An experimental device for impedance characteristic research of flexible flaw detection sensor

Abstract

The present application relates to a kind of experimental apparatus for the impedance characteristic study of flexible flaw detection sensor, belong to sensing technology field.The experimental apparatus includes bearing module, regulation and control module and acquisition module.Bearing module is composed of fixed bearing unit and movable bearing unit;Regulation and control module is composed of two-dimensional moving platform and its controller;Acquisition module is composed of impedance analyzer and microprocessor.Flexible flaw detection sensor is placed on fixed bearing unit, target object is placed on movable bearing unit, two-dimensional moving platform parameters are set using controller, movable bearing unit is controlled to move to change the relative position between flexible flaw detection sensor and defect in target object, and the impedance value of flexible flaw detection sensor is recorded by impedance analyzer and collected in microprocessor.The experimental apparatus designed in the present application can obtain the impedance response data of flexible flaw detection sensor for different positions and shape defects in target object, and provides experimental environment and conditions for performance research and prototype development of flexible flaw detection sensor.

Description

Technical Field

[0001] This invention belongs to the field of sensing technology, and specifically relates to the study of impedance characteristics of flexible flaw detection sensors. Background Technology

[0002] Flaw detection in metal workpieces plays a crucial role in modern industry. With technological advancements, many engineering applications require flaw detection sensors with excellent flexibility, capable of conforming smoothly to curved surfaces to perform flaw detection tasks. Conductive polymer composite coils possess intrinsic flexibility and conductivity, making them suitable as sensitive units in flexible flaw detection sensors. Their impedance changes systematically with the shape and location of flaws in the metal workpiece, thus holding the potential to perform flaw detection tasks using their impedance response. However, research on flexible flaw detection sensors is still in its early stages, lacking fully functional and technologically mature experimental setups for conducting related research. This has become a bottleneck in the further development of flexible flaw detection sensor prototypes. Therefore, how to construct an experimental setup for studying the impedance characteristics of flexible flaw detection sensors is a pressing problem that needs to be solved in this field. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of existing technologies and propose an experimental device for studying the impedance characteristics of flexible flaw detection sensors. The experimental device includes a support module, a control module, and a data acquisition module. The support module consists of a fixed support unit and a movable support unit; the fixed support unit includes a support platform, a fixed guide rail, a slider, a fixing groove, a metal clamp, and a lead wire groove; the movable support unit includes a movable guide rail, a movable stage, and a crossbeam. The slider fixes the movable guide rail, and the movable stage is combined with the movable guide rail to support the target object. The control module consists of a two-dimensional moving stage and its controller. The controller drives a stepper motor to provide power to the two-dimensional moving stage via an electrical signal. The two-dimensional moving stage is connected to the crossbeam of the movable support unit via a guide rod, realizing the displacement control of the target object supported by the two-dimensional moving stage. The acquisition module consists of an impedance analyzer and a microprocessor. The device is used by placing the flexible flaw detection sensor on a fixed support unit and securing it with metal inserts. The target object is placed on a movable stage of a movable support unit. The controller sets the operating parameters of a stepper motor, which drives a two-dimensional moving stage, controlling its movement within a two-dimensional plane and changing the relative position of the target defect and the flexible flaw detection sensor. Simultaneously, the impedance analyzer in the acquisition module provides alternating current to the flexible flaw detection sensor at a set frequency, acquiring the sensor's impedance value and storing it in the microprocessor, providing experimental data for studying the impedance characteristics of the flexible flaw detection sensor.

[0004] In this invention, the support module is used to fix and support the flexible flaw detection sensor and the target object. The support platform supports the fixed guide rail and the flexible flaw detection sensor. The fixing groove is located in the center of the support platform and is square. Each end of the fixing groove has a lead wire groove leading to the edge of the support platform. A metal clip is installed at the interface between the lead wire groove and the fixing groove. When the flexible flaw detection sensor is placed in the fixing groove, the metal clip can fix the lead wire of the flexible flaw detection sensor. The other side of the metal clip is connected to a metal wire and connected to an external circuit through the lead wire groove. The fixed guide rail is located on both sides of the fixing groove on the support platform. The center of the guide rail is a circular slide bar, which is used to support movable sliders and support the movable support unit. There are four sliders, which are respectively fitted onto the slide bar between the two fixed guide rails and can slide back and forth on the fixed guide rail to support the movable guide rail. The track is fixed on two sliders, perpendicular to the fixed guide rail, with a circular sliding rod in the middle, allowing it to move back and forth along the fixed guide rail with the support of the sliders. There are two movable platforms, each embedded in the circular sliding rod between the two movable guide rails. The movable platforms can slide back and forth between the movable guide rails. The two movable platforms are connected by a crossbeam, enabling simultaneous, unidirectional, and unidirectional movement. The target object is located on the movable platform. When the movable platform moves along the guide rail, it can move the target object simultaneously, changing the relative position of the target object and the flexible flaw detection sensor. The crossbeam is located between the two movable platforms and connected to them. The crossbeam is connected to the two-dimensional moving stage through a guide rod. When the two-dimensional moving stage moves, it drives the crossbeam through the guide rod, causing the movable platforms to move in a set direction, and the target object above the movable platforms changes position accordingly.

[0005] In this invention, the control module controls the relative distance between the target object and the flexible flaw detection sensor, and adjusts various components at the location of the target object's defects. By changing the position of the defects, the flexible flaw detection sensor sweeps over the defects. The two-dimensional moving stage includes a stepper motor, an X-axis displacement axis, a Y-axis displacement axis, and a connecting platform. Each of the X-axis and Y-axis displacement axes has a stepper motor mounted at one end. The controller communicates with the stepper motors via an RS232 interface, sets the stepper motor displacement parameters, and the stepper motors provide power to the two-dimensional moving stage's axis-shifting screw, thereby controlling the displacement of the two-dimensional moving stage. The controller can quantitatively control the movement direction, movement distance, and movement speed of the two-dimensional moving stage's X-axis and Y-axis displacement axes.

[0006] In this invention, the experimental platform is used by placing a flexible flaw detection sensor in a fixed slot of the support platform. Metal clips are embedded at both ends of the fixed slot. The endpoints of the flexible flaw detection sensor's leads are connected to the metal clips at both ends of the fixed slot. The downward pressure of the elastic metal clips ensures good contact between the flexible flaw detection sensor's leads and the external circuit, and also fixes the flexible flaw detection sensor. The metal clips are embedded in lead slots leading to the edge of the support platform, and external metal wires pass through the lead slots on both sides. A target object of a certain size is placed on the movable platform. The vertical distance between the target object and the upper surface of the flexible flaw detection sensor is 1 mm. The crossbeam in the middle of the movable platform is connected to the connecting platform of the two-dimensional moving platform via a guide rod. The movable platform moves in a specified direction under the control of the two-dimensional moving platform, realizing the control module's control of the target object's relative position in the horizontal direction. The controller sets the motion parameters of the stepper motor, controlling the two-dimensional moving platform to make the movable platform move at a uniform speed, allowing the flexible flaw detection sensor to scan the defects of the target object at a uniform speed. Metal wires are used to connect the acquisition module and the flexible flaw detection sensor. The flaw detection sensor is connected, and the parameters of the impedance analyzer are set, including the output voltage and excitation frequency. An impedance meter is used to provide alternating currents of different frequencies to the flexible flaw detection sensor, while the impedance values ​​of the flexible sensor are collected and stored in the microprocessor to obtain the impedance response data of the flexible flaw detection sensor to the defect location. The above flaw detection experiment is repeated with target objects having defects of different depths. The impedance values ​​of the flexible flaw detection sensor are collected under different excitation frequencies using the impedance analyzer to obtain the impedance response data of the flexible flaw detection sensor to the defect depth at different frequencies. The above flaw detection experiment is repeated with target objects having the same defect depth but different widths. The impedance values ​​of the flexible flaw detection sensor are collected under different excitation frequencies using the impedance analyzer to obtain the impedance response data of the flexible flaw detection sensor to the defect width at different frequencies. The above flaw detection experiment is repeated when the angle of the target object is adjusted to change the angle between the defect and the direction of movement, to obtain the impedance response data of the flexible flaw detection sensor to the defect at different scanning angles.

[0007] Features and effects of the present invention

[0008] When conducting impedance characteristic experiments using the experimental apparatus designed in this invention, the flexible flaw detection sensor is fixed to a support platform, and its leads are secured with metal clips to reduce sensor movement and prevent damage to its internal structure. The two-dimensional moving stage and movable support unit enable flaw detection research on target objects within a two-dimensional plane. During testing, the following functions can be achieved: acquiring impedance response data of flexible flaw detection sensors with different mass ratios to defects at different excitation frequencies; moving the target object within a two-dimensional plane and acquiring impedance response data of the flexible flaw detection sensor to the defect location; adjusting the angle between the defect and the direction of movement to acquire impedance response data of the flexible flaw detection sensor to defects at different scanning angles; and detecting metal plates with defects of different depths or widths to investigate the impedance response data of the flexible flaw detection sensor to defect depth and width. This experimental apparatus provides an experimental environment and conditions for studying the performance of flexible flaw detection sensors, and is particularly suitable for the field of non-destructive testing based on thin-film sensor probes. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the overall structure of the experimental setup.

[0010] Figure 2 This is a schematic diagram of a fixed load-bearing unit structure.

[0011] Figure 3 This is a schematic diagram of a movable load-bearing unit structure.

[0012] Figure 4 This is a schematic diagram of the control module structure.

[0013] The components represented by the numbers in the attached diagram are as follows:

[0014] 1. Bearing module; 2. Control module; 3. Data acquisition module;

[0015] 4. Fixed bearing unit; 401. Support platform; 402. Fixed guide rail; 403. Slider; 404. Fixed groove; 405. Lead wire groove; 406. Metal clip;

[0016] 5. Movable load-bearing unit; 501. Movable guide rail; 502. Movable platform; 503. Crossbeam;

[0017] 6. Two-dimensional moving stage; 601. X-axis displacement axis; 602. Y-axis displacement axis; 603. Connecting platform; 604. Stepper motor; 605. Guide rod; 7. Controller; 8. Impedance analyzer; 9. Microprocessor. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] In this invention, an experimental apparatus (structure as follows) for studying the impedance characteristics of flexible flaw detection sensors is provided. Figure 1 As shown in the diagram, it includes a support module 1, a control module 2, and a data acquisition module 3. The support module includes a fixed support unit 4 (as shown in the diagram). Figure 2 (as shown) and movable support unit 5 (as shown in the schematic diagram) Figure 3 As shown in the diagram), the control module 2 (as shown in the diagram) Figure 4 The system includes a two-dimensional moving stage 6 and a controller 7; the acquisition module 3 includes an impedance analyzer 8 and a microprocessor 9; the fixed support unit 4 is used to fix the flexible flaw detection sensor, and the movable support unit 5 is used to support the target object; the two-dimensional moving stage 6 is connected to the movable support unit 5 to control the relative position between the target object defect and the flexible flaw detection sensor; the controller 7 sends a displacement control signal to control the movement direction of the movable support unit 5 through the two-dimensional moving stage 6, so as to realize the movement of the target object in a two-dimensional plane; the acquisition module 3 and the impedance analyzer 8 provide alternating currents of different frequencies for magnetic field excitation of the flexible flaw detection sensor, and acquire the impedance response data of the flexible flaw detection sensor, which is stored in the microprocessor 9, providing an experimental environment and conditions for the performance research and prototype development of the flexible flaw detection sensor.

[0020] In this invention, the supporting module 1 is a component that fixes the flexible flaw detection sensor and provides support for the target object; the fixed supporting unit 4 (such as...) Figure 2 The fixing groove 404 and metal clip 406 (as shown) fix the flexible flaw detection sensor, and the movable support unit 5 (as shown) Figure 3The movable guide rail 501 and movable platform 502 (shown) provide support for the target object, and the crossbeam 503 connects the movable platform 502. The support platform 401 in the fixed bearing unit 4 is used to support and fix the flexible flaw detection sensor, with dimensions of 40cm (length) × 40cm (width) × 5cm (height). Each corner of the support platform has a countersunk hole 10cm from the edge. The upper part of the countersunk hole is a 6mm diameter threaded hole with a depth of 10mm, and the lower part is a 10mm diameter circular hole with a depth of 10mm. The fixed guide rail 402 is connected to the support platform 401 through a countersunk threaded hole. The support platform 401 has a square fixing groove 404 in the center, with dimensions of 10cm (length) × 5cm (width) × 3mm (depth), for placing the flexible flaw detection sensor. Metal clips 405 are embedded at both ends of the fixing groove 404. The metal clips 405 are elastic and fit tightly against the bottom surface of the fixing groove 404. The leads at both ends of the flexible flaw detection sensor are inserted under the metal clips 405. The downward pressing force of the metal clips 405 ensures good contact between the flexible flaw detection sensor and the external circuit. It also serves to fix the flexible flaw detection sensor. The metal clip 405 is embedded in the lead wire groove 406 leading to the edge of the support platform. The lead wire groove 406 is 3mm (width) × 3mm (depth) in size, and metal wires pass through the lead wire grooves on both sides. The metal clip 405 is connected to the acquisition module 3 by external metal wires to form a conductive path. The fixing guide rail 402 is fixed above the support platform 401, 10cm away from the edge. The fixing guide rail 402 is 40cm (length) × 5cm (width) × 3cm (height) in size, and has a smooth surface. The slider 403 has a round hole in the middle and is fitted onto the fixed guide rail. The cylindrical guide rod inside the fixed guide rail 402 can slide back and forth above the fixed guide rail 402; the movable bearing unit 5 has a movable guide rail 501 fixed above the slider 402 and perpendicular to the fixed guide rail 401. The movable platform 502 is fitted into the circular slide rod inside the movable guide rail 501 through a circular hole. The movable platform 502 has dimensions of 10cm (length) × 6cm (width) × 3cm (height) and is used to carry the target object. The two movable platforms 502 are connected by a crossbeam 503 to ensure that the two movable platforms 502 move simultaneously, in the same direction and at the same distance.

[0021] In this invention, the control module 2 (e.g. Figure 4As shown, the relative position of the target object and the flexible flaw detection sensor is changed by controlling the two-dimensional moving stage 6. The two-dimensional moving stage 6 has an X-direction displacement axis 601, a Y-direction displacement axis 602, a connecting platform 603, and a stepper motor 604. The X-direction displacement axis 601 is located at the bottom layer, and its lower surface is flush with the bottom surface of the support platform 401 of the fixed bearing unit 4. The Y-direction displacement axis 602 is located above the X-direction displacement axis 601, and the two are perpendicular to each other. The connecting platform 603 is located above the Y-direction displacement axis 602. The movable stage 6 moves back and forth under the action of the helical rod on the Y-direction displacement axis 602. The connecting platform 603 is connected to the crossbeam 503 of the movable bearing unit 5 through the guide rod 605. The connecting platform 603 controls the moving direction and moving speed of the movable stage 502 through the guide rod 605. There is a stepper motor 604 at one end of the X-direction displacement axis 601 and the Y-direction displacement axis 602. The moving parameters of the stepper motor position 604 are set by the controller 7 to set the moving direction, moving distance and moving speed of the two-dimensional moving stage 6.

[0022] In this invention, the acquisition module 4 consists of an impedance analyzer 8 and a microprocessor 9. The impedance analyzer 8 comprises a touch screen, a power switch, a display switch button, an internal resistance measurement circuit, and an impedance measurement circuit. The operating mode and parameters of the impedance analyzer 8 can be set through the touch screen. The power switch 802 is used to supply power to the impedance analyzer 8, and the display switch is used to control the opening and closing of the touch screen. The impedance analyzer 8 requires 220V AC power, and the maximum output voltage is 5V. The excitation frequency, AC voltage, data acquisition rate, and operating mode of the impedance analyzer 8 can be set through the touch screen. The excitation frequency is adjustable from 10Hz to 1MHz. During flaw detection, the impedance analyzer 8 operates in LCR mode, which can acquire the impedance modulus and impedance angle of the flexible flaw detection sensor in real time, provide alternating currents with different excitation frequencies to the flexible flaw detection sensor, and excite an alternating magnetic field. At the same time, the acquired impedance values ​​of the flexible flaw detection sensor are transmitted to the microprocessor 9 for storage, thereby obtaining impedance response data of the flexible flaw detection sensor to the target defect at different frequencies.

[0023] In this invention, the experimental device is used by placing a flexible flaw detection sensor in a fixed groove 404 in the middle of the fixed support unit 4. The size and shape of the fixed groove 404 roughly match the flexible flaw detection sensor. Metal clips 405 are embedded at both ends of the fixed groove 404. The end of the lead wire of the flexible flaw detection sensor is fixed below the metal clip 405. The elasticity and downward squeezing force of the metal clip 405 ensure good contact between the lead wire of the flexible flaw detection sensor and the metal clip 405, and fix the flexible flaw detection sensor. The metal clip 405 is embedded at the port of the lead wire groove 406 leading to the edge of the support platform 401. The external metal wire of the metal clip 405 passes through the lead wire grooves 406 on both sides, and the metal wire is connected to the acquisition module 3 to form a passage. The target object is placed on the movable platform 502 for support. The crossbeam 504 and the connecting platform 603 of the two-dimensional moving platform 6 are connected by the guide rod 605.Turn on the power switch 802 to connect the impedance analyzer 8 to the power supply. Connect the interface to the external wire of the lead slot 406. Turn on the touch screen switch and set the working mode and related parameters of the impedance analyzer 8 through the touch screen display. Set the output AC voltage to 5V and the excitation frequency to 1kHz to provide alternating current to the flexible flaw detection sensor. At the same time, detect the impedance value of the flexible flaw detection sensor and store the collected impedance value in the microprocessor 9. Set the displacement parameters of the stepper motor 604 through the controller 7. The stepper motor 604 will move according to the control... The controller sets parameters to drive the X-axis 601 and Y-axis 602 of the two-dimensional moving stage 6. First, the X-axis 601 drives the connecting platform 603 to move at a constant speed in the positive X direction. The connecting platform 603 drives the crossbeam 503 through the guide rod 605, which in turn drives the movable platform 502 to move. The target object located on the movable platform 502 also moves at a constant speed in the positive X direction. When the flexible flaw detection sensor scans the defect of the target object, the controller 7 drives the stepper motor 604 to adjust the Y-axis 602, which in turn drives the connecting platform 603. The device moves at a constant speed in the positive Y direction, and then moves along the negative X direction via the displacement axis 601 in the X direction. Through the transmission between the connecting platform 603, guide rod 605, crossbeam 503, and movable stage 502, the target object is moved in a two-dimensional plane, realizing the flaw detection experiment of the flexible flaw detection sensor on the target object in a two-dimensional plane at a fixed frequency. The above flaw detection experiment is repeated with target objects with defects of different depths. The impedance value of the flexible flaw detection sensor is collected by the impedance analyzer 8 and stored in the microprocessor 9 to obtain the impedance response data of the flexible flaw detection sensor to the defect depth at a certain excitation frequency. The above flaw detection experiment is repeated by adjusting the excitation frequency of the impedance analyzer 8 to obtain the impedance response data of the flexible flaw detection sensor to the defect position at different frequencies. The above flaw detection experiment is repeated with target objects with the same defect depth but different widths to obtain the impedance response data of the flexible flaw detection sensor to the defect width at the same excitation frequency. When the angle of the target object is adjusted to change the angle between the defect and the moving direction, the above flaw detection experiment is repeated to obtain the impedance response data of the flexible flaw detection sensor to the defect at different scanning angles.

Claims

1. An experimental apparatus for studying the impedance characteristics of flexible flaw detection sensors, characterized in that, The experimental setup includes a support module, a control module, and a data acquisition module. The support module consists of a fixed support unit and a movable support unit. The control module consists of a two-dimensional moving stage and its controller. The data acquisition module consists of an impedance analyzer and a microprocessor. A flexible flaw detection sensor is placed on the fixed support unit, and the target object is placed on the movable support unit. The controller sets the operating parameters of the two-dimensional moving stage, controlling the movement of the movable support unit to change the relative position between the flexible flaw detection sensor and the defect in the target object. The impedance response data of the flexible flaw detection sensor is recorded by the impedance analyzer and acquired by the microprocessor. The support module fixes the flexible flaw detection sensor, provides support for the target object, and controls the movement of the movable support unit. The system determines the trajectory and range of the target object's movement. The fixed support unit comprises a support platform, fixed guide rails, fixed grooves, metal clips, lead wire grooves, and a slider. It provides fixation for the flexible flaw detection sensor and support for the movable support unit. The support platform has a fixed groove in the middle, with elastic metal clips embedded at both ends, tightly fitting the bottom of the groove. The leads at both ends of the flexible flaw detection sensor are inserted under the metal clips and combined with them. The squeezing force of the metal clips ensures good contact between the leads and the external circuitry and also fixes the flexible flaw detection sensor. The metal clips are embedded in the lead wire grooves leading to the edge of the support platform, with metal wires passing through the lead wire grooves on both sides. External metal wires connected to the metal clips are connected to the acquisition module. The movable support unit consists of two movable guide rails perpendicular to the fixed guide rails, a movable platform, and a crossbeam. The movable guide rails are located above the sliders and are fixed to them via threaded holes. Each movable guide rail has a movable platform mounted on it, allowing it to slide back and forth between the rails. The two platforms are connected by the crossbeam to support the target object. The target object slides along the fixed and movable guide rails, supported by the movable guide rails and platforms. The control module uses an electrical signal to drive a stepper motor and control the two-dimensional moving platform, enabling the movable platform carrying the target object to move. The platform moves horizontally within a two-dimensional plane, enabling the flexible flaw detection sensor to scan and detect defects in the target object in two dimensions. The two-dimensional moving platform has two displacement axes, X and Y, each with a stepper motor at one end. The motion parameters are set by a controller. The lower X-axis displacement axis controls the left and right movement of the target object along the X direction, while the upper Y-axis displacement axis guide rail is connected to the X-axis displacement axis guide rail via a support base, pulling the target object forward and backward along the Y direction. The Y-axis displacement axis guide rail has a connecting platform sleeved on it, which is connected to the movable platform crossbeam of the movable support unit, controlling the movement of the movable platform. The controller can set the movement direction, movement distance, and movement speed parameters of the two-dimensional moving platform.The impedance analyzer is connected to the flexible flaw detection sensor via wires, thereby providing an alternating current to the sensor to excite an alternating magnetic field. Simultaneously, it acquires the impedance value of the flexible flaw detection sensor in real time and transmits the acquired impedance data to a microprocessor for storage.

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