component 8. During operation, the pulsed light generated by the light source component 3 is filtered by the filter component 8 and then transmitted to the light-emitting working surface, and the transmitted light wave is used for beauty or treatment operations. The filter component 8 is located at the front end of the light source component 3; the storage channel is arranged on the sealing ring pressing plate 75 or the light source bracket 7, or is jointly defined by both; furthermore, the filter component is elastically fixed by a spring 83. The filter component 8 includes a filter, such as filter glass, and a frame bracket for installing the filter, and further includes a circuit board, on which a resistor is arranged. The filter circuit board and the resistor can be arranged in the slots (not shown) of the frame bracket.

[0226] In this embodiment, the beauty instrument 1000 can be configured with multiple filter components 8 for selective use. The filter component 8 is detachably assembled in the beauty instrument or can be inserted into the storage channel / card slot in a pluggable manner. The filter bands of different filter components 8 can be set differently to obtain light of different bands, and correspondingly obtain different beauty effects.

[0227] In some embodiments, the wavelength of the light emitted by the filter (the light wave filtered by the filter) can be: 510nm - 1200nm, 530nm - 1200nm, 560nm - 1200nm, 590nm - 1200nm, 610nm - 1200nm, 640nm - 1200nm, 645 - 750nm.

[0228] For the filter component 8 used in the beauty instrument 1000 with a hair removal function, the light wave wavelength of the filter is preferably above 610nm. For example, a filter component in the range of 610 - 1200nm is used to transmit the light wave with a wavelength greater than 610nm through the working surface. In other embodiments, the light wave of at least one filter component 8 can be 645 - 750nm, that is, dual-band filtering, filtering out the light waves below 645nm and above 750nm, and the wavelength of the emitted light is 645 - 750nm.

[0229] Examples of the wavelength of the filter and the beauty effects of the beauty instrument include but are not limited to:

[0230] A filter with a wavelength of 430 - 1200nm can be used to treat inflammatory acne;

[0231] A filter with a wavelength of 480 - 1200nm can be used to treat acne and vascular lesions;

[0232] A filter with a wavelength of 530 - 1200nm can be used to treat vascular (superficial small blood vessels) and pigmentary lesions;

[0233] A filter with a wavelength of 560 - 1200nm can be used for wrinkle removal, and treating pigmentary and vascular lesions (thick and deep blood vessels);

[0234] A filter with a wavelength range of 640 - 1200 nm can be used for hair removal, skin rejuvenation, and deep redness reduction.

[0235] A filter with a wavelength range of 690 - 1200 nm can be used for hair removal, deep redness reduction, etc.

[0236] Different filter components 8 can be set with filters of different wavelengths and resistors with different resistance values. Thus, by detecting the resistance value of the resistor in the filter component, or the voltage across the resistor, or the current flowing through the resistor, the corresponding filter component can be identified. The corresponding relationship between the resistance value / voltage across the two ends / current of the resistor and the wavelength of the filter has been preset.

[0237] The resistor is set on the filter component circuit, specifically on the filter component circuit board, and is electrically connected to the control circuit boards 5, 5' inside the beauty device through the electrode component 80. The electrode component 80 includes a pair of electrodes 81 and 82, which are respectively electrically connected to the two ends of the resistor on the filter circuit board for detecting the voltage across the resistor. According to the preset value, the resistor and the corresponding filter can be distinguished, and the wavelength of the used filter can be obtained. The pair of electrodes 81 and 82 of the electrode component 80 are fixed by an insulating body. At both ends of each electrode, one end is used to electrically connect one end of the resistor on the filter component circuit board, and the other end is used to electrically connect the control circuit board (control unit) inside the beauty device. The electrode component 80 is installed and fixed on the sealing ring pressing plate 75 or the light source bracket 7. For example, a groove is opened on the sealing ring pressing plate 75 for clamping the insulating body, and a storage channel or a slot is provided on the sealing ring pressing plate 75, or a storage channel or a slot is defined between the sealing ring pressing plate 75 and the light-emitting surface of the light source component to install the filter component 8 on the cross-section of the light transmission channel. An elastic pin is also provided on the insulating body for elastically clamping the filter component 8.

[0238] Specifically, the principle of the beauty device of the present invention for identifying the filter (filter glass) it uses is as follows:

[0239] Among different filter components 8, the resistors set on their circuit boards have different resistance values. When the filter component 8 is inserted into the working head of the beauty device, one end of each of the electrodes 81 and 82 of the electrode component 80 inside the beauty device is respectively connected to one end of the resistor on the circuit board, so that the control circuit boards 5, 5' inside the beauty device detect the resistance value or voltage value or current value of this resistor through this circuit, and query the wavelength of the filter corresponding to this resistance value or voltage value or current value to achieve the identification of different filter components 8.

[0240] The beauty device of the present invention has a main body of the beauty device that can be configured with multiple filter components 8, and the corresponding filter component of the corresponding wavelength band is selected according to the use. The filter component 8 is inserted through the bin opening on the main body of the beauty device. After the beauty device is powered on, the control circuit board controls the light source component 3 to generate pulsed light, which is filtered by the filter in the filter component 8 and then emitted from the working surface to perform beauty operations on the skin. When different beauty functions are required, the original filter component 8 can be ejected from the bin opening on the housing, and different filter components 8 can be replaced. A filter component 8 is installed on the working head of the hair removal device, so that the hair removal device has other beauty or treatment functions besides hair removal, such as skin rejuvenation, whitening, redness removal, wrinkle removal, treatment of skin diseases, etc.

[0241] The tail of the second main body 200 (or the beauty device 1000) is covered by a tail cover 69'. A power cord is provided on the tail cover 69' and is connected to the internal control circuit board 5 for connecting to an external power supply. The power cord can be a DC line, which can be connected to the second main body 200 through an interface, and an adapter can be connected to the power cord.

[0242] In other embodiments, the power cord is connected to a power adapter, and the power supply unit 4 uses an energy storage capacitor. The power supply electronic control principle is as follows:

[0243] The power adapter is the first electronic control module; the sub-control circuit board 5' is the high-voltage discharge PCBA arranged in the rotating head housing 61', that is, the second electronic control module, and the control circuit board 5 arranged in the rear housing 62' is the boost PCBA, that is, the third electronic control module;

[0244] The electronic control principle from the beauty device being turned on to normal operation is as follows: After the power cord (AC line) connected to the power adapter is inserted into the mains power socket, the power adapter is powered on. At this time, the externally input voltage is a wide voltage AC90V - 264V, and the voltage is stepped down in the power adapter by the first electronic control module to form a low-voltage output, such as DC12V or DC24V, or a voltage value between DC12 - 24V; then it is output to the main body of the beauty device through the DC line (at this time, the DC line is inserted into the main body DC socket); when the DC voltage is input to the boost PCBA of the second electronic control module, that is, the sub-control circuit board 5' (the Figures 28 - 32 shown power boost module), the voltage ranges from DC12V or DC24V, or a voltage value between DC12V - 24V, and the boost voltage value (voltage value range DC250V - 400V) is adjusted according to the energy level required for hair removal treatment or beauty / therapy treatment to charge the energy storage capacitor 4; then it is controlled by the third electronic control module, that is, the control circuit board 5 (the Figure 9 Figure 9 Figure 9 shown IPL lamp tube trigger module) to control the light source component 3 (IPL lamp tube) to emit light. This low-voltage input is safer to use. The light source in the light source component 3, such as the IPL lamp tube 31, emits light by the principle: the IPL lamp tube is triggered to light up by a double voltage, and the capacitor energy is released to achieve a flash effect.

[0245] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than explicitly or implicitly indicating that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0246] Although the embodiments of the present invention have been shown and described, the technical solutions in the above embodiments can be combined or replaced with each other. For those of ordinary skill in the art, it can be understood that various changes, modifications, replacements, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and all of them should belong to the scope of the present invention; the protection scope of the present invention is defined by the appended claims and their equivalent scope.

Claims

1. A beauty device, with a hair removal device as the main body, including a housing, in which a light source assembly, a power supply unit and a control circuit board are arranged; the light source assembly is powered by the power supply unit and generates pulsed light under the control of the control circuit board; the front end face of the beauty device is the working face; it is characterized in that: The beauty device is also provided with a display module electrically connected to the control circuit board; A control unit is arranged on the control circuit board; The light source assembly includes an IPL lamp tube, and the power supply unit is a charging capacitor for supplying power to the IPL lamp tube; An IPL lamp tube triggering module electrically connected to the control unit is arranged on the control circuit board; the IPL lamp tube triggering module is electrically connected to the IPL lamp tube, and the control unit controls the IPL lamp tube triggering module to light the IPL lamp tube to generate pulsed light; A power cord is connected to the main body to access an external power supply to supply power to the beauty device; A power boost module electrically connected to the control unit is arranged on the control circuit board, the power boost module is electrically connected to the charging capacitor, and the voltage output by the power cord is boosted by the power boost module and then used to charge the charging capacitor; The voltage output by the power cord is boosted by the power boost module and then used to supply power to the IPL lamp tube triggering module; the power boost module is set by the control unit according to the current gear or function mode to control the cut-off voltage of the power boost module, charge the charging capacitor for energy storage, and obtain the output voltage of the corresponding charging capacitor; The display module is a touch screen, including a display module and a touch control module electrically connected to the control unit; The touch control module is used for touch control to realize the function mode setting of the beauty device, and / or for setting the voltage or gear of the power supply unit; The function modes of the beauty device include two or more of the following function modes: facial hair removal mode, leg hair removal mode, underarm hair removal mode, intimate area hair removal mode, skin rejuvenation mode, whitening mode, summer cooling mode, winter cooling mode, import and export mode, and EMS mode; The voltage of the charging capacitor corresponding to the function mode of the beauty device is a preset value; The voltage of the charging capacitor corresponding to the gear is a preset value.

2. The beauty device according to claim 1, characterized in that: A DC power supply module electrically connected to the control unit is arranged on the control circuit board; The power cord is connected to a power adapter to supply power to the beauty device, and the power adapter has two outputs: One output is connected to the power boost module to supply power to the charging capacitor and the IPL lamp tube triggering module in parallel; One output is connected to the DC power supply module to supply power to the control unit and the electrical appliances connected to the control unit; The voltage of the charging capacitor is 270 - 380V; The power adapter has a low-voltage output; the low-voltage output of the power adapter is 12 - 32V.

3. The beauty device according to claim 1, characterized in that: The beauty device is also provided with at least one of the following modules electrically connected to the control unit: a fan, a refrigeration module, a skin sensing module, a filter detection module, a skin color detection module, etc.; The refrigeration module is a semiconductor refrigeration chip, and its positive and negative poles are electrically connected to the control unit; The skin sensing module is a sensor connected to the control unit, used for sensing the contact area between the working surface and the skin, or sensing whether there is skin approaching the working surface to control the switching of the IPL lamp tube; The filter detection module is electrically connected to the control unit and is used for detecting the filter component used in the beauty device to determine the wavelength characteristics of the filter in the filter component; The skin color detection module is electrically connected to the control unit and is used to detect the skin color or hair color of the skin in contact with the working surface of the beauty instrument, so as to control the intensity of the IPL pulsed light; The beauty instrument is further provided with a key unit electrically connected to the control unit, which is used for power on / off and / or controlling the switch of the IPL lamp tube; When the control unit receives the switch signal sent by the key unit or the display module, it executes two judgment conditions: Condition 1: Whether the skin sensing module senses the approach of the skin, or whether the contact area between the working surface of the beauty instrument and the skin reaches a preset condition; Condition 2: Whether the voltage of the charging capacitor meets the preset voltage corresponding to the current mode or gear; When both conditions are met, the control unit controls the IPL lamp tube trigger module to light up the IPL lamp tube to generate pulsed light.

4. The beauty instrument according to any one of claims 1 to 3, characterized in that: The beauty instrument further includes a semiconductor refrigeration sheet; The semiconductor refrigeration sheet includes a PN thermoelectric particle layer, as well as a cold surface and a hot surface; The hot surface of the semiconductor refrigeration sheet is provided with a hot end circuit, and the cold surface of the semiconductor refrigeration sheet is provided with a cold end circuit; the PN thermoelectric particle layer includes P-type / N-type semiconductor particles; the cold end circuit and the hot end circuit respectively electrically connect the two ends of the P-type / N-type semiconductor particles to form a series circuit; Both ends of the series circuit are connected to a pair of electrodes and are electrically connected to the control circuit board; The cold surface of the semiconductor refrigeration sheet is directly used as the working surface of the beauty instrument or cools the working surface.

5. The beauty instrument according to claim 4, characterized in that: An optical output cavity is arranged between the light source assembly and the working surface to transmit the pulsed light generated by the light source assembly to the working surface, and a sealed light transmission channel is defined inside the structure of the optical output cavity; Both the front and rear ends of the light transmission channel are open; The front end face of the optical cavity structure abuts against the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet covers the front opening of the light transmission channel, which is adapted to the light transmission area of the semiconductor refrigeration sheet, and transmits the pulsed light generated by the light source assembly to the light transmission area of the semiconductor refrigeration sheet through the light transmission channel; The rear end face of the optical cavity structure abuts against the light output surface of the light source assembly, and the light output surface of the light source assembly covers the rear opening of the light transmission channel, and the pulsed light generated by the light source assembly is transmitted to the light transmission channel after being transmitted from the light output surface.

6. The beauty instrument according to claim 4, characterized in that: The semiconductor refrigeration sheet has a light transmission area for the pulsed light generated by the light source assembly to be transmitted through for beauty treatment; The working surface is formed of a transparent crystal material to form a transparent crystal working surface; or The cold surface of the semiconductor refrigeration sheet is made of a transparent crystal material to form a transparent crystal cold surface, and the transparent crystal cold surface is used as the working surface.

7. The beauty instrument according to claim 4, characterized in that: The semiconductor refrigeration sheet uses a transparent crystal as the cold surface, and the transparent crystal is fixedly connected to one or more groups of the PN thermoelectric particle layers and the hot surface connected to the PN thermoelectric particle layer; the transparent crystal cold surface forms a light transmission area for the pulsed light generated by the light source assembly to be transmitted through for beauty treatment.

8. The beauty instrument according to claim 4, characterized in that: The thermoelectric cooler uses a transparent crystal as the cold surface, and the hot surface of the thermoelectric cooler is annular; the P-type / N-type semiconductor particles of the PN electric couple particle layer are arranged in an annular shape and are correspondingly fixed on the annular hot surface; the transparent crystal cold surface is a whole crystal, covering the PN electric couple particle layer on the hot surface, and the annular hollow area serves as a light-transmitting area for the pulsed light generated by the light source assembly to transmit.

9. The beauty instrument according to claim 4, characterized in that: The hot surface of the thermoelectric cooler is annular; the P-type / N-type semiconductor particles of the PN electric couple particle layer are arranged in an annular shape; the cold surface is annular and is made of transparent or opaque material, and the annular hot surface and the cold surface are respectively welded to both ends of the P-type / N-type semiconductor particles of the PN electric couple particle layer, and the annular hollow area forms a light-transmitting area.

10. The beauty instrument according to claim 4, wherein: A plurality of air inlets and air outlets are provided on the housing; A heat dissipation assembly is arranged in the main body of the host for dissipating heat from the thermoelectric cooler; The heat dissipation assembly includes a heat pipe and a radiator connected to the heat pipe; a fan is also arranged in the housing; An air path is connected between the air inlet, the radiator, the fan, and the air outlet to form a first heat dissipation air duct for air-cooling the radiator; by starting the fan, cold air is inhaled from the air inlet, the heat on the surface of the radiator is taken away, and hot air is discharged from the air outlet; The hot surface of the thermoelectric cooler is connected to the radiator by a heat pipe, and the heat pipe contains a refrigerant; The radiator includes a plurality of heat dissipation fins.

11. The beauty instrument according to claim 10, wherein: An air path is connected between the air inlet on the housing, the space on the heat dissipation surface of the light source assembly, the fan, and the air outlet to form a second heat dissipation air duct. By starting the fan, cold air is inhaled from the air inlet, the heat on the surface of the light source assembly is taken away, and the hot air is discharged from the air outlet by the fan for air-cooling the light source assembly.

12. The beauty instrument according to claim 10, characterized in that: The light source assembly is connected to the radiator by a heat pipe for heat dissipation.

13. The beauty instrument according to claim 10, wherein: The plurality of heat dissipation fins are metal heat dissipation fins, and the plurality of heat dissipation fins are connected and fixed by a connecting structure.

14. The beauty instrument according to claim 10, characterized in that: The plurality of heat dissipation fins are integrally formed by graphene to form a graphene radiator.

15. The beauty instrument according to claim 4, wherein: The hot surface of the thermoelectric cooler forms a VC heat conduction plate hot surface with a VC heat conduction plate, and the inside contains a refrigerant; the hot surface of the thermoelectric cooler is connected with a heat pipe, and the heat pipe is connected with the radiator; The inside of the heat pipe is communicated with the inside of the heat conduction plate to form a connected closed space; the refrigerant circulates in the closed space; The heat end circuit or the metal conductor is arranged on the surface of the heat conduction plate and is electrically connected and fixedly connected to one end of the P-type / N-type semiconductor particle.

16. The beauty instrument according to claim 1, wherein: A card slot for inserting a filter component is arranged between the light source assembly and the working surface in the main body of the host, and the filter component can be replaced in a pluggable manner to filter the pulsed light generated by the light source assembly before it transmits through the working surface to obtain pulsed light of a predetermined wavelength, so as to achieve different beauty or treatment effects; The filter component includes a filter sheet, a frame bracket for fixing the filter sheet, and a filter component circuit; the filter component circuit is arranged on a circuit board and is installed on the frame bracket; the filter component and the card slot are further elastically tightened by an elastic element; The filter component circuit includes a resistor, and the wavelength characteristics of the filter in the corresponding filter component are identified by detecting the resistance value of the resistor in the filter component, or detecting the voltage across the resistor, or detecting the current flowing through the resistor; the wavelength characteristics of the filter are preset to correspond to the resistance value. An electrode assembly electrically connected to the main control circuit board is provided on the beauty device. The electrode assembly includes a pair of counter electrodes, which are respectively electrically connected to the two ends of the resistor of the filter component circuit to detect and identify the filter in the corresponding filter component.

17. The beauty instrument according to claim 1, wherein: The main body is divided by a pair of cross-sections inside into a first main body and a second main body that can rotate relative to each other. The first main body and the second main body are connected by a rotary connection structure; the front end face of the first main body is the working face, and the light source assembly is located inside the first main body. The first main body rotates relative to the second main body so that the first main body and the second main body are in a straight plate shape or a side-standing state at different angles; the pair of cross-sections respectively serve as the connection end faces of the first main body and the second main body.

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