The invention provides a defect detection method and
system for
integrated circuit manufacturing. Wherein in the
integrated circuit packaging stage, packaged chips are divided into a first type of chips meeting a preset physical characteristic threshold value and a second type of chips exceeding the physical characteristic threshold value through a pneumatic sorting device; performing
scanning electron microscope imaging on the surface of the second type of
chip, generating a three-dimensional topological structure by using an image reconstruction technology, and positioning a micron-sized particle defect area by comparing
reference type differences; synchronously applying high-frequency
electric signal excitation in the sorting process, detecting
impedance response of the second type of chips, and recording an abnormal
signal sequence exceeding a preset
frequency domain range; performing space-
time correlation matching on the micron-sized particle defect area and the abnormal
signal sequence, and judging that the defect is a multi-layer composite defect when a preset
coupling condition is met; and dynamically adjusting the mesh
diameter and vibration frequency parameters of the pneumatic sorting device. According to the technical scheme provided by the invention, accurate identification of the multi-layer composite defect of the
chip is realized, and the defect interception efficiency is remarkably improved.