Substrate transport module and die bonder
By designing a clamping and conveying mechanism for the substrate transport module, the problem of vibration and shaking of the substrate during long-distance transport is solved, achieving higher stability and die bonding efficiency.
CN114975206BActive Publication Date: 2026-04-14SHENZHEN XINYICHANG TECH CO LTD
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Patent Information
- Application Number
- CN202210742431.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-28
- Publication Date
- 2026-04-14
- Estimated Expiration
- 2042-06-28
AI Technical Summary
Technical Problem
In existing die bonding equipment, the substrate is prone to shaking and wobbling when transported over long distances, resulting in low stability.
Method used
A substrate transport module is adopted, including a substrate supply mechanism, a loading clamping and conveying mechanism, a transfer mechanism, a unloading clamping and conveying mechanism, and a recycling and docking mechanism. The substrate is transferred by clamping, reducing belt conveying and increasing stability.
Benefits of technology
It improves the stability of substrate transfer, shortens the transport path length, and enhances die bonding efficiency and accuracy.
✦ Generated by Eureka AI based on patent content.
Abstract
The application relates to the technical field of die bonding equipment, and provides a substrate conveying module and a die bonder. The substrate conveying module comprises a rack, a substrate supply mechanism, a feeding clamping and conveying mechanism, a carrying mechanism, a discharging clamping and conveying mechanism, a recycling connection mechanism and a substrate storage mechanism. The feeding clamping and conveying mechanism is used for clamping and fixing a substrate, and moving the substrate from one side of the feeding clamping and conveying mechanism to the other side of the feeding clamping and conveying mechanism. The carrying mechanism is used for moving the substrate to a die bonding station. The discharging clamping and conveying mechanism is used for clamping and fixing the substrate and moving the substrate. The recycling connection mechanism is used for moving the substrate from one side of the recycling connection mechanism to the other side of the recycling connection mechanism. The die bonder comprises the substrate conveying module. The substrate conveying module and the die bonder provided by the application are not prone to shaking and shaking, have high conveying stability, greatly shorten the conveying path length of the substrate, shorten the time for moving the substrate, have high running speed, and improve the die bonding efficiency and precision.
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