Substrate handling device with adjustable joints

Abstract

The present disclosure relates to an adjustable joint for insertion into a linkage of a substrate handler for processing of a substrate. The adjustable joint allows adjustment of the pitch and roll of an attached link. Such adjustment can allow alignment of a pick surface of an end effector to a desired plane. After adjustment, the joint can be fixed to maintain the desired orientation of the attached link. The adjustable joint allows correction of deflection of a pick surface of an end effector from a desired pick plane due to, for example, sag caused by high temperature use, mechanical tolerances, and / or installation errors.

Description

Technical Field

[0001] This disclosure generally relates to gas-phase reactors and systems. More specifically, this disclosure relates to systems and methods for performing substrate operations during substrate fabrication, and more specifically to substrate transfer linkages with adjustable joints for high-temperature applications. Background Technology

[0002] Vapor phase reactors, such as chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), and atomic layer deposition (ALD) reactors, can be used in a variety of applications, including depositing and etching materials on substrate surfaces such as semiconductor wafers. For example, vapor phase reactors can be used to deposit and / or etch layers on a substrate to form semiconductor devices, flat panel displays, photovoltaic devices, microelectromechanical systems (MEMS), and more.

[0003] A typical gas-phase reactor system includes a reactor comprising a reaction chamber, one or more precursor and / or reactant gas sources fluidly coupled to the reaction chamber, one or more carrier gas sources and / or purge gas sources fluidly coupled to the reaction chamber, a gas injection system for delivering gases (e.g., one or more precursor / reactant gases and / or one or more carrier / purge gases) to the reaction chamber, and an exhaust source fluidly coupled to the reaction chamber. During processing, one or more substrates are placed in the reaction chamber using a substrate transfer device (e.g., a linkage device or robotic arm). Once placed in the reaction chamber, the substrate(s) can be exposed to various precursor and / or reactant gases. After processing, the substrate(s) are removed from the reaction chamber using a transfer device. During such processing, care must be taken to avoid physical damage and particulate contamination of the extremely fragile and easily contaminated substrates.

[0004] Various systems are known for manipulating substrates within vapor phase processing systems. The specific application or environment from which the substrate is lifted typically determines the type of pick-up device (e.g., an "end effector"). One type of pick-up device, known as a Bernoulli bar, is typically used in high-temperature applications. A Bernoulli bar utilizes a jet of gas flowing downwards from the bar toward the substrate to create a low-pressure region above the wafer, thereby lifting the substrate. An advantage is that the substrate does not need to physically contact the pick-up bar. Such a Bernoulli bar is illustrated in U.S. Patent No. 5,080,549 to Goodwin et al. Another type of wafer pick-up device is a simple paddle, which relies on friction caused by gravity between the substrate support surface and the back side of the substrate. In one variation, a vacuum-enhanced paddle is used to hold the substrate on the paddle.

[0005] While such mechanisms are relatively effective at placing and removing substrates from the reactor, their moving parts can provide a source of particulate contamination. Furthermore, as the reaction temperature within the reactor continues to rise, the linkage of the substrate transfer device supporting the pickup (e.g., end effector) is susceptible to slight deflection (e.g., sagging), which can lead to substrate misalignment during transfer. Such misalignment can result in substrate damage. Therefore, improved mechanisms and techniques for substrate transfer are needed.

[0006] Any discussion set forth in this section, including discussions of problems and solutions, is included in this disclosure solely for the purpose of providing background to this disclosure and should not be construed as an admission that any or all such discussions were known at the time of completion of this invention or otherwise constitute prior art. Summary of the Invention

[0007] This overview is provided to introduce a set of concepts in a simplified form. These concepts will be described in more detail below in the detailed description of exemplary embodiments of this disclosure. This overview is not intended to necessarily identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0008] Various embodiments of this disclosure relate to an adjustable joint for insertion into a linkage of a substrate manipulator for substrate processing. The adjustable joint allows adjustment of the pitch and roll of one of the links attached to it. Such adjustment allows the pickup surface of the end effector to be aligned with a desired plane. After adjustment, the joint can be secured to maintain the desired orientation of the attached link. The adjustable joint allows correction of deflection of the end effector's pickup surface relative to the desired pickup plane caused by, for example, sag due to high-temperature use, mechanical tolerances, and / or installation errors.

[0009] In one arrangement, an adjustable linkage substrate manipulation device is disclosed. The device includes at least a first link and a second link, both extending between a proximal and a distal end. Such links are typically elongated, having a long axis extending between their proximal and distal ends. Adjacent links are attached via a rotary joint, about which the links can rotate. In one arrangement, the distal end of the first link is attached to the proximal end of the second link via the rotary joint. The distal end of the linkage mechanism (e.g., the second link or a subsequent link) can support an end effector. To provide adjustment for one of the links, an adjustable joint can be disposed between an end of one of the links and the rotary joint. The adjustable joint includes a first body connectable to the rotary joint and a second body connectable to one of the links (e.g., the proximal end of the second link). The body of the adjustable joint can be engaged at a selected contact angle to adjust the pitch and / or tumble of the link connected to the second body. Such adjustment can provide a desired alignment for the end effector. Once the contact angle is selected, the body can be fixedly engaged to maintain this orientation.

[0010] In one arrangement, the first and second bodies of the adjustable joint include mating surfaces. The first body may include an adjusting surface, and the second body may include a contact surface. When the bodies are rigidly connected, the adjusting surface abuts the contact surface. One or more adjusters (e.g., retaining screws) may selectively extend through the adjusting surface. When extending above the adjusting surface, and when the first and second bodies are fixedly attached, the adjusters(s) provide a gap between the adjusting surface and the contact surface. That is, the contact angle between the first and second bodies can be adjusted based on the position of the adjusters relative to the adjusting surface. Such adjustment can be on a first axis and / or a second axis.

[0011] In another arrangement, a linkage-type substrate manipulation device is disclosed to reduce the possibility of substrate contamination. The device includes at least a first link and a second link connected by a rotary coupling having at least a first gear that transmits rotational motion from the first link to the second link. In one arrangement, the distal end of the first link is attached to the proximal end of the second link via the rotary coupling. The distal end of the device supports an end effector configured to engage and release a substrate (e.g., a semiconductor wafer). The end effector is spaced at a distance from all gears of the substrate manipulation device to reduce potential sources of particulate contamination. In one arrangement, the edge (e.g., the proximal edge) of the end effector is at least 100 mm away from any gear in the substrate manipulation device. In another arrangement, the end effector is at least 200 mm away from any gear in the substrate manipulation device.

[0012] These and other embodiments will be apparent to those skilled in the art from the following detailed description of certain embodiments with reference to the accompanying drawings; this disclosure is not limited to any particular embodiment disclosed. Attached Figure Description

[0013] A more complete understanding of exemplary embodiments of the present disclosure can be obtained by referring to the detailed description and claims when considered in conjunction with the following illustrative drawings.

[0014] Figure 1 The reactor system is shown.

[0015] Figure 2A and 2B The substrate manipulation device is shown in both the retracted and extended positions.

[0016] Figures 3A-3C Side views of the linkage substrate manipulator in the non-deflection, deflection, and correction positions are shown respectively.

[0017] Figure 4A An embodiment of a dual-arm substrate manipulator is shown.

[0018] Figure 4B It shows Figure 4A A partial cross-sectional view of the substrate manipulator.

[0019] Figure 5 An exemplary embodiment of the adjustable connector according to this disclosure is shown.

[0020] Figures 6A-6D It shows Figure 5 The first series of adjustments of the adjustable connector.

[0021] Figure 7A and 7B It shows Figure 5 The second series of adjustments of the adjustable connector.

[0022] It should be understood that the elements in the figures are for illustrative purposes only and are not necessarily drawn to scale. For example, some of the elements in the figures may be enlarged relative to other elements to aid in understanding the embodiments illustrated in this disclosure. Detailed Implementation

[0023] The description of exemplary embodiments provided below is merely illustrative and intended for purposes of explanation only; the following description is not intended to limit the scope of this disclosure or the claims. Furthermore, the description of multiple embodiments having the stated features is not intended to exclude other embodiments having additional features or other embodiments incorporating different combinations of the stated features.

[0024] As used herein, “substrate” can refer to any material having a surface on which material can be deposited. A substrate can include a bulk material such as silicon (e.g., monocrystalline silicon), or can include one or more layers covering a bulk material. Furthermore, a substrate can include various topologies formed within or on at least a portion of the layers of the substrate.

[0025] Furthermore, in this disclosure, any two numbers of a variable may constitute a working range of the variable, and any indicated range may include or exclude endpoints. Additionally, any indicated variable value (whether or not it is indicated by “about”) may refer to an exact value or an approximate value and include equivalent values, and may refer to the mean, median, representative value, multi-value, etc. Furthermore, in some embodiments of this disclosure, the terms “comprising,” “consisting of,” and “having” independently mean “generally or broadly comprising,” “including,” “substantially consisting of,” or “consisting of.” In some embodiments of this disclosure, the meaning of any definition does not necessarily exclude the common and conventional meaning.

[0026] Now turn to the attached image. Figure 1 An exemplary reactor system 100 is illustrated. The reactor system 100 can be used in a variety of applications, such as chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), atomic layer deposition (ALD), cleaning processes, etching processes, etc. In an exemplary embodiment, the system is an epitaxial reactor system; however, unless otherwise stated, the embodiments and this disclosure are not limited thereto.

[0027] In the example shown, reactor system 100 includes reactor 102 with four independent reaction chambers 104a-d. In this embodiment, a first substrate manipulator 110 (e.g., a linkage or robotic arm) is used to move substrates (e.g., semiconductor wafers) from one or more cassettes 112 to an intermediate loading station 114. Each cassette 112 (e.g., a front-opening foyer) can hold multiple substrates and engages with a loading station for loading the cassettes into system 100. Subsequently, a second substrate manipulator 120 is used to move the substrates from the intermediate loading station 114 to the reaction chambers 104a-d. Figure 1In this system, four substrates can be processed simultaneously. However, it should be understood that the system can be configured to process more or fewer substrates (e.g., a single substrate). System 100 may also include a gas injection and purging system (not shown) fluidly coupled to the processing station and a heating system (not shown) for raising the temperature within the reaction chamber 102 and / or the processing station to a desired processing temperature. In embodiments, the heating system may be configured and arranged to maintain a temperature between 20 and 2000°C. Furthermore, the system may include a pressure system (not shown) configured and arranged to bring the pressure in the reaction chamber and / or the processing station to and / or maintain it between 0.001 and 700 Torr. Additionally, system 100 may include a controller (not shown) configured to control the operation of the system.

[0028] In the illustrated embodiment, the substrate manipulator 120 disposed in reaction chamber 102 is a controllable arm having first and second links 122, 124 connected via a first rotary joint or coupling 126, the links being rotatable about the first rotary joint or coupling. More specifically, the distal end of the first link 122 is connected to the proximal end of the second link 124. The proximal end of the first link 122 is connected to the base member 128 via a second rotary joint or coupling 130. The free end or distal end of the second link 124 supports a substrate pickup device or end effector 132. In one embodiment, the end effector 132 is a Bernoulli bar. Such a Bernoulli bar uses a gas jet flowing downward from the bar to the substrate below to create a low-pressure region above the substrate, thereby lifting the substrate. However, it should be understood that this disclosure is not limited to any particular end effector. Rotary couplings 126, 130 allow the substrate manipulator 120 to extend and retract, respectively Figure 2A and 2B As shown in the diagram, the rotary coupling can have various bearings, shafts, gears, and / or actuators to enable the substrate manipulator to extend and retract to a desired position.

[0029] like Figure 1 In the exemplary embodiment shown, a substrate manipulator 120 is disposed within a reaction chamber 102. This arrangement within the reaction chamber 102 exposes the substrate manipulator 120 to the high temperatures required for substrate processing. As an example, some epitaxial reactor systems operate continuously at temperatures exceeding 500 or even 700°C. At such high temperatures, undesirable deflection or sagging may occur between the base of the substrate manipulator 120 and the distal end of the support end actuator. Alternatively, mechanical tolerances and / or mounting errors can cause undesirable deflection. This is in Figure 3A and 3BThe figure shows a simplified side view of the substrate manipulator 120 in an extended position. As shown, the base or proximal end of the first link 122 is connected to the base member 128 via a second swivel coupling 130. The first and second links 122, 124, connected by the first swivel coupling 126, cantilever out of the base member 128, supporting the end effector 132 at the distal end of the second link 124. Figure 3A A substrate manipulator 120 without deflection is shown. In an arrangement without deflection along the length of the substrate manipulator 120, the pickup surface (e.g., the bottom surface) of the end effector 132 is aligned with the desired pickup plane A-A'. That is, the generally planar bottom surface of the end effector 132 is substantially disposed within the reference plane A-A'. In other words, without deflection, the vertical position and / or tilt of the end effector is in a desired position that allows for precise engagement and placement of the substrate.

[0030] In arrangements where deflection occurs due to high temperatures or other mechanical misalignments, the pickup surface of the end effector 132 may not align with the desired pickup plane A-A'. As an example, high temperatures can cause the distal end of the substrate manipulator 120 to sag. This is in... Figure 3B As shown in the figure, in high-temperature applications, the rotating connection between the links allows for some movement between these components. Alternatively or additionally, at such high temperatures, the cantilever link itself may deflect slightly (e.g., under gravity). This can cause the planar pickup surface B-B' of the end effector 132 to shift relative to the desired pickup plane A-A'. That is, the generally planar pickup surface of the end effector 132 may shift relative to the reference plane A-A' (e.g., vertically and / or tilted). Such shift can impair the accuracy of the end effector engaging and releasing the substrate. In other words, the end effector 132 may be misaligned from its desired position, potentially causing substrate damage during substrate processing.

[0031] To address such displacement, this disclosure includes an adjustable joint 150 having at least one of the links 122, 124 of the substrate manipulator 120. This adjustable joint allows the orientation of one of the links to be adjusted to a desired orientation (e.g., pitch and roll), at which point the adjustable joint can be fixed to maintain that orientation. Figure 3CIn the illustrated embodiment, an adjustable joint 150 is disposed between the second link 124 and the first link 122 and connects the second link to the first link. More specifically, the body 152 of the adjustable joint 150 is attached to a first rotary coupling 126 supported by the distal end of the first link 122. That is, the proximal portion of the joint body 152 engages the rotary coupling 126, while the distal portion of the joint body 152 is configured to engage the proximal end 142 of the second link 124. As discussed more fully below, the joint 150 allows adjustment of the height of the distal end 144 of the second link 124. That is, the joint 150 allows adjustment of the "pitch" of the second link 124 along its long axis C-C' extending between the proximal end 142 and the distal end 144. Furthermore, the joint 150 allows adjustment of the angular orientation of the second link 124 about its long axis C-C'. In other words, the joint allows adjustment of the "roll" of the second link 124. Including the adjustable connector 150 in the substrate manipulator 120 allows the generally planar pickup surface of the end effector 132 to be aligned with the desired pickup plane A-A'.

[0032] exist Figure 3C In the illustrated embodiment, the adjustable joint 150 is upward and, when needed, adjusts the distal end 144 of the second link 124 about the long axis C-C' of the second link 124 to align the pickup surface of the end effector 132 with the desired pickup plane A-A'. That is, Figure 3C The substrate manipulator 120 is shown in the calibration position. Such adjustment allows for the correction of a so-called “negative displacement,” where the end effector pickup surface initially shifts below the desired pickup plane. Notably, the adjustable joint also allows for the correction of a “positive displacement” (not shown), where the end effector pickup surface shifts above the desired pickup plane. During operation, the amount of positive or negative displacement can be measured and corrected during the initial setup of the substrate manipulator. Alternatively, positive or negative displacement can be measured and corrected after the substrate manipulator has been placed in use.

[0033] Figure 4AAnother embodiment of a linked substrate manipulator is shown. More specifically, a dual-arm substrate manipulator 220. The substrate manipulator includes a linkage mechanism comprising a first pair of first links 222a, 222b, each first link having a proximal end connected to a base member 228 via a rotatable connection. The distal ends of the first links 222a, 222b are connected to a gear module 270 via first and second rotatable couplings 226a, 226b, respectively. The first and second rotatable couplings 226a, 226b are each attached to the proximal ends of a second pair of second links 224a, 224b via a pair of adjustable joints 250a, 250b. As shown, the adjustable joints 250a, 250b are connected to the proximal ends of the second links 224a, 224b. As further discussed herein, each adjustable joint 250a or 250b allows adjustment of the pitch and / or roll of the second link 224a or 224b connected to the adjustable joint. The distal ends of the second pair of links 224a, 224b are connected to the third link 240 via a pair of rotary bearings 242a, 242b. As shown, the second links 224a, 224b are attached to the first and second spaced positions along the length of the proximal portion of the third link 240. The distal end of the third link 240 supports the end effector 232. As mentioned above, the end effector can be a Bernoulli bar. However, this is not necessary. The substrate manipulator 220 may also include various gas lines 260 extending from the base 228 to the end effector 232. Such gas lines may be external to the links. Alternatively, the gas lines may extend through the interior of one or more links and through the center of one or more rotary connections. Such gas lines can provide airflow to control substrate pickup and release. For example, when using a Bernoulli bar, the gas lines can provide airflow through the end effector 232. Furthermore, such gas lines 260 can provide vacuum and purge gas to the end effector.

[0034] The linkage is driven by a shaft 230 connected to the proximal end of one of the first linkages. That is, one of the first linkages is a drive rod 222a, which is connected to the base member 228 via shaft 230. Shaft 230 is fixedly connected to the proximal end of drive rod 222a and extends through the base member 228, where it can be rotated by an actuator (e.g., a motor; not shown). Such rotation transmits motion to the substrate manipulator. Another linkage 222b is attached to the base member 228 via a rotary bearing 234. When shaft 230 rotates the adjusting rod 222a, the distal end of drive rod 222a transmits motion to the gear module 270 via a first rotary coupling 226a. In the illustrated embodiment, the lower ends of the first and second rotary couplings 226a, 226b are connected to the distal ends of linkages 222a, 222b. Figure 4BAs best shown in the partial cross-sectional view, the first and second rotary couplings 226a, 226b also include a pair of meshing gears 236a, 236b. In this arrangement, motion transmitted by a drive rod 222a, which can be fixedly attached to the shaft of the first rotary coupling 226a, causes the gears to rotate about their central axis. One of the gears 236b has a center of rotation in opposite directions, causing the upper ends (output ends) of the rotary couplings 226a, 226b to rotate in a common direction (e.g., clockwise or counterclockwise). Figure 4A As shown, the upper ends of the first and second rotary couplings 226a and 226b are connected to the first and second adjustable joints 250a and 250, respectively. Therefore, when the shaft 230 rotates to drive the rod 222a, the first pair of connecting rods 222a and 222b rotate in unison and transmit this common rotation to the first and second rotary couplings 226a and 226b. These rotary joints 226a and 226b rotate in unison, causing the second pair of second connecting rods 224a and 224b to rotate via the adjustable joints 250a and 250b. The second connecting rods 224a and 224b cause the third connecting rod 240 to rotate about a vertical axis (not shown) disposed between a pair of rotary bearings 242a and 242b that attach the distal ends of the second connecting rods 224a and 224b to the third connecting rod 240. Similarly, the end effector 232, fixedly connected to the third connecting rod 240, rotates about the vertical axis between the rotary bearings 242a and 242b. In operation, the substrate manipulator 220 is configured to move the end effector 232 between predetermined pick-up and release positions.

[0035] Regarding Figures 2A-3B As with the embodiments discussed, the substrate manipulator is prone to undesirable deflection due to, for example, high-temperature sagging and / or mechanical misalignment. To allow adjustment of the pickup surface of the end effector 232 with the desired pickup or release plane, the substrate manipulator utilizes adjustable joints 250a, 250b, which connect second links 224a, 224b to first links 222a, 222b via rotary couplings 226a, 226b.

[0036] Figure 5An exploded perspective view of one of the adjustable joints 250a or 250b (hereinafter referred to as 250) and one of the corresponding second links 224a or 224b (hereinafter referred to as 224) is shown. The adjustable joint 250 shown includes two main components that together allow the joint to adjust the pitch and / or tumble of the distal end 246 of the link 244. Specifically, the joint 250 includes a first body connectable to a rotating coupling and a second body connectable to the link. The first and second bodies are configured to be rigidly connected to each other along mating surfaces. The interface between these mating surfaces can be adjusted to adjust the contact angle between them, preferably on at least two axes. By such adjustment, the pitch and / or tumble of the attached link can be adjusted. The first body or tilt plate 252 has an adjustment surface 256 configured to engage a generally planar contact surface 257 (e.g., a top surface) of the second body or base plate 258. The tilt plate 252 of the joint 250 has a first end 254 configured to attach to one of the rotating couplings. In the illustrated embodiment, the first end 254 includes a circular recess with one or more fastener holes that allow the tilting plate 252 to be securely attached to the upper end of the rotating coupling (e.g., a shaft). The second end of the tilting plate 252 includes an adjustment surface 256. In the illustrated embodiment, the tilting plate 252 is generally L-shaped between its first and second ends. However, it should be understood that the shape can be changed based on the desired application and / or configuration of the substrate manipulator. The substrate 258 is attached to the proximal end of the link 224 via a connector 262.

[0037] Both the adjusting surface 256 of the tilt plate 252 and the contact surface 257 of the substrate 258 include a plurality of holes. More specifically, a first set of fastener holes 266a extends through the adjusting surface 256 of the tilt plate 252. A mating set of fastener holes 266b extends through the contact surface of the substrate 252. More specifically, these fastener holes extend through the tilt plate 252 and the substrate 258. Fasteners such as bolts 272 can extend through the mating set of fastener holes to rigidly secure the adjusting surface 256 of the tilt plate 252 to the contact surface 257 of the substrate 258. In addition to the fastener holes, two adjusting holes 264 extend through the adjusting surface 256 of the tilt plate 252. The adjusting holes 264 are configured to receive two threaded retaining screws 268. The adjusting holes 264 are internally threaded, thereby allowing the retaining screws 268 to be advanced to a desired position relative to the adjusting surface 256. The substrate 258 has no mating adjusting holes. Therefore, when the tilting plate 252 and the substrate 258 are connected, the tips of any fixing screws that are pushed through the adjustment hole 264 beyond (e.g., above) the adjustment surface 256 of the tilting plate 252 engage the top surface of the substrate 258. The tips of the fixing screws 268 are positioned between the adjustment surface 256 and the contact surface 257 to adjust the angular interface (e.g., contact angle) between them.

[0038] Figures 6A-6D Both figures show a partial cross-sectional view of the connector 250 taken through one of the adjustment holes 264. As shown, the tilting plate 252 can be initially positioned above the base plate 258 to align with the fastener holes 266a, 266b. See also Figure 6A The tilting plate 252 can then be advanced to bring the adjusting surface 256 into contact with the contact surface 257 of the substrate 258. One or more threaded bolts 272 can extend through aligned fastener holes, engage mating connectors (e.g., threaded nuts), and tighten to rigidly secure the tilting plate 252 to the substrate 258. See 6B. Once rigidly secured, the adjustable joint 250 is fixed and does not provide further movement during use of the substrate manipulator. In the illustrated embodiment, one or more retaining screws 268 are advanced beyond (e.g., above) the surface of the adjusting surface 256 to align the substrate 258 in a neutral position such that the contact angle between at least a portion of the adjusting surface and the contact surface is substantially zero. This is in Figure 6B The reference line is shown in the middle. In this arrangement, once bolt 272 is tightened, connector 262 attached to substrate 258 and any links attached to connector 262 can be held in a neutral pitch position (e.g., horizontal). If adjustment is required, retaining screw 268 can be further advanced or retracted before tightening bolt 272. Figure 6C As shown, advancing the retaining screw 268 beyond the neutral position alters (e.g., increases) the contact angle of the connection between the adjusting surface 256 and the contact surface 257, such as... Figure 6C The two dashed reference lines are shown in the diagram. When the base plate 256 and the tilting plate 252 are rigidly connected, this adjustment tilts the base plate 258, connector 262, and any connected links upwards. This increases the pitch of the distal end of the connected links. (See diagram for reference.) Figure 6D As shown, retracting the retaining screw to the neutral position alters (e.g., reduces) the contact angle of the connection between the adjusting surface 256 and the contact surface 257, as... Figure 6D The two dashed reference lines are shown in the diagram. This causes the substrate, connector 262, and any connected links to tilt downwards, thereby reducing the pitch of the distal end of the connected links. Figures 6B-6D In the illustrated embodiment, adjustment of the retaining screw allows adjustment of the generally planar contact surface of the substrate along the first axis. Although the adjustment surface 256 of the tilt plate 252 is shown as having two angled planar surfaces to allow for increasing and decreasing the pitch of the attachment link, it should be understood that the adjustment surface can be formed by a single planar surface. In such an arrangement, the adjustable joint can be limited to increasing the pitch of the attachment link (e.g., to address sagging), for example, by advancing the retaining screw beyond a single planar adjustment surface.

[0039] In addition to increasing or decreasing the pitch of the attachment link along its long axis between its proximal and distal ends, the connector 250 can also adjust the tumble of the attachment link about its long axis. This is in Figure 7A and 7B The image shows a partial cross-sectional view taken through the two adjustment holes 264. Figure 7A As shown, when the two retaining screws 268 are pushed equally through the adjusting surface 256 of the tilt plate 252, the substrate 258 can be substantially horizontal (e.g., neutral), as indicated by the reference line aligned with the contact surface 257 of the substrate 258 and the adjusting surface 256 of the tilt plate 252. If tumbling about the long axis of the attached link is desired, the retaining screws 268 can be pushed through the adjusting surface 256 of the tilt plate 252 by different amounts. Once firmly secured to the tilt plate 252, this tilts the substrate. The tilting of the substrate causes the connector and any connected links to rotate. Figure 7A and 7B In the illustrated embodiment, adjustment of the fixing screw allows for movement along a generally transverse direction. Figures 6B-6D The generally planar contact surface of the second axis adjustment base plate shown is illustrated in the diagram. It should also be understood that the two retaining screws can be adjusted to achieve the desired tilt of the end effector pickup surface. Figure 4A In one embodiment, the first and second adjustable joints can be adjusted individually to provide the desired positioning of the end effector pickup surface.

[0040] In addition to the ability to adjust the pickup surface of the end effector, the proposed substrate manipulator offers another significant benefit. Specifically, the proposed linkage-type substrate manipulator eliminates any gearing mechanism from the end effector side of the linkage. That is, the meshing of mating gears generates particles during movement, which can contaminate the substrate during processing. To reduce or eliminate this potential source of contamination, any movable (e.g., rotating) connection near the end effector is free of mating gears. Figure 4A and 4BAs shown, the substrate manipulator is configured to utilize a single set of gears 236a, 236b in rotary couplings 226a, 226b, which connect a first set of links 222a, 222b to a second set of links 224a, 224b via an adjustable joint. In the proposed embodiment, the only connection between the second links 224a, 224b and the third link 240 (i.e., near the end effector) is via two rotary bearings 242a, 242b. These rotary bearings 242a, 242b allow rotational movement between the distal ends of the second links 224a, 224b and the third link 240. In one embodiment, these rotary bearings comprise inner and outer rings, with silicon nitride ceramic balls contained between them. The ceramic balls have four contact points on the rings to allow perfect rotation without causing any deformation or misalignment of the shaft. This rotary bearing configuration achieves better performance related to particulate issues because the ceramic balls do not cause any metal contamination. In summary, there are no gears or other similar devices that could be sources of particulate contamination near the end effector 232. In one embodiment, there are no gear-type components within at least 100 mm of the end effector 232. In another embodiment, there are no gear-type components within at least 200 mm of the end effector. In other words, there may be no gear-type components within a distance of at least half the maximum lateral dimension of the end effector. In another embodiment, there may be no gear-type components within a distance at least equal to the maximum lateral dimension of the end effector.

[0041] While exemplary embodiments of the present disclosure are illustrated herein, it should be understood that the disclosure is not limited thereto. For example, although a substrate manipulator device having one or more adjustable terminals has been described in conjunction with various specific constructions, the scope of the disclosure is not limited to these examples. Various modifications, variations, and enhancements may be made to the systems and methods described herein without departing from the spirit and scope of the disclosure.

[0042] The subject matter of this disclosure includes all novel and non-obvious combinations and sub-combinations of the various systems, components and constructions disclosed herein, as well as their other features, functions, actions and / or characteristics, and any and all equivalents thereof.

Claims

1. A linkage substrate manipulation device, comprising: The first link extending between the proximal and distal ends; A second link extending between the proximal and distal ends; A rotary joint is disposed between the distal end of the first link and the proximal end of the second link, wherein the first link and the second link are configured to rotate about the rotary joint; Adjustable connector, the adjustable connector having: The first body connected to the rotary joint; and A second body connected to the proximal end of the second link, wherein the first body and the second body are rigidly connectable at a selected contact angle to adjust the pitch or roll of the second link about a long axis extending between the proximal and distal ends of the second link; as well as An end effector supported by the distal end of the second link. The first body includes an adjustment surface and the second body includes a contact surface, wherein the adjustment surface abuts against the contact surface when the first body and the second body are rigidly connected. The contact surface is a planar surface; and The adjustment surface includes a first planar surface and a second planar surface set at a certain angle. The first entity further includes: Extending through at least a first adjusting hole through the adjusting surface, the first adjusting hole being internally threaded; and A first fixing screw is disposed in the first adjusting hole, wherein the first fixing screw is configured to advance and retract through the first adjusting hole to selectively position the tip of the first fixing screw above or below the adjusting surface. When the first body and the second body are connected, the tip of the first fixing screw, which is pushed through the first adjustment hole and extends beyond the adjustment surface of the first body, engages the contact surface of the second body.

2. The linkage substrate operation device according to claim 1, wherein the first main body further comprises: The adjustment surface extends through at least a second adjustment hole, the second adjustment hole being internally threaded; as well as A second fixing screw is disposed in the second adjustment hole, wherein the second fixing screw is configured to advance and retract through the second adjustment hole to selectively position the tip of the second fixing screw above or below the adjustment surface.

3. The linkage substrate operation device according to claim 1, further comprising: Multiple fasteners connect the first body to the second body.

4. The linkage substrate operation device according to claim 1, wherein the first link comprises a pair of parallel first links, and the second link comprises a pair of parallel second links, wherein the rotary joint comprises a first rotary joint and a second rotary joint, and the adjustable joint comprises a first adjustable joint and a second adjustable joint.

5. The linkage substrate manipulation device according to claim 1, wherein the rotary joint includes at least a first gear for transmitting motion from the first link to the second link.

6. The linkage substrate manipulation device according to claim 5, wherein the end effector supported by the distal end of the second link is spaced at least 200 mm from any gear.

7. An adjustable connector configured for insertion into a linkage device of a substrate operating apparatus, comprising: A first body having a first end configured for attachment to one of a rotary joint and an elongated connecting rod, the first body having an adjustment surface; The second body has a first end configured for attachment to the other of the rotary joint and the elongated connecting rod, and the second body has a contact surface, wherein the adjustment surface is disposed against the contact surface when the first body and the second body are rigidly connected; as well as At least a first fixing screw is disposed in a first adjusting hole extending through the adjusting surface, wherein the first fixing screw is configured to advance and retract through the first adjusting hole to selectively position the tip of the first fixing screw above or below the adjusting surface. The contact surface is a planar surface; and the adjustment surface includes a first planar surface and a second planar surface set at a certain angle. When the first body and the second body are connected, the tip of the first fixing screw, which is pushed through the first adjustment hole and extends beyond the adjustment surface of the first body, engages the contact surface of the second body.

Images