Circuit board plugging device and plugging method
By introducing a temperature control unit into the plug-in device of the circuit board to heat the circuit board, the problem of poor through-hole filling is solved, and the quality of plug-in and product production yield is improved.
Patent Information
- Application Number
- CN202111193635.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-10-13
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2041-10-13
AI Technical Summary
In the existing circuit board production process, poor filling of the through holes leads to a reduced product reliability.
A plug-in device for a circuit board is designed, including a mounting part, a temperature control part and a plug-in part. The temperature control unit heats the hole to be filled through the first heating member, and detects the temperature by the temperature sensor. The plug hole part is filled with a scraper.
By heating the circuit board during the plug process to keep it at a preset temperature, the plug quality is improved and the plug defects, such as plug hole cavity and plug hole depressions are reduced, and the product yield is improved.
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Figure CN113905526B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board manufacturing, and in particular to a hole plugging device and a hole plugging method for a circuit board. Background Art
[0002] As electronic products are rapidly developing towards light, thin, short, small, high-density, multi-functional and microelectronic integration technology, the requirements for the integration of electronic components that constitute these electronic products are becoming higher and higher, and there are also higher requirements for the lines of printed circuit boards (PCBs).
[0003] Via plugging is an important process in the production of circuit boards. It is necessary to fill the specified via plugging material into the via holes of the circuit board in a certain way according to the requirements. In addition to being filled to form a flat surface, the via holes can also be further lined in the via holes, thereby improving the wiring density of the product.
[0004] In the existing production process, although the via hole can be plugged, there is still a situation where the reliability of the product is reduced due to poor filling of the via hole. Summary of the invention
[0005] The present invention aims to solve one of the problems existing in the prior art to at least a certain extent. To this end, the present invention proposes a circuit board plugging device that can improve the plugging quality. In addition, the present invention also proposes a circuit board plugging method.
[0006] According to the first aspect of the present invention, a hole plugging device for a circuit board comprises: a loading portion for loading the circuit board, wherein the circuit board is provided with a hole portion to be plugged; a temperature control portion having a first heating element and a temperature sensor, wherein the first heating element heats at least a part of the hole portion to be plugged, and the temperature sensor detects the temperature of the hole portion to be plugged; and a hole plugging portion having a scraper, wherein the scraper is driven back and forth relative to the circuit board to plug the hole portion to be plugged.
[0007] The plugging device for a circuit board according to the first aspect of the present invention has the following advantageous effects: since a temperature control unit for heating the hole portion to be filled of the circuit board is provided before the plugging unit, the plugging can be performed while keeping the circuit board at a preset temperature, thereby improving the plugging quality.
[0008] In some embodiments, a position detection unit is further included, and the position detection unit at least detects the position of the hole to be filled on the circuit board.
[0009] In some embodiments, the position detection unit includes a CCD detection device.
[0010] In some embodiments, the first heating element is an electric heating wire element, a light heating element or an electromagnetic heating element.
[0011] In some embodiments, the first heating element is disposed above the circuit board; the temperature control unit further includes a second heating element, which is disposed below the circuit board and heats the hole to be filled.
[0012] In some embodiments, the system further includes a first transport portion, and the loading portion is disposed on the first transport portion.
[0013] In some embodiments, the temperature control unit and the plugging unit are arranged at intervals along a conveying direction of the first conveying unit.
[0014] In some embodiments, it also includes: a first robot arm, the temperature control unit is mounted on the end of the first robot arm; and a third robot arm, the plugging unit is mounted on the end of the third robot arm.
[0015] In some embodiments, the plugging portion includes a first mounting support, and the scraper is floatingly mounted to the first mounting support.
[0016] According to the second aspect of the present invention, the method for plugging holes in a circuit board comprises: a loading step of placing the circuit board in a loading portion, wherein the circuit board is provided with a hole portion to be plugged; a heating step of heating the hole portion to be plugged to a preset temperature by a temperature control portion, wherein the temperature control portion has a first heating element and a temperature sensor, the first heating element heats the hole portion to be plugged, and the temperature sensor detects the temperature of the hole portion to be plugged; a plugging step of plugging the hole portion to be plugged by the plugging portion after the heating step, wherein the plugging portion has a scraper, and the scraper is driven back and forth relative to the circuit board to plug the hole portion to be plugged.
[0017] The circuit board plugging method according to the second aspect of the present invention has the following advantageous effects: since a heating step is added before the plugging step, the plugging can be performed while keeping the circuit board at a preset temperature, thereby improving the plugging quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a stereoscopic view from the front direction of an embodiment of the plugging device for a circuit board according to the first aspect of the present invention.
[0019] Figure 2 yes Figure 1 A three-dimensional view of a plugging device for a circuit board as seen from the rear.
[0020] Figure 3 yes Figure 1A three-dimensional view of the first transport unit and the loading unit in FIG.
[0021] Figure 4 yes Figure 1 A three-dimensional diagram of the temperature control unit and the position detection unit.
[0022] Figure 5 yes Figure 2 A three-dimensional view of the plug hole portion.
[0023] Figure 6 is a schematic diagram of one embodiment of a circuit board. DETAILED DESCRIPTION
[0024] Embodiments of the present embodiment are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present embodiment, and should not be construed as limiting the present embodiment.
[0025] In the description of this embodiment, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this embodiment.
[0026] In the description of this embodiment, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0027] In the description of this embodiment, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this embodiment based on the specific content of the technical solution.
[0028] Figure 1 , Figure 2 It is a stereoscopic view in the front and rear directions of an embodiment of a plugging hole device for a circuit board. Figure 3 It is a perspective view of the first conveying unit 112 and the placing unit 101 . Figure 4 is a perspective view of the temperature control unit 102 and the position detection unit 116. Figure 4In the figure, a first robot arm 119 and a second robot arm 125 are also shown. Figure 5 is a perspective view of the plug hole portion 103. Figure 5 In FIG. 1 , a third robot arm unit 126 is also shown. Figure 6 is a schematic diagram of the circuit board 104 .
[0029] Reference Figures 1 to 6 , and mainly refer to Figure 1 , Figure 2 According to the first embodiment, the plugging device for a circuit board (hereinafter sometimes referred to as "plugging device" for convenience of explanation) comprises: a placement portion 101, a temperature control portion 102, and a plugging portion 103. The placement portion 101 is used to place a circuit board 104, wherein the circuit board 104 is provided with a hole portion 105 to be plugged (see Figure 6 The temperature control unit 102 has a first heating element 106 and a temperature sensor 107, wherein the first heating element 106 heats at least a portion of the hole 105 to be plugged, and the temperature sensor 107 detects the temperature of the hole 105 to be plugged. The plugging unit 103 has a scraper 108, which is driven back and forth relative to the circuit board 104 to plug the hole 105 to be plugged.
[0030] According to the plugging device for a circuit board of this embodiment, since a temperature control unit 102 for heating the hole portion 105 to be filled of the circuit board 104 is provided before the plugging unit 103, the plugging can be performed while keeping the circuit board 104 at a preset temperature, thereby improving the plugging quality.
[0031] Specifically, as a method for filling the hole 105 (conducting hole) of the circuit board 104, for example, conductive paste plugging, green oil plugging, resin plugging, electroplating filling, and electroplated copper pillars can be listed. When the hole 105 is poorly filled, such as cavities, cracks, bubbles, unevenness, and depressions at the hole mouth, it may have an adverse effect on the reliability of the product. After repeated studies, the inventors found that temperature has a great influence on the filling of the hole 105 of the circuit board 104. Taking resin plugging as an example, in the previous plugging process, for example, before the resin plugging, the circuit board 104 with the hole 105 to be filled needs to be baked in an oven to, for example, greater than 50°C, and then the circuit board 104 is transported from the oven to the plugging device. Since the room temperature required in the production workshop where the plugging device is located is relatively low (for example, 20±2°C), the temperature of the circuit board 104 will gradually decrease during transportation. And because the viscosity of the ink changes rapidly when the temperature is less than 30°C. Depending on the temperature, the ink viscosity may increase from 300 dPa·s to more than 600 dPa·s.
[0032] Therefore, during the process of resin plugging, the viscosity of the ink may increase due to the low temperature of the circuit board 104 having the hole 105 to be plugged, which may lead to defects such as plugging voids or plugging depressions when filling the hole 105, thereby causing the quality of the circuit board 104 to be unqualified.
[0033] In this embodiment, before plugging the circuit board 104, the temperature sensor 107 of the temperature control unit 102 can first detect the temperature of the hole 105 to be plugged or the surrounding area of the hole 105. When the temperature is lower than the required temperature (for example, above 30°C), the first heating element 106 heats the hole 105 or the surrounding area of the hole 105 as a whole, so that the hole 105 to be plugged is at a suitable temperature before plugging (that is, the viscosity of the plugging material such as resin ink can be within a suitable range). When plugging the circuit board 104, the viscosity of the plugging material such as ink can be suppressed from increasing due to the decrease in the temperature of the circuit board 104. It is ensured that when plugging the circuit board 104, the viscosity of the plugging material is kept within a certain range (for example, in the case of resin plugging, the viscosity of the ink is less than 360dPa·s). As a result, defects such as plugging voids and plugging depressions in the hole 105 of the circuit board 104 can be prevented from occurring when plugging is performed on the circuit board 104, thereby improving the production yield of the circuit board 104.
[0034] Furthermore, compared with conventional circuit boards with an aspect ratio of less than 20, for some circuit boards with an ultra-high aspect ratio, for example, a chip test board with a thickness greater than 5.2 mm and a hole diameter less than or equal to 0.13 mm (a thickness ratio greater than 40), in the plugging process, in order to evenly plug the ink into the hole, the ink needs to be scraped 20-30 times by a scraper, and the work efficiency and yield (due to the long working time, the temperature gradually decreases) will be greatly reduced. In the plugging device for the circuit board of this embodiment, due to the provision of the above-mentioned temperature control unit 102, the temperature of the hole 105 to be plugged of the circuit board 104 can be effectively controlled, and the viscosity of the plugging material used to plug the hole 103 can be kept within a certain range (for example, in the case of resin plugging, the ink viscosity is less than 360 dPa·s), so that the production yield of the chip test board can be improved. In addition, the number of times the scraper 108 works can be reduced (for example, it can be reduced to 10 to 15 times), thereby improving the work efficiency.
[0035] The plugging device for a circuit board of this embodiment can be integrated into a device, for example. Specifically, for example, the plugging device for a circuit board of this embodiment includes a frame 109, and a base 110 is arranged on the frame 109. The base 110 is supported by a support column 111, for example, and can be adjusted in the up and down direction. Various components such as the loading part 101, the temperature control part 102, and the plugging part 103 can be installed in the base 110.
[0036] Continue to refer to Figure 3 , and auxiliary reference Figure 1 , Figure 2 In some embodiments, the plugging device may include a first transporting portion 112, and the loading portion 101 is disposed on the first transporting portion 112. Specifically, the first transporting portion 112 may select a linear transporting type transporting device such as a belt line, a single-axis manipulator, etc. In addition, the first transporting portion 112 may also select a rotating transporting device such as a turntable driven by a motor. For example, the first transporting portion 112 may include two first electric modules 113 (single-axis manipulators) driven by a motor in the front-to-back direction, and the first electric modules 113 are arranged at intervals in the left-to-right direction. The loading portion 101, for example, includes a loading plate 114 for loading the circuit board 104, and the left and right ends of the loading plate 114 are respectively mounted on the first electric module 113. A receiving groove 115 for accommodating the circuit board 104 is provided on the loading plate 114, and the receiving groove 115 can be set according to the shape of the circuit board 104. In addition, when a positioning hole (not shown) is provided on the circuit board 104, a positioning hole (not shown) for positioning the circuit board 104 may also be provided in the receiving groove 115. The middle of the receiving groove 115 may be penetrated to facilitate heating the lower surface of the circuit board 104 (described later). By providing the first transport portion 112 for transporting the carrier portion 101, the circuit board 104 can be easily transferred, so that the circuit board 104 can be switched between different processes (heating process and plugging process, etc.).
[0037] In addition, although the example of conveying the loading unit 101 by the first conveying unit 112 is described above, the present invention is not limited thereto. For example, the loading unit 101 may be directly disposed on the base 110, and correspondingly, the temperature control unit 102 and the plugging unit 103 may be driven to switch positions by, for example, a multi-axis manipulator (e.g., a three-axis manipulator), so as to heat the circuit board 104 or plug the hole 105 of the circuit board 104.
[0038] Continue to refer to Figure 4 , and auxiliary reference Figure 1, the temperature control unit 102 is arranged within the travel range covered by the first conveying unit 112. For example, when the first conveying unit 112 has a first electric module 113 driven in the front-rear direction, the temperature control unit 102 can be arranged within the travel range of the first electric module 113 in the front-rear direction.
[0039] As described above, the temperature control unit 102 includes a first heating element 106 and a temperature sensor 107. In some embodiments, the first heating element 106 is a resistance wire. The first heating element 106 can be, for example, disposed above the first conveying portion 112 (loading portion 101). As the resistance wire, for example, a commercially available resistance wire can be used. Specifically, the resistance wire as the first heating element 106 transfers heat to the position to be heated (for example, the hole 105) of the circuit board 104 due to its own heat after being powered on. While the first heating element 106 heats the circuit board 104, the temperature sensor 107 detects the temperature of the heated position of the first heating element 106. After the temperature of the heated position of the circuit board 104 reaches a preset temperature (for example, above 30°C), the first heating element 106 stops heating the circuit board 104.
[0040] In addition, the first heating element 106 may also be a light heating element or an electromagnetic heating element. As the light heating element, for example, an infrared heating tube, etc., as the electromagnetic heating element, for example, a high-frequency induction heating coil, a high-frequency induction heating tube, etc., may be selected.
[0041] The first heating element 106 may heat the entire circuit board 104 , heat the area around the hole 105 to be plugged, or heat the hole 105 itself.
[0042] The temperature sensor 107 may be, for example, an infrared temperature sensor, a thermocouple, etc. In order to reduce the influence of the first heating element 106 on the temperature sensor 107 , the temperature sensor 107 may be an infrared temperature sensor with a longer detection range.
[0043] Continue to refer to Figure 4 , and auxiliary reference Figure 1In some embodiments, in order to improve the accuracy of the heating position of the first heating element 106 and the detection accuracy of the temperature sensor 107, the plugging device may further include a position detection unit 116, which at least detects the position of the hole 105 to be plugged on the circuit board 104. Specifically, the position detection unit 116 may include a CCD detection device, for example. The CCD detection device includes a camera 117, a light source 118, etc. Before the first heating element 106 heats the circuit board 104, the CCD detection device as the position detection unit 116 first accurately determines the position of the hole 105 to be plugged. After the position of the hole 105 to be plugged is determined, the first heating element 106 is driven to the position of the hole 105 to be plugged, thereby heating the hole 105 to be plugged. By setting the position detection unit 116, the position of the hole 105 to be plugged can be accurately detected, so that the first heating element 106 can accurately heat the hole 105 to be plugged, thereby improving the heating efficiency. Furthermore, the temperature sensor 107 can also accurately detect the temperature of the heated hole portion 105, thereby improving the accuracy of detection.
[0044] In some embodiments, the plugging device may further include: a first manipulator 119, and the temperature control unit 102 is mounted at the end of the first manipulator 119. The first manipulator 119 is mounted above the carrier 101. As the first manipulator 119, as long as the first heating element 106 of the temperature control unit 102 can accurately heat the hole 105 to be plugged of the circuit board 104, and the temperature sensor 107 can accurately detect the temperature of the heated hole 105, its form is not particularly limited. For example, the first manipulator 119 can select a single-axis manipulator, a dual-axis manipulator, a three-axis manipulator, etc. In the case where the carrier 101 is placed on the first conveying unit 112 having a first electric module 113 driven in the front-to-back direction, the first manipulator 119 can select, for example, a dual-axis manipulator that can be driven in the left-right direction and the up-and-down direction. In the case where the first manipulator 119 selects a dual-axis manipulator, for example, the first manipulator 119 may include a second electric module 120 driven in the left-right direction, and the second electric module 120 is installed with a first mounting plate 121. The first mounting plate 121 is equipped with a first cylinder 122 driven in the up-down direction. The first heating element 106 is installed on the first cylinder 122 with the heat insulating element 123 in between. The first heating element 106 approaches or moves away from the circuit board 104 in the up-down direction through the first cylinder 122. In addition, the CCD detection device of the position detection unit 116 and the temperature sensor 107 of the temperature control unit 102 can be directly installed on the first mounting plate 121. Thus, the second electric module 120 of the first manipulator 119 and the first electric module 113 of the first conveying unit 112 are integrally formed into a dual-axis manipulator, which can drive the CCD detection device of the temperature control unit 102 and the position detection unit 116, and integrally cover the circuit board 104 in the front-back direction and the left-right direction. In addition, the second electric module 120 of the first manipulator part 119, the first cylinder 122, and the first electric module 113 of the first conveying part 112 as a whole constitute a three-axis manipulator, which can drive the first heating element 106 of the temperature control part 102 to accurately heat the hole part 105 to be filled of the circuit board 104.
[0045] In addition, when the placement portion 101 is directly fixed to the base 110 , the first robot 119 may be a three-axis robot, so as to cover the entire circuit board 104 along the front-to-back direction, the left-to-right direction, and the up-down direction.
[0046] In addition, in some embodiments, in order to further improve the efficiency of heating, the temperature control unit 102 may also include a second heating element 124. The first heating element 106 is arranged above the carrier portion 101 (circuit board 104). The second heating element 124 is arranged below the carrier portion 101 (circuit board 104) and heats the hole portion 105 to be filled. Like the first heating element 106, the second heating element 124 may also be a heating wire element, a light heating element or an electromagnetic heating element. Specifically, for a circuit board 104 with an ultra-high aspect ratio, such as a chip test board, since the thickness of the circuit board 104 is relatively thick and the aperture of the hole portion 105 to be filled is relatively small, heating is performed only on one side of the circuit board 104, and there may be problems of low heating efficiency and uneven heating on the other side of the circuit board 104. By arranging the second heating element 124 on the other side of the circuit board 104 (the lower side in this embodiment), since the heating efficiency of the first heating element 106 and the second heating element 124 on the circuit board 104 is roughly the same under the same heating conditions, both sides of the circuit board 104 can be effectively heated at the same time, which not only improves the heating efficiency but also evenly heats the two sides of the hole 105 to be filled.
[0047] In some embodiments, the plugging device may further include a second robot arm 125, and the second heating element 124 is mounted at the end of the second robot arm 125. The structure of the second robot arm 125 may be set with reference to the first robot arm 119, and will not be described in detail here.
[0048] Continue to refer to Figure 5 , and auxiliary reference Figure 2 , after heating the hole portion 105 to be plugged of the circuit board 104, the circuit board 104 can be plugged. Specifically, for example, in some embodiments, the temperature control unit 102 and the plugging hole portion 103 are arranged at intervals along the conveying direction of the first conveying unit 112. In the case of selecting a single-axis manipulator as the actuator of the first conveying unit 112, the temperature control unit 102 can be arranged in front of the base 110 along the front-to-back direction of the base 110. The plugging hole portion 103 can be arranged behind the base 110 along the front-to-back direction of the base 110. Therefore, after completing the heating process of the circuit board 104, the first conveying unit 112 can directly convey the carrying unit 101 carrying the circuit board 104 to the plugging hole portion 103, thereby plugging the hole portion 105 to be plugged of the circuit board 104.
[0049] As described above, the plugging portion 103 has a scraper 108, and the scraper 108 is driven back and forth relative to the circuit board 104 to plug the hole portion 105 to be plugged. Specifically, for example, in some embodiments, the plugging device may further include: a third manipulator 126, and the plugging portion 103 is mounted at the end of the third manipulator 126. As the third manipulator 126, as long as the scraper 108 of the plugging portion 103 can be driven back and forth relative to the circuit board 104, its form is not particularly limited. For example, the third manipulator 126 can select a single-axis manipulator, a double-axis manipulator, a three-axis manipulator, etc. In the case where the loading portion 101 is loaded on the first conveying portion 112 having the first electric module 113 driven in the front-back direction, the third manipulator 126 can select, for example, a double-axis manipulator that can be driven in the left-right direction and the up-down direction. In the case where the third manipulator 126 selects a double-axis manipulator, for example, the third manipulator 126 can include a third electric module 127 driven in the left-right direction. The third electric module 127 is mounted with a second mounting plate 128. A second cylinder 129 driven in the up-down direction is mounted on the second mounting plate 128. The plugging portion 103 is mounted on the second mounting plate 128. Thus, by providing a third manipulator portion 126 with a dual-axis manipulator as an actuator, it is possible to easily achieve that the scraper 108 is driven back and forth relative to the circuit board 104, thereby filling the hole portion 105 to be filled. In addition, the third manipulator portion 126 and the first conveying portion 112 constitute a three-axis manipulator as a whole, thereby enabling the scraper 108 of the plugging portion 103 to cover the circuit board 104 as a whole.
[0050] Continue to refer to Figure 5 In some embodiments, the plug hole portion 103 may include a first mounting support 130, and the scraper 108 is floatingly mounted on the first mounting support 130. Specifically, for example, the first mounting support 130 is mounted on the second cylinder 129. In order to easily install the scraper 108, the plug hole portion 103 may also include a second mounting support 131, and the scraper 108 may be mounted on the second mounting support 131 by any known method such as locking, clamping, and clamping. The second mounting support 131 is mounted to the first mounting support 130 through a connecting column 132 that can slide in the up and down direction relative to the first mounting support 130. A buffer spring 133 is sleeved on the connecting column 132, one end of the buffer spring 133 abuts the first mounting support 130, and the other end of the buffer spring 133 abuts the second mounting support 131. In this way, the scraper 108 can be floatingly mounted on the first mounting support 130.
[0051] In addition, the plugging portion 103 may include a plurality of (for example, two) scrapers 108. These scrapers 108 are respectively mounted on the second mounting brackets 131. Thus, the plugging portion 103 can scrape the circuit board 104 back and forth in the left and right directions while scraping away the excess stuffing, thereby improving the quality of stuffing.
[0052] Continue to refer to Figure 1 In addition, in order to prevent the circuit board 104 from shaking or tilting when the hole 105 to be plugged of the circuit board 104 is plugged. The plugging device of this embodiment may also include a clamping portion 134, which is used to reliably clamp the circuit board 104 in the receiving groove 115 of the carrier portion 101. The installation position of the clamping portion 134 is not particularly limited. For example, it can be installed on the rear side of the base 110 and located on the left and right sides of the plugging portion 103. The clamping portion 134 may, for example, include a clamping cylinder 135 and a clamping member 136. The clamping member 136 is connected to the clamping cylinder 135 and is driven by the clamping cylinder 135 to extend and retract in the up and down directions. In this way, the circuit board 104 can be reliably pressed, and the circuit board 104 can be prevented from shaking or tilting, thereby improving the quality of plugging.
[0053] In addition, although the above description describes an example in which the pressing part 134 is disposed on the rear side of the base 110, the present invention is not limited thereto. For example, the pressing part 134 may be directly disposed on the mounting plate 114 and directly press the circuit board 104 in the mounting part 101. In this way, the circuit board 104 can be prevented from shaking during the process of transporting the circuit board 104.
[0054] Continue to refer to Figures 1 to 6 , through the plugging devices of the above embodiments, the circuit board 104 can be plugged. Specifically, according to the plugging method of the circuit board of the second embodiment, it includes: a loading step, a heating step and a plugging step. In the loading step, the circuit board 104 is placed in the loading part 101. The circuit board 104 is provided with a hole portion 105 to be plugged. In the heating step, the hole portion 105 to be plugged is heated to a preset temperature by the temperature control part 102. Among them, the temperature control part 102 has a first heating element 106 and a temperature sensor 107, the first heating element 106 heats the hole portion 105 to be plugged, and the temperature sensor 107 detects the temperature of the hole portion 105 to be plugged. After the heating step, the plugging step is performed, and in the plugging step, the hole portion 105 to be plugged is plugged by the plugging part 103. The plugging portion 103 has a scraper 108 , and the scraper 108 is driven back and forth relative to the circuit board 104 to plug the hole 105 to be plugged.
[0055] According to the circuit board via plugging method of this embodiment, since a heating step is added before the via plugging step, the via plugging can be performed while the circuit board 104 is maintained at a preset temperature, thereby improving the via plugging quality.
[0056] In the loading step, the method for placing the circuit board 104 on the placing portion 101 is not particularly limited, and for example, the circuit board 104 may be placed by a robot or manually by an operator.
[0057] In addition, a positioning step may be added before the heating step. For example, the specific position of the hole 105 to be plugged in the circuit board 104 may be detected by the position detection unit 116 having a CCD detection device, so that the first heating element 106 can accurately heat the hole 105 to be plugged, thereby improving the heating efficiency. In addition, the temperature sensor 107 can also accurately detect the temperature of the heated hole 105, thereby improving the detection accuracy.
[0058] In the heating step, the circuit board 104 can be heated by the first heating element 106 located above the circuit board 104 and the second heating element 124 located below the circuit board 104. Thus, even if the circuit board 104 has a very high aspect ratio, such as a chip test board, both sides of the circuit board 104 can be effectively heated at the same time, which can not only improve the heating efficiency, but also achieve uniform heating of both sides of the hole 105 to be filled.
[0059] In the heating step, the preset temperature (the temperature to be reached) of the circuit board 104 can be set to, for example, 30° C. or above. Further, it can be set to, for example, 50° C.
[0060] In addition, a pressing step may be added before the plugging step. In the pressing step, for example, the circuit board 104 may be pressed by the pressing portion 134. Thus, the circuit board 104 can be reliably pressed to prevent the circuit board 104 from shaking or warping, thereby improving the quality of plugging.
[0061] According to the plugging device and plugging method of each embodiment above, it is possible to suppress the occurrence of plugging holes and plugging depressions in the hole portion 105 of the circuit board 104 when plugging the circuit board 104, thereby improving the production yield of the circuit board 104. In particular, it is possible to improve the production yield of the circuit board 104 with an ultra-high aspect ratio, such as a chip test board. Furthermore, it is also possible to reduce the number of times the scraper 108 works (for example, it can be reduced to 10 to 15 times), thereby improving the work efficiency.
[0062]
Table 1
[0063] project Before improvement After improvement Product yield 70% 95% Scraper 108 times 20-30 times 10-15 times
[0064] For example, as shown in Table 1, for a chip test board with an ultra-high aspect ratio such as the circuit board 104, the product yield can be increased to about 95% by using the above plugging device and plugging method. In addition, the number of times the scraper 108 needs to work can be reduced to 10 to 15 times.
[0065] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present implementation. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0066] Although examples of the present embodiment have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present embodiment, and the scope of the present embodiment is defined by the claims and their equivalents.
Claims
1. A plugging device for a circuit board, wherein: The circuit board (104) has a thickness-to-diameter ratio greater than 40, and is characterized by comprising: A mounting portion (101) for mounting a circuit board (104), wherein a hole portion (105) to be filled is provided on the circuit board (104); A temperature control unit (102) is configured to make the temperature of the hole portion (105) of the circuit board (104) or the surrounding area of the hole portion (105) be above 30°C, wherein the temperature control unit (102) has a first heating element (106) and a temperature sensor (107), wherein the first heating element (106) heats at least a portion of the hole portion (105) to be plugged, and the temperature sensor (107) detects the temperature of the hole portion (105) to be plugged; The plugging portion (103) has a scraper (108), and the scraper (108) is driven back and forth relative to the circuit board (104) to plug the hole portion (105) to be plugged; The first heating element (106) is arranged above the circuit board (104); The temperature control unit (102) further comprises a second heating element (124), the second heating element (124) being arranged below the circuit board (104) and heating the hole (105) to be filled.
2. The circuit board plugging device according to claim 1, characterized in that: It also includes a position detection unit (116), wherein the position detection unit (116) at least detects the position of the hole (105) to be filled on the circuit board (104).
3. The circuit board plugging device according to claim 2, characterized in that: The position detection unit (116) includes a CCD detection device.
4. The circuit board plugging device according to claim 1, characterized in that: The first heating element (106) is an electric heating wire element, a light heating element or an electromagnetic heating element.
5. The circuit board plugging device according to any one of claims 1 to 4, characterized in that: It also includes a first transport portion (112), and the loading portion (101) is arranged on the first transport portion (112).
6. The circuit board plugging device according to claim 5, characterized in that: The temperature control unit (102) and the plugging unit (103) are arranged at intervals along the conveying direction of the first conveying unit (112).
7. The circuit board plugging device according to claim 6, characterized in that: Also includes: A first robot arm (119), wherein the temperature control unit (102) is mounted at the end of the first robot arm (119); A third robot arm (126), wherein the plugging portion (103) is mounted on the end of the third robot arm (126).
8. The circuit board plugging device according to claim 1, characterized in that: The plugging portion (103) comprises a first mounting support (130), and the scraper (108) is floatingly mounted to the first mounting support (130).
9. A method for plugging a hole in a circuit board, characterized in that: include: a loading step, placing a circuit board (104) having an aspect ratio greater than 40 in a loading portion (101), wherein a hole portion (105) to be filled is provided on the circuit board (104); a heating step, heating the hole portion (105) to be filled to above 30° C. by a temperature control unit (102), wherein the temperature control unit (102) comprises a first heating element (106), a second heating element (124) and a temperature sensor (107), the first heating element (106) heats the hole portion (105) to be filled from above the circuit board (104), the second heating element (124) heats the hole portion (105) to be filled from below the circuit board (104), and the temperature sensor (107) detects the temperature of the hole portion (105) to be filled; A plugging step, after the heating step, plugging the hole portion (105) to be filled by a plugging portion (103), wherein the plugging portion (103) has a scraper (108), and the scraper (108) is driven back and forth relative to the circuit board (104) to fill the hole portion (105) to be filled.
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