Computerized system and method for obtaining information about a region of an object
Through multi-parameter imaging and image processing technology, the problem of difficulty in distinguishing between light spots and defects in existing wafer inspection tools has been solved, achieving higher-precision defect detection.
Patent Information
- Application Number
- CN202080009755.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-01-17
- Filing Date
- 2020-01-14
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2040-01-14
AI Technical Summary
Existing wafer inspection tools have difficulty effectively distinguishing between light spots scattered by printed pattern roughness and actual defects, resulting in inaccurate defect detection.
The method comprises the steps of: obtaining multiple images of multiple areas of the image parameters by taking an imaging instrument, performing multiple image processors on the imaging instrument to generate multiple difference images, performing multiple comparisons of the multiple parameters of the multiple parameters, performing multiple reference images, calculating multiple attributes of the pixels of the area through the multiple reference images, calculating noise attributes through the multiple difference images, and determining whether the pixels of the area represent defects.
The detection accuracy and reliability of small defects are improved, the false detection rate is reduced, and the reliability of defect detection is enhanced.