Electromagnetic wave shielding housings, inverter parts, air conditioning parts, and automotive parts

Abstract

The electromagnetic shielding frame (121) of the present invention comprises: a resin molded body (101), which is a cured product of a thermosetting resin composition; and a plating layer (103), which is arranged on the surface of the resin molded body (101) (cured product), and the plating layer (103) includes a Cu layer (first plating layer (105)), and the thickness of the Cu layer (first plating layer (105)) is greater than 2 μm and less than 30 μm.

Description

Technical Field

[0001] The present invention relates to an electromagnetic wave shielding frame, an inverter component, an air conditioner component and an automobile component formed of a cured product of a thermosetting resin composition. Background Art

[0002] In recent years, from the perspective of lightweighting, many products and components have gradually been replaced from metal to plastic (i.e., resin molded products). From the perspective of weather resistance and design, such products and components are plated. Various technologies have been proposed for the plating treatment of resin products. For example, as a technology to improve the adhesion between a molded body of a thermosetting resin and a plating film, it is described in Patent Document 1 (Japanese Patent Publication No. 2018-58960). Patent Document 1 describes a packaging resin composition containing an epoxy resin, a phenolic compound, and an aromatic monocarboxylic acid having a specific electron-withdrawing functional group. The packaging material made from the composition is believed to be able to have high adhesion with a plated lead frame at high temperatures.

[0003] In addition, as a document recording a plating method for plastics, Patent Document 2 (Japanese Patent Publication No. 5-59587) can be cited. Patent Document 2 records that calcium carbonate particles with a particle size of 10 μm or less are mixed into a resin that is difficult to plate, such as a polyethylene resin or a polypropylene resin, to form a molded product, and then the molded product is treated in a conventional plating process of an ABS resin including a chemical etching process. It is believed that the conventional plating process and equipment of the ABS resin can be directly used to adhere the plating layer to the PA resin, PP resin, etc. that are difficult to plate.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-58960

[0007] Patent Document 2: Japanese Patent Application Laid-Open No. 5-59587 Summary of the invention

[0008] Technical problem to be solved by the invention

[0009] As described above, it has been found that when products and parts are replaced from metal to plastic, there is still room for improvement in electromagnetic wave shielding properties (also referred to as "electromagnetic wave shielding performance").

[0010] Technical solutions for solving technical problems

[0011] One embodiment of the present invention is an electromagnetic shielding frame having:

[0012] A cured product of a thermosetting resin composition; and

[0013] a plating layer provided on the surface of the solidified object,

[0014] The plating layer includes a Cu layer,

[0015] The thickness of the Cu layer is not less than 2 μm and not more than 30 μm.

[0016] Another embodiment of the present invention is an electromagnetic wave shielding frame having:

[0017] A cured product of a thermosetting resin composition; and

[0018] a coating layer laminated on the surface of the cured product,

[0019] The electromagnetic wave shielding performance of the structure of the cured product and the plated layer is 40 dB or more at a frequency of 10 MHz.

[0020] Another embodiment of the present invention is an inverter component including the above-mentioned electromagnetic wave shielding housing.

[0021] Another embodiment of the present invention is an air conditioning component including the above-mentioned electromagnetic wave shielding housing.

[0022] Another embodiment of the present invention is an automobile component including the above-mentioned electromagnetic wave shielding housing.

[0023] Effects of the Invention

[0024] According to the present invention, the electromagnetic wave shielding property of the housing formed of the resin molded body can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a cross-sectional view showing a structural example of a molded body in the embodiment.

[0026] Figure 2 yes Figure 1 An enlarged view of a portion of the frame area.

[0027] Figure 3 yes Figure 2 FIG. 2 is a diagram showing another example of an enlarged view of a partial region of the frame shown.

[0028] Figure 4 yes Figure 2 This is another example of an enlarged view of a partial region of the frame shown. DETAILED DESCRIPTION

[0029] Hereinafter, the embodiments of the present invention will be described using the accompanying drawings. In addition, in all the drawings, the same reference numerals are used for the same components, and their descriptions are appropriately omitted. In addition, unless otherwise specified, the "to" of the numerical range means from above to below, and the numerical values ​​at both ends are included. In addition, in the present embodiment, the composition can contain each component alone or in combination of two or more components.

[0030] The following describes (1) a frame having electromagnetic wave shielding properties and subjected to a plating treatment, (2) a phenolic resin composition for the frame, and (3) a plating layer, and further describes (4) the adhesion of a specific plating layer based on a formulation example of a phenolic resin composition and (5) the electromagnetic wave shielding properties based on an embodiment.

[0031] In addition, regarding electromagnetic wave shielding properties, three types of electric field wave shielding properties (electric field wave: 10 MHz to 1000 MHz), magnetic field wave shielding properties (magnetic field wave: 10 MHz to 1000 MHz), and electromagnetic field wave shielding properties (electromagnetic field wave: 1000 MHz to 6000 MHz) are described below.

[0032] (Plated frame with electromagnetic wave shielding properties)

[0033] In this embodiment, the inverter component 120 is exemplified as a product (including components) that can be used as the plated frame (molded body 100) having electromagnetic wave shielding properties, but it is not limited thereto. In addition, it can also be used in products or components that require high electromagnetic wave shielding properties, such as air conditioning components and vehicle components.

[0034] Figure 1 1 is a cross-sectional view schematically showing the structure of the inverter unit 120. The inverter unit 120 includes a housing 121 and an inverter circuit 123 provided inside the housing 121.

[0035] The frame 121 is, for example, box-shaped, and contains the inverter circuit 123. At this time, the entire surface of the frame 121 is covered by the plating layer 103. Therefore, the electromagnetic waves emitted by the inverter circuit 123 inside the frame 121 are blocked by the frame 121, and the frame 121 is covered by the plating layer 103 having electromagnetic wave shielding properties. As a result, the electromagnetic waves emitted by the inverter circuit 123 are greatly suppressed from leaking to the outside. In addition, the external electromagnetic waves are blocked from intruding into the interior of the inverter component 120, so that the adverse effects of the external electromagnetic waves on the inverter circuit 123 can be eliminated.

[0036] Figure 2 yes Figure 11 is an enlarged view of a region A1 of a portion of a frame 121. As shown in the figure, the frame 121 has a resin molded body 101 as a frame body and a plating layer 103 formed on one side of the resin molded body 101 (here, the outer surface 125 of the frame 121) in a cross-sectional structure. The resin molded body 101 is, for example, a cured product of a phenolic resin composition. The plating layer 103 includes a first plating layer 105 and a second plating layer 107 from the resin molded body 101 side.

[0037] Hereinafter, the phenolic resin composition (thermosetting resin composition) will be described first, and then the plating layer 103 will be described.

[0038] (Thermosetting resin composition)

[0039] The thermosetting resin composition (hereinafter, also referred to as “resin composition” as appropriate) is a resin composition for a resin molded body whose surface is subjected to a plating treatment, and contains the following components (A) and (B).

[0040] (A) Thermosetting resin;

[0041] (B) Core-shell elastomer particles.

[0042] In the present embodiment, the resin composition is specifically a thermosetting resin composition.

[0043] Hereinafter, the constituent components of the resin composition will be described with reference to specific examples.

[0044] (ingredient (A))

[0045] Component (A) is a thermosetting resin.

[0046] Component (A) may be any component used for molding materials. Specific examples of component (A) include phenolic resins, epoxy resins, urea-formaldehyde (urea) resins, melamine resins and other resins having a triazine ring, bismaleimide resins, unsaturated polyester resins, polyurethane resins, diallyl phthalate resins, silicone resins, cyanate resins, polyimide resins, polyamide-imide resins, benzocyclobutene resins, resins having a benzoxazine ring, polyvinyl butyral resins and polyvinyl acetate resins.

[0047] More specifically, component (A) contains one or more selected from epoxy resins and phenolic resins, preferably contains phenolic resins, and more preferably contains phenolic resins or epoxy resins and phenolic resins. Furthermore, the resin composition is preferably a phenolic resin composition.

[0048] (Phenolic resin)

[0049] As the phenolic resin, for example, there can be mentioned phenolic novolac resins represented by phenol novolac resins and cresol novolac resins, which are obtained by condensing or co-condensing phenols such as phenol, cresol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, α-naphthol, β-naphthol, dihydroxynaphthalene and the like with formaldehyde or ketones in the presence of an acidic catalyst; phenol aralkyl resins having a phenylene skeleton synthesized from the above phenols and dimethoxy-p-xylene or bis(methoxymethyl)biphenyl; phenol aralkyl resins such as phenol aralkyl resins having a biphenylene skeleton; and phenolic resins having a triphenylmethane skeleton.

[0050] The phenolic resin preferably contains one or more selected from the group consisting of resol-type phenolic resins and novolac-type phenolic resins.

[0051] From the viewpoint of improving the adhesion with the plating film formed on the surface of the resin molded body, the component (A) more preferably contains a resol type phenolic resin and a novolac type phenolic resin, and even more preferably a resol type phenolic resin and a novolac type phenolic resin.

[0052] Among them, by including a resol-type phenolic resin in component (A), the adhesion with the plating film formed on the surface of the resin molded body can be improved, and the crosslinking density of the resin molded body can be appropriately increased, the toughness of the resin molded body can be improved, and the mechanical strength can be improved. In addition, since the crosslinking density can be appropriately increased in this way, the dimensional change of the resin molded body due to water absorption / moisture absorption can be effectively suppressed.

[0053] The resol type phenolic resin can be obtained, for example, by reacting phenols and aldehydes in the presence of a basic catalyst, usually at a molar ratio of aldehydes to phenols (aldehydes / phenols) of 1.3 to 1.7.

[0054] Examples of the phenols used in the production of the resol-type phenolic resin include one or more phenol compounds selected from phenol, o-cresol, m-cresol, p-cresol, xylenol, alkylphenols, catechol, and resorcinol.

[0055] Furthermore, examples of aldehydes used in the production of the resol-type phenolic resin include aldehyde compounds such as formaldehyde, paraformaldehyde, and benzaldehyde, and substances that are sources of these aldehyde compounds or solutions of these aldehyde compounds.

[0056] When component (A) contains a resol-type phenolic resin, from the viewpoint of improving the heat resistance of the resin molded body and suppressing the dimensional change of the resin molded body by water absorption / moisture absorption, the content thereof is more than 0% by mass, preferably 50% by mass or more, more preferably 60% by mass or more, further preferably 70% by mass or more, and further preferably 75% by mass or more, relative to the entire component (A) contained in the resin composition.

[0057] Furthermore, from the viewpoint of suppressing the dimensional change of the resin molded body due to heating, the content of the resol-type phenolic resin is 100% by mass or less, preferably 95% by mass or less, more preferably 90% by mass or less, further preferably 85% by mass or less, and even more preferably 80% by mass or less, relative to the entire component (A) contained in the resin composition.

[0058] Furthermore, when the component (A) contains a novolac-type phenolic resin, adhesion with a plating film formed on the surface of the resin molded body can be improved, and the mechanical strength of the resin molded body can be improved.

[0059] Examples of the novolac-type phenolic resin include phenol novolac resins, cresol novolac resins, and bisphenol novolac resins.

[0060] From the viewpoint of improving the adhesion with the plating film formed on the surface of the resin molded body and improving the mechanical strength of the resin molded body, the novolac-type phenolic resin preferably contains one or more resins selected from the group consisting of a resin represented by the following general formula (1) and a resin represented by the following general formula (2).

[0061]

[0062] (In the above general formula (1), R 1 each independently represents a hydrogen atom, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 1 to 10 carbon atoms, or an aryl group or a substituted aryl group having 6 to 10 carbon atoms, and R 2 Each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 1 to 10 carbon atoms, or an aryl group or substituted aryl group having 6 to 10 carbon atoms, and 1 is a number of 1 to 10.)

[0063] The resin represented by the general formula (1) can be appropriately selected from resins obtained by reacting phenols and aldehydes in the absence of a catalyst or in the presence of an acidic catalyst, depending on the application. More specifically, as the resin represented by the general formula (1), a phenolic resin of a random novolac type or a high-ortho-novolac type can be used.

[0064] The novolac-type phenolic resin can generally be obtained by reacting the phenolic compound so that the molar ratio of the aldehyde to the phenolic compound (aldehyde / phenolic compound) is controlled to be 0.7 to 0.9.

[0065] Specific examples of the phenols used in the preparation of the resin represented by the general formula (1) include phenol, o-cresol, m-cresol, p-cresol, xylenol, alkylphenols, catechol, and resorcinol.

[0066] Examples of aldehydes used in the preparation of the resin represented by the general formula (1) include aldehyde compounds such as formaldehyde, paraformaldehyde, and benzaldehyde, and substances that are sources of these aldehyde compounds or solutions of these aldehyde compounds.

[0067]

[0068] (In the above general formula (2), R 1 each independently represents a hydrogen atom, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 1 to 10 carbon atoms, or an aryl group or a substituted aryl group having 6 to 10 carbon atoms, and R 2 Each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 1 to 10 carbon atoms, or an aryl group or substituted aryl group having 6 to 10 carbon atoms, the group X is a divalent group selected from the groups represented by the following general formulae (3) to (5), m is a number of 1 to 10, and n is a number of 1 to 10.

[0069]

[0070] (In the above general formulas (3) to (5), R 3 Each of them is independently a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group having 1 to 10 carbon atoms.)

[0071] When giving a specific example of the method for preparing the resin represented by the general formula (2), the following are the corresponding R 3 The benzene-modified phenolic resin in which all hydrogen atoms are present can be prepared, for example, by reacting p-xylene dimethyl ether with phenols in the presence of an acidic catalyst. 3 In the case of a substituted benzene-modified phenolic resin having an alkyl group having 1 to 10 carbon atoms or a cycloalkyl group having 1 to 10 carbon atoms, the substituted benzene and aldehydes can be reacted in the presence of an acidic catalyst, and the obtained polymer is reacted with phenols or the obtained polymer is reacted with phenols and aldehydes in the presence of an acidic catalyst.

[0072] Thereby, a structural unit derived from benzene or substituted benzene can be introduced into the repeating unit of the novolac-type phenol resin.

[0073] In general formula (2), although terminal structural units are not shown, as such structural units, both structural units derived from phenols and structural units derived from benzene or substituted benzene can be used.

[0074] Furthermore, the modification rate of the resin represented by the general formula (2) is defined by the ratio of n in the general formula (2) to the sum of m and n, i.e., the value of (n / (m+n)). The modification rate can be appropriately adjusted according to the intended use, etc., but when a resin molded body is prepared from the resin composition, from the viewpoint of controlling the crosslinking density to be appropriate, it is, for example, 0.15 or more, preferably 0.20 or more, and, for example, 0.60 or less, preferably 0.50 or less.

[0075] Specific examples of phenols used in preparing the resin represented by general formula (2) include phenol, o-cresol, m-cresol, p-cresol, xylenol, alkylphenols, catechol, resorcinol, etc. These phenols may be used alone or in combination of two or more.

[0076] As aldehydes used in preparing the resin represented by general formula (2), for example, aldehyde compounds such as formaldehyde, paraformaldehyde, benzaldehyde, and substances that are sources of these aldehyde compounds or solutions of these aldehyde compounds can be used. In addition, these aldehydes can be used alone or in combination of two or more.

[0077] Furthermore, examples of the substituted benzene used when preparing the resin represented by the general formula (2) include toluene, xylene, mesitylene, and cyclohexylbenzene.

[0078] When preparing the resin represented by the general formula (2), it is preferred to use benzene or toluene or xylene among the above-mentioned substituted benzenes, and to use R as the phenol from the viewpoint of high availability. 1 A benzene-modified novolac phenolic resin, a toluene-modified novolac phenolic resin or a xylene-modified novolac phenolic resin is prepared by using a phenol in which all the groups are hydrogen atoms, and the resin is set as a resin represented by the general formula (2).

[0079] When component (A) contains a novolac-type phenolic resin, from the viewpoint of excellent processability of the resin molded body, its content exceeds 0% by mass, preferably 5% by mass or more, more preferably 10% by mass or more, further preferably 15% by mass or more, and further preferably 20% by mass or more, relative to the entire component (A) contained in the resin composition.

[0080] Furthermore, from the viewpoint of improving the mechanical strength of the resin molded body, the content of the novolac-type phenolic resin is 100% by mass or less, preferably 50% by mass or less, more preferably 40% by mass or less, further preferably 35% by mass or less, further preferably 30% by mass or less, and further preferably 20% by mass or less, relative to the entire component (A) contained in the resin composition.

[0081] (Epoxy resin)

[0082] The epoxy resin refers to all monomers, oligomers, and polymers having two or more epoxy groups in one molecule, and the molecular weight and molecular structure thereof are not limited.

[0083] Examples of the epoxy resin include bifunctional or crystalline epoxy resins such as biphenyl epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, stilbene epoxy resins, and hydroquinone epoxy resins; novolac epoxy resins such as cresol novolac epoxy resins, phenol novolac epoxy resins, and naphthol novolac epoxy resins; phenol aralkyl epoxy resins such as phenylene skeleton-containing phenol aralkyl epoxy resins, biphenylene skeleton-containing phenol aralkyl epoxy resins, and phenylene skeleton-containing naphthol aralkyl epoxy resins; trifunctional epoxy resins such as trisphenol methane epoxy resins and alkyl-modified trisphenol methane epoxy resins; modified novolac epoxy resins such as dicyclopentadiene-modified novolac epoxy resins and terpene-modified novolac epoxy resins; and epoxy resins containing heterocycles such as triazine core-containing epoxy resins.

[0084] The epoxy resin preferably includes a novolac type epoxy resin, and more preferably includes a cresol novolac type epoxy resin.

[0085] Furthermore, the resin composition may include an epoxy resin and a curing agent. As the curing agent, phenolic resin curing agents, amine curing agents, anhydride curing agents, thiol curing agents, etc. may be cited. Among these, from the perspective of the balance of flame retardancy, moisture resistance, electrical properties, curability, storage stability, etc., phenolic resin curing agents are preferably used. Furthermore, the curing agents of multiple systems may be combined.

[0086] Specific examples of the phenolic resin curing agent include the various phenolic resins described above.

[0087] From the viewpoint of improving the curing characteristics of the resin composition, the content of the component (A) in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 30% by mass or more, based on the entire resin composition.

[0088] Furthermore, from the viewpoint of improving the adhesion with the plating film formed on the surface of the resin molded body, the content of component (A) in the resin composition can be, for example, 99% by mass or less, preferably 90% by mass or less, more preferably 80% by mass or less, further preferably 70% by mass or less, further preferably 60% by mass or less, and further preferably 50% by mass or less, relative to the entire resin composition.

[0089] (Component (B))

[0090] Component (B) is core-shell type elastomer particles.

[0091] By making the resin composition contain the component (A) and the component (B), a resin molded body excellent in adhesion to the plating film can be obtained stably.

[0092] The component (B) is preferably a component that dissolves in an acid.

[0093] Furthermore, the component (B) is, for example, a graft copolymer having a core-shell structure, and more specifically, is composed of a rubbery polymer constituting a core and a graft chain constituting a shell.

[0094] Examples of the material of the core of the component (B) include rubber-like polymers.

[0095] From the perspective of improving the adhesion with the plating film formed on the surface of the resin molded body, the core material preferably includes butadiene (co)polymers such as polybutadiene (butadiene rubber), styrene-butadiene copolymer (styrene-butadiene rubber: SBR), methyl methacrylate-butadiene-styrene copolymer (MBS), and acrylonitrile-butadiene copolymer (nitrile rubber).

[0096] In addition, as the material of the core, in addition to these, there can be mentioned polyisoprene (isoprene rubber), polychloroprene (chloroprene rubber), alkyl acrylate copolymer (acrylic rubber), ethylene-acrylate copolymer (ethylene-acrylic rubber), ethylene-propylene copolymer (ethylene-propylene rubber), epichlorohydrin (co)polymer (epichlorohydrin rubber), organosiloxane (co)polymer (organic silicone rubber), fluororubber, natural rubber and materials obtained by adding or partially adding hydrogen to the unsaturated bond parts of these.

[0097] Furthermore, from the viewpoint of improving the adhesion between the resin molded body and the plating film, the material of the core preferably contains one or more selected from the group consisting of MBS polymers, SBR polymers, and acrylic polymers.

[0098] The material of the shell of component (B) preferably includes, for example, a (co)polymer having a structure derived from one or more monomers selected from aromatic vinyl monomers, (meth)acrylate monomers, and halogenated vinyl monomers.

[0099] Examples of the aromatic vinyl monomer include styrene compounds such as halogenated styrenes such as styrene, methyl (o-, m- or p-) styrene, ethyl styrene, isobutyl styrene, tert-butyl styrene, alkoxy styrene and bromostyrene; and naphthalene compounds such as vinyl naphthalene.

[0100] Specific examples of the (meth)acrylate monomer include alkyl methacrylates such as methyl methacrylate, ethyl methacrylate, hydroxyethyl methacrylate, propyl methacrylate, butyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, and octyl methacrylate; and alkyl acrylates such as methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, cyclohexyl methacrylate, 2-ethylhexyl acrylate, and octyl acrylate.

[0101] Specific examples of the halogenated vinyl monomer include vinyl chloride.

[0102] Furthermore, from the viewpoint of improving the adhesion between the resin molded body and the plating film, the material of the shell preferably includes one or more selected from polycarbonate (PC), polybutylene terephthalate (PBT), polyvinyl chloride (PVC) and polymethyl methacrylate (PMMA).

[0103] Examples of commercially available products of component (B) include Kane Ace M series such as Kane Ace M711, Kane Ace M701, Kane Ace M577, and Kane Ace M210 (manufactured by KANEKA CORPORATION);

[0104] Kane Ace B series such as Kane Ace B513 (manufactured by KANEKA CORPORATION); and

[0105] Staphyroid series (manufactured by AICA Kogyo Co., Ltd.) represented by Staphyroid AC series, such as product name "Staphyroid AC-3832" (alkyl acrylate-alkyl methacrylate copolymer microparticles), product name "Staphyroid AC-3816N" (alkyl acrylate-alkyl methacrylate copolymer microparticles), and product name "Staphyroid AC-4030" (alkyl acrylate-alkyl methacrylate copolymer microparticles).

[0106] From the viewpoint of improving the adhesion between the resin molded body and the plating film, the content of component (B) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, further preferably 1% by mass or more, further preferably 1.5% by mass or more, and further preferably 2.5% by mass or more, relative to the entire resin composition.

[0107] Furthermore, from the viewpoint of improving the strength of the resin molded body, the content of component (B) in the resin composition is preferably 10% by mass or less, more preferably 8% by mass or less, further preferably 6% by mass or less, and further preferably 4% by mass or less, relative to the entire resin composition.

[0108] In the present embodiment, since the resin composition comprises components (A) and (B), when the surface of a resin molded body composed of a cured product of the resin composition is subjected to a plating treatment, the adhesion between the resin molded body and the plated film can be effectively improved. Therefore, the resin composition of the present embodiment is preferably used to obtain a resin molded body subjected to a plating treatment on the surface.

[0109] In the present embodiment, the resin composition may contain components other than the components (A) and (B).

[0110] (Filling material)

[0111] The resin composition may further contain a filler other than the component (B). Examples of the shape of the filler other than the component (B) include fibrous and spherical particles.

[0112] Specific examples of fibrous fillers include glass fiber, carbon fiber, fibrous wollastonite and asbestos. The number average fiber diameter of the fibrous filler is, for example, 10 to 15 μm, and the number average fiber length is, for example, 20 to 5000 μm. By using such a fibrous filler, the workability when manufacturing the resin composition can be improved, and the mechanical strength of the resin molded body can be further improved.

[0113] Specific examples of the granular filler include spherical inorganic fillers, more specifically, spherical glass such as glass beads and glass powder; silica such as spherical silica and crushed silica; kaolin; calcium carbonate; aluminum hydroxide; clay; and mica.

[0114] From the viewpoint of improving adhesion with a plating film formed on the surface of the resin molded body and improving the mechanical strength of the resin molded body, the resin composition preferably contains an inorganic filler, more preferably contains a fibrous inorganic filler, and even more preferably contains glass fiber.

[0115] From the viewpoint of improving the mechanical strength of the resin molded body, the content of the glass fiber in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, further preferably 30% by mass or more, and further preferably 40% by mass or more, relative to the entire resin composition.

[0116] Furthermore, from the viewpoint of improving the curing characteristics of the resin composition, the content of the filler in the resin composition is preferably 70% by mass or less, more preferably 65% ​​by mass or less, and even more preferably 60% by mass or less, based on the entire resin composition.

[0117] Furthermore, the resin composition may further contain an elastomer other than component (B). Specific examples of the elastomer other than component (B) include one or more selected from butadiene rubber, butadiene-acrylonitrile copolymer, and modified polyvinyl alcohols such as alkyl acetalized polyvinyl alcohol.

[0118] In addition, the resin composition may contain various additives for thermosetting resin molding materials. Specific examples of the additives include mold release agents such as stearic acid, calcium stearate, magnesium stearate, carnauba wax, polyethylene, etc.; curing aids such as magnesium oxide, calcium hydroxide (slaked lime), etc.; colorants such as carbon black; adhesion enhancers or coupling agents for improving the bonding between the filler and the thermosetting resin; and solvents.

[0119] The content of these components in the resin composition is, for example, approximately 0.1 to 5% by mass, respectively, based on the entire resin composition.

[0120] For example, as the coupling agent, specifically, one or more of the known coupling agents selected from various silane compounds such as epoxy silane, aminosilane, phenylaminosilane, alkylsilane, ureidosilane, vinylsilane, methacrylate silane, titanium compounds, aluminum chelates, aluminum / zirconium compounds, etc. can be cited.

[0121] (Matching example)

[0122] (Preparation of resin composition)

[0123] For each of the formulation examples, a resin composition for encapsulation was prepared as follows. That is, a mixture obtained by blending each component in the blending amount shown in Table 1 was kneaded using heated rollers with different rotation speeds, and the material cooled in a flake form was crushed to obtain a granular molding material (thermosetting resin composition). Among them, regarding the kneading conditions of the heated rollers, the rotation speed was set to 20 / 14 rpm for the high speed side / low speed side, the temperature was set to 90 / 20°C for the high speed side / low speed side, and the kneading time was set to 5 to 10 minutes.

[0124] The details of each component in Table 1 are as follows. In addition, the mixing ratio of each component shown in Table 1 represents the mixing ratio (mass %) with respect to the entire resin composition.

[0125] (A) Thermosetting resin 1: Resol type phenolic resin, PR-53529 (manufactured by Sumitomo Bakelite Co., Ltd.)

[0126] (A) Thermosetting resin 2: Novolac type phenolic resin, PR-51305 (manufactured by Sumitomo Bakelite Co., Ltd.)

[0127] (A) Thermosetting resin 3: Novolac type phenolic resin, PR-51967 (manufactured by Sumitomo Bakelite Co., Ltd.)

[0128] (A) Thermosetting resin 4: o-cresol type epoxy resin, Epiclon N-670 (manufactured by DIC Corporation)

[0129] Curing aid 1: slaked lime

[0130] Curing aid 2: 2-phenyl-4-methylimidazole, 2P4MZ (manufactured by Shikoku Chemicals Co., Ltd.)

[0131] Filler 1: Glass fiber, CS3E479 (manufactured by Nittobo Co., Ltd.), average fiber diameter 11 μm, average fiber length 3 mm

[0132] Filler 2: Crushed silica, RD-8 (manufactured by Ryzen Co., Ltd.), average particle size d 50 =15μm

[0133] (B) Elastomer 1: core-shell type, core: MBS polymer, KaneAce M701 (manufactured by KANEKA CORPORATION)

[0134] (B) Elastomer 2: core-shell type, core: acrylic polymer, shell: PVC, Kane Ace M577 (manufactured by KANEKA CORPORATION)

[0135] Elastomer 3: Butadiene-acrylonitrile copolymer, TR2250 (manufactured by JSR Corporation)

[0136] Elastomer 4: Alkyl acetalized polyvinyl alcohol, ES-LEC BH-3 (manufactured by Sekisui Chemical Co., Ltd.)

[0137] Release agent 1: Calcium stearate, CA-ST (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0138] Colorant 1: Carbon black, #5 (manufactured by Mitsubishi Chemical Corporation)

[0139] The following measurements were performed on the resin composition obtained in each example.

[0140] (Method for measuring physical properties of resin molded article)

[0141] (Method for measuring coefficient of linear expansion (CTE))

[0142] For the resin composition obtained in each example, the bending test piece was molded at 175°C for 3 minutes, and then cured in an oven at 180°C for 8 hours to obtain a cured test piece. TMA measurements were performed in the flow direction (planar direction or XY direction) and thickness direction (Z direction) of the obtained test piece. TMA measurements were performed at a temperature increase of 5°C / min, and the average linear expansion coefficient of 40 to 150°C was set as CTE.

[0143] (Evaluation method)

[0144] (Determination method of peel strength)

[0145] The resin composition obtained in each example was molded into a 125 mm square × 1.5 mm thick molded article at 175°C for 90 seconds to obtain a resin molded body. Thereafter, the plated film-forming surface of the resin molded body obtained by curing at 180°C for 8 hours in an oven was subjected to chromic acid etching to roughen the plated film-forming surface. The etching solution was an aqueous solution containing chromic anhydride and sulfuric acid at the following concentrations, respectively.

[0146] (Etching liquid)

[0147] Ingredient concentration

[0148] Chromic anhydride 400g / L

[0149] Sulfuric acid 400g / L

[0150] After that, a 0.1 to 3 μm Ni film was formed on the etched surface of the resin molded body by electroless Ni plating, and then a 10 to 50 μm Cu film was formed by electrolytic Cu plating. The plating width was set to 10 mm. The composition of the plating solution (aqueous solution) used in each plating step is shown below.

[0151] (Electroless Ni plating solution)

[0152]

[0153] (Electrolytic Cu plating solution)

[0154] Ingredient concentration

[0155] Copper sulfate 200g / L

[0156] Sulfuric acid 50g / L

[0157] The strength when the plated layer as the adherend is vertically peeled off from the molded body obtained as described above, that is, the maximum peel strength when a 90° peel test is performed is defined as the peel strength. The strength is measured as follows.

[0158] Measurement method: After peeling one end of the copper foil (adherent) to an appropriate length, install it on a support bracket, clamp the front end of the peeled copper foil with a clamp, and continuously peel about 50 mm in a direction perpendicular to the copper foil surface at a speed of about 50 mm per minute in the direction of stretching. The minimum value of the load during this period is set as the peel strength [N / cm].

[0159] (Measurement method of flexural strength and flexural elastic modulus)

[0160] For the resin composition obtained in each example, a bending test piece was formed under the curing conditions of 175° C. and 3 minutes based on JIS K 6911, and then cured at 180° C. for 8 hours to obtain a test piece. The strength when the test piece was broken by the method based on JIS K 6911 was defined as the bending strength. In addition, the bending modulus was calculated from the slope of the stress-strain curve in the elastic domain.

[0161]

[0162] As can be seen from Table 1, in the molded bodies obtained by using the resin compositions in Formulation Examples 1 and 2, the peel strength of the plated film from the resin molded body is higher than that of the molded bodies in Formulation Examples 3 to 6. Therefore, by using the resin compositions in Formulation Examples 1 and 2, the adhesion between the plated film and the resin molded body when the plated film is formed on the surface of the resin molded body can be improved.

[0163] Furthermore, the resin composition obtained in each example also has preferable characteristics in terms of the flexural strength, flexural modulus and linear expansion coefficient of the cured product.

[0164] Next, the physical properties of the resin composition or its cured product will be described.

[0165] From the viewpoint of improving the reliability of the temperature cycle of the molded body obtained by plating the surface of the resin molded body, for the cured product obtained by molding the resin composition at 175°C for 3 minutes and then curing it at 180°C for 8 hours, the linear expansion coefficient in the plane direction (XY direction, MD) in the range of 40°C to 150°C measured by thermomechanical analysis (TMA) at a heating rate of 5°C / min is preferably 5 ppm / °C or more, more preferably 8 ppm / °C or more, further preferably 10 ppm / °C or more, and can be, for example, 70 ppm / °C or less, preferably 30 ppm / °C or less, more preferably 25 ppm / °C or less, further preferably 20 ppm / °C or less, and further preferably 18 ppm / °C or less.

[0166] From the same point of view, that is, from the point of view of improving the reliability of the temperature cycle of the molded body obtained by plating the surface of the resin molded body, for the cured product obtained by molding the resin composition at 175°C for 3 minutes and then curing it at 180°C for 8 hours, the linear expansion coefficient in the thickness direction (Z direction, TD) in the range of 40°C to 150°C measured by thermomechanical analysis (TMA) at a heating rate of 5°C / min is preferably 5 ppm / °C or more, more preferably 10 ppm / °C or more, further preferably 15 ppm / °C or more, further preferably 20 ppm / °C or more, and can be, for example, 70 ppm / °C or less, preferably 35 ppm / °C or less, more preferably 30 ppm / °C or less, and further preferably 25 ppm / °C or less.

[0167] Regarding the method for manufacturing the resin composition, for example, the above-mentioned components can be mixed by a known method, further melt-kneaded by a mixer such as a roller, a kneader or an extruder, and then pulverized after cooling. And, as needed, after pulverization in the above method, a granular resin composition can be obtained by tablet molding in the shape of an ingot. And, after pulverization in the above method, a sheet-like resin composition can be obtained, for example, by vacuum lamination molding or compression molding. And, the dispersibility or fluidity of the obtained resin composition can be appropriately adjusted.

[0168] Among them, when the resin composition contains a filler, it is preferred to mix the component (B) and the filler in advance and then mix the mixture with the component (A) from the viewpoint of excellent dispersibility of the raw materials. More specifically, the component (B) and the filler are pre-treated and mixed using a mixer equipped with rotating blades such as a Henschel mixer. In this case, it is more preferred to pre-treat and mix the component (B), the filler and the coupling agent.

[0169] (Resin molded body)

[0170] The resin molded body (molded article) is composed of a cured product of the above-mentioned resin composition.

[0171] The resin molded body can be obtained by molding the above resin composition. The molding method is preferably transfer molding or injection molding.

[0172] The conditions at this time also depend on the thickness of the resin molded body. For example, when a molded product with a wall thickness of about 5 mm is molded by injection molding, the conditions that can be used are a mold temperature of 170 to 190°C, a molding pressure of 100 to 150 MPa, and a curing time of 30 to 90 seconds.

[0173] Furthermore, the obtained resin molding can be post-baked as required, and the post-baking conditions can be appropriately selected according to the purpose. For example, the maximum reaching temperature can be set to 150°C to 270°C, and the holding time can be set to 1 hour to 15 hours. More preferably, the maximum reaching temperature can be set to 170°C to 240°C, and the holding time can be set to 1 hour to 10 hours. There is a tendency that the higher the post-baking is performed at a high temperature, the smaller the heating dimensional change in the use environment.

[0174] Furthermore, from the viewpoint of further improving the adhesion between the resin molded body and the plating film, the resin molded body preferably has a sea-island structure, and more preferably the resin molded body has a sea-island structure, and the component (C) is present in the island phase.

[0175] Among them, the sea-island structure can be confirmed by electron microscope observation.

[0176] (Molding body)

[0177] The molded body comprises a cured product of the resin composition and a plating layer provided in contact with the surface of the cured product. The molded body is used as Figure 1 The inverter component 120 shown is a frame 121 (resin molded body 101).

[0178] As mentioned above Figure 2 As shown, the molded body 100 (frame 121) includes a resin molded body 101 composed of a cured product of a resin composition and a plating layer 103 provided in contact with the surface of the resin molded body 101. The plating layer 103 may be composed of one layer or may have a plurality of layers, for example, Figure 2 2 shows a structure in which the plating layer 103 includes a first plating layer 105 and a second plating layer 107 from the resin molded body 101 side.

[0179] Furthermore, the plating layer 103 is preferably provided on the entire surface of the resin molded body 101 .

[0180] The plating methods of the first plating layer 105 and the second plating layer 107 may be the same or different.

[0181] The first plating layer 105 is specifically an electroless plating layer from the viewpoint of improving the adhesion between the resin molded body and the plating layer 103. Furthermore, the second plating layer 107 may be an electroless plating layer or an electrolytic plating layer.

[0182] Furthermore, the first plating layer 105 and the second plating layer 107 are specifically metal layers, and for example, these layers are independently layers containing one or more selected from Cu, Ni, Al, Fe, Au, and alloys thereof.

[0183] From the viewpoint of improving the adhesion between the resin molded body and the plating layer 103 , it is preferred that one of the first plating layer 105 and the second plating layer 107 is a Ni film and the other is a Cu film.

[0184] From the viewpoint of improving the adhesion between resin molded body 101 and plating layer 103 , resin molded body 101 preferably has a roughened layer on the bonding surface with plating layer 103 , and plating layer 103 is provided inside a recess provided in the roughened layer.

[0185] From the viewpoint of improving adhesion with the second plating layer 107 or improving electromagnetic wave shielding properties, the thickness of the first plating layer 105 is preferably 0.1 μm or more, more preferably 0.3 μm or more, and preferably 5 μm or less, more preferably about 3 μm.

[0186] From the viewpoint of improving electromagnetic wave shielding properties, the thickness of the second plating layer 107 is preferably 0.5 μm or more, more preferably 1 μm or more, and is preferably 50 μm or less, more preferably 30 μm or less.

[0187] Furthermore, from the viewpoint of improving electromagnetic wave shielding properties, the thickness of the entire plating layer 103 is preferably 0.1 μm or more, more preferably 0.5 μm or more, and is preferably 60 μm or less, more preferably 30 μm or less.

[0188] (Preferred plating when high electromagnetic wave shielding properties are required)

[0189] Among them, Figure 1 In the case where high electromagnetic wave shielding properties are required, such as when the molded body 100 is applied to the frame 121 of the inverter component 120, the plating layer 103 is preferably configured as follows. That is, from the perspective of both electromagnetic wave shielding properties and weather resistance (rust prevention function), Figure 2 In the embodiment, the first plating layer 105 on the resin molded body 101 side is preferably a Cu film (Cu layer) and the second plating layer 105 on the outside is preferably a Ni film (Ni layer). That is, the Cu film that contributes to electromagnetic wave shielding is set as the first plating layer 105, and the Ni layer with high rust resistance is set as the second plating layer 107.

[0190] At this time, the thickness of the first plating layer 105 (Cu layer) and the second plating layer 107 (Ni layer) preferably satisfies the following values. That is, the first plating layer 105 (Cu layer) is preferably 1.5 μm or more, more preferably 2 μm or more, and further preferably 2.5 μm or more, and is preferably 60 μm or less, and more preferably 30 μm or less.

[0191] The thickness of the second plating layer (Ni layer) is preferably 0.1 μm or more, more preferably 0.3 μm or more, and is preferably 30 μm or less, more preferably 20 μm or less.

[0192] Thereby, high electromagnetic wave shielding properties can be achieved.

[0193] (Effects of Embodiment (Electromagnetic Shielding Properties))

[0194] The specific values ​​of the electromagnetic wave shielding properties will be described in the following examples. Figure 2 In the case of single-sided plating shown, the shielding of magnetic field waves can achieve 40dB or more (blocking 99% or more) at a frequency of 10MHz, and 60dB or more (99.9% or more) at a frequency of 100MHz. As shielding of electric field waves, both the frequencies of 10MHz and 100MHz can achieve 60dB or more (99.9% or more).

[0195] (Another example of a plating layer that exhibits high electromagnetic wave shielding properties)

[0196] Figure 3 yes Figure 2 1 is a cross-sectional view of another example of an enlarged view of a region A1 of a portion of the frame 121 shown, and shows a case where the plating layer 103 is provided on both the outer surface 125 and the inner surface 126 of the resin molded body 101 (in the case of double-sided plating). In the case of double-sided plating, both the magnetic field wave and the electric field wave can achieve shielding properties equivalent to the measurement limit. That is, with respect to the shielding properties of either the magnetic field wave or the electric field wave, more than 60 dB (blocking more than 99.9%) can be achieved at a frequency of more than 10 MHz.

[0197] Figure 4 yes Figure 2 FIG. 1 is a cross-sectional view of another example of an enlarged view of a region A1 of a portion of the frame body 121 shown. Figure 4 The frame 121B has three plating layers 103B on the outer surface 125 of the resin molded body 101. That is, the plating layer 103B has a first plating layer 105B, a second plating layer 107B, and a third plating layer 109B in this order from the resin molded body 101 side.

[0198] An example of the plating layer 103B is as follows: That is, the first plating layer 105B is a Ni film (Ni layer). The thickness of the first plating layer 105B is, for example, 0.25 μm.

[0199] The second plating layer 107B is a Cu film (Cu layer). The thickness of the second plating layer 107B is, for example, 5 μm.

[0200] The third plating layer 109B is a permalloy film (permalloy layer). The thickness of the third plating layer 109B is, for example, 5 μm. Permalloy is an alloy mainly composed of Ni and Fe.

[0201] In addition, two plating layers of Ni film (Ni layer) and Cr film (Cr layer) can be formed from the second plating layer 109B side instead of the Permalloy film (Permalloy layer) (not shown) constituting the third plating layer 109B. In this case, for example, the thickness of the Ni film (Ni layer) is 5 μm, and the thickness of the Cr film (Cr layer) is 0.15 μm.

[0202] The above is an example of the plating layer 103 when high electromagnetic wave shielding properties are required like the inverter component 120 .

[0203] (Method for producing molded article)

[0204] Next, a method for producing the molded body 100 is described. The method for producing the molded body includes, for example, the steps of preparing a resin molded body 101 which is a cured product of the resin composition, etching and roughening the surface of the resin molded body 101, and forming a plating layer 103 on the roughened surface.

[0205] The step of roughening the surface of the resin molded body 101 by etching is specifically a step of dissolving and removing calcium carbonate present near the surface of the resin molded body 101 before plating treatment. In addition, when the resin molded body 101 contains an elastomer dissolved in the etching solution, the elastomer present near the surface of the resin molded body 101 is preferably removed together with the calcium carbonate.

[0206] As an etching method, for example, acid treatment can be cited. As specific examples of the acid used for the acid treatment, chromic acid, sulfuric acid, etc. can be cited. For example, when the acid used is only chromic acid, the etching conditions can be appropriately set according to the types of components such as thermosetting resin contained in the resin molded body 101.

[0207] Furthermore, it is preferable to clean and neutralize the surface of the resin molded body 101 after the acid treatment and before forming the plating layer 103 .

[0208] In the process of forming the plating layer 103, the first plating layer 105 and the second plating layer 107 are sequentially formed using a known method according to the type of metal constituting the plating film and the plating method. For example, a seed layer is formed on the roughened surface of the resin molded body 101, and a metal film is grown based on the seed layer.

[0209] In this embodiment, since the rough layer is formed on the resin molded body 101, the first plated layer 105 can be formed by filling the inside of the recessed portion provided in the rough layer with the plated film. Therefore, the plated layer 103 having excellent adhesion to the resin molded body 101 can be obtained.

[0210] Through the above, we can obtain Figure 2A shaped body 100 is shown.

[0211] The use of the molded article 100 obtained in this embodiment is not limited, and can be expanded to various uses, for example, it can be used for aircraft parts, automobile parts, electronic equipment parts, home appliance parts, industrial equipment parts, etc.

[0212] Among them, the molded body 100 can be preferably used for parts in which the coating 103 functions as a heat diffusion part or parts in which the coating 103 functions as an electromagnetic wave shield, for example, parts of inverters, parts of air conditioners, parts of electric motors, control parts of automobiles (ECU control devices), etc.

[0213] As mentioned above, although embodiment of this invention was described, these are illustrations of this invention, and various structures other than the above-mentioned can also be adopted.

[0214] [Example]

[0215] Hereinafter, the present embodiment will be described in detail with reference to Examples and Comparative Examples. In addition, the present embodiment is not limited to the description of these Examples.

[0216] With reference to Table 2 and Table 3, the structure of the plating layer 103 and embodiments related to electromagnetic shielding properties are described.

[0217] Table 2 shows the compounding amounts and plating levels of the resin molded bodies of Examples 1 to 4 and Comparative Examples 1 to 3. The details of the components in Table 2 are the same as those in Table 1.

[0218] Table 3 shows the measurement results of the electromagnetic wave shielding performance of the resin molded bodies of Examples 1 to 4 and Comparative Examples 1 to 3.

[0219] (Overview of molded articles having a plated layer and molded articles of comparative examples)

[0220] In Examples 1 to 4, an electromagnetic shielding plating layer was formed on a resin molded body (a cured body of a phenolic resin composition) as shown in Table 2. As components of the resin molded body, the components shown in Compound Example 1 in Table 1 were used.

[0221] Example 1 is an example in which two layers of a Cu film of 2.5 μm and a Ni film of 0.3 μm are plated on both sides of a resin molded body 101 as the plated layer 103 .

[0222] Example 2 is an example in which two layers of a Cu film of 2.5 μm and a Ni film of 0.3 μm are plated as the plating layer 103 on one side of a resin molded body 101 .

[0223] Example 3 is an example in which four layers of Ni film 0.25 μm, Cu film 5 μm, Ni film 5 μm, and Cr film 0.15 are plated on both sides of a resin molded body 101 as the plating layer 103 .

[0224] Example 4 is an example in which three layers of a Ni film of 0.25 μm, a Cu film of 5 μm, and a Permalloy film of 5 μm are plated on both sides of a resin molded body 101 as the plating layer 103 .

[0225] Comparative Example 1 is an example in which the resin molded body of Comparative Example 3 is subjected to double-sided coating.

[0226] Comparative Example 2 is an example in which the resin molded body of Comparative Example 3 is subjected to single-side coating.

[0227] Comparative Example 3 is an example of a phenolic resin (resin molded body without plating).

[0228] In addition, regarding Example 1 and Example 2, electric field waves, magnetic field waves, and electromagnetic field waves were measured.

[0229] Only the electromagnetic field wave was measured for Example 3 and Example 4. Both the electric field wave and the magnetic field wave were measured for Comparative Examples 1 to 3.

[0230] Furthermore, in Examples 1 and 2, when the Cu layer was directly provided on the resin molded body 101 , a Cu seed layer was formed on the resin molded body 101 , and the Cu layer was formed thereon by electrolytic plating.

[0231] (Sample preparation method)

[0232] Sample for measuring electric field wave / magnetic field wave shielding performance: A molded product having a size of 125 mm square and 1.5 mm thick obtained by molding at 175° C. for 1 minute was used.

[0233] Sample for measuring electromagnetic shielding performance: A molded product of 80 mm×50 mm×0.9 mm in thickness obtained by molding at 175° C. for 3 minutes was processed into a product of 5 mm square×0.9 mm in thickness and used.

[0234] (Electromagnetic wave shielding performance measurement method)

[0235] The shielding performance of electric field waves and magnetic field waves was measured based on the KEC method, and the shielding performance of electromagnetic field waves was measured based on a method called the GHz KEC method.

[0236] (Measurement method of flexural strength)

[0237] The JIS bending test piece was formed at 175° C. for 3 minutes, and the strength when the test piece was broken by a method based on JIS K 6911 was defined as the bending strength.

[0238] (Method for measuring coefficient of linear expansion (CTE) α)

[0239] A JIS bending test piece was formed at 175°C for 3 minutes and cured at 180°C for 8 hours to obtain a test piece, and TMA measurement in the flow direction was performed at a temperature increase of 5°C / min, and the average linear expansion coefficient at 40 to 150°C was defined as α.

[0240]

[0241]

[0242] As shown in the measurement results of Table 3, for Comparative Examples 1 to 3 where plating treatment is not performed, there is no example that can satisfy a blocking rate of more than 99% under all conditions. For example, the electric field wave of Comparative Example 1 (double-sided coating) is more than 40dB (blocking rate more than 99%), but the magnetic field wave is less than 30dB. This is insufficient for the market demand for electromagnetic wave shielding in recent years. In Comparative Example 2 (single-sided coating), the electric field wave is slightly higher than 40dB at 10MHz and 100MHz, which is insufficient as electromagnetic wave shielding performance.

[0243] On the other hand, in Examples 1 to 4 in which the plating treatment is implemented, very high electromagnetic shielding properties are exhibited. For example, in the results of Example 1 (double-sided plating), the values ​​are roughly equivalent to the measurement limit under any conditions. That is, it has very high electromagnetic wave shielding performance. Under the conditions of Example 2 (single-sided plating), although it does not reach 60dB (blocking 99.9%) at a magnetic field wave of 10MHz, it is 50.0dB, which blocks 99% (40dB) or more, and has sufficiently high electromagnetic wave shielding performance. Under other conditions, it is more than 60dB, which has very high electromagnetic wave shielding properties.

[0244] This application claims priority based on Japanese Patent Application No. 2019-232496 filed on December 24, 2019, and incorporates all the contents of the present disclosure therein.

[0245] Explanation of symbols

[0246] 100: molded body, 101: resin molded body, 103: plating layer, 105, 105B: first plating layer, 107, 107B: second plating layer, 109B: third plating layer, 120: inverter component, 121, 121B: frame, 123: inverter circuit, 125: outer surface, 126: inner surface.

Claims

1. An electromagnetic wave shielding frame, characterized in that: have: A cured product of a thermosetting resin composition; and a plating layer provided on the surface of the solidified object, The thermosetting resin composition is a phenolic resin composition, The phenolic resin composition comprises the following component A and component B: A: Phenolic resins including resol type phenolic resins and novolac type phenolic resins, B: core-shell elastomer particles, The content of the component A is 30% by mass or more and 50% by mass or less relative to the entire phenolic resin composition. The content of the component B is 2.5% by mass or more and 4% by mass or less relative to the entire phenolic resin composition. The content of the resol-type phenolic resin is 70% by mass or more and 85% by mass or less relative to the entire component A. The content of the novolac-type phenolic resin is 15% by mass or more and 30% by mass or less relative to the entire component A. The plating layer includes a Cu layer, The thickness of the Cu layer is not less than 2 μm and not more than 30 μm.

2. The electromagnetic wave shielding frame according to claim 1, characterized in that: The cured product obtained by molding and then curing the thermosetting resin composition has a linear expansion coefficient of 5 ppm / °C to 25 ppm / °C in a range of 40°C to 150°C as measured by thermomechanical analysis at a heating rate of 5°C / min.

3. The electromagnetic wave shielding frame according to claim 1, characterized in that: The cured product of the thermosetting resin composition has a flexural strength of 140 MPa or more.

4. The electromagnetic wave shielding frame according to claim 1, wherein: The cured product of the thermosetting resin composition has a 90 degree peel strength of 4 N / cm or more as measured by 90 degree peeling under the following conditions, Peeling speed: 50mm / min, Adherend: copper foil.

5. The electromagnetic wave shielding frame according to claim 1, wherein: The plating layer includes a Ni-containing plating layer provided on the outer side of the Cu layer in the stacking direction.

6. The electromagnetic wave shielding frame according to claim 5, characterized in that: The thickness of the Ni-containing plating layer is not less than 0.3 μm and not more than 20 μm.

7. The electromagnetic wave shielding frame according to any one of claims 1 to 4, characterized in that: The plating layer includes a permalloy layer provided on the outer side of the Cu layer in the stacking direction.

8. The electromagnetic wave shielding frame according to any one of claims 1 to 4, characterized in that: The plating layer includes a Ni-containing plating layer between the Cu layer and the solidified material.

9. The electromagnetic wave shielding frame according to any one of claims 1 to 4, characterized in that: The electromagnetic wave shielding performance of the structure of the cured product and the plating layer provided on the surface of the cured product is 40 dB or more at a frequency of 10 MHz.

10. The electromagnetic wave shielding frame according to any one of claims 1 to 4, characterized in that: The electromagnetic wave shielding performance of the structure of the cured product and the plating layer provided on the surface of the cured product is 60 dB or more at a frequency of 100 MHz.

11. An inverter component, characterized in that: A method comprising the electromagnetic wave shielding frame according to any one of claims 1 to 10.

12. An air conditioning component, characterized in that: A method comprising the electromagnetic wave shielding frame according to any one of claims 1 to 10.

13. An automobile component, characterized in that: A method comprising the electromagnetic wave shielding frame according to any one of claims 1 to 10.

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