Integrated circuit device and method

By designing obliquely configured IO patterns and via electrical coupling technology in integrated circuits, the problem of integration difficulty of different modules is solved, and more efficient integrated circuit manufacturing and adaptability are achieved.

CN114446950AInactive Publication Date: 2022-05-06TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
2 Cites 0 Cited by

Patent Information

Application Number
CN202110472896.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2021-01-04
Filing Date
2021-04-29
Publication Date
2022-05-06
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Integration of modules built by different designers in integrated circuit (IC) devices is difficult, mainly due to the different metal design specifications used by different designers, which makes integration and coupling difficult.

Method used

Adopt an IC device design that includes a substrate, a circuit area, and an input/output (IO) pattern, where the IO pattern is tilted along a specific direction and electrically coupled through vias and metal layers, using automated configuration and routing tools (APR) Overlap the access pattern and IO pattern to achieve electrical contact and form an acute-angle structure.

Benefits of technology

It improves the integration and coupling efficiency of different modules, simplifies the manufacturing process of integrated circuits, enhances the flexibility and adaptability of IC devices, and is compatible with different metal design specifications.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention discloses an integrated circuit device and a method. The integrated circuit device comprises an integrated circuit; an IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input / output (IO) pattern configured to electrically couple the circuit region to circuitry outside the circuit region. The at least one first input / output (IO) pattern extends along a third direction, the third direction being simultaneously inclined to the first direction and the second direction.
Need to check novelty before this filing date? Find Prior Art