High-power chip heat dissipation structure and preparation method thereof

By setting heat dissipation components and shielding on high-power chips, the problems of external electromagnetic interference and temperature unevenness during the heat dissipation process of high-power chips are solved, achieving effective heat dissipation and radio frequency signal shielding, and improving the performance and reliability of the chips.

CN114256176BActive Publication Date: 2026-06-09INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
Filing Date
2021-11-23
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

High-power chips are susceptible to external electromagnetic interference during heat dissipation, resulting in radio frequency signal distortion. Furthermore, uneven temperature distribution within the chip leads to localized hot spots and thermal stress, affecting chip performance and reliability.

Method used

Heat dissipation components and shielding components are set on high-power chips. The heat dissipation components dissipate heat directly through coolant, while the shielding components shield radio frequency signals and act as a heat diffusion layer, improving temperature uniformity and shortening the heat transfer path.

Benefits of technology

It achieves effective heat dissipation and radio frequency signal shielding for high-power chips, reduces the influence of external electromagnetic interference, improves the temperature uniformity and heat dissipation capacity of the chip, and avoids local high-temperature hot spots and thermal stress.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a high-power chip heat dissipation structure and a preparation method thereof, and relates to the technical field of microelectronic heat dissipation. The high-power chip heat dissipation structure comprises a heat dissipation component on the high-power chip, the heat dissipation component is bonded with the high-power chip, and the projection of the heat dissipation component covers at least the heat generating junction area of the device layer of the high-power chip. The cooling liquid can be introduced to the heat generating junction area on the front surface of the high-power chip through the heat dissipation component, the radio frequency signal of the high-power chip is shielded through the shielding piece, the high-power chip and the heat dissipation component are isolated through the shielding piece, the shielding piece can also serve as a heat diffusion layer to diffuse the heat gathered in the chip, the uniformity of the temperature in the chip is improved, the heat generated by the chip is dissipated through the front surface of the chip by connecting the heat dissipation component to the shielding piece, the heat transfer path is shortened, and the signal shielding requirement of the high-power chip and the heat dissipation requirement of the chip are met.
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