A light-emitting substrate and a preparation method thereof

Abstract

The present application provides a light-emitting substrate and a method for manufacturing the same, wherein the light-emitting substrate is provided with a light-emitting region and a non-light-emitting region surrounding at least a portion of the light-emitting region. The light-emitting substrate comprises a substrate, a first conductive layer, a functional layer, and a second conductive layer. The first conductive layer, disposed on one side of the substrate, comprises a plurality of auxiliary conductive structures located in the non-light-emitting region, and a recessed region located between adjacent auxiliary conductive structures. The functional layer comprises a first portion located in the recessed region. The second conductive layer comprises an auxiliary electrode located in the recessed region, the auxiliary electrode being located on a side of the first portion away from the substrate. The auxiliary electrode contacts the sidewalls of adjacent auxiliary conductive structures. Due to the special structural design of the first conductive layer, the number of masks required can be reduced, the preparation process of the light-emitting substrate can be simplified, the preparation yield of the light-emitting substrate can be improved, and the overall cost of the light-emitting substrate can be reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more specifically, to a light-emitting substrate and a preparation method thereof. Background Art

[0002] OLED (Organic Light Emitting Diode) display panels are gaining widespread attention due to their wide viewing angles, high contrast, fast response times, and flexible manufacturing capabilities. These advantages have led to their widespread application in display-enabled devices such as mobile phones, monitors, laptops, digital cameras, and wearable devices.

[0003] However, the current production cost of organic light-emitting diode display panels is still relatively high, which is not conducive to the further promotion and use of organic light-emitting diode display panels. Summary of the Invention

[0004] In view of this, the embodiments of the present application are directed to providing a light-emitting substrate with a simple preparation process and a preparation method thereof, so as to solve the problem of high preparation cost of the light-emitting substrate in the prior art.

[0005] In a first aspect, an embodiment of the present application provides a light-emitting substrate, wherein the light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least a portion of the light-emitting area, and the light-emitting substrate includes:

[0006] substrate;

[0007] a first conductive layer, the first conductive layer being located on one side of the substrate, the first conductive layer comprising a plurality of auxiliary conductive structures located in a non-luminous area, with recessed areas being provided between adjacent auxiliary conductive structures;

[0008] a functional layer, the functional layer comprising a first portion located in the recessed area;

[0009] The second conductive layer includes an auxiliary electrode located in the recessed area, the auxiliary electrode is located on a side of the first portion away from the substrate; and the auxiliary electrode contacts a sidewall of an adjacent auxiliary conductive structure.

[0010] Optionally, the light-emitting substrate further includes:

[0011] The conductive connection layer includes a conductive connection structure located on the surface of the auxiliary electrode facing away from the substrate, and the conductive connection structure is in contact with side walls of adjacent auxiliary conductive structures.

[0012] Optionally, the conductive connection structure contacts a sidewall of an adjacent auxiliary conductive structure.

[0013] Optionally, an orthographic projection of the second conductive layer on the substrate coincides with an orthographic projection of the functional layer on the substrate.

[0014] Optionally, the functional layer also includes a second part located on the side of the auxiliary conductive structure away from the substrate, and the first part and the second part are broken at the step formed by the auxiliary conductive structure and the recessed area; the second conductive layer also includes a third part located on the side of the second part away from the substrate.

[0015] Optionally, the third portion and the auxiliary electrode are broken at a step formed by the auxiliary conductive structure and the recessed area.

[0016] Optionally, the light-emitting substrate further comprises: a plurality of light-emitting units located on one side of the substrate; the plurality of light-emitting units are located in the light-emitting area;

[0017] The light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction away from the substrate; the second electrode is electrically connected to the auxiliary electrode;

[0018] The second conductive layer and the second electrode are provided in the same layer and made of the same material.

[0019] Optionally, the functional layer and the light-emitting functional layer are provided in the same layer and are made of the same material.

[0020] Optionally, the first conductive layer and the first electrode are provided in the same layer and are made of the same material.

[0021] Optionally, all light-emitting units in the light-emitting area have the same light-emitting color and structure.

[0022] Optionally, the light-emitting unit is a single-color single-layer light-emitting unit, a single-color stacked light-emitting unit, a single-layer white light-emitting unit or a stacked white light-emitting unit.

[0023] Optionally, the light emitting unit emits blue light.

[0024] The light-emitting substrate further includes a color conversion layer located on the light-emitting side of the light-emitting unit.

[0025] Optionally, the light emitting unit emits white light.

[0026] The light-emitting substrate further includes: a filter layer located on the light-emitting side of the light-emitting unit; the filter layer includes one or more of red color resistance, green color resistance and blue color resistance.

[0027] Optionally, an angle between a sidewall of the auxiliary conductive structure close to the recessed region and a bottom of the auxiliary conductive structure close to the substrate is 90 degrees, or an obtuse angle.

[0028] In a second aspect, an embodiment of the present application further provides a method for preparing a light-emitting substrate, wherein the light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least a portion of the light-emitting area, the preparation method comprising:

[0029] providing a substrate;

[0030] forming a first conductive layer on the substrate, wherein the first conductive layer comprises a plurality of auxiliary conductive structures located in the non-luminescent region, and a recessed region is provided between adjacent auxiliary conductive structures;

[0031] forming a functional layer, the functional layer including a first portion located in the recessed area;

[0032] A second conductive layer is formed, the second conductive layer includes an auxiliary electrode located in the recessed area, the auxiliary electrode is located on a side of the first portion away from the substrate, and the auxiliary electrode contacts a sidewall of an adjacent auxiliary conductive structure.

[0033] Optionally, an orthographic projection of the second conductive layer on the substrate coincides with an orthographic projection of the functional layer on the substrate;

[0034] Optionally, the functional layer further includes a second portion located on a side of the auxiliary conductive structure away from the substrate, and the first portion and the second portion are broken at a step formed by the auxiliary conductive structure and the recessed area;

[0035] Optionally, the second conductive layer further includes a third portion located on a side of the second portion away from the substrate;

[0036] Optionally, the mask used to form the second conductive layer and the functional layer is the same mask.

[0037] As can be seen from the above technical solution, the embodiment of the present application provides a light-emitting substrate and a preparation method thereof, wherein the light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least part of the light-emitting area, the light-emitting substrate is provided with a first conductive layer on one side of the substrate, and in the first conductive layer, a plurality of auxiliary conductive structures are provided in the non-light-emitting area, and a recessed area is provided between adjacent auxiliary conductive structures, the functional layer includes a first portion located in the recessed area; the second conductive layer includes an auxiliary electrode located in the recessed area, the auxiliary electrode is located on a side of the first portion away from the substrate; the auxiliary electrode is in contact with the sidewall of the adjacent auxiliary conductive structure. The first conductive layer is provided in this way, so that the auxiliary conductive structures can cooperate with the auxiliary electrodes in the second conductive layer to achieve electrical connection with each other, avoiding the functional layer affecting the electrical connection between the second conductive layer and the first conductive layer, and facilitating the second conductive layer to have normal electrical conductivity through the auxiliary conductive structure and the first signal line below the auxiliary conductive structure. Due to the special structural design of the first conductive layer, the light-emitting substrate does not need to use a mask plate when preparing the functional layer and the second conductive layer, or the same mask plate can be used without replacing the mask plate. There is no need to consider the alignment problem between the substrate and the mask plate when replacing the mask plate, which reduces the number of mask plates required, simplifies the preparation process of the light-emitting substrate, improves the preparation yield of the light-emitting substrate, and reduces the overall cost of the light-emitting substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 Schematic diagram of the top view of the light-emitting substrate in the prior art;

[0039] Figure 2 for Figure 1 Schematic diagram of the cross-section structure along line AA';

[0040] Figure 3 A schematic top view of a light-emitting substrate provided in one embodiment of the present application;

[0041] Figure 4 An embodiment of the present application provides a Figure 3 Schematic diagram of the cross-sectional structure along line BB';

[0042] Figure 5 Another embodiment of the present application provides a Figure 3 Schematic diagram of the cross-sectional structure along line BB';

[0043] Figure 6 Another embodiment of the present application provides a Figure 3 Schematic diagram of the cross-sectional structure along line BB';

[0044] Figure 7 Another embodiment of the present application provides a Figure 3 Schematic diagram of the cross-sectional structure along line BB';

[0045] Figure 8 A schematic diagram of a partial cross-sectional structure of a light-emitting substrate provided in one embodiment of the present application;

[0046] Figure 9 A schematic diagram of a partial cross-sectional structure of a light-emitting substrate provided in another embodiment of the present application;

[0047] Figure 10 A schematic flow chart of a method for preparing a light-emitting substrate provided in one embodiment of the present application;

[0048] Figure 11 A schematic structural diagram of an electronic device provided in accordance with an embodiment of the present application. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] Application Overview

[0051] During their research, the inventors of this application noted that with the increasing PPI (Pixels Per Inch) of OLED light-emitting substrates, particularly silicon-based Micro-OLED light-emitting substrates, the sub-pixel size of various light-emitting substrates (e.g., silicon-based micro-light-emitting substrates) has become smaller. Smaller sub-pixel sizes and smaller sub-pixel pitches increase the difficulty of preparing the various film layers of the light-emitting substrate. The masks used to prepare different film layers have different patterns, and each time the mask is replaced, the mask must be precisely aligned with the original light-emitting substrate. The choice of mask material, the screen stretching technology, the alignment accuracy, and the cleaning process all have a significant impact on the product yield and increase the cost of OLED panel production. Due to the limited selection of mask materials, the difficulty of preparation, the high precision requirements, and the tendency to deform after long-term use, cleaning, and drying, the product production process is difficult, the product yield is low, and the product production cost is increased.

[0052] The following combination Figure 1 and Figure 2 Give an example explanation. Figure 1 shows a schematic plan view of a light-emitting substrate, Figure 2 Shown along Figure 1 The cross-sectional structure diagram of line AA' is shown.

[0053] Combine Figure 1 and Figure 2 As shown, the light-emitting substrate includes a substrate 30, which includes a display area 10 and a non-display area 20, wherein the non-display area 20 surrounds at least a portion of the display area 10. A plurality of light-emitting units 40 are arranged in an array in the display area 10, and the non-display area 20 includes at least a cathode ring area. Figure 2 A cathode ring 21 is provided in the cathode ring region. The cathode ring 21 overlaps and is directly electrically connected to the cathode layer 43 extending from the display area 10, electrically connecting the cathode ring 21 to the first signal line 51. The first signal line 51 is used to provide a first power drive signal (e.g., cathode voltage) to the cathode layer 43 via the cathode ring 21. Furthermore, Figure 2 Also shown are the insulating layer 31, the anode 41 of the light-emitting unit 40, the light-emitting functional layer 42 and the cathode layer 43. The anode 41 can be electrically connected to the second signal line 52 through a via hole passing through the insulating layer 31. The second signal line 52 is used to provide a second power drive signal (such as an anode voltage) to the anode 41. Optionally, the first power drive signal is less than the second power drive signal.

[0054] The inventors have found through research that Figure 1 and Figure 2In the illustrated light-emitting substrate, during the preparation process of the light-emitting functional layer 42 of the light-emitting unit 40, a mask is required to cover the cathode ring 21 to prevent the prepared light-emitting functional layer 42 from covering the cathode ring 21, and to prevent the cathode layer 43 formed in the subsequent process from being properly overlapped with the cathode ring 21. This means that during the preparation of the light-emitting unit 40 of this type of light-emitting substrate, the mask used to prepare the light-emitting functional layer is different from the mask used to prepare the cathode layer, requiring at least two masks. This, on the one hand, increases the number of masks used and the number of preparation steps, increasing material and process costs. On the other hand, the mask replacement process is prone to misalignment, resulting in a reduced yield rate of the light-emitting substrate and further increasing the preparation cost of the light-emitting substrate.

[0055] Therefore, at least one embodiment of the present application provides a light-emitting substrate and a method for preparing the same, wherein the light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least part of the light-emitting area, the light-emitting substrate is provided with a first conductive layer on one side of the substrate, and in the first conductive layer, a plurality of auxiliary conductive structures are provided in the non-light-emitting area, and a recessed area is provided between adjacent auxiliary conductive structures, the functional layer includes a first portion located in the recessed area; the second conductive layer includes an auxiliary electrode located in the recessed area, the auxiliary electrode is located on a side of the first portion away from the substrate; the auxiliary electrode is in contact with the sidewall of the adjacent auxiliary conductive structure. The first conductive layer is provided in this manner so that the auxiliary conductive structures cooperate with the auxiliary electrodes in the second conductive layer to achieve mutual conductive electrical connection, thereby preventing the functional layer from affecting the conductive electrical connection between the second conductive layer and the first conductive layer, and facilitating the second conductive layer to have normal conductive function with the first signal line below the auxiliary conductive structure through the auxiliary conductive structure. Due to the special structural design of the first conductive layer, the light-emitting substrate does not need to use a mask plate when preparing the functional layer and the second conductive layer, or the same mask plate can be used without replacing the mask plate. There is no need to consider the alignment problem between the substrate and the mask plate when replacing the mask plate, which reduces the number of mask plates required, simplifies the preparation process of the light-emitting substrate, improves the preparation yield of the light-emitting substrate, and reduces the overall cost of the light-emitting substrate.

[0056] The following non-restrictive description of the light-emitting substrate provided in the embodiments of the present application is given by several examples or embodiments. As described below, different features in these specific examples or embodiments can be combined with each other without conflicting with each other to obtain new examples or embodiments, and these new examples or embodiments also fall within the scope of protection of the present disclosure.

[0057] Exemplary light-emitting substrates

[0058] Figure 3 is a schematic top view of a light-emitting substrate provided by an exemplary embodiment of the present application. Figure 4 It is along Figure 3The cross-sectional structure diagram of the BB' line shown in FIG. Figure 3 and Figure 4 As shown, the light-emitting substrate provided by the embodiment of the present application is provided with a light-emitting area and a non-light-emitting area 200 surrounding at least part of the light-emitting area 100. The light-emitting substrate includes: a substrate 110, a first conductive layer 210, a functional layer and a second conductive layer 140.

[0059] The first conductive layer 210 is located on one side of the substrate 110 . The first conductive layer includes a plurality of auxiliary conductive structures 211 located in the non-light-emitting area 200 . A recessed area 212 is formed between adjacent auxiliary conductive structures 211 .

[0060] The functional layer includes a first portion 133 located in the recessed area 212. The material of the functional layer may include an organic layer, etc.

[0061] The second conductive layer 140 includes an auxiliary electrode 142 located in the recessed region 212 . The auxiliary electrode 142 is located on a side of the first portion 133 away from the substrate 110 . The auxiliary electrode 142 contacts a sidewall of an adjacent auxiliary conductive structure 211 .

[0062] In this specification, unless otherwise specified, "a plurality of" means two or more.

[0063] In order to more completely represent the structure of the light-emitting substrate, Figure 4 Also shown is an insulating layer 120 located on the substrate. The insulating layer 120 may include multiple film layers of different material types and different functions, such as a gate insulating layer, a planarization layer, an interlayer insulating layer, and a pixel definition layer. Other metal structures may be formed between the different insulating film layers. The auxiliary conductive structure 211 may include a conductive material, such as a metal material. The auxiliary conductive structure 211 may be in a columnar shape, etc. Multiple auxiliary conductive structures 211 may be arranged in an array. The auxiliary conductive structure 211 may be arranged around at least a portion of the light-emitting area 100. The auxiliary conductive structure 211 may be in a strip shape, and the multiple auxiliary conductive structures 211 may be arranged at intervals along the direction from the non-light-emitting area 200 to the light-emitting area 100.

[0064] Still refer to Figure 4 In an exemplary embodiment, the orthographic projection of the second conductive layer 140 on the substrate 110 coincides with the orthographic projection of the functional layer on the substrate 110, that is, the orthographic projection of the second conductive layer 140 on the substrate 110 is the same as the orthographic projection of the functional layer on the substrate 110 in size and shape, and the coverage area of ​​the functional layer is the same as the coverage area of ​​the second conductive layer 140. In this way, when preparing the functional layer and the second conductive layer 140, there is no need to use a mask plate, or the same mask plate can be used without replacing the mask plate, which is conducive to simplifying the preparation process and reducing the difficulty and cost of preparation.

[0065] In an exemplary embodiment of the present application, reference may be made to Figure 4 , the functional layer also includes a second portion 134 located on the side of the auxiliary conductive structure 211 away from the substrate 110. The first portion 133 and the second portion 134 of the functional layer are broken at the step formed by the auxiliary conductive structure 211 and the recessed area 212. The auxiliary conductive structure 211 can be used as a partition structure during the preparation of the functional layer, disconnecting the functional layer formed on the top surface of the auxiliary conductive structure 211 and falling into the recessed area 212 to form a discontinuous organic film, making it convenient for the side wall of the auxiliary conductive structure 211 to contact the auxiliary electrode 142 to achieve electrical connection. The orthographic projections of the first portion 133 and the second portion 134 of the functional layer on the substrate 110 may not overlap, and the heights of the first portion 133 and the second portion 134 along the thickness direction of the light-emitting substrate may be different.

[0066] Optionally, based on the above embodiment, Figure 4 As shown, the second conductive layer 140 further includes a third portion 144 located on the side of the second portion 134 away from the substrate 110. The third portion 144 can be connected to the auxiliary electrode 142 of the second conductive layer 140 that falls into the recessed region 212, or the third portion 144 can be disconnected from the auxiliary electrode 142 at the step formed by the auxiliary conductive structure 211 and the recessed region 212. When the third portion 144 is connected to the auxiliary electrode 142, it is beneficial to reduce the resistance of the auxiliary electrode 142. When the third portion 144 is disconnected from the auxiliary electrode 142 at the step formed by the auxiliary conductive structure 211 and the recessed region 212, it is convenient to subsequently form another conductive structure on the side of the auxiliary electrode 142 away from the substrate 110, the conductive structure being in contact with the sidewall of the auxiliary conductive structure 211 and being connected in parallel with the auxiliary electrode 142, thereby reducing the overall resistance of the auxiliary electrode 142 and the auxiliary conductive structure 211.

[0067] If the second portion 134 and the third portion 144 are present, the complexity of the pattern of the mask for preparing the functional layer and the second conductive layer can be reduced, and the number of openings on the mask can be reduced. If the second portion 134 and the third portion 144 are absent, the material used for the functional layer and the second conductive layer can be reduced.

[0068] exist Figure 3 In the embodiment, the light-emitting substrate includes a light-emitting area 100 and a non-light-emitting area 200 surrounding at least a portion of the light-emitting area 100. The light-emitting substrate may be a display substrate, the light-emitting area 100 may be a display area, and the non-light-emitting area 200 may be a non-display area. In some embodiments of the present application, according to actual needs, the non-light-emitting area 200 may completely surround the light-emitting area 100 or partially surround the light-emitting area 100, and the present application does not limit this. Optionally, the auxiliary conductive structure 211 is located in the non-light-emitting area 200. In some embodiments, the auxiliary conductive structure 211 and the auxiliary electrode 142 connecting adjacent auxiliary conductive structures 211 can be used as a cathode ring of the light-emitting substrate.

[0069] Optionally, a light-emitting substrate can be used for lighting.

[0070] from Figure 4 It can be clearly seen that due to the presence of multiple discrete auxiliary conductive structures 211, when forming the functional layer of the light-emitting unit 130, direct evaporation can be performed through a non-fine mask. The part of the functional layer falling into the non-luminous area is separated by multiple auxiliary conductive structures 211 into at least a first part 133 falling into the recessed area 212 and a second part 134 located on the side of the auxiliary conductive structure 211 away from the substrate 110. The part of the subsequently formed second conductive layer 140 falling into the recessed area 212 becomes an auxiliary electrode 142. The auxiliary electrode 142 is located on the side of the first part 133 away from the substrate 110. The sidewalls of the auxiliary electrode 142 are in contact with the auxiliary conductive structures 211 on both sides of the recessed area 212, so that the discrete auxiliary conductive structures 211 can be electrically connected to each other. On the basis of ensuring that the basic function of the electrical connection between the first conductive layer 210 and the auxiliary conductive structure is realized, the number of masks required for preparing the light-emitting substrate is reduced, the preparation process of the light-emitting substrate is simplified, and it is beneficial to reduce the preparation cost and difficulty of the light-emitting substrate.

[0071] Optionally, based on the above embodiment, Figure 4 In the embodiment, the light-emitting substrate further includes: a plurality of light-emitting units 130 located on one side of the substrate 110. Optionally, the plurality of light-emitting units 130 may be located in the light-emitting area 100. The light-emitting unit 130 includes a first electrode 131, a light-emitting functional layer 132, and a second electrode 1411, which are sequentially stacked in a direction away from the substrate 110. The second electrode 1411 is electrically connected to the auxiliary electrode 142. Optionally, the second conductive layer 140 and the second electrode 1411 are provided in the same layer and made of the same material, that is, the second electrode 1411 and the auxiliary electrode 142 are the same film layer formed in the same process, which is conducive to simplifying the manufacturing process and reducing the difficulty of manufacturing. Optionally, the functional layer is provided in the same layer and made of the same material as the light-emitting functional layer 132 located in the light-emitting area 100. The light-emitting functional layer 132, the first portion 133 and the second portion 134, and the functional layers in other locations in the non-light-emitting area 200 can be film layers formed simultaneously in the same process, which is conducive to simplifying the manufacturing process and reducing the difficulty of manufacturing. Optionally, the first conductive layer and the first electrode 131 are arranged in the same layer and have the same material, that is, the auxiliary conductive structure 211 in the first conductive layer and the first electrode 131 can be film layers formed simultaneously in the same process, which is conducive to simplifying the preparation process and reducing the preparation difficulty.

[0072] exist Figure 4In the present invention, the portion of the second conductive layer 140 in the light-emitting area 100 is referred to as the electrode layer 141, which can serve as the cathode layer for the light-emitting unit 130. The electrode layer 141 can be a single layer structure, extending from the light-emitting area 100 to the non-light-emitting area 200. Through contact with the auxiliary conductive structure 211, it is electrically connected to the auxiliary electrode 142 and the auxiliary conductive structure 211. The portion of the electrode layer 141 corresponding to each light-emitting unit 130 is referred to as the second electrode 1411 (specifically, it can serve as the cathode for the light-emitting unit 130). The portion of the second conductive layer 140 in the non-light-emitting area 200 is subdivided into the auxiliary electrode 142 within the recessed area 212, a third portion 144, and a portion 143 within other non-light-emitting areas 200, depending on the location. Since the electrode layer 141 is a single layer structure, a separate mask is not required for its formation, simplifying the fabrication process for the second conductive layer 140 and reducing the cost and difficulty of manufacturing the light-emitting substrate.

[0073] The light-emitting functional layer 132, the first electrode 131, and the second electrode 1411 are all components of the light-emitting unit 130. The first electrode 131 can serve as the anode of the light-emitting unit 130. The functional layer can be a single layer structure, and the light-emitting functional layer 132, the first portion 133, and the second portion 134 are formed simultaneously in the same process.

[0074] The light-emitting functional layer may include an emission layer (EML). Of course, in order to improve the electron and hole injection capability of the light-emitting functional layer, the light-emitting functional layer may also include at least one of a hole transport layer (HTL), a hole injection layer (HIL), an electron blocking layer, an electron transport layer (ETL), an electron injection layer (EIL) and a hole blocking layer. Among them, each layer of the hole transport layer, the hole injection layer, the electron transport layer and the electron injection layer may be a common layer, that is, a whole layer structure. In order to reduce the difficulty and cost of making the mask, the light-emitting layer may also be a whole layer structure. Figure 4 In the above description, the light-emitting functional layers are all common layers. It is easy to understand that in some embodiments, at least one or all of the light-emitting functional layers can be formed as discrete structural layers according to actual needs. All film layers included in the light-emitting functional layer can be formed by a film-forming process such as evaporation.

[0075] The second electrode of all light-emitting units in any light-emitting zone can be continuous, completely covering the light-emitting zone, and can extend into the non-light-emitting zone. The light-emitting functional layer of all light-emitting units in any light-emitting zone can be continuous, completely covering the light-emitting zone, and can extend into the non-light-emitting zone. Optionally, the first electrode can be an anode, and the second electrode can be a cathode. Optionally, the first electrode can be a cathode, and the second electrode can be an anode. The second electrode can include materials such as magnesium and silver.

[0076] Optionally, the luminous colors and structures of all the light-emitting units 130 in the light-emitting area 100 are the same, that is, the film layer structures of all the light-emitting units 130 are the same, so that the second conductive layer 140 can be prepared using the same mask template as the various film layers of the functional layer, which is conducive to simplifying the preparation process and reducing the difficulty of preparation.

[0077] In an exemplary embodiment, the light-emitting unit 130 is a monochrome single-layer light-emitting unit, a monochrome stacked light-emitting unit, a single-layer white light-emitting unit or a stacked white light-emitting unit, that is, the light-emitting unit 130 is a light-emitting unit 130 that emits monochromatic light. In this way, the light-emitting unit 130 in the light-emitting area does not need to replace the mask template multiple times during the preparation process, and does not need to be prepared using the FMM (Fine Metal Mask) process, which is beneficial to reducing the preparation cost of the light-emitting substrate and reducing the preparation difficulty.

[0078] The light-emitting functional layer of a single-color single-layer light-emitting unit can be a single color light-emitting functional layer, for example, a red light-emitting functional layer, a green light-emitting functional layer, or a blue light-emitting functional layer. Each of the single-color light-emitting functional layers can include an emission layer (EML). Each of the single-color light-emitting functional layers can also include at least one of a hole transport layer, a hole injection layer, an electron blocking layer, an electron transport layer, an electron injection layer, and a hole blocking layer.

[0079] The luminescent functional layer of a single-color stacked light-emitting unit may include at least two single-color light-emitting functional layers arranged along the thickness direction of the light-emitting substrate, and a charge generation layer disposed between adjacent single-color light-emitting functional layers. A single-color stacked light-emitting unit produces a higher light intensity than a single-color single-layer light-emitting unit.

[0080] The luminescent functional layer of the laminated white light emitting unit may include at least two monochromatic luminescent functional layers of different colors arranged along the thickness direction of the luminescent substrate, and a charge generation layer disposed between adjacent monochromatic luminescent functional layers. For example, white light may be generated by mixing the light emitted by the red, green, and blue luminescent functional layers, or by mixing the light emitted by the blue and yellow luminescent functional layers.

[0081] The light-emitting functional layer of the single-layer white light-emitting unit may be one white light-emitting functional layer.

[0082] In an exemplary embodiment, the thickness of the first portion 133 along the thickness direction of the light-emitting substrate is less than the thickness of the auxiliary conductive structure 211 along the thickness direction of the light-emitting substrate, so that the auxiliary conductive structure 211 can effectively separate the first portion 133 from the second portion 134, reduce the situation where the functional layer completely covers the sidewalls of the auxiliary conductive structure 211, and improve the production yield of the light-emitting substrate. Optionally, along the thickness direction of the light-emitting substrate, the height of the auxiliary conductive structure 211 away from the substrate 110 relative to the substrate 110 is higher than the height of the first portion 133 away from the substrate 110 relative to the substrate 110, so that the auxiliary conductive structure 211 can effectively separate the first portion 133 from the second portion 134.

[0083] In an exemplary embodiment, the functional layer is a whole layer structure, that is, the first part 133 and the light-emitting functional layer 132 are both formed of the same light-emitting material, especially the light-excitation layers in the first part 133 and the light-emitting functional layer 132 are both formed using the same light-excitation material. In this way, the light-emitting unit 130 in the light-emitting area does not need to replace the mask template multiple times during the preparation process, and does not need to be prepared using the FFM (Fine Metal Mask) process, which is beneficial to reducing the preparation cost of the light-emitting substrate.

[0084] Combine Figure 3 and Figure 4 As shown, Figure 4 Also shown are first signal lines 121 and second signal lines 122. The first signal line 121 can be electrically connected to the first conductive layer 210 via at least one via, allowing the first signal line 121 to provide a first voltage signal (e.g., a cathode voltage) to the second conductive layer 140 via the auxiliary conductive structure 211. The second signal line 122 can be electrically connected to the first electrode via at least one via, allowing the second signal line 122 to provide a second voltage signal (e.g., an anode voltage) to each first electrode. The light-emitting substrate may also include a drive array layer. The drive array layer may be located between the light-emitting functional layer and the substrate. The first signal line 121 and / or the second signal line 122 may be located within the drive array layer. The drive array layer may be used to form thin-film transistors, scan lines, data lines, light-emitting control lines, and the like. The signals transmitted by the first signal line 121 and the second signal line 122 may be different.

[0085] The first electrode 131 can be a reflective electrode made of a reflective material. The reflective electrode and the second electrode 1411 of the light-emitting unit 130 form a microcavity structure. The microcavity structure utilizes the strong reflective function of the reflective electrode to cause the light directly emitted by the light-emitting functional layer 132 and the light reflected by the reflective electrode to interfere with each other, thereby improving the color gamut of the light emitted by the light-emitting unit 130 and improving the brightness of the emitted light.

[0086] For clarity of illustration, Figure 4 The pixel driving circuit located in the light-emitting area is not shown. The pixel driving circuit can be formed on the substrate 110 using a CMOS process or other processes. The pixel driving circuit can be a 7T1C pixel driving circuit or other types of pixel driving circuits such as a 2T1C pixel driving circuit. The substrate 110 can be a silicon-based substrate, which is not limited in this application. A complete driving cycle of the light-emitting unit may include at least one of: a node reset phase, a data writing phase, and a light-emitting phase. The specific operating principles of each phase are not further described in this application.

[0087] In an exemplary embodiment, the auxiliary conductive structure and the first electrode are formed in the same layer. In this specification, "two structures in the same layer" means that the two structures are formed simultaneously in the same process. It is understood that due to factors such as manufacturing parameters and mask shape, the two structures in the same layer do not necessarily have the same thickness or the same morphology. Therefore, in this embodiment, "the auxiliary conductive structure and the first electrode in the same layer" means that the auxiliary conductive structure and the first electrode are formed simultaneously in the same process. This eliminates the need for a separate mask process for the auxiliary conductive structure, simplifying the manufacturing process of the light-emitting substrate and reducing the manufacturing cost of the light-emitting substrate. The auxiliary conductive structure and the first electrode can be obtained by patterning the same conductive layer.

[0088] In some possible implementations, reference Figure 5 , Figure 5 Another embodiment of the present application provides Figure 3 Schematic diagram of the cross-sectional structure along line BB'. In this embodiment, the angle α between the side wall of the auxiliary conductive structure 211 close to the recessed area 212 and the bottom of the auxiliary conductive structure 211 close to the substrate 110 is an obtuse angle, that is, the cross-sectional shape of the auxiliary conductive structure is an inverted trapezoid. It is not difficult to understand that the inverted trapezoidal shape of the auxiliary conductive structure is beneficial for blocking the functional layer falling in the non-luminescent area, which is beneficial for improving the preparation yield of the light-emitting substrate.

[0089] Of course, in other possible embodiments of the present application, the angle α between the sidewall of the auxiliary conductive structure 211 close to the recessed region 212 and the bottom of the auxiliary conductive structure 211 close to the substrate 110 can also be 90 degrees (e.g. Figure 4 ), or, acute angles (as Figure 6 As shown), that is, the cross-sectional shape of the auxiliary conductive structure can also be a regular trapezoid (as shown Figure 6 As shown), rectangle, square and other feasible shapes are not listed here in this application.

[0090] In addition, Figure 5In the embodiment, each auxiliary conductive structure 211 is connected to the first signal line 121 through a via hole to reduce the contact resistance between the first conductive layer and the first signal line 121. Of course, in some possible embodiments, the number of auxiliary conductive structures 211 directly connected to the first signal line 121 through a via hole can be selected according to actual conditions, for example, it can be 1, 2, or more, and this application does not limit this.

[0091] In an exemplary embodiment, reference Figure 7 , Figure 7 Another embodiment of the present application provides Figure 3 In the cross-sectional structural diagram along line BB', in this embodiment, the light-emitting substrate further includes a conductive connection layer 220. The conductive connection layer 220 includes a conductive connection structure 221 located on the surface of the auxiliary electrode 142 facing away from the substrate 110. The conductive connection structure 221 contacts the sidewall of the adjacent auxiliary conductive structure 211.

[0092] The conductive connection layer 220 can be formed in the non-luminescent area by inkjet printing (IJP) or other methods. It is readily understood that the conductive connection structure 221 is located on the upper surface of the auxiliary electrode 142 (i.e., the surface of the auxiliary electrode 142 facing away from the substrate 110), directly contacting the auxiliary electrode 142. Furthermore, the sidewalls of the conductive connection structure 221 also contact the sidewalls of the adjacent auxiliary conductive structure 211. This allows the conductive connection layer 220 to increase the contact area between the auxiliary electrode 142 and the auxiliary conductive structure 211, thereby reducing the contact resistance between the auxiliary electrode 142 and the auxiliary conductive structure 211, lowering the required driving voltage for the light-emitting substrate, and thereby reducing the power consumption of the light-emitting substrate. The conductive connection structure 221 may include silver nanowires, for example. The conductivity of the conductive connection structure 221 may be greater than that of the auxiliary electrode 142.

[0093] exist Figure 7 In the figure, only the conductive connection structure 221 located in the recessed area is shown. In fact, during the inkjet printing process, other areas of the non-luminous area 200 may also form conductive connection structures ( Figure 7 (not shown), but the conductive connection structure does not affect the function of the light-emitting substrate.

[0094] It should be noted that in Figure 3-Figure 7 Only a portion of the non-luminous area 200 is shown in the figure. The non-luminous area 200 may also include a binding area for forming a pad, which will not be described in detail in this application.

[0095] In an exemplary embodiment of the present application, Figure 8As shown, the light-emitting unit emits blue light, and the light-emitting substrate further includes a color conversion layer 530 located on the light-emitting side of the light-emitting unit. The color conversion layer 530 can convert the blue light emitted by at least a portion of the light-emitting unit 130 into light other than blue, such as red or green light. The color conversion layer 530 can convert the blue light emitted by a portion of the light-emitting unit 130 into red light, and convert the blue light emitted by another portion of the light-emitting unit 130 into green light. The color conversion layer 530 can be located on the side of the second electrode 1411 away from the substrate 110. The color conversion layer 530 can include one or more materials selected from quantum dots, phosphors, and perovskites.

[0096] exist Figure 8 In the embodiment, the color filter substrate includes a color conversion layer 530, a black matrix 520, and a first color filter substrate 510. The color conversion layer 530 may include a quantum dot array and a light-transmitting layer 533. The quantum dot array includes a plurality of red quantum dot light-emitting layers 531 and a green quantum dot light-emitting layer 532. Blue light emitted by the light-emitting units in the array substrate serves as an excitation source for the quantum dot array. After passing through the red quantum dot light-emitting layer 531, the blue light excites the red light to be emitted. After passing through the green quantum dot light-emitting layer 532, the blue light excites the green light to be emitted. After passing through the light-transmitting layer 533, the blue light remains blue light. In some exemplary embodiments, the color conversion layer 530 may also include a yellow quantum dot light-emitting layer. The yellow quantum dot light-emitting layer can convert some blue light into yellow light while transmitting some blue light. The converted yellow light and the transmitted blue light mix to form white light. This enables RGBW four-color display, significantly improving the color richness and display brightness of the light-emitting substrate and enabling the production of light-emitting substrates with higher resolution.

[0097] In another exemplary embodiment of the present application, Figure 9 As shown, the light-emitting unit emits white light. The light-emitting substrate further includes a filter layer located on the light-emitting side of the light-emitting unit. The filter layer includes one or more of red, green, and blue color resists. The filter layer can be located on the side of the second electrode away from the substrate.

[0098] Figure 9 The cross-sectional structure diagram of the light-emitting substrate is shown in FIG300 . The color filter substrate 300 includes a filter layer 304 . After the monochromatic or white light emitted by the light-emitting unit passes through the color resists of different colors, it will form light of corresponding colors, thus realizing the function of the light-emitting substrate to emit light of different colors. In some possible embodiments, the color resists may include red, green, and blue. In addition, Figure 9The figure also shows other film layers of the color filter substrate 300, including a black matrix 302, a second color filter substrate 303, and an optical adhesive layer 301. The light-emitting substrate may also include photo spacers (PS) for supporting and isolating adjacent light rays, a thin-film encapsulation layer (TFE) for isolating water and oxygen, and providing encapsulation, and a protective cover.

[0099] In some possible embodiments, the color filter can be integrated on the light-emitting substrate using CFOT (Color Filter On TFE) technology. In this way, in the structure of the light-emitting substrate, the encapsulation layer and the cover plate can be directly formed in the light-emitting direction of the light-emitting substrate, which is beneficial to reducing the overall thickness of the light-emitting substrate.

[0100] Exemplary Preparation Methods

[0101] The present application also provides a method for preparing a light-emitting substrate, which can be used to prepare the light-emitting substrate in the above embodiment. Figure 10 As shown, the preparation method of the light-emitting substrate includes:

[0102] S101: providing a substrate.

[0103] The light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least a portion of the light-emitting area. The light-emitting substrate may include one or more non-light-emitting areas, and accordingly, the light-emitting substrate may also include one or more light-emitting areas. The substrate 110 may include a flexible substrate or a rigid substrate. Flexible substrates may include materials such as polyimide. Rigid substrates may include glass substrates, etc. The substrate may be a silicon-based substrate containing multiple metal traces for connecting the light-emitting area and cathode ring to the bonding area.

[0104] S102: forming a first conductive layer on a substrate, wherein the first conductive layer includes a plurality of auxiliary conductive structures located in a non-luminous area, and recessed areas are provided between adjacent auxiliary conductive structures.

[0105] As mentioned above, the first conductive layer can be formed simultaneously with the first electrode of the light-emitting unit in the light-emitting area in the same process to simplify the preparation process and improve production efficiency.

[0106] S103: forming a functional layer, where the functional layer includes a first portion located in the recessed area.

[0107] S104: forming a second conductive layer, the second conductive layer including an auxiliary electrode located in the recessed area, the auxiliary electrode being located on a side of the first portion away from the substrate; and the auxiliary electrode being in contact with a sidewall of an adjacent auxiliary conductive structure.

[0108] Due to the unique structure of the first conductive layer, when forming the light-emitting functional layer, there is no need to use a mask to block the area where the first conductive layer is located, so that the auxiliary conductive structure cooperates with the auxiliary electrode in the recessed area to achieve electrical connection with each other, so that the first conductive layer can have normal conductive function through the auxiliary conductive structure and the first signal line below the auxiliary conductive structure.

[0109] The light-emitting substrate includes one or more sub-light-emitting substrate areas. Each sub-light-emitting substrate area may include a light-emitting area and a non-light-emitting area surrounding the light-emitting area. The light-emitting substrate may be cut to obtain multiple sub-light-emitting substrates.

[0110] Optionally, the orthographic projection of the second conductive layer on the substrate coincides with the orthographic projection of the functional layer on the substrate. Due to the special structural design of the first conductive layer, the same mask can be used when preparing the functional layer and the second conductive layer of the light-emitting substrate, eliminating the need to replace the mask and the need to consider the alignment of the substrate and the mask when replacing the mask. This reduces the number of masks required, simplifies the preparation process of the light-emitting substrate, improves the preparation yield of the light-emitting substrate, and reduces the overall cost of the light-emitting substrate.

[0111] Optionally, the functional layer further includes a second portion located on a side of the auxiliary conductive structure away from the substrate, and the first portion and the second portion are broken at a step formed by the auxiliary conductive structure and the recessed area.

[0112] Optionally, the second conductive layer further includes a third portion located on a side of the second portion away from the substrate.

[0113] Optionally, the mask used to form the second conductive layer and the functional layer is the same mask. The mask used to form the second conductive layer and the functional layer is the same common metal mask (CMM).

[0114] For the structure of each layer of the light-emitting substrate prepared by the preparation method and the corresponding description, refer to the corresponding description in “Exemplary Light-Emitting Substrate”.

[0115] Exemplary electronic devices

[0116] The present application also provides an electronic device, such as Figure 11 As shown, Figure 11 1 is a schematic structural diagram of an electronic device 600, which includes the light-emitting substrate described in any of the above embodiments. The electronic device 600 may include a mobile phone, a tablet computer, a notebook computer, a lighting device, etc.

[0117] In summary, the embodiments of the present application provide a light-emitting substrate and a method for preparing the same, wherein the light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least a portion of the light-emitting area. The light-emitting substrate is provided with a first conductive layer on one side of the substrate, and in the first conductive layer, multiple auxiliary conductive structures are provided in the non-light-emitting area, as well as a recessed area between adjacent auxiliary conductive structures. The functional layer includes a first portion located in the recessed area; the second conductive layer includes an auxiliary electrode located in the recessed area, the auxiliary electrode being located on a side of the first portion away from the substrate; and the auxiliary electrode is in contact with the sidewall of the adjacent auxiliary conductive structure. The first conductive layer provided in this manner allows the auxiliary conductive structures to cooperate with the auxiliary electrodes in the second conductive layer to achieve electrical connection with each other, preventing the functional layer from affecting the electrical connection between the second conductive layer and the first conductive layer, and facilitating the second conductive layer to have normal electrical conductivity through the auxiliary conductive structure and the first signal line below the auxiliary conductive structure. Due to the special structural design of the first conductive layer, the light-emitting substrate does not need to use a mask plate when preparing the functional layer and the second conductive layer, or the same mask plate can be used without replacing the mask plate. There is no need to consider the alignment problem between the substrate and the mask plate when replacing the mask plate, which reduces the number of mask plates required, simplifies the preparation process of the light-emitting substrate, improves the preparation yield of the light-emitting substrate, and reduces the overall cost of the light-emitting substrate.

[0118] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0119] Unless otherwise defined, technical or scientific terms used in the embodiments of this application should have the same ordinary meaning as those understood by persons of ordinary skill in the art to which this invention belongs. The terms "first," "second," and similar expressions used in the embodiments of this application do not denote any order, quantity, or importance, but are merely provided to avoid confusion among constituent elements.

[0120] Unless the context requires otherwise, throughout this specification, the terms "including" and "comprising" are to be interpreted as open-ended and inclusive, meaning "including, but not limited to." Throughout this specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any appropriate manner in any one or more embodiments or examples. When describing some embodiments, the terms "coupled" and "connected," along with their derivatives, may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact with each other. However, the terms "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other but nonetheless cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

[0121] The light-emitting substrate provided in some embodiments of the present disclosure may also include other components, for example, may include a circuit for providing an electrical signal to the light-emitting substrate to drive the light-emitting substrate to emit light, and this circuit may be called a control circuit, and may include a circuit board and / or IC (Integrate Circuit) electrically connected to the light-emitting substrate.

[0122] In some embodiments, the light-emitting substrate is used to display an image (i.e., a picture). The light-emitting substrate can be used as a display or a product containing a display. The display can be an FPD (Flat Panel Display), a microdisplay, or the like.

[0123] In other exemplary embodiments, the light-emitting substrate may be provided in a lighting device, in which case the light-emitting substrate serves as a light source to achieve a lighting function. For example, the light-emitting substrate may be a backlight module in a liquid crystal display device, a lamp for internal or external lighting, or various signal lights, etc. If the display is divided according to whether the user can see the back of the display, it may be a transparent display or an opaque display. If the display is divided according to whether it can be bent or curled, it may be a flexible display or an ordinary display (which may be called a rigid display). For example, products containing displays may include: wearable devices, computer monitors, televisions, billboards, laser printers with display functions, telephones, mobile phones, PDAs (Personal Digital Assistants), laptop computers, digital cameras, camcorders, viewfinders, vehicles, large-area walls, theater screens or stadium signs, etc.

[0124] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0125] The block diagrams of devices, apparatuses, equipment, and systems referred to in this application are intended only as illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems may be connected, arranged, or configured in any manner.

[0126] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

Claims

1. A light-emitting substrate, characterized in that: The light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least part of the light-emitting area, the light-emitting area is a display area, and the non-light-emitting area is a non-display area. The light-emitting substrate includes: substrate; a first conductive layer, the first conductive layer being located on one side of the substrate, the first conductive layer comprising a plurality of auxiliary conductive structures located in the non-luminous area, with recessed areas being provided between adjacent auxiliary conductive structures; a functional layer, the functional layer comprising a first portion located in the recessed area; a second conductive layer, the second conductive layer comprising an auxiliary electrode located in the recessed area, the auxiliary electrode being located on a side of the first portion away from the substrate; the auxiliary electrode being in contact with a sidewall of an adjacent auxiliary conductive structure; a first signal line located in the non-luminescent area, the first signal line being electrically connected to the auxiliary conductive structure through a via, and the first signal line being used to provide a first voltage signal to the second conductive layer; The auxiliary conductive structure and the auxiliary electrode connecting adjacent auxiliary conductive structures serve as a cathode ring of the light-emitting substrate, and the cathode ring is located in the non-display area and extends along the edge of the light-emitting substrate; The auxiliary conductive structure is located in the non-display area and in the frame area of ​​the light-emitting substrate. A plurality of light-emitting units are located in the display area. The mask used to form the second conductive layer and the functional layer is the same mask.

2. The light-emitting substrate according to claim 1, wherein Also includes: A conductive connection layer includes a conductive connection structure located on a side of the auxiliary electrode facing away from the substrate.

3. The light-emitting substrate according to claim 2, wherein: The conductive connection structure contacts a sidewall of an adjacent auxiliary conductive structure.

4. The light-emitting substrate according to claim 1, wherein The orthographic projection of the second conductive layer on the substrate coincides with the orthographic projection of the functional layer on the substrate; the orthographic projection of the second conductive layer on the substrate is the same in size and shape as the orthographic projection of the functional layer on the substrate, and the coverage area of ​​the functional layer is the same as the coverage area of ​​the second conductive layer; The auxiliary conductive structure is in a strip shape, and a plurality of the auxiliary conductive structures are arranged at intervals along a direction from the non-luminous area to the luminous area.

5. The light-emitting substrate according to claim 1, wherein The functional layer further includes a second portion located on a side of the auxiliary conductive structure away from the substrate, and the first portion and the second portion are broken at a step formed by the auxiliary conductive structure and the recessed area; The second conductive layer further includes a third portion located on a side of the second portion away from the substrate.

6. The light-emitting substrate according to claim 5, characterized in that The third portion and the auxiliary electrode are broken at a step formed by the auxiliary conductive structure and the recessed area.

7. The light-emitting substrate according to claim 1, wherein The light-emitting substrate further comprises: a plurality of light-emitting units located on one side of the substrate; the plurality of light-emitting units are located in the light-emitting area; The light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction away from the substrate; the second electrode is electrically connected to the auxiliary electrode; The auxiliary conductive structure is located outside the area between adjacent light-emitting units; The second conductive layer and the second electrode are provided in the same layer and made of the same material.

8. The light-emitting substrate according to claim 7, wherein: The functional layer and the light-emitting functional layer are arranged on the same layer and made of the same material.

9. The light-emitting substrate according to claim 7, wherein: The first conductive layer and the first electrode are provided in the same layer and made of the same material.

10. The light emitting substrate according to claim 7, wherein All the light-emitting units in the light-emitting area have the same light-emitting color and structure.

11. The light emitting substrate according to claim 7, wherein The luminous color of the light emitting unit is blue, The light-emitting substrate further includes a color conversion layer located on the light-emitting side of the light-emitting unit.

12. The light-emitting substrate according to claim 7, wherein The light emitting color of the light emitting unit is white, The light-emitting substrate further includes: a filter layer located on the light-emitting side of the light-emitting unit; the filter layer includes one or more of red color resistance, green color resistance and blue color resistance.

13. The light-emitting substrate according to claim 1, wherein An angle between a sidewall of the auxiliary conductive structure close to the recessed region and a bottom of the auxiliary conductive structure close to the substrate is 90 degrees, or an obtuse angle.

14. The light-emitting substrate according to claim 1, wherein The auxiliary conductive structure serving as the cathode ring is located on the left frame, the right frame and the upper frame.

15. A light-emitting substrate, characterized in that: The light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least part of the light-emitting area, the light-emitting area is a display area, and the non-light-emitting area is a non-display area. The light-emitting substrate includes: substrate; a first conductive layer, the first conductive layer being located on one side of the substrate, the first conductive layer comprising a plurality of auxiliary conductive structures located in the non-luminous region, with recessed regions being provided between adjacent auxiliary conductive structures; the auxiliary conductive structures being strip-shaped, the plurality of auxiliary conductive structures being arranged at intervals along a direction from the non-luminous region to the luminous region; and the auxiliary conductive structures being located in a border region of the light-emitting substrate; a functional layer, the functional layer comprising a first portion located in the recessed area; a second conductive layer, the second conductive layer comprising an auxiliary electrode located in the recessed area, the auxiliary electrode being located on a side of the first portion away from the substrate; the auxiliary electrode being in contact with a sidewall of an adjacent auxiliary conductive structure; the auxiliary conductive structure and the auxiliary electrode connecting the adjacent auxiliary conductive structures serving as a cathode ring of the light-emitting substrate, the cathode ring being located in the non-display area and extending along an edge of the light-emitting substrate; the functional layer further comprising a second portion located on a side of the auxiliary conductive structure away from the substrate, the first portion and the second portion being broken at a step formed by the auxiliary conductive structure and the recessed area; the second conductive layer further comprising a third portion located on a side of the second portion away from the substrate; the third portion and the auxiliary electrode being broken at a step formed by the auxiliary conductive structure and the recessed area, the mask used to form the second conductive layer and the functional layer being the same mask; a first signal line located in the non-luminescent area, the first signal line being electrically connected to the auxiliary conductive structure through a via, and the first signal line being used to provide a first voltage signal to the second conductive layer; A plurality of light-emitting units are located on one side of the substrate; the plurality of light-emitting units are located in the light-emitting area; the light-emitting units include a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction away from the substrate; the second electrode is electrically connected to the auxiliary electrode; the auxiliary conductive structure is located outside the area between adjacent light-emitting units.

16. A method for preparing a light-emitting substrate, characterized in that: The light-emitting substrate is provided with a light-emitting area and a non-light-emitting area surrounding at least a portion of the light-emitting area, the light-emitting area is a display area, and the non-light-emitting area is a non-display area. The preparation method includes: providing a substrate; forming a first signal line located in the non-luminescent area; forming a first conductive layer on the substrate, the first conductive layer comprising a plurality of auxiliary conductive structures located in the non-luminescent region, with recessed regions provided between adjacent auxiliary conductive structures; connecting a first signal line to the auxiliary conductive structures through a via hole, the first signal line being configured to provide a first voltage signal to the second conductive layer; forming a functional layer, the functional layer including a first portion located in the recessed area; forming a second conductive layer, wherein the second conductive layer includes an auxiliary electrode located in the recessed area, the auxiliary electrode is located on a side of the first portion away from the substrate, and the auxiliary electrode contacts a sidewall of an adjacent auxiliary conductive structure; The auxiliary conductive structure is located in the non-display area and in the frame area of ​​the light-emitting substrate. Multiple light-emitting units are located in the display area. The mask used to form the second conductive layer and the functional layer is the same mask, and there is no need to replace the mask.

17. The method for preparing a light-emitting substrate according to claim 16, wherein: An orthographic projection of the second conductive layer on the substrate coincides with an orthographic projection of the functional layer on the substrate.

18. The method for preparing a light-emitting substrate according to claim 17, wherein: The functional layer further includes a second portion located on a side of the auxiliary conductive structure away from the substrate, and the first portion and the second portion are broken at a step formed by the auxiliary conductive structure and the recessed area.

19. The method for preparing a light-emitting substrate according to claim 18, wherein: The second conductive layer further includes a third portion located on a side of the second portion away from the substrate.

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