Inductor component and method for manufacturing the same

Abstract

A thin inductor component is provided. A blank (BD) has a main surface and a side surface perpendicular to the main surface. An inductor wiring (20) extends in parallel with the main surface in the blank (BD). A first vertical wiring (71) extends from the inductor wiring (20) in a direction toward the main surface, and a first supporting wiring (41) extends in parallel with the main surface. The inductor wiring (20) has a wiring body (21) and a first pad (22) provided at an end of the wiring body (21). The first vertical wiring (71) and the first supporting wiring (41) are connected to the first pad (22). The first supporting wiring (41) is arranged on the opposite side of the wiring body (21) across the first pad (22). When observing from the thickness direction, when a virtual tangent D1 is drawn at the connection position between the wiring body (21) and the first solder pad (22) with respect to the central axis C1 of the wiring body (21), the first supporting wiring (41) extends from the first solder pad (22) parallel to the virtual tangent D1, and the central axis A1 of the first supporting wiring (41) and the virtual tangent D1 are located on different straight lines.

Description

Technical Field

[0001] The present disclosure relates to an inductor component and a method of manufacturing the inductor component. Background Art

[0002] In the inductor component disclosed in Patent Document 1, an insulating substrate is arranged inside a blank. Inductor wiring is stacked on both sides of the insulating substrate in the thickness direction. In addition, a protrusion protrudes from the edge of the insulating substrate. The protrusion is an integral part with the insulating substrate and is located on the same layer as the insulating substrate. The front end of the protrusion is exposed on the surface of the blank.

[0003] The inductor components are formed by cutting a mother substrate on which a plurality of inductor components are bonded. In the mother substrate state, the insulating substrates of the inductor components are connected to each other via a rod. When the mother substrate is cut, the protrusion is formed by cutting the rod.

[0004] Patent Document 1: U.S. Patent Application Publication No. 2020 / 0135374

[0005] In the technology disclosed in Patent Document 1, there is a high need for a rod body that supports and positions each inductor wiring in the state of a mother substrate, and a protrusion that ensures the bending and strength of the blank in the state of the cut inductor component. However, due to the existence of an insulating substrate that forms the rod body and the protrusion, the thickness of the inductor component increases accordingly. Therefore, it is considered to remove the insulating substrate and use the inductor wiring itself instead of the rod body and the protrusion. However, since the mechanical functions required of the rod body and the protrusion are different from the electrical functions required of the inductor wiring, it is difficult to optimize both. Summary of the invention

[0006] In order to solve the above-mentioned problems, one embodiment of the present invention is an inductor component, comprising: a body having a main surface and a side surface perpendicular to the main surface; an inductor wiring extending in parallel with the main surface in the body; a vertical wiring extending from the inductor wiring in a thickness direction toward the main surface and exposed at the main surface; and a supporting wiring extending from the inductor wiring in parallel with the main surface and with an end exposed at the side surface, the inductor wiring having a wiring main body extending linearly and a pad provided at an end of the wiring main body and connecting the vertical wiring and the supporting wiring, the supporting wiring being arranged on the opposite side of the wiring main body with the pad interposed therebetween, and when a virtual tangent is drawn to the central axis of the wiring main body at a connection position between the wiring main body and the pad when viewed from the thickness direction, the supporting wiring extends from the pad in parallel with the virtual tangent, and the central axis of the supporting wiring and the virtual tangent are located on different straight lines.

[0007] According to the above configuration, the inductor component includes the supporting wiring extending from the pad in parallel to the wiring main body. Therefore, an insulating substrate for forming the rod body and the protrusion is not required, which can contribute to the reduction in weight and thickness of the inductor component.

[0008] In addition, according to the above-mentioned structure, the wiring body that performs the electrical function and the supporting wiring that performs the mechanical function are separated with the solder pad as the boundary, and the virtual tangent of the wiring body and the central axis of the supporting wiring are located on different straight lines, so the electrical function and the mechanical function can be designed independently, which can contribute to the optimization of both parties. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is an exploded perspective view of the inductor component according to the first embodiment.

[0010] Figure 2 It is a perspective plan view of the inductor component according to the first embodiment, excluding the fifth layer.

[0011] Figure 3 It is along Figure 2 A cross-sectional view of the inductor component of line 3-3 in FIG.

[0012] Figure 4 It is along Figure 2 A cross-sectional view of a 4-4 line inductor component.

[0013] Figure 5 This is a side view showing a first side surface of the inductor component according to the first embodiment.

[0014] Figure 6 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0015] Figure 7 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0016] Figure 8 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0017] Fig. 9 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0018] Fig.10 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0019] Fig.11 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0020] Fig.12 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0021] Fig.13 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0022] Fig.14 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0023] Fig.15 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0024] Fig.16 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0025] Fig.17 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0026] Fig.18 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0027] Fig.19 It is an explanatory diagram of the method for manufacturing the inductor component according to the first embodiment.

[0028] Fig. 20 It is an exploded perspective view of the inductor component according to the second embodiment.

[0029] Fig.21 It is a perspective plan view of the inductor component according to the second embodiment.

[0030] Fig. 22 It is along Fig.21 A cross-sectional view of the inductor component of line 5-5 in FIG.

[0031] Fig.23 It is a side view showing a first side surface of the inductor component according to the second embodiment.

[0032] Fig.24 It is an explanatory diagram of the method for manufacturing the inductor component according to the second embodiment.

[0033] Fig.25 It is a perspective plan view of an inductor component according to a modified example.

[0034] Fig.26 It is a perspective plan view of an inductor component according to a modified example.

[0035] Description of Reference Numerals

[0036] 10…inductor component, 20…inductor wiring, 21…wiring body, 22…first solder pad, 23…second solder pad, 41…first supporting wiring, 42…second supporting wiring, 71…first vertical wiring, 72…second vertical wiring, 90…insulating layer, 93…first side surface, 94…second side surface, BD…blank, MF…main surface, A1…central axis of supporting wiring, C1…central axis of wiring body, D1…virtual tangent. DETAILED DESCRIPTION

[0037] Hereinafter, a first embodiment of the inductor component will be described. In addition, in some drawings, components are enlarged to facilitate understanding. The dimensional ratio of components may be different from the actual ratio or the ratio in other drawings.

[0038] like Figure 1 As shown in FIG. 1 , the inductor component 10 as a whole has a structure in which five layers are stacked in the thickness direction Td. In the following description, one side in the thickness direction Td is referred to as the upper side, and the opposite side is referred to as the lower side.

[0039] The first layer L1 includes two inductor wirings 20, a first support wiring 41 and a second support wiring 42 extending from each inductor wiring 20, an inner magnetic circuit portion 51, and an outer magnetic circuit portion 52. In the following description, when it is necessary to distinguish between the two inductor wirings 20, one inductor wiring 20 is referred to as a first inductor wiring 20R, and the other inductor wiring 20 is referred to as a second inductor wiring 20L.

[0040] The first layer L1 is a rectangle when viewed from the thickness direction Td. In addition, the direction along the long side of the rectangle is referred to as the long side direction Ld, and the direction along the short side is referred to as the short side direction Wd.

[0041] The inductor wiring 20 includes a wiring main body 21 extending linearly, and a first pad 22 and a second pad 23 provided at the end of the wiring main body 21 .

[0042] The wiring body 21 extends in the long side direction Ld of the first layer L1. The first pad 22 is connected to the first end of the wiring body 21 on the first end side of the long side direction Ld. The dimension of the first pad 22 in the short side direction Wd is larger than the dimension of the wiring body 21 in the short side direction Wd. The first pad 22 is substantially square when viewed from the thickness direction Td. In addition, the second pad 23 is connected to the second end of the wiring body 21 on the second end side of the long side direction Ld. The dimension of the second pad 23 in the short side direction Wd is larger than the dimension of the wiring body 21 in the short side direction Wd. The second pad 23 is substantially square like the first pad 22 when viewed from the thickness direction Td.

[0043] The inductor wiring 20 is made of a conductive material. In the present embodiment, the composition of the inductor wiring 20 can be such that the ratio of copper is 99 wt % or more and the ratio of sulfur is 0.1 wt % or more and 1.0 wt % or less.

[0044] In the first layer L1, the first support wiring 41 extends from the opposite side of the wiring body 21 sandwiching the first pad 22. That is, the first support wiring 41 extends from the edge of the first end side of the long side direction Ld of the first pad 22. The first support wiring 41 extends linearly parallel to the long side direction Ld. The first support wiring 41 extends to the first side surface 91 on the first end side of the long side direction Ld of the first layer L1, and is exposed on the first side surface 91. In addition, there are two first support wirings 41 corresponding to the number of inductor wirings 20, and both are exposed on the first side surface 91.

[0045] Similarly, in the first layer L1, the second support wiring 42 extends from the opposite side of the wiring body 21 sandwiching the second pad 23. That is, the second support wiring 42 extends from the edge of the second end side of the long side direction Ld of the second pad 23. The second support wiring 42 extends linearly parallel to the long side direction Ld. The second support wiring 42 extends to the second side surface 92 on the second end side of the long side direction Ld of the first layer L1, and is exposed on the second side surface 92. In addition, there are two second support wirings 42 corresponding to the number of inductor wirings 20, and both are exposed on the second side surface 92.

[0046] The material of the first support wiring 41 and the second support wiring 42 is the same conductive material as the inductor wiring 20. However, a portion of the first support wiring 41 including the exposed surface 41A exposed at the first side surface 91 is made of Cu oxide. Similarly, a portion of the second support wiring 42 including the exposed surface 42A exposed at the second side surface 92 is made of Cu oxide.

[0047] like Figure 2 As shown in FIG. 1 , when a straight line passing through the center of the short side direction Wd of the first layer L1 and extending in the long side direction Ld is set as the symmetry axis AX, the two inductor wirings 20, the first support wiring 41 extending from each inductor wiring 20, and the second support wiring 42 are arranged to be line-symmetrical with respect to the symmetry axis AX. That is, the two inductor wirings 20 exist on the same plane. In this embodiment, the first support wiring 41 extending from the first inductor wiring 20R and the second support wiring 42 extending from the first inductor wiring 20R are located on the second end side of the short side direction Wd relative to the symmetry axis AX. Furthermore, the first support wiring 41 extending from the second inductor wiring 20L and the second support wiring 42 extending from the second inductor wiring 20L are located on the first end side of the short side direction Wd relative to the symmetry axis AX.

[0048] like Figure 1 As shown, in the first layer L1, the area between the first inductor wiring 20R and the second inductor wiring 20L becomes the inner magnetic circuit portion 51. The material of the inner magnetic circuit portion 51 is a magnetic material. Specifically, the material of the inner magnetic circuit portion 51 is a resin containing metal magnetic powder. In this embodiment, the metal magnetic powder is an organic resin containing metal magnetic powder composed of an iron-silicon alloy or an amorphous alloy thereof. For the metal magnetic powder, the average particle diameter of the metal magnetic powder can be about 5 microns.

[0049] In addition, in this embodiment, the particle diameter of the metal magnetic powder refers to the longest length of a line segment drawn from edge to edge of the cross-sectional shape of the metal magnetic powder appearing on the cross-sectional shape of the inner magnetic circuit portion 51. Furthermore, the average particle diameter refers to the average of the particle diameters of the metal magnetic powder at three or more random points in the cross-sectional shape of the metal magnetic powder appearing on the cross-sectional shape of the inner magnetic circuit portion 51.

[0050] In the first layer L1, when viewed in the thickness direction Td, the region on the second end side of the first inductor wiring 20R in the short direction Wd and the region on the first end side of the second inductor wiring 20L in the short direction Wd are the outer magnetic path portion 52. The material of the outer magnetic path portion 52 is the same magnetic material as that of the inner magnetic path portion 51.

[0051] In the present embodiment, the dimension of the first layer L1 in the thickness direction Td, that is, the dimension of the inductor wiring 20 , the first support wiring 41 , and the second support wiring 42 in the thickness direction Td can be approximately 40 μm.

[0052] A second layer L2 having the same rectangular shape as the first layer L1 when viewed in the thickness direction Td is stacked on the lower surface of the first layer L1 in the thickness direction Td. The second layer L2 includes two insulating resins 61 and an insulating resin magnetic layer 53 .

[0053] The insulating resin 61 covers the inductor wiring 20, the first support wiring 41, and the second support wiring 42 from the lower side in the thickness direction Td. The insulating resin 61 has a shape that covers a range slightly wider than the outer edges of the inductor wiring 20, the first support wiring 41, and the second support wiring 42 when viewed from the thickness direction Td. As a result, the insulating resin 61 as a whole has a strip shape extending in the long side direction Ld of the second layer L2. The material of the insulating resin 61 is an insulating resin, and in this embodiment, for example, a polyimide resin can be used. The insulating resin 61 has higher insulating properties than the inductor wiring 20. Two insulating resins 61 are arranged side by side in the short side direction Wd in accordance with the number and arrangement of the inductor wirings 20.

[0054] In the second layer L2, the portion other than the two insulating resins 61 is an insulating resin magnetic layer 53. The insulating resin magnetic layer 53 is made of the same magnetic material as the inner magnetic path portion 51 and the outer magnetic path portion 52 described above.

[0055] A third layer L3 having the same rectangular shape as the second layer L2 when viewed from the thickness direction Td is stacked on the lower surface of the second layer L2 in the thickness direction Td. The third layer L3 is the first magnetic layer 54. Therefore, the first magnetic layer 54 is arranged on the lower side compared to the inductor wiring 20. The material of the first magnetic layer 54 is an organic resin containing the same metal magnetic powder as the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, and the insulating resin magnetic layer 53 described above.

[0056] On the other hand, a fourth layer L4 having the same rectangular shape as the first layer L1 when viewed in the thickness direction Td is stacked on the upper surface of the first layer L1 in the thickness direction Td. The fourth layer L4 includes two first vertical wirings 71 , two second vertical wirings 72 , and a second magnetic layer 55 .

[0057] The first vertical wiring 71 is directly connected to the upper surface of the first pad 22 in the inductor wiring 20 without interposing any other layers. That is, the first vertical wiring 71 , the first end of the wiring body 21 , and the first supporting wiring 41 are connected to the first pad 22 .

[0058] The material of the first vertical wiring 71 is the same as that of the inductor wiring 20. The first vertical wiring 71 is in the shape of a regular quadrangular prism, and the axis direction of the regular quadrangular prism coincides with the thickness direction Td.

[0059] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction Td, the size of each side of the square first vertical wiring 71 is slightly smaller than the size of each side of the square first pad 22. Therefore, the area of ​​the first pad 22 is larger than the area of ​​the first vertical wiring 71 at the connection position with the first pad 22. In addition, when viewed from the upper side in the thickness direction Td, the central axis CV1 of the first vertical wiring 71 coincides with the geometric center of the substantially square first pad 22. Two first vertical wirings 71 are provided corresponding to the number of inductor wirings 20.

[0060] like Figure 1 As shown, the second vertical wiring 72 is directly connected to the upper surface of the second pad 23 in the inductor wiring 20 without intervening other layers. That is, the second vertical wiring 72, the second end of the wiring body 21, and the second supporting wiring 42 are connected to the second pad 23.

[0061] The material of the second vertical wiring 72 is the same as that of the inductor wiring 20. The second vertical wiring 72 is in the shape of a regular quadrangular prism, and the axis direction of the regular quadrangular prism coincides with the thickness direction Td.

[0062] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction Td, the size of each side of the square second vertical wiring 72 is slightly smaller than the size of each side of the square second pad 23. Therefore, the area of ​​the second pad 23 is larger than the area of ​​the second vertical wiring 72 at the connection position with the second pad 23. In addition, when viewed from the upper side in the thickness direction Td, the central axis CV2 of the second vertical wiring 72 coincides with the geometric center of the substantially square second pad 23. Two second vertical wirings 72 are provided corresponding to the number of inductor wirings 20.

[0063] like Figure 1 As shown, in the fourth layer L4, the portion other than the two first vertical wirings 71 and the two second vertical wirings 72 becomes the second magnetic layer 55. Therefore, the second magnetic layer 55 is stacked on the upper surfaces of each inductor wiring 20 and each support wiring 41, 42. That is, each support wiring 41, 42 is in direct contact with the second magnetic layer 55. The material of the second magnetic layer 55 becomes the same magnetic material as the first magnetic layer 54 described above.

[0064] In the inductor component 10, the magnetic layer 50 is composed of the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55. The inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are connected and surround each inductor wiring 20. In this way, the magnetic layer 50 forms a closed magnetic circuit with respect to each inductor wiring 20. Therefore, each inductor wiring 20 extends inside the magnetic layer 50. In addition, although the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are shown separately, there is a case where they are integrated as the magnetic layer 50 and the boundary cannot be confirmed.

[0065] A fifth layer L5 having the same rectangular shape as the fourth layer L4 when viewed in the thickness direction Td is stacked on the upper surface of the fourth layer L4 in the thickness direction Td. The fifth layer L5 includes two first external terminals 81 , two second external terminals 82 , and an insulating layer 90 .

[0066] The first external terminal 81 is directly connected to the upper surface of the first vertical wiring 71 without passing through other layers. The first external terminal 81 is rectangular when viewed from the thickness direction Td, and is also located on the second magnetic layer 55. The long side of the rectangle of the first external terminal 81 extends parallel to the long side direction Ld of the fifth layer L5, and the short side extends parallel to the short side direction Wd of the fifth layer L5. Two first external terminals 81 are provided corresponding to the number of inductor wirings 20.

[0067] The second external terminal 82 is directly connected to the upper surface of the second vertical wiring 72 without passing through other layers. The second external terminal 82 is rectangular when viewed from the thickness direction Td. The long side of the rectangle of the second external terminal 82 extends parallel to the long side direction Ld of the fifth layer L5, and the short side extends parallel to the short side direction Wd of the fifth layer L5.

[0068] In the fifth layer L5, the portion other than the two first external terminals 81 and the two second external terminals 82 becomes the insulating layer 90. In other words, the range of the upper surface of the fourth layer L4 that is not covered by the two first external terminals 81 and the two second external terminals 82 is covered by the insulating layer 90 of the fifth layer L5. The insulating property of the insulating layer 90 is higher than that of the magnetic layer 50. In the present embodiment, the insulating layer 90 is a solder resist. The dimension of the insulating layer 90 in the thickness direction Td is smaller than the dimension of the thickness direction Td of any one of the first external terminal 81 and the second external terminal 82.

[0069] In the present embodiment, the green body BD is composed of the magnetic layer 50, the insulating resin 61, and the insulating layer 90. In the present embodiment, the dimension of the green body BD in the thickness direction Td is, for example, approximately 0.2 mm.

[0070] The surface of the base body BD on the upper side of the insulating layer 90 in the thickness direction Td is the main surface MF. Therefore, the inductor wiring 20 extends parallel to the main surface MF of the base body BD. In addition, the first vertical wiring 71 extends from the first pad 22 of the inductor wiring 20 toward the main surface MF in the thickness direction Td. The first vertical wiring 71 is exposed on the main surface MF. The second vertical wiring 72 extends from the second pad 23 of the inductor wiring 20 toward the main surface MF in the thickness direction Td. The second vertical wiring 72 is exposed on the main surface MF. In addition, as in the present embodiment, at least a portion of the surface of the first vertical wiring 71 and the second vertical wiring 72 exposed on the main surface MF may be covered by the first external terminal 81 and the second external terminal 82.

[0071] The blank BD has a first side surface 93 perpendicular to the main surface MF. In addition, the first side surface 91 of the first layer L1 is a part of the first side surface 93 of the blank BD. In addition, the blank BD has a side surface perpendicular to the main surface MF and a second side surface 94 parallel to the first side surface 93. In addition, the second side surface 92 of the first layer L1 is a part of the second side surface 94 of the blank BD. That is, the first support wiring 41 extends from the inductor wiring 20 in parallel with the main surface MF, and the end portion is exposed at the first side surface 93 of the blank BD. Similarly, the second support wiring 42 extends from the inductor wiring 20 in parallel with the main surface MF, and the end portion is exposed at the second side surface 94 of the blank BD.

[0072] Next, each wiring is described in detail.

[0073] like Figure 2 As shown, when viewed from the thickness direction Td, the central axes C1 of the two wiring bodies 21 extend in parallel to the long side direction Ld. In addition, the central axis C1 of the wiring body 21 is a line along the midpoint of the wiring body 21 in the short side direction Wd, which is a direction perpendicular to the direction in which the wiring body 21 extends. The line width of each wiring body 21, that is, the dimension in the short side direction Wd, can be 50 microns. In the following description, the distance between the central axis C1 of the wiring body 21 of the first inductor wiring 20R and the central axis C1 of the wiring body 21 of the second inductor wiring 20L in the short side direction W is referred to as the spacing between the wiring bodies 21. In the present embodiment, the spacing between the wiring bodies 21 is, for example, approximately 250 microns. In addition, the spacing between adjacent wiring bodies 21, that is, Figure 2 The distance between the first end side of the wiring body 21 of the first inductor wiring 20R in the short-side direction Wd and the second end side of the wiring body 21 of the second inductor wiring 20L in the short-side direction Wd is, for example, approximately 200 micrometers. In addition, in the present embodiment, the minimum interval between adjacent inductor wirings 20 is the interval between the first pads 22 and the interval between the second pads 23, both of which are 50 micrometers or more.

[0074] When viewed from the thickness direction Td, a virtual tangent line D1 is drawn as a tangent to the central axis C1 of the wiring body 21 at the connection position between the wiring body 21 and the first pad 22. In the present embodiment, the central axis C1 and the virtual tangent line D1 are located on the same straight line.

[0075] The central axis A1 of the first support wiring 41 extends parallel to the virtual tangent line D1. The central axis A1 of the first support wiring 41 is a line along the midpoint of the first support wiring 41 in the short-side direction Wd, which is a direction perpendicular to the direction in which the first support wiring 41 extends.

[0076] The central axis A1 of the first support wiring 41 is located outside the short side direction Wd compared to the virtual tangent line D1. That is, the first support wiring 41 extends from the first pad 22 in parallel with the virtual tangent line D1, and the central axis A1 of the first support wiring 41 and the virtual tangent line D1 are located on different straight lines. The distance between the central axis A1 of the first support wiring 41 and the virtual tangent line D1 is, for example, 15 micrometers.

[0077] When viewed from the thickness direction Td, the extension line of the center axis A1 of the first support wiring 41 passes through the center axis CV1 of the first vertical wiring 71. That is, the extension line of the center axis A1 of the first support wiring 41 passes through the geometric center of the connection surface between the first vertical wiring 71 and the first pad 22.

[0078] Similarly, when viewed from the thickness direction Td, a virtual tangent D2 is drawn as a tangent to the central axis C1 of the wiring body 21 at the connection position between the wiring body 21 and the second pad 23. In this embodiment, the central axis C1 and the virtual tangent D2 are located on the same straight line.

[0079] The central axis A2 of the second support wiring 42 extends parallel to the virtual tangent line D2. The central axis A2 of the second support wiring 42 is a line along the midpoint of the second support wiring 42 in the short-side direction Wd, which is a direction perpendicular to the direction in which the second support wiring 42 extends.

[0080] The central axis A2 of the second support wiring 42 is located outside the short side direction Wd compared to the virtual tangent line D2. That is, the second support wiring 42 extends from the second pad 23 in parallel with the virtual tangent line D2, and the central axis A2 of the second support wiring 42 and the virtual tangent line D2 are located on different straight lines. The distance between the central axis A2 of the second support wiring 42 and the virtual tangent line D2 is, for example, 15 micrometers.

[0081] Furthermore, the extension line of the central axis A2 of the second support wiring 42 passes through the central axis CV2 of the second vertical wiring 72. That is, the extension line of the central axis A2 of the second support wiring 42 passes through the center of the connection surface between the second vertical wiring 72 and the second pad 23.

[0082] The first support wiring 41 and the second support wiring 42 extending from the same inductor wiring 20 are arranged at the same position in the short side direction Wd. That is, the central axis A1 of the first support wiring 41 and the central axis A2 of the second support wiring 42 are located on the same straight line. In addition, in the present application, based on the minimum line width of the inductor wiring 20, if the deviation is within 10%, it is considered to be located on the same straight line. Specifically, the minimum line width of the inductor wiring 20 in the present embodiment can be the line width of the wiring body 21, that is, 50 microns. Therefore, "on the same straight line" in the present embodiment refers to the case where the shortest distance between the two axes is within 5 microns, and "on different straight lines" refers to the case where the shortest distance between the two axes exceeds 5 microns.

[0083] As described above, in the first layer L1, the inductor wirings 20, the first support wirings 41, and the second support wirings 42 are arranged line-symmetrically with respect to the symmetry axis AX. Figure 2 As shown, the distance Q1 from the end of the second end side in the short side direction Wd of the blank BD to the center axis A1 of the first support wiring 41 extending from the first inductor wiring 20R is the same as the distance Q1 from the end of the first end side in the short side direction Wd of the blank BD to the center axis A1 of the first support wiring 41 extending from the second inductor wiring 20L.

[0084] Similarly, the distance Q2 from the end portion on the second end side in the short-side direction Wd of the base body BD to the central axis A2 of the second support wiring 42 extending from the first inductor wiring 20R is the same as the distance Q2 from the end portion on the first end side in the short-side direction Wd of the base body BD to the central axis A2 of the second support wiring 42 extending from the second inductor wiring 20L. Furthermore, since the central axis A1 of the first support wiring 41 and the central axis A2 of the second support wiring 42 are located on the same straight line, the distance Q1 is equal to the distance Q2.

[0085] On the other hand, in the present embodiment, the distance P1 from the central axis A1 of the first support wiring 41 extending from the first inductor wiring 20R to the central axis A1 of the first support wiring 41 extending from the second inductor wiring 20L in the short-side direction Wd is greater than the distance Q1 and the distance Q2 described above. Specifically, the distance P1 is approximately twice the length of the distance Q1 and the distance Q2.

[0086] like Figure 3 as well as Figure 4 As shown in FIG. 1 , the wiring width W1 of the first support wiring 41 in the short-side direction Wd is smaller than the wiring width H1 of the wiring main body 21 in the inductor wiring 20 in the short-side direction Wd. Here, the first support wiring 41 and the wiring main body 21 of the inductor wiring 20 are provided in the same first layer L1 and have substantially the same dimensions in the thickness direction Td. Therefore, reflecting the difference in wiring width, the cross-sectional area of ​​each first support wiring 41 is smaller than the cross-sectional area of ​​each wiring main body 21. Similarly, Figure 2 as well as Figure 3 The wiring width W2 of each second support wiring 42 in the short-side direction Wd is smaller than the wiring width H1 of the wiring body 21 in the short-side direction Wd of the inductor wiring 20. Therefore, reflecting the difference in wiring width, the cross-sectional area of ​​each second support wiring 42 is smaller than the cross-sectional area of ​​each wiring body 21.

[0087] like Figure 5 As shown, the ends of the two first support wirings 41 are exposed from the first side surface 93 on the first end side of the long side direction Ld in the blank BD. The shape of the exposed surface 41A exposed on the first side surface 93 of each first support wiring 41 is a shape that is a slightly enlarged shape of the cross-sectional shape of the first support wiring 41 orthogonal to the center axis A1. As a result, the area of ​​the exposed surface 41A of the first support wiring 41 is larger than the cross-sectional area of ​​the first support wiring 41 inside the blank BD in the cross section orthogonal to the center axis A1. Similarly, Figure 1As shown, both second support wirings 42 are exposed on the second side surface 94 at the second end side in the long side direction Ld of the base body BD. The area of ​​the exposed surface 42A of the second support wiring 42 exposed on the second side surface 94 is larger than the cross-sectional area of ​​the second support wiring 42 inside the base body BD on the cross section orthogonal to the central axis A2. As a result, the contact area between the first support wiring 41 and the first side surface 93 of the base body BD is increased, and the contact area between the second support wiring 42 and the second side surface 94 of the base body BD is increased, and the close contact between the support wirings 41, 42 and the base body BD is improved. In addition, as long as the size of the cross-sectional area satisfies the above relationship, for example, the exposed surface 41A may be a shape in which one side is stretched and the other side is covered by the stretched part of the base body BD.

[0088] Next, a method for manufacturing the inductor component 10 according to the first embodiment will be described.

[0089] like Figure 6 As shown, first, a base component preparation step is performed. Specifically, a plate-shaped base component 101 is prepared. The material of the base component 101 is ceramic. The base component 101 is a quadrilateral when viewed from the thickness direction Td. The size of each side is a size that can accommodate a plurality of inductor components 10. In the following description, the direction perpendicular to the surface direction of the base component 101 is set as the thickness direction Td for description.

[0090] Next, if Figure 7 As shown, the dummy insulating layer 102 is applied to the entire upper surface of the base member 101. Next, when viewed in the thickness direction Td, the insulating resin 61 is patterned by photolithography in a range slightly wider than the range where the inductor wiring 20 is arranged.

[0091] Next, a seed layer forming step is performed to form the seed layer 103. Specifically, the copper seed layer 103 is formed on the upper surfaces of the insulating resin 61 and the dummy insulating layer 102 from the upper surface side of the base member 101 by sputtering. In the drawings, the seed layer 103 is shown with bold lines.

[0092] Next, if Figure 8As shown, a first covering process is performed to form a first covering portion 104 covering a portion of the upper surface of the seed layer 103 where the inductor wiring 20, the first support wiring 41, and the second support wiring 42 are not formed. Specifically, first, a photosensitive dry film resist is applied to the entire upper surface of the seed layer 103. Next, the entire upper surface of the dummy insulating layer 102 and the upper surface of the outer edge of the upper surface of the insulating resin 61 covered by the insulating resin 61 are exposed to be cured. Thereafter, the uncured portion of the applied dry film resist is removed by a chemical solution. Thus, the cured portion of the applied dry film resist is formed as the first covering portion 104. On the other hand, the portion of the seed layer 103 that is removed by the chemical solution in the applied dry film resist and not covered by the first covering portion 104 is exposed. The dimension of the first covering portion 104 in the thickness direction Td, that is, the thickness ratio of the first covering portion 104 Figure 3 The thickness of the inductor wiring 20 of the inductor component 10 shown is slightly larger. In addition, the photolithography in other processes described later is also the same process, so the detailed description is omitted.

[0093] Next, if Fig. 9 As shown, a wiring processing step is performed to form the inductor wiring 20, the first support wiring 41, and the second support wiring 42 by electrolytic plating on the portion of the upper surface of the insulating resin 61 that is not covered by the first covering portion 104. Specifically, electrolytic copper plating is performed to grow copper on the portion of the upper surface of the insulating resin 61 where the seed layer 103 is exposed. In this way, the inductor wiring 20, the first support wiring 41, and the second support wiring 42 are formed. Therefore, in this embodiment, the step of forming a plurality of inductor wirings 20 and the step of forming a plurality of first support wirings 41 and second support wirings 42 that connect pads of different inductor wirings are the same step. In addition, the inductor wiring 20 and the first support wiring 41 and the second support wiring 42 are formed on the same plane. In addition, in Fig. 9 In FIG. 1 , the inductor wiring 20 is shown, but the supporting wirings are not shown.

[0094] Next, if Fig.10 As shown in FIG. 1 , a second covering step of forming the second covering portion 105 is performed. The range in which the second covering portion 105 is formed is the entire upper surface of the first covering portion 104, the entire upper surface of each supporting wiring, and the range in which the first vertical wiring 71 and the second vertical wiring 72 are not formed in the upper surface of the inductor wiring 20. In this range, the second covering portion 105 is formed by photolithography in the same manner as the method for forming the first covering portion 104. In addition, the dimension of the second covering portion 105 in the thickness direction Td is the same as that of the first covering portion 104.

[0095] Next, a vertical wiring processing step is performed to form each vertical wiring 71, 72. Specifically, the first vertical wiring 71 and the second vertical wiring 72 are formed by electrolytic copper plating in the portion of the inductor wiring 20 that is not covered by the second covering portion 105. Thus, the first vertical wiring 71 and the second vertical wiring 72 are formed in the thickness direction Td perpendicular to the plane on which the plurality of inductor wirings 20, the first support wiring 41, and the second support wiring 42 are formed. In addition, in the vertical wiring processing step, the upper end of the grown copper is set to be slightly lower than the upper surface of the second covering portion 105. Specifically, the dimension of the thickness direction Td of each vertical wiring before cutting described later is set to be the same as the dimension of the thickness direction Td of each inductor wiring 20.

[0096] Next, if Fig.11 As shown in FIG. 1 , a covering portion removal step of removing the first covering portion 104 and the second covering portion 105 is performed. Specifically, the first covering portion 104 and the second covering portion 105 are wet-etched using chemicals to peel off the first covering portion 104 and the second covering portion 105. Fig.11 In FIG. 1 , the first vertical wiring 71 is shown, but the second vertical wiring is not shown.

[0097] Next, a seed layer etching step is performed to etch the seed layer 103. The seed layer 103 is etched to remove the exposed seed layer 103. In this way, each inductor wiring and each supporting wiring are formed by SAP (Semi Additive Process).

[0098] Next, if Fig.12 As shown, the second magnetic layer processing step of laminating the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, and the second magnetic layer 55 is performed. Specifically, first, the material of the magnetic layer 50, that is, the resin containing magnetic powder is applied to the upper surface side of the base member 101. At this time, the resin containing magnetic powder is applied so as to also cover the upper surface of each vertical wiring. Next, the resin containing magnetic powder is cured by stamping, and the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, and the second magnetic layer 55 are formed on the upper surface side of the base member 101.

[0099] Next, if Fig.13 As shown in the figure, the upper part of the second magnetic layer 55 is cut until the upper surface of each vertical wiring is exposed. In addition, although the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, and the second magnetic layer 55 are formed integrally, in the accompanying drawings, they are also divided into the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, and the second magnetic layer 55 for illustration.

[0100] Next, if Fig.14 As shown, an insulating layer processing step is performed. Specifically, on the upper surface of the second magnetic layer 55 and the upper surface of each vertical wiring where the external terminals are not formed, the solder resist that functions as the insulating layer 90 is patterned by photolithography. In addition, in this embodiment, the direction perpendicular to the upper surface of the insulating layer 90, that is, the main surface MF of the blank BD is the thickness direction Td.

[0101] Next, if Fig.15 Specifically, the base member 101 and the dummy insulating layer 102 are completely removed by cutting. In addition, as a result of completely cutting the dummy insulating layer 102, a part of the lower side of each insulating resin is also removed by cutting, but each inductor wiring is not removed.

[0102] Next, if Fig.16 As shown in FIG. 1 , the first magnetic layer processing step of laminating the first magnetic layer 54 is performed. Specifically, first, a resin containing magnetic powder, which is the material of the first magnetic layer 54, is applied to the lower side of the base member 101. Next, a press process is performed to harden the resin containing magnetic powder, thereby forming the first magnetic layer 54 on the lower side of the base member 101.

[0103] Next, the lower end portion of the first magnetic layer 54 is cut. For example, the lower end portion of the first magnetic layer 54 is cut so that the dimension from the upper surface of each external terminal to the lower surface of the first magnetic layer 54 becomes a desired value.

[0104] Next, if Fig.17 As shown, the terminal processing step is performed. Specifically, the first external terminal 81 and the second external terminal 82 are formed on the upper surface of the second magnetic layer 55 and the upper surface of each vertical wiring 71, 72 that is not covered by the insulating layer 90. These metal layers are formed by electroless plating of copper, nickel, and gold. In addition, there may be a catalyst layer such as palladium between copper and nickel. Thus, the first external terminal 81 and the second external terminal 82 of the three-layer structure are formed. In addition, Fig.17 In FIG. 8 , the first external terminal 81 is shown, but the second external terminal 82 is not shown.

[0105] Next, if Fig.18 As shown in FIG. 1 , a singulation process is performed. Specifically, the singulation is performed by cutting along the break lines DL. Thus, the inductor component 10 can be obtained.

[0106] In addition, in the state before cutting, for example Fig.19As shown in FIG. 1 , a plurality of inductor components are arranged side by side in the long side direction Ld and the short side direction Wd, and the respective inductor components are connected by the base body BD, the first support wiring 41, and the second support wiring 42. By cutting the first support wiring 41 and the second support wiring 42 included in the break line DL in the thickness direction Td, the cross section of the first support wiring 41 is exposed as the exposed surface 41A on the first side surface 93. The cross section of the second support wiring 42 is exposed as the exposed surface 42A on the second side surface 94. In addition, Fig.19 In the figure, the fifth layer L5 is omitted.

[0107] After the individualization process, each inductor component 10 is left in the presence of oxygen for a certain period of time, thereby causing a portion of the exposed surface 41A including the first support wiring 41 and a portion of the exposed surface 42A including the second support wiring 42 to be oxidized and become Cu oxide.

[0108] Next, the operation of the first embodiment will be described.

[0109] As described above, in the singulation process, the first support wiring 41 and the second support wiring 42 included in the break line DL are cut. When the first support wiring 41 and the second support wiring 42 are cut, shear stress is applied to the first support wiring 41 and the second support wiring 42. Due to this stress, each support wiring is deformed. Figure 5 As shown, the exposed surface 41A, which is a cross section on the first side surface 93 of the first support wiring 41, is deformed. Similarly, the exposed surface 42A, which is a cross section on the second side surface 94 of the second support wiring 42, is deformed.

[0110] Next, the effects of the first embodiment will be described.

[0111] (1-1) In the first embodiment described above, the inductor wiring 20, the first supporting wiring 41, and the second supporting wiring 42 are present in the first layer L1. In a state where a plurality of inductor components 10 are arranged in parallel, in other words, before being cut, a configuration can be adopted in which the plurality of inductor wirings are connected by the first supporting wiring 41 and the second supporting wiring 42. If the plurality of inductor wirings 20 are connected by the first supporting wiring 41 and the second supporting wiring 42, the inductor wirings 20 can be supported and positioned even without the need for an insulating substrate or the like for supporting the inductor wirings 20. Therefore, since the need for an insulating substrate or the like for supporting the inductor wirings 20 is eliminated, it can contribute to a reduction in the weight and thickness of the inductor component 10.

[0112] In addition, the center axis A1 of the first support wiring 41 and the center axis C1 of the wiring body 21 of the inductor wiring 20 are located on different straight lines. This is because the first support wiring 41 and the inductor wiring 20 have different purposes. Specifically, in a state where a plurality of inductor components 10 are arranged side by side before cutting, it is more appropriate to arrange the first support wiring 41 at equal intervals, for example, in terms of supporting and positioning the plurality of inductor wirings 20. On the other hand, the inductor wiring 20 needs to be arranged at a position where a desired inductance can be obtained in accordance with the relationship with other inductor wirings 20 and the magnetic layer 50 existing around it. That is, in the above-mentioned embodiment, the wiring body 21 having an electrical function and the first support wiring 41 having a mechanical function are separated, and the virtual tangent line D1 of the wiring body 21 and the center axis A1 of the first support wiring 41 are located on different straight lines. Therefore, when the electrical function and the mechanical function are independently designed in the inductor component 10, it can contribute to the optimization of both. This is also the same for the second support wiring 42.

[0113] In addition, in the first embodiment, the first pad 22 is provided on the first end side of the wiring body 21 in the long side direction Ld, and the second pad 23 is provided on the second end side. Each of the pads 22 and 23 is directly connected to each of the vertical wirings 71 and 72. The inductor wiring 20 connected to each of the vertical wirings 71 and 72 is arranged on the same plane in the thickness direction Td. Therefore, compared with arranging two inductor wirings 20 overlapping in the thickness direction Td, it can contribute to the thinning of the thickness direction Td of the inductor component 10. In addition, the fewer the number of inductor wirings 20 arranged in the thickness direction Td, the greater the influence of the positions of the wiring body 21 and the first support wiring 41 and the second support wiring 42. Therefore, the effects of the first support wiring 41 and the second support wiring 42 described above can be significantly obtained.

[0114] Assume that the central axis A1 of the first support wiring 41 and the virtual tangent D1 are on the same straight line, and the central axis A2 of the second support wiring 42 and the virtual tangent D1 are on the same straight line. In this state, if a torsional force is applied to the inductor component 10, the inductor wiring 20, the first support wiring 41, and the second support wiring 42 can function as the central axis of the torsional force, so that the body BD as a whole is not easy to resist the torsional force.

[0115] On the other hand, in the first embodiment, the central axis A1 of the first supporting wiring 41 and the central axis C1 of the wiring body 21 are located on different straight lines, and the central axis A2 of the second supporting wiring 42 and the central axis C1 of the wiring body 21 are also located on different straight lines. Therefore, the inductor wiring 20, the first supporting wiring 41, and the second supporting wiring 42 as a whole do not function as a central axis of torsion, and the strength against torsion can be increased.

[0116] (1-2) In the first embodiment, the first support wiring 41 is exposed on the first side surface 93. The second support wiring 42 is exposed on the second side surface 94 extending parallel to the first side surface 93. That is, these support wirings are provided on both sides of the first end side and the second end side in the long side direction Ld of the body BD. Therefore, in the inductor component 10, uniform strength in the long side direction Ld can be achieved.

[0117] (1-3) In the first embodiment, the central axis A1 of the first support wiring 41 and the central axis A2 of the second support wiring 42 are located on the same straight line. That is, the first support wiring 41 and the second support wiring 42 are arranged in the same manner in the short-side direction Wd. Therefore, it is possible to prevent the flow of magnetic flux at the first end side and the second end side in the long-side direction Ld of the blank BD from being greatly changed due to the uneven arrangement of the first support wiring 41 and the second support wiring 42.

[0118] (1-4) In the first embodiment, the cross-sectional area of ​​the first support wiring 41 is smaller than the cross-sectional area of ​​the wiring body 21. The smaller the cross-sectional area of ​​the first support wiring 41, the smaller the load applied to the inductor component 10 during cutting in the singulation process, and the less likely the inductor component 10 is to deform during cutting.

[0119] (1-5) In the first embodiment described above, if Figure 2 As shown, the pitch P1 is approximately twice the length of the distance Q1 and the distance Q2. Fig.19 As shown, before the inductor component 10 is singulated, a plurality of inductor components are arranged side by side in the long side direction Ld and the short side direction Wd, and the inductor components are connected by the base body BD and the support wirings 41 and 42. When the inductor components are connected, the intervals between the adjacent support wirings in the short side direction Wd are all the intervals P1. According to the relationship between the distances Q1 and Q2 and the interval P1 as described above, the support wirings 41 and 42 are arranged at equal intervals for the entire length of the mother substrate along the short side direction Wd of each inductor component. If the mother substrate is cut along the break line DL, the support wirings 41 and 42 are arranged at equal intervals, so the load during cutting is easily evenly distributed. Since the load is evenly distributed, the deformation of the inductor component 10 generated during cutting can be suppressed.

[0120] (1-6) In the first embodiment described above, the first vertical wiring 71 is in the shape of a regular quadrangular prism. In addition, the extension line of the central axis A1 of the first support wiring 41 passes through the geometric center of the first vertical wiring 71. In addition, the central axis CV1 of the first vertical wiring 71 passes through the center of the first vertical wiring 71 and extends linearly in the thickness direction Td. Therefore, the central axis CV1 of the first vertical wiring 71 and the central axis A1 of the first support wiring 41 exist on the same plane. Therefore, it can be expected that the strength of the inductor component 10 against the force in the direction intersecting the plane is improved. This is also the same for the second vertical wiring 72.

[0121] (1-7) In the first embodiment described above, the exposed surface 41A of the first support wiring 41 is made of Cu oxide in this embodiment. Since the exposed surface 41A is made of Cu oxide, the conductivity is low in the exposed surface 41A. Therefore, even if other electrical components are in contact with the exposed surface 41A, it is possible to suppress the flow of current through the exposed surface 41A. This is also the case for the second support wiring 42.

[0122] (1-8) In the first embodiment, the first magnetic layer 54 is stacked on the opposite side of the main surface MF than the first layer L1 in the body BD. In addition, the second magnetic layer 55 is stacked on the main surface MF side than the first layer L1 in the body BD. That is, the inductor wiring 20 is sandwiched by the magnetic layer 50. Therefore, it is easy to ensure the efficiency of obtaining the inductance of the inductor component 10.

[0123] (1-9) According to the first embodiment, the material of the magnetic layer 50 is an organic resin containing metal magnetic powder composed of Fe-based metal powder such as an iron-silicon alloy or an amorphous alloy thereof. Therefore, the efficiency of obtaining the inductance of the inductor component 10 can be improved. In addition, the DC superposition characteristics of the inductor component 10 can be improved.

[0124] (1-10) In the first embodiment, the first support wiring 41 and the second support wiring 42 are in close contact with the second magnetic layer 55, that is, the magnetic layer 50. Since the magnetic layer 50 is in close contact with the first support wiring 41 and the second support wiring 42, the volume of the magnetic layer 50 can be ensured, and the efficiency of obtaining the inductance of the inductor component 10 can be easily ensured.

[0125] (1-11) In the first embodiment described above, the wiring body 21 of the inductor wiring 20 is in a straight line shape. When the wiring body 21 is in a straight line shape, the wiring length of the wiring body 21 is shorter than that of the curved line shape. Since the wiring length is shorter, it is easy to ensure the volume of the inner magnetic circuit portion 51 and the outer magnetic circuit portion 52 arranged in the first layer L1. In addition, since the wiring body 21 is in a straight line shape, the DC resistance of the wiring body 21 is small. Therefore, the efficiency of obtaining the inductance of the inductor component 10 is not easily reduced. In addition, if the wiring body 21 is in a straight line shape, even if the wiring body 21 is arranged in parallel on the same layer as in the present embodiment, the size of the inductor component 10 is not easy to increase, and a small inductor component is easy to form.

[0126] (1-12) In the first embodiment described above, the area of ​​the first pad 22 is larger than the area of ​​the first vertical wiring 71 at the connection position with the first pad 22. Therefore, even if the position of the first vertical wiring 71 is shifted due to manufacturing errors, the entire contact surface of the first vertical wiring 71 with the first pad 22 is easy to contact the first pad 22. This is also the same for the second vertical wiring 72.

[0127] (1-13) In the first embodiment, the dimension Td of the green body BD in the thickness direction is about 0.2 mm. The smaller the dimension Td of the green body BD in the thickness direction is, the smaller the dimension of the inductor component 10 protruding from the substrate when the inductor component 10 is mounted on the substrate. Therefore, the inductor component 10 of the first embodiment can also be mounted in a position that cannot be mounted when the dimension Td in the thickness direction is large.

[0128] (1-14) If the dimension Td of the first support wiring 41 in the thickness direction is too small, it is difficult to realize the function of the first support wiring 41 to connect the inductor wirings 20 to each other and to support and position them when the multiple inductor components 10 before cutting are arranged side by side. On the other hand, if the dimension Td of the first support wiring 41 in the thickness direction is too large, the load during cutting is large. Therefore, it is preferred that the dimension Td of the first support wiring 41 in the thickness direction is more than one-tenth and less than one-third of the dimension Td of the blank BD in the thickness direction. In the above-mentioned first embodiment, the dimension Td of the first support wiring 41 in the thickness direction is approximately 40 microns, which is suitable because it is one-fifth of the dimension Td of the blank BD in the thickness direction. This is also the same for the second support wiring 42.

[0129] (1-15) In the first embodiment, the first magnetic layer 54 and the second magnetic layer 55 are organic resins containing metal magnetic powder. The metal magnetic powder is an alloy containing iron, and the average particle size of the metal magnetic powder is about 5 microns. By using magnetic powder with a particle size of 10 microns or less, it is possible to reduce iron loss while ensuring the relative magnetic permeability of the first magnetic layer 54 and the second magnetic layer 55.

[0130] (1-16) In the first embodiment, the distance in the short-side direction Wd from the central axis C1 of the wiring body 21 of the first inductor wiring 20R to the central axis C1 of the wiring body 21 of the second inductor wiring 20L is approximately 250 micrometers. This is more than twice the minimum distance between the distance from the first support wiring 41 to the end of the short-side direction Wd on the first side surface 91 and the distance from the second support wiring 42 to the end of the short-side direction Wd on the second side surface 92. As a result, the distance is relatively large, and it is easy to design the size between the wiring bodies 21 to be larger, which can improve the efficiency of obtaining the inductance value.

[0131] In the first embodiment, the minimum interval between adjacent inductor wirings 20, that is, the interval between the first pads 22 and the interval between the second pads 23, is approximately 50 micrometers or more. This is suitable in terms of ensuring insulation between the inductor wirings 20. It is more suitable if it is approximately 100 micrometers or more.

[0132] (1-17) In the first embodiment described above, the process of forming the plurality of inductor wirings 20 is the same as the process of forming the plurality of first support wirings 41 and second support wirings 42. That is, the first support wirings 41 and second support wirings 42 can be formed without adding a process. Since the number of processes does not increase, the increase in the cost of forming the inductor component 10 can be suppressed.

[0133] The second embodiment of the inductor component is described below. In addition, in some drawings, the components are enlarged to facilitate understanding. The size ratio of the components may be different from the actual ratio or the ratio in other drawings. In addition, the description of the same structure as the first embodiment may be simplified or omitted.

[0134] like Fig. 20 As shown in FIG. 1 , the inductor component 10 as a whole has a structure in which five layers are stacked in the thickness direction Td. In the following description, one side in the thickness direction Td is referred to as the upper side, and the opposite side is referred to as the lower side.

[0135] The first layer L1 includes a first inductor wiring 20R, a second inductor wiring 20L, a first support wiring 41 , a second support wiring 42 , an inner magnetic path portion 51 , and an outer magnetic path portion 52 .

[0136] The first layer L1 is a rectangle when viewed from the thickness direction Td. In addition, the direction along the long side of the rectangle is referred to as the long side direction Ld, and the direction along the short side is referred to as the short side direction Wd.

[0137] The first inductor wiring 20R includes a first wiring main body 21R, a first pad 22R provided at a first end of the first wiring main body 21R, and a second pad 23R provided at a second end of the first wiring main body 21R.

[0138] The first wiring body 21R extends linearly in the long side direction Ld of the first layer L1. The first pad 22R is connected to the first end of the first wiring body 21R on the first end side of the long side direction Ld. The size of the first pad 22R in the short side direction Wd is larger than the size of the first wiring body 21R in the short side direction Wd. The first pad 22R is substantially square when viewed from the thickness direction Td. In addition, the second pad 23R is connected to the second end of the first wiring body 21R on the second end side of the long side direction Ld. The size of the second pad 23R in the short side direction Wd is larger than the size of the first wiring body 21R in the short side direction Wd. The second pad 23R is substantially square like the first pad 22R when viewed from the thickness direction Td. In addition, the first inductor wiring 20R is arranged close to the second end side of the short side direction Wd of the first layer L1.

[0139] The second inductor wiring 20L includes a second wiring main body 21L, a first pad 22L provided at a first end of the second wiring main body 21L, and the above-described second pad 23R provided at a second end of the second wiring main body 21L.

[0140] The second wiring body 21L has two straight portions and a portion connecting these straight portions, and as a whole extends in an L-shape. Specifically, the second wiring body 21L is composed of a long straight portion 31 extending in the long side direction Ld, a short straight portion 32 extending in the short side direction Wd, and a connecting portion 33 connecting these straight portions.

[0141] like Fig.21 As shown, when a straight line passing through the center of the short side direction Wd of the first layer L1 and extending in the long side direction Ld is set as the symmetry axis AX, the long straight portion 31 is arranged at a position line-symmetrical to the first wiring body 21R with respect to the symmetry axis AX. In addition, the length of the long straight portion 31 extending in the long side direction Ld is slightly longer than the length of the first wiring body 21R extending in the long side direction Ld. In addition, the dimension of the long straight portion 31 in the short side direction Wd is equal to the dimension of the first wiring body 21R in the short side direction Wd. The first end of the long straight portion 31 on the first end side of the long side direction Ld is connected to the first pad 22R. The second end of the long straight portion 31 on the second end side of the long side direction Ld is connected to the first end of the connecting portion 33.

[0142] The second end of the connection portion 33 not connected to the long straight portion 31 faces the second end side in the short direction Wd. That is, the connection portion 33 is bent 90 degrees from the first direction in the long direction Ld toward the second end side in the short direction Wd in the second wiring body 21L.

[0143] The second end of the connection portion 33 facing the second end side in the short-side direction Wd is connected to the first end of the short straight portion 32. The dimension of the short straight portion 32 in the long-side direction Ld is equal to the dimension of the long straight portion 31 in the short-side direction Wd. The second end of the short straight portion 32 facing the second end side in the short-side direction Wd is connected to the second pad 23R connected to the first wiring body 21R. That is, the second pad 23R of the first inductor wiring 20R and the second pad 23R of the second inductor wiring 20L are the same pad.

[0144] The number of turns of the second inductor wiring 20L is determined based on a virtual vector. The starting point of the virtual vector is arranged on the central axis C2 extending in the extending arrangement direction of the second wiring body 21L through the center of the wiring width of the second wiring body 21L. In addition, for the virtual vector, when the angle of rotation of the direction of the virtual vector is 360 degrees when the starting point of the second wiring body 21L is moved from the state where the starting point is arranged at the first end to the second end of the central axis C2 when viewed from the thickness direction Td, the number of turns is determined to be 1.0 turns. However, in the case where the direction of the virtual vector is wound multiple times, the number of turns increases in the case of continuous winding in the same direction. In the case where the direction of the virtual vector is wound in a direction different from the direction of the previous winding, the number of turns is counted again from 0 turns. For example, in the case of winding 180 degrees clockwise and then winding 180 degrees counterclockwise, the number of turns is 0.5 turns. In the present embodiment, the direction of the virtual vector virtually arranged on the second wiring body 21L is rotated 90 degrees in the connection portion 33. Therefore, the number of turns of the second wiring body 21L is 0.25 turns. The center axis C2 of the second wiring body 21L is a line along the middle point of the second wiring body 21L in a direction orthogonal to the direction in which the second wiring body 21L extends. That is, the center axis C2 of the second wiring body 21L is substantially L-shaped when viewed from the thickness direction Td.

[0145] like Fig.21 As shown in FIG. 1 , a first pad 22L is connected to a first end of a first end side of a long straight portion 31 of a second wiring main body 21L in a long side direction Ld. The first pad 22L has the same shape as the first pad 22R connected to the first wiring main body 21R. That is, the first pad 22L is substantially square when viewed from the thickness direction Td. In addition, the first pad 22L is arranged to be line symmetrical with the first pad 22R connected to the first wiring main body 21R with respect to the symmetry axis AX.

[0146] In the first layer L1, the first support wiring 41 extends from the opposite side of the first wiring body 21R sandwiching the first pad 22R. That is, the first support wiring 41 extends from the edge of the first end side of the long side direction Ld of the first pad 22R. The first support wiring 41 extends linearly parallel to the long side direction Ld. The first support wiring 41 extends to the first side surface 91 of the first end side of the long side direction Ld of the first layer L1, and is exposed at the first side surface 91. Similarly, in the first layer L1, the first support wiring 41 also extends from the opposite side of the second wiring body 21L sandwiching the first pad 22L.

[0147] In the first layer L1, the second support wiring 42 extends from the opposite side of the first wiring body 21R sandwiching the second pad 23R. That is, the second support wiring 42 extends from the edge of the second end side of the long side direction Ld of the second pad 23R. The second support wiring 42 extends linearly parallel to the long side direction Ld. The second support wiring 42 extends to the second side surface 92 of the second end side of the long side direction Ld of the first layer L1, and is exposed at the second side surface 92. In addition, in the present embodiment, no support wiring is provided on the opposite side of the short straight line portion 32 of the second wiring body 21L sandwiching the second pad 23R.

[0148] The first inductor wiring 20R and the second inductor wiring 20L are made of a conductive material. In the present embodiment, the first inductor wiring 20R and the second inductor wiring 20L may have a composition of 99 wt % or more of copper and 0.1 wt % or more and 1.0 wt % or less of sulfur.

[0149] The material of the first support wiring 41 and the second support wiring 42 is the same conductive material as the first inductor wiring 20R and the second inductor wiring 20L. However, a portion of the first support wiring 41 including the exposed surface 41A exposed at the first side surface 91 is made of Cu oxide. Similarly, a portion of the second support wiring 42 including the exposed surface 42A exposed at the second side surface 92 is made of Cu oxide.

[0150] like Fig. 20 As shown, in the first layer L1, the area between the first inductor wiring 20R and the second inductor wiring 20L becomes the inner magnetic circuit portion 51. The material of the inner magnetic circuit portion 51 is an organic resin containing metal magnetic powder. In this embodiment, the metal magnetic powder is a metal magnetic powder composed of an Fe-based alloy or an amorphous alloy thereof. More specifically, the metal magnetic powder is a FeSiCr-based metal powder containing iron. In addition, the average particle size of the metal magnetic powder can be approximately 5 microns. In addition, the processing of the average particle size is the same as that of the first embodiment.

[0151] In the first layer L1, when viewed in the thickness direction Td, the region on the second end side of the first inductor wiring 20R in the short direction Wd and the region on the first end side of the second inductor wiring 20L in the short direction Wd are the outer magnetic path portion 52. The material of the outer magnetic path portion 52 is the same magnetic material as that of the inner magnetic path portion 51.

[0152] In the present embodiment, the dimension of the first layer L1 in the thickness direction Td, that is, the dimension of the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 in the thickness direction Td can be approximately 40 micrometers.

[0153] A second layer L2 having the same rectangular shape as the first layer L1 when viewed in the thickness direction Td is stacked on the lower surface of the first layer L1 in the thickness direction Td. The second layer L2 includes two insulating resins 61 and an insulating resin magnetic layer 53 .

[0154] The insulating resin 61 covers the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 from the lower side in the thickness direction Td. When viewed from the thickness direction Td, the insulating resin 61 has a shape that covers a range slightly wider than the outer edges of the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42. As a result, one insulating resin 61 has a straight strip shape. The other insulating resin 61 has a strip shape that extends roughly in an L shape. The material of the insulating resin 61 is an insulating resin, and in this embodiment, for example, a polyimide resin can be used. The insulating property of the insulating resin 61 is higher than that of the first inductor wiring 20R and the second inductor wiring 20L. Two insulating resins 61 are arranged side by side in the short side direction Wd in accordance with the number and arrangement of the first inductor wiring 20R and the second inductor wiring 20L, and are connected to each other at the end.

[0155] In the second layer L2, the portion other than the two insulating resins 61 is the insulating resin magnetic layer 53. The insulating resin magnetic layer 53 is made of the same magnetic material as the inner magnetic path portion 51 and the outer magnetic path portion 52 described above.

[0156] The third layer L3 having the same rectangular shape as the second layer L2 when viewed from the thickness direction Td is stacked on the lower surface of the second layer L2 in the thickness direction Td. The third layer L3 is the first magnetic layer 54. Therefore, the first magnetic layer 54 is arranged on the lower side compared with the first inductor wiring 20R and the second inductor wiring 20L. The material of the first magnetic layer 54 is an organic resin containing the same metal magnetic powder as the above-mentioned inner magnetic circuit portion 51, the outer magnetic circuit portion 52, and the insulating resin magnetic layer 53.

[0157] On the other hand, a fourth layer L4 having the same rectangular shape as the first layer L1 when viewed in the thickness direction Td is stacked on the upper surface of the first layer L1 in the thickness direction Td. The fourth layer L4 includes two first vertical wirings 71 , one second vertical wiring 72 , and a second magnetic layer 55 .

[0158] The first vertical wiring 71 is directly connected to the upper surfaces of the first pads 22R and 22L in the first inductor wiring 20R and the second inductor wiring 20L without passing through other layers. That is, the first vertical wiring 71, the first end of the first wiring body 21R, and the first support wiring 41 are connected to the first pad 22R. The first vertical wiring 71, the first end of the second wiring body 21L, and the first support wiring 41 are connected to the first pad 22L. The two first vertical wirings 71 are arranged at positions that are line-symmetrical with respect to the symmetry axis AX. The material of the first vertical wiring 71 is the same material as the first inductor wiring 20R and the second inductor wiring 20L. The first vertical wiring 71 is in the shape of a regular quadrangular prism, and the axial direction of the regular quadrangular prism coincides with the thickness direction Td.

[0159] like Fig.21 As shown, when viewed from the thickness direction Td, the size of each side of the square first vertical wiring 71 is slightly smaller than the size of each side of the square first pads 22R, 22L. Therefore, the area of ​​the first pads 22R, 22L is larger than the area of ​​the first vertical wiring 71 at the connection position with the first pads 22R, 22L. In addition, when viewed from the upper side of the thickness direction Td, the central axis CV1 of the first vertical wiring 71 coincides with the geometric center of the substantially square first pads 22R, 22L. Two first vertical wirings 71 are provided corresponding to the number of the first pads 22R, 22L.

[0160] like Fig. 20 As shown in FIG. 1 , the second vertical wiring 72 is directly connected to the upper surface of the second pad 23R in the first inductor wiring 20R without passing through other layers. That is, the second vertical wiring 72, the second end of the first wiring body 21R, the second end of the second wiring body 21L, and the second supporting wiring 42 are connected to the second pad 23. The material of the second vertical wiring 72 is the same as that of the first inductor wiring 20R. The second vertical wiring 72 is in the shape of a regular quadrangular prism, and the axial direction of the regular quadrangular prism coincides with the thickness direction Td.

[0161] like Fig.21As shown, when viewed from the thickness direction Td, the size of each side of the square second vertical wiring 72 is slightly smaller than the size of each side of the square second pad 23R. Therefore, the area of ​​the second pad 23R is larger than the area of ​​the second vertical wiring 72 at the connection position with the second pad 23R. In addition, when viewed from the upper side of the thickness direction Td, the central axis CV2 of the second vertical wiring 72 coincides with the geometric center of the substantially square second pad 23R. One second vertical wiring 72 is provided corresponding to the number of second pads 23R.

[0162] like Fig. 20 As shown, in the fourth layer L4, the portion other than the two first vertical wirings 71 and the one second vertical wiring 72 becomes the second magnetic layer 55. Therefore, the second magnetic layer 55 is stacked on the upper surfaces of the first inductor wiring 20R, the second inductor wiring 20L, and the support wirings 41 and 42. That is, the support wirings 41 and 42 are in direct contact with the second magnetic layer 55. The material of the second magnetic layer 55 is the same magnetic material as the first magnetic layer 54 described above.

[0163] In the inductor component 10, the magnetic layer 50 is constituted by the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55. The inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are connected and surround the first inductor wiring 20R and the second inductor wiring 20L. In this way, the magnetic layer 50 constitutes a closed magnetic circuit for the first inductor wiring 20R and the second inductor wiring 20L. Therefore, the first inductor wiring 20R and the second inductor wiring 20L extend inside the magnetic layer 50. In addition, although the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are shown separately, there is a case where they are integrated as the magnetic layer 50 and the boundary cannot be confirmed.

[0164] A fifth layer L5 having the same rectangular shape as the fourth layer L4 when viewed from the thickness direction Td is stacked on the upper surface of the fourth layer L4 in the upper side in the thickness direction Td. The fifth layer L5 includes four terminal portions 80 and an insulating layer 90. Two of the four terminal portions 80 are first external terminals 81 electrically connected to the first inductor wiring 20R or the second inductor wiring 20L via the first vertical wiring 71. In addition, one of the four terminal portions 80 is a second external terminal 82 electrically connected to the first inductor wiring 20R and the second inductor wiring 20L via the second vertical wiring 72. The remaining one of the four terminal portions 80 other than the first external terminal 81 and the second external terminal 82 is a dummy portion 83 that is not electrically connected to any of the first inductor wiring 20R and the second inductor wiring 20L.

[0165] like Fig.21 As shown, when a virtual straight line BX is drawn that passes through the center of the long side direction Ld of the fifth layer L5 and is parallel to the short side direction Wd, the point on the upper surface of the fifth layer L5 where the above-mentioned symmetry axis AX and the virtual straight line BX intersect is the geometric center G of the fifth layer L5. When viewed from the thickness direction Td, the four terminal portions 80 are arranged at positions that are secondarily symmetrical with respect to the geometric center G of the fifth layer L5.

[0166] The first external terminal 81 is directly connected to the upper surface of the first vertical wiring 71 without passing through other layers. The first external terminal 81 is rectangular when viewed from the thickness direction Td, and is also located on the second magnetic layer 55. The area where the first external terminal 81 contacts the first vertical wiring 71 is less than half of the entire area of ​​the first external terminal 81. The long side of the rectangle of the first external terminal 81 extends parallel to the long side direction Ld of the fifth layer L5, and the short side extends parallel to the short side direction Wd of the fifth layer L5. Two first external terminals 81 are provided corresponding to the number of first vertical wirings 71.

[0167] The second external terminal 82 is directly connected to the upper surface of the second vertical wiring 72 without passing through other layers. The area where the second external terminal 82 contacts the second vertical wiring 72 is less than half of the entire area of ​​the second external terminal 82. The second external terminal 82 is rectangular when viewed from the thickness direction Td, and is also located on the second magnetic layer 55. The long sides of the rectangle of the second external terminal 82 extend parallel to the long side direction Ld of the fifth layer L5, and the short sides extend parallel to the short side direction Wd of the fifth layer L5.

[0168] like Fig. 20 As shown, one of the four terminal portions 80 becomes a dummy portion 83. Fig. 22 As shown, the dummy portion 83 is disposed on the upper surface of the second magnetic layer 55 of the fourth layer L4. Fig.21 As shown, the dummy portion 83 has a shape different from the first external terminal 81 and the second external terminal 82 when viewed from the thickness direction Td. In the present embodiment, the dummy portion 83 is an ellipse when viewed from the thickness direction Td. In addition, the shape of the dummy portion 83 is not limited thereto, and for example, as long as it is a shape different from the first external terminal 81 and the second external terminal 82, it may also be a rectangle, a circle, etc. The major axis of the ellipse of the dummy portion 83 extends parallel to the long side direction Ld of the fifth layer L5, and the minor axis extends parallel to the short side direction Wd of the fifth layer L5.

[0169] When viewed from the thickness direction Td, most of the dummy portion 83 overlaps with the second inductor wiring 20L. More specifically, when viewed from the thickness direction Td, the dummy portion 83 is arranged at a position overlapping with the connection portion 33 in the second inductor wiring 20L. In addition, when viewed from the thickness direction Td, the area of ​​the dummy portion 83 is the same as the area of ​​the first external terminal 81 and the second external terminal 82. In addition, in this embodiment, "the same area" means that the manufacturing error is allowed. Therefore, if the difference between the area of ​​the dummy portion 83 and the first external terminal 81 and the second external terminal 82 is within ±10%, the area is considered to be the same.

[0170] The four terminal portions 80 are composed of a plurality of conductive layers. Specifically, they are a three-layer structure of copper, nickel, and gold. In addition, when viewed from the thickness direction Td, the second magnetic layer 55 and the first vertical wiring 71 provided on the lower side of the thickness direction Td can be seen through the first external terminal 81. The area where the first vertical wiring 71 can be seen through from the first external terminal 81 is an area less than half of the first external terminal 81 when viewed from the thickness direction Td.

[0171] Similarly, the second magnetic layer 55 and the second vertical wiring 72 provided on the lower side in the thickness direction Td may be seen through the second external terminal 82. The area where the second vertical wiring 72 can be seen through the second external terminal 82 is an area less than half of the second external terminal 82 when viewed in the thickness direction Td.

[0172] In the dummy portion 83, the second magnetic layer 55 provided on the lower side in the thickness direction Td can be seen through. On the other hand, the area of ​​the second magnetic layer 55 that can be seen through from the first external terminal 81 is an area of ​​more than half of the first external terminal 81. The area of ​​the second magnetic layer 55 that can be seen through from the second external terminal 82 is an area of ​​more than half of the second external terminal 82. That is, when viewed from the thickness direction Td, the entire dummy portion 83 and the areas of more than half of the first external terminal 81 and the second external terminal 82 are optically the same color. For the same color here, for example, when using a color difference meter, the same color is considered when the difference in the numerical values ​​representing RGB is within a specified range. In addition, the specified range is, for example, 10%.

[0173] In the fifth layer L5, the portion other than the terminal portion 80 becomes the insulating layer 90. In other words, the range of the upper surface of the fourth layer L4 that is not covered by the two first external terminals 81, the one second external terminal 82, and the one dummy portion 83 is covered by the insulating layer 90 of the fifth layer L5. The insulating property of the insulating layer 90 is higher than that of the magnetic layer 50. In the present embodiment, the insulating layer 90 is a solder resist. The dimension of the insulating layer 90 in the thickness direction Td is smaller than the dimension of the terminal portion 80 in the thickness direction Td.

[0174] In this embodiment, the green body BD is formed by the magnetic layer 50, the insulating resin 61, and the insulating layer 90. That is, the green body BD is rectangular when viewed in the thickness direction Td. In this embodiment, the dimension of the green body BD in the thickness direction Td is, for example, approximately 0.2 mm.

[0175] The surface of the base body BD on the upper side of the insulating layer 90 in the thickness direction Td is the main surface MF. Therefore, the inductor wiring 20 extends parallel to the main surface MF of the base body BD. In addition, the first vertical wiring 71 extends from the first pad 22R of the first inductor wiring 20R toward the main surface MF in the thickness direction Td. Similarly, the first vertical wiring 71 extends from the first pad 22L of the second inductor wiring 20L toward the main surface MF in the thickness direction Td. All the first vertical wirings 71 are exposed on the main surface MF.

[0176] The second vertical wiring 72 extends from the second pad 23R toward the main surface MF in the thickness direction Td. The second vertical wiring 72 is exposed on the main surface MF. The upper surface of the terminal portion 80 is exposed on the main surface MF and is located on the upper side of the thickness direction Td compared to the main surface MF. That is, the outer edge of each terminal portion 80 including the dummy portion 83 is in contact with the insulating layer 90. In addition, as in the present embodiment, there is also a case where at least a portion of the surface of the first vertical wiring 71 and the second vertical wiring 72 exposed on the main surface MF is covered by the first external terminal 81 and the second external terminal 82.

[0177] The blank BD has a first side surface 93 perpendicular to the main surface MF. In addition, the first side surface 91 of the first layer L1 is a part of the first side surface 93 of the blank BD. In addition, the blank BD has a side surface perpendicular to the main surface MF and a second side surface 94 parallel to the first side surface 93. In addition, the second side surface 92 of the first layer L1 is a part of the second side surface 94 of the blank BD. That is, the first support wiring 41 extends from the first inductor wiring 20R in parallel with the main surface MF, and the end portion is exposed at the first side surface 93 of the blank BD. Similarly, the second support wiring 42 extends from the first inductor wiring 20R in parallel with the main surface MF, and the end portion is exposed at the second side surface 94 of the blank BD.

[0178] In the present embodiment, when viewed from the thickness direction Td, the geometric center G of the fifth layer L5 coincides with the geometric center G of the main surface MF. In addition, the geometric center G of the main surface MF coincides with the geometric center G of the body BD.

[0179] like Fig.21As shown, on a virtual straight line BX passing through the geometric center G of the main surface MF and parallel to one side of the short side direction Wd of the main surface MF, the main surface MF is virtually divided into a first region and a second region. When the first end side in the long side direction Ld compared to the virtual straight line BX is set as the first region, no dummy portion 83 is provided in the first region. In addition, when the second end side in the long side direction Ld compared to the virtual straight line BX is set as the second region, the same number of dummy portions 83 as the number of second external terminals 82 provided in the second region are provided in the second region.

[0180] Next, each wiring is described in detail.

[0181] like Fig.21 As shown, the central axis C1 of the first wiring body 21R extends in the longitudinal direction Ld when viewed from the thickness direction Td. The central axis C1 of the first wiring body 21R is a line along the midpoint of the first wiring body 21R in the lateral direction Wd, which is perpendicular to the direction in which the first wiring body 21R extends.

[0182] As described above, the central axis C2 of the second wiring main body 21L of the second inductor wiring 20L extends substantially in an L shape. Here, the wiring length of the long straight portion 31 of the second wiring main body 21L is longer than the wiring length of the first wiring main body 21R. In addition, the second wiring main body 21L has a connecting portion 33 and a short straight portion 32. Therefore, the wiring length of the second wiring main body 21L is longer than the wiring length of the first wiring main body 21R. Specifically, the wiring length of the second wiring main body 21L is 1.2 times or more of the wiring length of the first wiring main body 21R.

[0183] Reflecting the above-mentioned difference in wiring length, the inductance value of the second inductor wiring 20L is 1.1 times or more the inductance value of the first inductor wiring 20R. In the present embodiment, the inductance value of the first inductor wiring 20R is, for example, approximately 2.5 nH.

[0184] The first wiring body 21R of the first inductor wiring 20R extends along one side of the outer edge in the longitudinal direction Ld of the base body BD. The first pad 22L and the second pad 23R of the second inductor wiring 20L are arranged at positions symmetrical with respect to the geometric center G of the base body BD. In the present embodiment, the first pad 22L and the second pad 23R of the second inductor wiring 20L are arranged at positions twice symmetrical with respect to the geometric center G.

[0185] The first inductor wiring 20R has a parallel portion extending parallel to the second inductor wiring 20L. Specifically, the long straight portion 31 of the first wiring main body 21R and the second wiring main body 21L corresponds to the parallel portion. The first wiring main body 21R and the long straight portion 31 are arranged side by side in the short-side direction Wd in the first layer L1. In addition, the parallel portion only needs to be substantially parallel, and manufacturing errors are allowed.

[0186] In the following description, the distance between the center axis C1 of the first wiring body 21R and the center axis C2 of the long straight portion 31 of the second wiring body 21L in the short side direction Wd of the parallel portions arranged side by side, which is perpendicular to the direction in which the parallel portions extend, is referred to as the spacing X1 between the wiring bodies. That is, the spacing between the wiring bodies is the spacing between adjacent parallel portions.

[0187] The interval between adjacent parallel portions, ie, the distance between the first end side of the short-side direction Wd of the first wiring body 21R and the second end side of the long straight portion 31 of the second wiring body 21L in the short-side direction Wd is, for example, approximately 200 micrometers.

[0188] like Fig.21 As shown, a first distance Y1 is a distance from the central axis C1 of the first wiring body 21R, which is a parallel portion located on the second end side in the short direction Wd, to the end of the base body BD closest to the first wiring body 21R, which is the second end side.

[0189] The distance from the central axis C2 of the long straight portion 31, which is a parallel portion located at the first end side in the short side direction Wd, to the end of the blank BD in the short side direction Wd closest to the long straight portion 31, which is the end side, is set as the second distance Y2. In the present embodiment, the first distance Y1 is the same size as the second distance Y2.

[0190] In the short side direction Wd, the spacing X1 between the wiring bodies is different from the first distance Y1 and the second distance Y2. Specifically, the spacing X1 between the wiring bodies can be approximately "250 microns". The first distance Y1 and the second distance Y2 can be approximately "175 microns". As such, it is preferred that the first distance Y1 and the second distance Y2 are slightly larger than half of the spacing X1.

[0191] When viewed from the thickness direction Td, a virtual tangent line D1 is drawn as a tangent to the central axis C1 of the wiring body 21R at the connection position between the wiring body 21R and the first pad 22R. In the present embodiment, the central axis C1 and the virtual tangent line D1 are located on the same straight line.

[0192] The central axis A1 of the first support wiring 41 connected to the first wiring body 21R extends parallel to the virtual tangent line D1. The central axis A1 of the first support wiring 41 is a line along the midpoint of the first support wiring 41 in the short side direction Wd, which is perpendicular to the direction in which the first support wiring 41 extends.

[0193] The center axis A1 of the first support wiring 41 is located outside the virtual tangent line D1 in the short-side direction Wd. That is, the center axis A1 of the first support wiring 41 and the virtual tangent line D1 are located on different straight lines. The distance between the center axis A1 of the first support wiring 41 and the virtual tangent line D1 is, for example, 15 micrometers.

[0194] When viewed from the thickness direction Td, the extension line of the center axis A1 of the first support wiring 41 passes through the center axis CV1 of the first vertical wiring 71. That is, the extension line of the center axis A1 of the first support wiring 41 passes through the center of the connection surface between the first vertical wiring 71 and the first pad 22R.

[0195] When viewed from the thickness direction Td, a virtual tangent line D1 is drawn as a tangent line to the center axis C2 of the second wiring main body 21L at a connection position between the second wiring main body 21L and the first pad 22L.

[0196] The central axis A1 of the first support wiring 41 connected to the second wiring body 21L extends in parallel with the virtual tangent line D1. The central axis A1 of the first support wiring 41 is located outside the virtual tangent line D1 in the short-side direction Wd. That is, the first support wiring 41 extends from the first pad 22L in parallel with the virtual tangent line D1, and the central axis A1 of the first support wiring 41 and the virtual tangent line D1 are located on different straight lines.

[0197] In addition, when viewed from the thickness direction Td, the extension line of the central axis A1 of the first support wiring 41 passes through the central axis CV1 of the first vertical wiring 71. That is, the extension line of the central axis A1 of the first support wiring 41 passes through the center of the connection surface between the first vertical wiring 71 and the first pads 22R and 22L. In addition, the first support wiring 41 connected to the first wiring body 21R and the first support wiring 41 connected to the second wiring body 21L are arranged at positions symmetrical with respect to the symmetry axis AX as a reference line.

[0198] In addition, similarly, at the position where the central axis C1 of the first wiring body 21R is connected to the second pad 23R, a virtual tangent D2 is drawn as a tangent to the central axis C1. In the present embodiment, the central axis C1 and the virtual tangent D2 are located on the same straight line. The central axis A2 of the second support wiring 42 extends parallel to the virtual tangent D2. In addition, the central axis A2 of the second support wiring 42 is a line along the middle point of the second support wiring 42 in the short side direction Wd, which is a direction orthogonal to the direction in which the second support wiring 42 extends.

[0199] The center axis A2 of the second support wiring 42 is located outside the virtual tangent line D2 in the short-side direction Wd. That is, the second support wiring 42 extends from the second pad 23R in parallel with the virtual tangent line D2, and the center axis A2 of the second support wiring 42 and the virtual tangent line D2 are located on different straight lines.

[0200] In addition, the second vertical wiring 72 is arranged on the central axis A2 of the second support wiring 42. Moreover, the extension line of the central axis A2 of the second support wiring 42 passes through the central axis CV2 of the second vertical wiring 72. That is, the extension line of the central axis A2 of the second support wiring 42 passes through the center of the connection surface between the second vertical wiring 72 and the second pad 23R.

[0201] The first support wiring 41 and the second support wiring 42 extending from the first inductor wiring 20R are arranged at the same position in the short-side direction Wd. That is, the central axis A1 of the first support wiring 41 and the central axis A2 of the second support wiring 42 are located on the same straight line. In addition, as in the first embodiment, based on the minimum line width of the first inductor wiring 20R and the second inductor wiring 20L, if the deviation is within 10%, it is considered to be located on the same straight line. Specifically, the minimum line width of the inductor wiring 20 in this embodiment can be the line width of the first wiring body 21R and the second wiring body 21L, that is, 50 microns. Therefore, "on the same straight line" in this embodiment refers to the case where the shortest distance between the two axes is within 5 microns, and "on different straight lines" refers to the case where the shortest distance between the two axes exceeds 5 microns.

[0202] As described above, in the first layer L1, the first supporting wirings 41 are arranged to be line-symmetrical with respect to the symmetry axis AX. Fig.21 As shown, the distance Q1 from the end of the second end side in the short side direction Wd of the blank BD to the center axis A1 of the first support wiring 41 extending from the first inductor wiring 20R is the same as the distance Q2 from the end of the first end side in the short side direction Wd of the blank BD to the center axis A1 of the first support wiring 41 extending from the second inductor wiring 20L.

[0203] On the other hand, in the short-side direction Wd, the distance P1 from the central axis A1 of the first support wiring 41 extending from the first inductor wiring 20R to the central axis A1 of the first support wiring 41 extending from the second inductor wiring 20L is greater than the distance Q1 and the distance Q2 described above. Specifically, the distance P1 is approximately twice the length of the distance Q1 and the distance Q2.

[0204] In the present embodiment, the cross-sectional area of ​​the first wiring body 21R and the cross-sectional area of ​​the second wiring body 21L in the cross section perpendicular to the central axis C1 of the first wiring body 21R are equal. In addition, in the present application, if the difference between the cross-sectional areas of the first wiring body 21R and the second wiring body 21L is within 10% of the cross-sectional area of ​​each wiring body 21R, 21L, the cross-sectional areas are considered to be equal.

[0205] In addition, the cross-sectional area of ​​the first support wiring 41 in the cross section perpendicular to the central axis A1 of the first support wiring 41 is smaller than the cross-sectional areas of the first wiring body 21R and the second wiring body 21L described above. The cross-sectional area of ​​the second support wiring 42 in the cross section perpendicular to the central axis A2 of the second support wiring 42 is also smaller than the cross-sectional areas of the first wiring body 21R and the second wiring body 21L described above.

[0206] like Fig.23 As shown, the ends of the two first support wirings 41 are exposed from the first side surface 93 on the first end side in the long side direction Ld of the blank BD. The shape of the exposed surface 41A exposed on the first side surface 93 of each first support wiring 41 is a shape in which the cross-sectional shape of the first support wiring 41 orthogonal to the central axis A1 is slightly stretched in the short side direction Wd. As a result, the area of ​​the exposed surface 41A of the first support wiring 41 is larger than the cross-sectional area of ​​the first support wiring 41 inside the blank BD in the cross section orthogonal to the central axis A1. Similarly, Fig. 20 As shown, the area of ​​the exposed surface 42A of the second supporting wiring 42 exposed on the second side surface 94 is larger than the cross-sectional area of ​​the second supporting wiring 42 inside the base body BD on the cross section perpendicular to the central axis A2. As a result, the contact area of ​​the first supporting wiring 41 and the second supporting wiring 42 with the first side surface 93 and the second side surface 94 of the base body BD is increased, and the close contact between them is improved. In addition, as long as the size of the cross-sectional area satisfies the above relationship, for example, the exposed surface 41A may be a shape in which one side is stretched and the other side is covered by the stretched part of the base body BD.

[0207] Furthermore, two first support wirings 41 are exposed on the first side surface 93 , and one second support wiring 42 is exposed on the second side surface 94 , and the number of exposed support wirings is different.

[0208] A method for manufacturing the inductor component 10 according to the second embodiment will be described. In addition, the method for manufacturing the inductor component 10 according to the second embodiment will be described below in terms of differences from the method for manufacturing the inductor component 10 according to the first embodiment described above.

[0209] In the insulating layer processing step in the second embodiment, the solder resist that functions as the insulating layer 90 is patterned by photolithography on the upper surface of the second magnetic layer 55 and the upper surface of each vertical wiring 71, 72 where the terminal portion 80 is not formed. In addition, in the present embodiment, the direction orthogonal to the upper surface of the insulating layer 90, that is, the main surface MF of the blank BD is the thickness direction Td.

[0210] In the terminal processing step in the second embodiment, the first external terminal 81, the second external terminal 82, and the dummy portion 83 are formed on the upper surface of the second magnetic layer 55 and the upper surface of each vertical wiring 71, 72 that is not covered by the insulating layer 90. These metal layers are formed by electroless plating copper, nickel, and gold, respectively. In addition, a catalyst layer such as palladium may be provided between copper and nickel. Thus, the first external terminal 81, the second external terminal 82, and the dummy portion 83 of the three-layer structure are formed.

[0211] In the singulation process of the second embodiment, as Fig.24 As shown in FIG. 1 , the inductor component 10 is obtained by cutting along the break lines DL to separate the pieces.

[0212] In the state before cutting, for example Fig.24 As shown, a plurality of inductor components are arranged side by side in the long side direction Ld and the short side direction Wd, and the respective inductor components are connected at the base body BD, the first support wiring 41, and the second support wiring 42. Specifically, the first support wirings 41 are connected to each other via the first support wiring 41, and the second support wirings 42 are connected to each other via the second support wiring 42. By cutting the first support wiring 41 and the second support wiring 42 included in the break line DL in the thickness direction Td, the cross section of the first support wiring 41 is exposed as the exposed surface 41A at the first side surface 93. In addition, the cross section of the second support wiring 42 is exposed as the exposed surface 42A at the second side surface 94.

[0213] Next, the effects of the second embodiment will be described. The inductor component 10 of the second embodiment has the following effects in addition to the effects (1-1) to (1-4), (1-6) to (1-10), and (1-12) to (1-17) of the first embodiment.

[0214] (2-1) In the second embodiment, two supporting wirings are exposed on the first side surface 93 of the inductor component 10, and one supporting wiring is exposed on the second side surface 94. That is, the number of supporting wirings exposed on the second side surface 94 is small. Since the number of supporting wirings is small, the load applied to the inductor component 10 during cutting can be reduced.

[0215] (2-2) In the above embodiment, the wiring length of the first wiring body 21R is different from the wiring length of the second wiring body 21L. Therefore, it is possible to switch to different inductance values ​​depending on whether the current flows through the first pad 22R or the first pad 22L.

[0216] (2-3) In the second embodiment described above, the dummy portion 83 is provided in the fifth layer L5. When viewed from the thickness direction Td, the area of ​​the dummy portion 83 is equal to that of the first external terminal 81 and the second external terminal 82. Therefore, when the dummy portion 83 is soldered to a substrate or the like in the same manner as the first external terminal 81 and the second external terminal 82, the amount of solder applied to the four terminal portions 80 can be made uniform. Therefore, it is possible to prevent the inductor component 10 from being mounted on a substrate or the like at an angle.

[0217] The first embodiment and the second embodiment can be implemented with modifications as follows. The first embodiment, the second embodiment, and the following modifications can be implemented in combination with each other within a range that does not technically contradict each other.

[0218] The number of inductor wirings inside the body BD may be one. Alternatively, three or more inductor wirings may be provided. Alternatively, the number of supporting wirings exposed on the first side surface 93 and the second side surface 94 may be three or more depending on the number of inductor wirings.

[0219] exist Fig.25 In the example shown, in addition to the first inductor wiring 20R and the second inductor wiring 20L, a third inductor wiring 20X and a fourth inductor wiring 20Y are provided. The third wiring body 21X of the third inductor wiring 20X extends in parallel with the first wiring body 21R of the first inductor wiring 20R. The third wiring body 21X is arranged between the long straight line portion 31 of the first wiring body 21R and the second wiring body 21L. The first end of the third wiring body 21X is connected to the short straight line portion 32 of the second wiring body 21L. That is, the third inductor wiring 20X and the second inductor wiring 20L share a part of the wiring. The first pad 22X is connected to the second end of the third wiring body 21X.

[0220] The fourth wiring body 21Y of the fourth inductor wiring 20Y extends in parallel with the first wiring body 21R of the first inductor wiring 20R. The fourth wiring body 21Y is arranged between the first wiring body 21R and the third wiring body 21X. The first end of the fourth wiring body 21Y is connected to the short straight line portion 32 of the second wiring body 21L. That is, the fourth inductor wiring 20Y and the second inductor wiring 20L share a portion of the wiring. The first pad 22Y is connected to the second end of the fourth wiring body 21Y.

[0221] According to the configuration of this modification example, a desired inductance value can be obtained from four different inductance values ​​by switching which of the first pad 22R, the first pad 22L, the first pad 22X, and the first pad 22Y the current flows through.

[0222] The shape of the inductor wiring is not limited to the examples in the above-mentioned embodiments. For example, the wiring body of the inductor wiring may also be spiral. Fig.26 In the example shown, when viewed from the thickness direction Td, the wiring body 201 of the inductor wiring 200 extends clockwise from the radial outer side to the radial inner side. In this example, the number of turns of the wiring body 201 is 1.25. A first pad 202 is connected to a first end of the wiring body 201. A second pad 203 is connected to a second end of the wiring body 201. The first pad 202 and the second pad 203 are circular when viewed from the thickness direction Td. An external terminal is connected to the first pad 202 via a first vertical wiring 271. An external terminal is connected to the second pad 203 via a second vertical wiring 272. In addition, Fig.26 The external terminals are omitted in the illustration.

[0223] The support wiring 240 extends from the opposite side of the wiring body 201 sandwiching the first pad 202. When a virtual tangent D10 is drawn at the connection position with the first pad 202 with respect to the center axis C10 of the wiring body 201, the center axis A10 of the support wiring 240 is parallel to the virtual tangent D10. In addition, the center axis A10 of the support wiring 240 is located outside the radial direction of the wiring body 201 compared with the virtual tangent D10. That is, the center axis A10 of the support wiring 240 and the virtual tangent D10 are located on different straight lines.

[0224] In the above-mentioned embodiments, the central axis A1 of the first support wiring 41 and the central axis A2 of the second support wiring 42 may be located on different straight lines. The arrangement of each support wiring can be appropriately changed according to the shapes of the first pad 22 and the second pad 23 .

[0225] Depending on the cutting method and the post-cutting treatment, the area of ​​the exposed surface 41A of the first support wiring 41 may be equal to the cross-sectional area of ​​the first support wiring 41 inside the blank BD. For example, if the first side surface 91 including the exposed surface 41A is polished after cutting, the shape of the exposed surface 41A is the same as the cross-sectional shape of the first support wiring 41 inside the blank BD, so the cross-sectional areas of the two are also the same. This is also the case for the second support wiring 42.

[0226] In the above embodiments, the average particle size of the metal magnetic powder contained in the magnetic layer 50 is not limited to the examples in the above embodiments. However, in order to ensure the relative magnetic permeability, the average particle size of the metal magnetic powder is preferably 1 micrometer or more and 10 micrometers or less.

[0227] In each of the above-mentioned embodiments, the second supporting wiring 42 may be omitted. In this case, no exposed supporting wiring exists on the second side surface 94 .

[0228] In the first embodiment, the wiring width W1 of the first support wiring 41 in the short-side direction Wd may be the same as the wiring width H1 of the wiring body 21 in the short-side direction Wd of the inductor wiring 20. In this case, the cross-sectional area of ​​the first support wiring 41 is substantially the same as the cross-sectional area of ​​each wiring body 21. In addition, the wiring width W1 may be larger than the wiring width H1. This also applies to the second support wiring 42.

[0229] In each of the above-mentioned embodiments, the metal magnetic powder contained in the first magnetic layer 54 and the second magnetic layer 55 may not be the metal magnetic powder containing Fe, but may be, for example, the metal magnetic powder containing Ni or Cr.

[0230] In the above-mentioned embodiments, the minimum distance between adjacent inductor wirings may be between wiring bodies 21 instead of between pads. However, from the viewpoint of insulation between inductor wirings 20, the minimum distance is preferably 50 microns or more, and more preferably about 100 microns or more.

[0231] In the above-mentioned embodiments, the material of the part including the exposed surface 41A of the first support wiring 41 and the part including the exposed surface 42A of the second support wiring 42 may not be Cu oxide. When a Cu alloy is used as the first support wiring 41 and the second support wiring 42, it is preferable to use a Cu alloy oxide as the material including the part of each exposed surface. In addition, an insulating layer made of resin may be laminated on the exposed surface 41A of the first support wiring 41 and the exposed surface 42A of the second support wiring 42.

[0232] In each of the above-described embodiments, the material constituting the first support wiring 41 and the second support wiring 42 may be directly exposed on each exposed surface 41A.

[0233] In the above-mentioned embodiments, the dimension Td of the green body BD in the thickness direction is not limited to the examples in the above-mentioned embodiments. However, as described above, the smaller the dimension Td of the green body BD in the thickness direction is, the smaller the dimension protruding from the substrate is when the inductor component 10 is mounted on the substrate. Specifically, it can be 0.25 mm or less.

[0234] In the above embodiments, the dimension of the first layer L1, ie, the inductor wiring 20 in the thickness direction Td is not limited to the above embodiments. However, as described above, it is preferably not less than one tenth and not more than one third of the dimension of the thickness direction Td of the body BD.

[0235] In the above-mentioned embodiments, the pitch P1 from the central axis A1 of the first support wiring 41 extending from the first inductor wiring 20R to the central axis A1 of the first support wiring 41 extending from the second inductor wiring 20L is not limited to the examples in the above-mentioned embodiments. For example, the pitch P1, the distance Q1, and the distance Q2 may be arranged to be equal. In addition, the distance Q1 and the distance Q2 may be different.

[0236] In the above embodiments, the composition of the first inductor wiring 20R and the second inductor wiring 20L is not limited to the above embodiments. For example, silver or gold may be used. In addition, the composition of the first support wiring 41 and the second support wiring 42 is also not limited to the above embodiments.

[0237] In the above-mentioned embodiments, the composition of the magnetic layer 50 is not limited to the examples in the above-mentioned embodiments. For example, the material of the magnetic layer 50 may be ferrite powder or a mixture of ferrite powder and metal magnetic powder.

[0238] In each of the above-described embodiments, another layer may be interposed between each of the support wirings 41 and 42 and the magnetic layer 50 . For example, an insulating layer may be interposed between each of the support wirings 41 and 42 and the magnetic layer 50 .

[0239] In each of the above-mentioned embodiments, the first inductor wiring 20R and the second inductor wiring 20L may be arranged at different positions in the thickness direction Td in the body BD. That is, when viewed in the thickness direction Td, the first inductor wiring 20R and the second inductor wiring 20L are arranged at overlapping positions, and the first inductor wiring 20R and the second inductor wiring 20L may be connected to the same first vertical wiring 71 and the same second vertical wiring 72.

[0240] In the first embodiment, the inductor wiring 20 may not be in a straight line shape. A connection portion may be provided in order to obtain an appropriate inductance value when used. In addition, a plurality of connection portions may be provided in the inductor wiring 20. In the second embodiment, the first inductor wiring 20R may not be in a straight line shape, and a plurality of connection portions may be provided in the second inductor wiring 20L.

[0241] In the above-described embodiments, the extension line of the central axis A1 of the first support wiring 41 and the extension line of the central axis A2 of the second support wiring 42 may not pass through the center of the connection surface between the vertical wirings 71 and 72 and the pads 22 and 23 .

[0242] In each of the above embodiments, when viewed from the thickness direction Td, the areas of the first pads 22R, 22L and the second pad 23R may be equal to the areas of the first vertical wiring 71 and the second vertical wiring 72. In addition, the length dimensions of the first pads 22R, 22L and the second pad 23R in the direction orthogonal to the extending direction of the wiring body may be the same as the wiring body.

[0243] In the above-mentioned embodiments, the first external terminal 81 and the second external terminal 82 may be omitted. If the first vertical wiring 71 and the second vertical wiring 72 are exposed on the main surface MF, current can flow directly from the first vertical wiring 71 and the second vertical wiring 72 to the inductor wiring 20. In this case, the portion of the first vertical wiring 71 exposed on the main surface MF and the portion of the second vertical wiring 72 exposed on the main surface MF function as external terminals.

[0244] In each of the above-mentioned embodiments, the outer surfaces of the first external terminal 81 and the second external terminal 82 may be covered with an insulating layer. In this case, when the inductor component 10 is stored before being mounted on a substrate or the like, it is possible to suppress the current from unintentionally flowing into the inside of the inductor component 10 via the external terminals. In addition, in the case of this modification, before mounting the inductor component 10 on a substrate or the like, the insulating layer covering the first external terminal 81 and the second external terminal 82 may be removed by cleaning or the like.

[0245] In the second embodiment, the dummy portion 83 may not have the same laminated structure as the first external terminal 81 and the second external terminal 82. For example, the dummy portion 83 may not be a conductive material. In addition, for example, the dummy portion 83 may be a portion of the second magnetic layer 55 exposed in the insulating layer 90.

[0246] In the second embodiment, the area of ​​the dummy portion 83 when viewed in the thickness direction Td may be different from the areas of the first external terminal 81 and the second external terminal 82 .

[0247] In the second embodiment, the dummy portion 83 may not be provided.

[0248] In the second embodiment, a dummy portion may be provided in the first region. In addition, the virtual straight line BX may be drawn parallel to the longitudinal direction Ld.

[0249] In the above embodiment, the manufacturing method of the inductor component 10 is not limited to the example of the above embodiment. For example, in the first embodiment and the second embodiment, the process of forming the inductor wiring 20 and the process of forming the first support wiring 41 and the second support wiring may be different processes. For example, after the inductor wiring 20 is formed, each support wiring 41 and 42 may be formed using a material different from that of the inductor wiring 20.

Claims

1. An inductor component, comprising: A blank having a main surface and a side surface perpendicular to the main surface; an inductor wiring extending in parallel with the main surface in the body; a vertical wiring extending from the inductor wiring in a thickness direction toward the main surface and exposed on the main surface; and a supporting wiring extending from the inductor wiring in parallel with the main surface and having an end exposed at the side surface, The inductor wiring includes a wiring main body extending linearly, and a pad provided at an end of the wiring main body and connected to the vertical wiring and the support wiring. The supporting wiring is arranged on the opposite side of the wiring main body via the pad. When viewed from the thickness direction, a virtual tangent line is drawn at a connection position between the wiring main body and the pad with respect to the central axis of the wiring main body. The support wiring extends from the pad in parallel with the virtual tangent line. The central axis of the supporting wiring and the virtual tangent line are located on different straight lines.

2. The inductor component according to claim 1, wherein The side surface includes a first side surface and a second side surface which are parallel to each other. A first pad serving as the pad is provided at a first end of the wiring body. A second pad serving as the pad is provided at the second end of the wiring body. A first support wiring as the support wiring extends from the first pad. A second support wiring as the support wiring extends from the second pad. The first supporting wiring is exposed on the first side surface. The second supporting wiring is exposed on the second side surface.

3. The inductor component according to claim 2, wherein: When viewed in the thickness direction, a central axis of the first supporting wiring and a central axis of the second supporting wiring are located on the same straight line.

4. The inductor component according to any one of claims 1 to 3, wherein: A cross-sectional area of ​​the support wiring in a cross section perpendicular to a central axis of the support wiring is smaller than a cross-sectional area of ​​the wiring main body in a cross section perpendicular to a central axis of the wiring main body.

5. The inductor component according to any one of claims 1 to 3, wherein: An area of ​​an exposed surface of the support wiring exposed at the side surface is larger than a cross-sectional area of ​​the support wiring located in the body as a cross section perpendicular to a central axis of the support wiring.

6. The inductor component according to any one of claims 1 to 3, wherein: There are a plurality of the inductor wirings on the same plane, and there are a plurality of the support wirings corresponding to each other. The plurality of supporting wirings are exposed on a first side surface among the side surfaces of the blank. When a direction along the first side surface and perpendicular to the thickness direction is defined as a first direction, A minimum pitch among pitches between adjacent supporting wirings in the first direction is greater than or equal to a minimum distance from the supporting wiring to an end portion in the first direction on the first side surface.

7. The inductor component according to any one of claims 1 to 3, wherein: When viewed in the thickness direction, an extension line of a central axis of the support wiring passes through a center of a connection surface between the vertical wiring and the pad.

8. The inductor component according to any one of claims 1 to 3, wherein: A portion of the exposed surface of the supporting wiring included in the base body is Cu oxide or Cu alloy oxide.

9. The inductor component according to any one of claims 1 to 3, wherein: The side surface includes a first side surface and a second side surface which are parallel to each other. There are a plurality of the inductor wirings on the same plane, and there are a plurality of the support wirings corresponding to each other. The plurality of supporting wirings are exposed on either the first side surface or the second side surface. The number of the plurality of supporting wirings exposed on the first side surface is different from the number of supporting wirings exposed on the second side surface.

10. The inductor component according to any one of claims 1 to 3, wherein: In the body, a first magnetic layer is stacked on a side opposite to the main surface relative to the inductor wiring. In the element, a second magnetic layer is stacked on the main surface side relative to the inductor wiring.

11. The inductor component according to claim 10, wherein The first magnetic layer and the second magnetic layer are made of an organic resin containing metal magnetic powder.

12. The inductor component according to claim 11, wherein The metal magnetic powder contained in the first magnetic layer and the second magnetic layer is Fe-based metal powder, and an average particle size of the metal magnetic powder is not less than 1 micrometer and not more than 10 micrometers.

13. The inductor component according to any one of claims 1 to 3, wherein: The above-mentioned green body has a magnetic layer, The supporting wiring is in direct contact with the magnetic layer.

14. The inductor component according to any one of claims 1 to 3, wherein: A first pad as the pad is provided at a first end of the wiring main body, and a second pad as the pad is provided at a second end of the wiring main body. A first vertical wiring as the vertical wiring is directly connected from the first pad. A second vertical wiring serving as the vertical wiring is directly connected from the second pad.

15. The inductor component according to any one of claims 1 to 3, wherein: The wiring main body extends linearly.

16. The inductor component according to any one of claims 1 to 3, wherein: When viewed from the thickness direction, The area of ​​the pad is larger than the area of ​​the vertical wiring at a connection position with the pad.

17. The inductor component according to any one of claims 1 to 3, wherein: The thickness dimension of the blank is less than 0.25 mm. The dimensions of the inductor wiring and the supporting wiring in the thickness direction are not less than one tenth and not more than one third of the dimension of the base body in the thickness direction.

18. The inductor component according to any one of claims 1 to 3, wherein: There are multiple inductor wirings on the same plane. The minimum distance between adjacent inductor wirings is 50 micrometers or more.

19. The inductor component according to any one of claims 1 to 3, wherein: A plurality of terminal portions are provided which are exposed on the main surface. At least one of the terminal portions is an external terminal electrically connected to the inductor wiring. The terminal portions other than the external terminals are dummy portions that are not electrically connected to the inductor wiring. The shape of the dummy portion is different from the shape of the external terminal. When viewed from the thickness direction, The area of ​​the dummy portion is the same as the area of ​​the external terminal.

20. A method for manufacturing an inductor component, comprising: The step of forming, on the same plane, a plurality of inductor wirings having a wiring main body extending linearly and pads provided at ends of the wiring main body, and a plurality of supporting wirings connecting the pads of different inductor wirings; forming a vertical wiring connected to the pad in a thickness direction perpendicular to a plane on which the plurality of inductor wirings and the plurality of support wirings are formed; a step of forming a base body covering the inductor wiring and the support wiring; and The step of cutting the green body in the thickness direction at a position where the supporting wiring is provided, so that a cross section of the supporting wiring is exposed at a side surface of the green body and an inductor component including at least one of the inductor wirings is obtained. When viewing from the thickness direction, for the inductor wiring to be formed, a virtual tangent line is drawn at a connection position between the wiring main body and the pad with respect to the central axis of the wiring main body. The support wiring is formed from the pad in parallel with the virtual tangent line, and a central axis of the support wiring and the virtual tangent line are located on different straight lines.

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