A method for reducing the color temperature and blue light radiation of a white light LED lighting source

Abstract

The present invention relates to an acoustic wave assisted thin film deposition device and its application. The acoustic wave assisted thin film deposition device is a closed container, in which an acoustic wave generator and a material source containing thin film deposition material are arranged. The acoustic wave generator is controlled by an acoustic wave controller to realize common vibration with the material source, so that the thin film deposition material inside is deposited on an LED light source sample. The acoustic wave assisted thin film deposition device of the present invention is suitable for the reprocessing process of a white light LED light source to obtain a white light LED light source with low color temperature and low blue light radiation. The process has the advantages of simple and cheap equipment, simple and fast operation, and green environmental protection.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED lighting lamps, and in particular relates to a method for reducing the color temperature and blue light radiation of a white light LED lighting source by using an acoustic wave-assisted thin film deposition device. Background Art

[0002] LED has attracted wide attention from academia and industry due to its advantages such as high brightness, high color rendering, energy saving and environmental protection, and is widely used in the fields of display and lighting. At present, white light LED lighting lamps on the market are mainly made of blue light LED chips coated with yellow phosphor, which leads to the disadvantages of high color temperature and high blue light radiation of white light LED lighting lamps, which seriously affects people's eye health.

[0003] Uniformly depositing a thin film of fluorescent material on an LED lighting source can effectively reduce its color temperature and blue light radiation. For example, Chinese patent CN 110061119 A discloses a method for reducing the color temperature and blue light radiation of an LED light source, which is used to solve the problem that high color temperature and high blue light radiation LED light sources are too harmful to the human body. The invention method is to evenly spin-coat the prepared ZnO quantum dot solution on the LED light source by spin coating, dry it, and encapsulate it, thereby preparing a low blue light radiation LED lamp with a color temperature between 4200K and 2500K and a 60% reduction in blue light radiation. However, the disadvantage of the spin coating method is that when using quantum dot materials with poor solubility, there are technical problems such as difficulty in film formation, high process difficulty, and low yield. Therefore, it is particularly important to develop a simple and easy-to-operate film preparation process and equipment for high melting point and low solubility materials. Summary of the invention

[0004] The object of the present invention is to provide an acoustic wave assisted thin film deposition device, so as to convert a white light LED lighting lamp with high color temperature and high blue light radiation into a white light LED lighting lamp with low color temperature and low blue light radiation through a simple and easy-to-operate process.

[0005] The technical solution adopted by the method of the present invention is as follows.

[0006] An acoustic wave assisted thin film deposition device, characterized in that the device body is a closed container, an acoustic wave generator is arranged on the top of the closed container, and the emission frequency and operation time of the acoustic wave are controlled by an acoustic wave controller arranged outside the device body; a material source is arranged at the lower end of the vibration part of the acoustic wave generator, and the material source is filled with powder material, and a sample table is fixedly installed at the bottom of the closed container at a position vertically corresponding to the material source.

[0007] Furthermore, the material source is a box-shaped container with a small hole with a pore size of 10-1000 μm at the bottom, which contains powder material for thin film deposition. Under the action of the acoustic wave generator, the powder material is evenly deposited toward the sample stage through the small hole.

[0008] In a specific embodiment, the sound wave controller is an arbitrary waveform generator, and is connected to the sound wave generator via a data line or wirelessly.

[0009] In a specific embodiment, the sound wave generator is an oscillator.

[0010] The present invention also provides a method for reducing the color temperature and blue light radiation of a white light LED lighting source, characterized in that the aforementioned acoustic wave assisted thin film deposition device is used to deposit a layer of one or more mixed fluorescent material films with absorption peaks and excitation peaks at 400-450nm and 500-700nm respectively on a white light LED lighting source encapsulated with epoxy resin potting glue but the potting glue is not solidified.

[0011] Furthermore, the method for reducing the color temperature and blue light radiation of a white light LED lighting source comprises the following steps:

[0012] Step 1: adding a fluorescent material having a volume of 1 / 3 to 2 / 3 of the volume of the material source (4) to the material source (4) of the acoustic wave assisted thin film deposition device;

[0013] Step 2: using the acoustic wave assisted thin film deposition device described in claims 1 to 4 to deposit a layer of one or more mixed fluorescent material thin films with absorption peaks and excitation peaks at 400-450nm and 500-700nm on a white light LED lighting source encapsulated with epoxy resin potting glue and the epoxy resin potting glue is not cured;

[0014] Step 3: drip epoxy resin potting glue on the upper surface of the white light LED lighting source with the fluorescent material film deposited to encapsulate the deposited fluorescent material film, and put it into a vacuum drying oven for degassing and curing after it is leveled.

[0015] As a preferred embodiment, the specific steps of fluorescent material film deposition in step 2 are: (1) placing a white light LED lighting source in the middle of the sample table and closing the sealed container; (2) setting the sound wave frequency to 100-800 Hz, turning on the sound wave generator, and turning off the sound wave generator after assisting the film deposition for a certain period of time; (3) after waiting for a period of time, opening the container and taking out the white light LED lighting source.

[0016] As a preferred embodiment, the time interval between the completion of encapsulating the white light LED lighting source with epoxy resin potting glue and the start of depositing the mixed fluorescent material is 5-30 minutes.

[0017] As a preferred embodiment, the acoustic wave assisted deposition time is 10-200s.

[0018] As a preferred embodiment, in step three, the degassing temperature of the encapsulation glue is 50°C and the time is 10 minutes; 1 ml of encapsulation glue is dripped on the surface of the white light LED lighting source, the leveling time is 2 minutes, and the degassing and curing temperature and time are 50°C and 60 minutes.

[0019] The method of reducing the color temperature and blue light radiation of a white light LED lighting lamp by using the device of the present invention has the following advantages:

[0020] (1) Using simple instruments and processes to reduce the color temperature and blue light radiation of LED light sources is beneficial to people's eye health and improves the lighting quality of white light LED lighting sources;

[0021] (2) Using sound waves of a specific frequency to assist in the deposition of fluorescent material films is easy to control and has high repeatability;

[0022] (3) The process uses simple instruments and a simple process flow, which is conducive to reducing production costs and simplifying the process;

[0023] (4) Improve the existing white light LED lighting to transform it into a low color temperature, low blue light LED lighting. Improvements are only made on the original LED lighting production line, which is easy to industrialize.

[0024] (5) Depositing fluorescent materials on white light LED lighting sources that are encapsulated with epoxy resin potting glue but not cured can help improve the density of the fluorescent material to increase the absorption rate of blue light radiation. On the other hand, it can help the LED potting glue to embed into the fluorescent material and enhance the adhesion between the LED potting glue on the upper and lower surfaces of the fluorescent material. The nano-fluorescent material can be stably encapsulated in the LED panel to prevent leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the acoustic wave assisted thin film deposition device.

[0026] Figure 2 The structure diagram of a white light LED lighting source prepared by the device and method disclosed in the present invention.

[0027] Figure 3 This is the luminescence spectrum of the LED device prepared in Example 1.

[0028] Figure 4 This is the luminescence spectrum of the LED device prepared in Example 2.

[0029] Figure 5 This is the luminescence spectrum of the LED device prepared in Example 3. DETAILED DESCRIPTION

[0030] The technical concept and specific technical solutions of the present invention are further illustrated by specific embodiments below.

[0031] like Figure 1 As shown, the device body 1 of the acoustic wave assisted thin film deposition device of the present invention is a closed container, in which an acoustic wave generator 2, a material source 4, and a sample stage 6 are arranged; the acoustic wave generator 2 realizes the control of the acoustic wave by connecting with the acoustic wave controller 3 outside the closed container; the material source 4 is fixedly installed at the lower end of the vibration part of the acoustic wave generator 2, and the material source 4 is filled with thin film deposition material. The bottom of the material source 4 has a small hole 5 with an aperture size of 10-1000μm, and the sample stage 6 is arranged at the bottom of the device vertically facing the material source 4. Under the action of the acoustic wave generator 2, the material source 4 evenly deposits powder material toward the sample stage 6, so as to form a certain thickness of one or more mixed fluorescent material films with absorption peaks and excitation peaks of 400-450nm and 500-700nm respectively on the surface of the sample.

[0032] In the acoustic wave assisted thin film deposition device of the present invention, the sealed container 2 is made of a highly elastic material, such as a cardboard, a plastic board, an acrylic board or the like.

[0033] In the acoustic wave assisted thin film deposition device of the present invention, the acoustic wave controller 3 may be an arbitrary waveform generator or a mobile communication device, which is connected to the acoustic wave generator 2 via a data line or wirelessly.

[0034] In the acoustic wave assisted thin film deposition device of the present invention, the acoustic wave generator 2 is a waveform generating device, such as an oscillator or an audio device.

[0035] As a preferred embodiment, in the acoustic wave assisted thin film deposition device, the sample stage is a plastic plate, acrylic plate, cardboard or polytetrafluoroethylene plate with a flat surface, which is fixed to the bottom of the sealed container using elastic ropes, elastic screws or double-sided tape with foam board.

[0036] Figure 2 The structure of the prepared LED device is shown, including a substrate 7, an electroluminescent chip 8, an LED encapsulation adhesive 9 for protecting the light-emitting chip 8, a fluorescent material film 10, and an LED encapsulation adhesive 11 for protecting the fluorescent material film.

[0037] The white light LED lighting lamps used in the following Examples 1-3 are LED integrated light sources produced by a certain enterprise, the rare earth ion fluorescent materials used are purchased from the market, and the remaining fluorescent materials are synthesized in the laboratory. In the experiment, the light color and electricity comprehensive test system is used to test the light spectrum, color temperature, color rendering and other parameters of the white light LED lighting lamps.

[0038] Example 1

[0039] This embodiment is implemented on a white LED integrated light source with a color temperature of 9040K, and its luminous spectrum and color temperature are tested using a light color and electricity test system. 2g of YAG:Ce is added to the material source of the acoustic wave assisted thin film deposition device. 3+ Red fluorescent material, and fix the material source on the sound wave generator; add 1ml of epoxy resin encapsulation glue mixed and stirred in a volume ratio of A liquid: B liquid = 10:1 on the white light LED integrated light source, and let it stand for 5 minutes; put the white light LED integrated light source with epoxy resin encapsulation glue added on the sample stage of the sound wave assisted thin film deposition device, adjust the sound wave frequency to 400Hz, and let it stand for 5 minutes after assisted deposition for 10 seconds; add 1ml of the same epoxy resin potting glue as above on the surface of the white light LED integrated light source after the fluorescent material film is deposited to encapsulate the deposited mixed fluorescent material film, let it stand for 2 minutes, put it into a vacuum drying oven at 50℃ for degassing and drying for 60 minutes before taking it out; use the optical color and electrical testing system to test its spectrum and color temperature, and the results show that its color temperature is 3802K, and the luminescence spectrum is as follows Figure 3 As shown, it proves that its blue light radiation is significantly reduced.

[0040] Example 2

[0041] This embodiment is implemented on a white LED integrated light source with a color temperature of 5800K, and its luminous spectrum and color temperature are tested using a light color and electricity test system. 2g of YAG:Ce is added to the material source of the acoustic wave assisted thin film deposition device. 3+ Red fluorescent material, and fix the material source on the sound wave generator; add 1ml of epoxy resin encapsulation glue mixed and stirred in a volume ratio of A liquid: B liquid = 10:1 on the white light LED integrated light source, and let it stand for 5 minutes; put the white light LED integrated light source with epoxy resin encapsulation glue added on the sample stage of the sound wave assisted thin film deposition device, adjust the sound wave frequency to 500Hz, and let it stand for 5 minutes after assisted deposition for 30 seconds; add 1ml of the same epoxy resin potting glue as above on the surface of the white light LED integrated light source after the fluorescent material film is deposited to encapsulate the deposited mixed fluorescent material film, let it stand for 2 minutes, put it into a vacuum drying oven at 50℃ for degassing and drying for 60 minutes, and then take it out; use the optical color and electrical testing system to test its spectrum and color temperature. The results show that its color temperature is 2570K, and the luminescence spectrum is as follows Figure 4 As shown, it proves that its blue light radiation is significantly reduced.

[0042] Example 3

[0043] This embodiment is implemented on a white LED integrated light source with a color temperature of 6285K, and its luminous spectrum and color temperature are tested using a light color and electricity test system. 2g of YAG:Ce is added to the material source of the acoustic wave assisted thin film deposition device. 3+Red fluorescent material, and fix the material source on the sound wave generator; add 1ml of epoxy resin encapsulation glue mixed and stirred in a volume ratio of A liquid: B liquid = 10:1 on the white light LED integrated light source, and let it stand for 5 minutes; put the white light LED integrated light source with epoxy resin encapsulation glue added on the sample stage of the sound wave assisted thin film deposition device, adjust the sound wave frequency to 400Hz, and let it stand for 5 minutes after assisted deposition for 8s; add 1ml of the same epoxy resin potting glue as above on the surface of the white light LED integrated light source after the fluorescent material film is deposited to encapsulate the deposited mixed fluorescent material film, let it stand for 2 minutes, put it into a vacuum drying oven at 50℃ for degassing and drying for 60 minutes, and then take it out; use the optical color and electrical testing system to test its spectrum and color temperature. The results show that its color temperature is 3992K, and the luminescence spectrum is as follows Figure 5 As shown, it proves that its blue light radiation is significantly reduced.

Claims

1. A method for reducing the color temperature and blue light radiation of a white light LED lighting source, It is characterized in that The steps include: Step 1: depositing a layer of one or more mixed fluorescent material thin films with absorption peaks and excitation peaks at 400-450nm and 500-700nm respectively on a white light LED lighting source encapsulated by epoxy resin potting glue but not cured by using an acoustic wave assisted thin film deposition device; Step 2: drip epoxy resin potting glue on the upper surface of the white light LED lighting source where the fluorescent material film is deposited to encapsulate the deposited fluorescent material film, and after it is leveled, put it into a vacuum drying oven for degassing and curing; In the above method, the acoustic wave assisted thin film deposition device comprises an apparatus body (1) and an acoustic wave controller (3), wherein the apparatus body (1) is a closed container, an acoustic wave generator (2) is arranged at the top of the closed container, and the emission frequency and operation time of the acoustic wave are controlled by the acoustic wave controller (3) arranged outside the apparatus body (1); A material source (4) is arranged at the lower end of the vibration part of the sound wave generator (2), and the material source (4) contains powder material. A sample table (6) is arranged at the bottom of the sealed container at a position vertically corresponding to the material source (4). The material source (4) is a box-shaped container with a small hole (5) with a pore size of 10-1000μm at the bottom, which contains powder material for thin film deposition. Under the action of the acoustic wave generator (2), the powder material is evenly deposited on the sample on the sample table (6) through the small hole (5).

2. A method for reducing the color temperature and blue light radiation of a white light LED lighting source as claimed in claim 1, It is characterized in that The steps of depositing the fluorescent material film in step 1 are as follows: (1) Place the white light LED lighting source in the middle of the sample stage and close the sealed container; (2) setting the acoustic wave frequency to 100-800 Hz, turning on the acoustic wave generator, and turning off the acoustic wave generator after assisting the thin film deposition for a certain period of time; (3) After waiting for a while, open the container and take out the white light LED lighting source.

3. A method for reducing the color temperature and blue light radiation of a white light LED lighting source as claimed in claim 2, It is characterized in that The acoustic wave assisted deposition time is 10-200s.

4. A method for reducing the color temperature and blue light radiation of a white light LED lighting source as claimed in claim 1, It is characterized in that The time interval between the completion of encapsulating the white light LED lighting source with epoxy resin potting glue and the start of the deposition of the mixed fluorescent material is 5-30 minutes.

5. A method for reducing the color temperature and blue light radiation of a white light LED lighting source as claimed in claim 1, It is characterized in that The degassing temperature of epoxy resin encapsulation glue is 50℃ and the time is 10min. 1ml of encapsulation glue is added to the surface of white light LED lighting source, the leveling time is 2min, and the degassing and curing temperature and time are 50℃ and 60min.

6. A method for reducing the color temperature and blue light radiation of a white light LED lighting source according to any one of claims 1 to 5, It is characterized in that The sound wave controller (3) is an arbitrary waveform generator or a mobile communication device, which is connected to the sound wave generator (2) via a data line or wirelessly.

7. A method for reducing the color temperature and blue light radiation of a white light LED lighting source according to any one of claims 1 to 5, It is characterized in that The sound wave generator (2) is an oscillator or an audio device.

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