Display device and method of manufacturing the same

Abstract

A display device and a manufacturing method thereof, the display device comprising a substrate, a plurality of light-emitting diodes (LEDs), and a plurality of reflective units. The LEDs are disposed on the substrate. The reflective units are disposed between the LEDs, with any one of the reflective units separating any two adjacent LEDs. Each of the reflective units comprises an arcuate sidewall and a top portion remote from the substrate, wherein the top portion is a top surface or has a shape having multiple surfaces, and the top portion is connected to the arcuate sidewall via a connecting line. The tangent slope of the arcuate sidewall is continuously and gradually changed, and the amount of the tangent slope gradually changes when reaching the connecting line.

Description

Technical Field

[0001] The present disclosure relates to a display device and a method for manufacturing the same. Background Art

[0002] The reflective unit is configured to reflect light from the LED. However, due to limitations in the reflective material's properties (for example, when using white or gray photoresist-type reflective materials, the reflective material's scattering properties prevent the exposure energy from fully reaching the bottom), achieving a shape with optimal reflective efficiency (e.g., narrow at the top and wide at the bottom) is difficult. Furthermore, the height of the reflective unit is limited, limiting improvements in reflective efficiency.

[0003] Therefore, how to provide a display device with better reflection efficiency is a problem to be solved. Summary of the Invention

[0004] Some embodiments of the present disclosure provide a display device comprising a substrate, a plurality of light-emitting diodes, and a plurality of reflective units. The light-emitting diodes are disposed on the substrate. The reflective units are disposed between the light-emitting diodes, and any one of the reflective units separates any two adjacent light-emitting diodes, wherein any one of the reflective units comprises an arcuate sidewall and a top portion away from the substrate, wherein the top portion is a top surface or has a shape having multiple surfaces, and the top portion is connected to the arcuate sidewall via a connecting line, wherein a tangent slope of the arcuate sidewall is continuously and gradually changed, and the amount of the tangent slope gradually changes when reaching the connecting line.

[0005] In some embodiments, the top portion is a top surface and is concave toward the substrate.

[0006] In some embodiments, the top portion is rectangular in shape.

[0007] In some embodiments, a top surface of the top portion is convex toward a direction away from the substrate.

[0008] In some embodiments, the display device further includes a plurality of filling layers covering the light-emitting diodes and filling the spaces between the reflective units, wherein a vertical distance from a top surface of any filling layer to the substrate is consistent with a vertical distance from the connecting line to the substrate.

[0009] In some embodiments, the material of the filling layer includes a color conversion material, an optical adhesive, or a combination thereof.

[0010] In some embodiments, the display device further includes a plurality of light shielding layers respectively disposed on the reflective unit.

[0011] In some embodiments, the display device further includes a plurality of lens arrays disposed between the light shielding layers.

[0012] In some embodiments, when the top portion is concave toward the substrate, the light shielding layer fills the concave area of ​​the top portion.

[0013] In some embodiments, a vertical distance between the connecting wire and the substrate is greater than a vertical distance between the top surface of any light-emitting diode and the substrate by 5 micrometers to 10 micrometers.

[0014] Some embodiments of the present disclosure provide a method for manufacturing a display device, comprising providing a substrate; disposing a plurality of light-emitting diodes on the substrate; disposing a positive photoresist material between the light-emitting diodes; exposing the positive photoresist material; performing a thermal reflow process on the positive photoresist material to obtain a plurality of arc-shaped photoresist layers between the light-emitting diodes; covering a plurality of filling layers on the light-emitting diodes and filling the spaces between the arc-shaped photoresist layers; removing the arc-shaped photoresist layers to expose a plurality of grooves having arc surfaces between the filling layers; and filling the grooves with a reflective material.

[0015] In some embodiments, the step of filling the groove with the reflective material includes filling the groove with the reflective material until the reflective material completely covers the curved surface.

[0016] In some embodiments, the step of filling the groove with the reflective material further includes filling an amount of the reflective material that is less than the capacity of the groove.

[0017] In some embodiments, the step of filling the groove with the reflective material further includes filling the groove with the reflective material.

[0018] In some embodiments, the step of filling the groove with the reflective material further includes filling the reflective material in an amount greater than the capacity of the groove.

[0019] In some embodiments, the step of filling the groove with the reflective material further includes filling the reflective material until the reflective material overflows the groove and covers the filling layer; and removing the reflective material above the filling layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present disclosure can be more fully understood by reading the following detailed description of the embodiments with reference to the accompanying drawings.

[0021] Figure 1 A flowchart illustrating a method of manufacturing a display device in some embodiments of the present disclosure.

[0022] Figures 2A to 2G Schematic cross-sectional view showing some stages of a method for manufacturing a display device in some embodiments of the present disclosure.

[0023] Figure 3 A schematic cross-sectional view illustrating a display device according to some embodiments of the present disclosure.

[0024] Figures 4A to 4B Schematic cross-sectional view showing some stages of a method for manufacturing a display device in some embodiments of the present disclosure.

[0025] Figures 5A to 5C A schematic cross-sectional view illustrating a display panel in a display device according to some embodiments of the present disclosure.

[0026] Figures 6A to 6B A schematic cross-sectional view illustrating a backlight module in a display device according to some embodiments of the present disclosure.

[0027] Description of reference numerals:

[0028] 100: Method

[0029] 200, 300, 400: Display device

[0030] 210, 310, 410, 510, 610: substrate

[0031] 220, 222, 224, 320, 420, 520, 522, 524, 526, 620: Light-emitting diodes

[0032] 220T: Top surface

[0033] 230: Positive photoresist material

[0034] 240, 242, 244, 246: Arc-shaped photoresist layer

[0035] 240A: curved surface

[0036] 240T: Top surface

[0037] 250, 252, 254, 350, 450, 452, 454, 550, 552, 554, 556, 650: Filling layer

[0038] 250T, 350T, 450T: Top surface

[0039] 260, 360, 460, 560, 660: Reflection unit

[0040] 260S, 460S, 660S: curved sidewalls

[0041] 260T, 360T, 460T, 560T, 660T: Top surface

[0042] 360P, 460P, 560P: Top part

[0043] 500A, 500B, 500C: Display panel

[0044] 600A, 600B: Backlight module

[0045] A0: connecting wire

[0046] BM: light-shielding layer

[0047] D: vertical distance

[0048] E: Electrode structure

[0049] M: Light-emitting component

[0050] MLA: Lens Array

[0051] MLAt: top surface

[0052] H: Thermal reflow process

[0053] H1, H2: height

[0054] L1, L2: light

[0055] P0, P1, P2, P3: points

[0056] R: reflective material

[0057] RL: Reflective layer

[0058] T: Groove

[0059] T1: curved surface

[0060] S110, S120, S130, S140, S150, S160, S170: Steps DETAILED DESCRIPTION

[0061] The following drawings and detailed descriptions clearly illustrate the concept of the present disclosure. After understanding the preferred implementation methods and embodiments of the present disclosure, any person skilled in the art can make changes and modifications based on the technology revealed by the present disclosure without departing from the concept and scope of the present disclosure.

[0062] Throughout this specification, the same reference numerals represent the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to another element, or an intermediate element may also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there is no intermediate element. As used herein, "connection" may refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may refer to the presence of other elements between two elements.

[0063] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Thus, a "first element," "component," "region," "layer," or "portion" discussed below may be referred to as a second element, component, region, layer, or portion without departing from the teachings herein.

[0064] The terms used herein are for the purpose of describing specific embodiments only and are not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms, including "at least one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. It should also be understood that when used in this specification, the terms "include" and / or "including" specify the presence and / or parts of the features, regions, entireties, steps, operations, elements, components and / or parts, but do not exclude the presence or addition of one or more other features, regions, entireties, steps, operations, elements, components and / or combinations thereof.

[0065] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as shown in the figures. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, the element described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. Thus, the exemplary term "lower" can include both "lower" and "upper" orientations, depending on the particular orientation of the figure. Similarly, if the device in one figure is turned over, the element described as being "below" or "beneath" the other elements will be oriented as being "above" the other elements. Thus, the exemplary term "below" or "below" can include both "upper" and "lower" orientations.

[0066] As used herein, "about," "approximately," or "substantially" includes the stated value and an average value within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, or ±5%. Furthermore, as used herein, "about," "approximately," "similar," or "substantially" may be selected based on the optical property, etching property, or other property, and may not apply to all properties with a single standard deviation.

[0067] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present invention, and will not be interpreted as idealized or overly formal unless explicitly defined as such herein.

[0068] Exemplary embodiments are described herein with reference to schematic top views of idealized embodiments. Thus, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances, are to be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions as shown herein, but rather include deviations in shapes resulting, for example, from manufacturing. For example, a region shown or described as flat may typically have rough and / or nonlinear features. Furthermore, sharp angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the claims.

[0069] Several embodiments are listed below to further illustrate the touch device of the present invention. However, these embodiments are for illustration only and are not intended to limit the present invention. The scope of protection of the present invention shall be determined by the claims.

[0070] Figure 1 A flow chart illustrating a method 100 of manufacturing a display device in some embodiments of the present disclosure.

[0071] Method 100 includes steps S110 to S170, which are respectively: step S110, providing a substrate; step S120, setting light-emitting diodes on the substrate; step S130, setting a positive photoresist material between the light-emitting diodes; step S140, performing a thermal reflow process on the positive photoresist material to obtain an arc-shaped photoresist layer; step S150, covering the light-emitting diodes with a filling layer and filling the space between the arc-shaped photoresist layers; step S160, removing the arc-shaped photoresist layer to expose a groove with a curved surface between the filling layers; and step S170, filling the groove with a reflective material.

[0072] The following targets Figure 1 Each step in the Figures 2A to 2G Specifically describe, Figures 2A to 2G Schematic cross-sectional view of some stages in method 100 .

[0073] First, please see Figure 1 Step S110 and Figure 2A , providing a substrate 210.

[0074] In some embodiments, the substrate 210 may be a light-transmitting material. For example, the substrate 210 may be a glass substrate, a quartz substrate, a sapphire substrate, or other suitable rigid substrate or flexible substrate (flexible substrate). In some embodiments, a reflective structure (e.g., a metal layer) may be provided on the substrate 210 based on reflection requirements.

[0075] Next, please see Figure 1 Step S120 and Figure 2B , a light-emitting diode 220 is disposed on the substrate 210, wherein the light-emitting diode 220 includes a light-emitting element M and an electrode structure E electrically connected to the light-emitting element M. In some embodiments, the light-emitting diodes 220 (the light-emitting diode 222 and the light-emitting diode 224) emit light of the same or similar wavelength. In some other embodiments, these light-emitting elements 220 can also emit light of multiple different colors. For example, the light-emitting diode 222 and the light-emitting diode 224 each emit one of the three primary colors (red light, blue light, and green light). In some embodiments, the height H1 of the light-emitting diode 220 is less than 5 microns, for example, 1 micron to 5 microns.

[0076] Next, please see Figure 1 Step S130 and Figure 2C , a positive photoresist material 230 is disposed between the light emitting diodes 220 .

[0077] In some embodiments, the positive photoresist material 230 is a photoresist material that can be dissolved by a developer after being irradiated (exposed) by ultraviolet light, such as a phenolic resin polymer.

[0078] Next, please see Figure 1 Step S140 and Figure 2D , aligning the photoresist material 230 (same reference Figure 2C ) performs a thermal reflow process H to obtain the arc-shaped photoresist layer 240. The temperature and time of the thermal reflow process H can be adjusted according to the material of the positive photoresist material 230, the height H2 of the arc-shaped photoresist layer 240 to be formed, or the curvature of the arc-shaped surface 240A.

[0079] In some embodiments, the tangent slopes at each point on the arcuate surface 240A vary continuously and gradually. In some embodiments, the arcuate photoresist layer 240 is a hemispherical structure, the radius of curvature of the arcuate surface 240A is equal to the height H2 of the arcuate photoresist layer 240, and the tangent slopes at each point vary regularly (e.g., according to a specific equation).

[0080] In some embodiments, the height H2 of the arc-shaped photoresist layer 240 is at least 5 microns greater than the height H1 of the LED 220 (ie, the vertical distance between the top surface 220T of the LED 220 and the substrate 210 ), for example, between 5 microns and 10 microns.

[0081] Next, please see Figure 1 Step S150 and Figure 2E , covering the filling layer 250 on the light emitting diode 220 and filling the space between the arc-shaped photoresist layers 240 (eg, the arc-shaped photoresist layer 242 , the arc-shaped photoresist layer 244 , and the arc-shaped photoresist layer 246 ).

[0082] In some embodiments, the filling layer 250 is a color conversion material, an optical adhesive, or a combination thereof. In some embodiments, the color conversion material includes, for example, a material containing phosphors, fluorescent dyes, quantum dots, or other light-converting substances, and is used to convert light from the LED 220 into light of another wavelength band, such as converting blue light into red light.

[0083] In some embodiments, filler layer 250 may be selected to correspond to different LEDs 220 by selecting optical adhesive containing color conversion materials of different colors or containing no color conversion materials. For example, if LEDs 220 (LEDs 222 and 222) both emit blue light, filler layer 252 containing red fluorescent dye is disposed on LED 222, and filler layer 254 containing green fluorescent dye is disposed on LED 224, thereby adjusting the wavelengths of the light to purple and cyan, respectively.

[0084] Depending on the different surface tensions and cohesive forces that different materials may have, the top surface 250T of the filling layer 250 may be concave in the middle (e.g., horn-shaped), convex in the middle, or horizontal. In some embodiments, for example, see Figure 2E The top surface 250T of the filling layer 250 is horizontal, and the top surface 250T of the filling layer 250 is slightly lower than the top surface 240T of the arc-shaped photoresist layer 240. For example, the top surface 250T is lower than the top surface 240T by between 0.5 microns and 1 micron (for example, 0.5 microns, 0.6 microns, 0.7 microns, 0.8 microns, 0.9 microns, 1 micron or any value in the foregoing range).

[0085] Next, please see Figure 1 Step S160 and Figure 2F , remove the arc-shaped photoresist layer 240 (see Figure 2E ), exposing a groove T with a curved surface T1 between the filling layers 250 (eg, the filling layer 252 and the filling layer 254).

[0086] In some embodiments, the arc-shaped photoresist layer 240 may be exposed (see also Figure 2E ), changing the solubility of the arc-shaped photoresist layer 240 in the developer, and then removing the arc-shaped photoresist layer 240 with the developer. It is worth emphasizing that the arc-shaped photoresist layer 240 adopts the positive photoresist material 230 (see Figure 2C ), compared to the negative photoresist material (which is insoluble in the developer after exposure and has increased hardness), the positive photoresist material 230 is not only easier to remove in subsequent processes, but also has better plastic elasticity during the thermal reflow operation.

[0087] Next, please see Figure 1 Step S170 and Figure 2G , filling the reflective material R into the groove T to form a reflective unit 260 between the filling layers 250 (for example, the filling layer 252 and the filling layer 254), separating any two adjacent ones of the light-emitting diodes 220 (for example, the light-emitting diode 222 and the light-emitting diode 224), and obtaining the display device 200.

[0088] In some embodiments, the reflective material R includes reflective inorganic particles, for example, barium sulfate (BaSO 4 ), titanium dioxide (TiO 2 ), zinc oxide, or a combination thereof.

[0089] In some embodiments, as Figure 2G As shown (same reference Figure 2F ), the reflective material R is filled until the reflective material R completely covers the arc surface T1, and the filling amount of the reflective material R is less than the capacity of the groove T. Therefore, the arc surface T1 of the groove T is used to define the arc-shaped sidewall 260S of the reflective unit 260.

[0090] It can be understood that due to the surface tension and cohesive properties of the reflective material R, when the reflective material R completely covers the curved surface T1 and the groove T is not completely filled, the top surface 260T of the reflective unit 260 is recessed toward the substrate 210. The top surface 260T of the reflective unit 260 directly contacts the top surface 250T of the filling layer 250 via the connecting line A0 (that is, the vertical distance from the top surface 250T of the filling layer 250 to the substrate 210 is consistent with the vertical distance D from the connecting line A0 to the substrate 210). Therefore, the slope of the tangent line at each point on the curved sidewall 260S exhibits a continuous gradient (for example, a regular gradient from point P0 to point P1 according to a specific equation). The gradient of the tangent line changes when the tangent line reaches the connecting line A0 (for example, point P2). In some embodiments, the slope of the tangent line from point P2 to point P3 exhibits a regular gradient according to another specific equation (different from the specific equation used to determine the gradient from point P0 to point P1).

[0091] It is worth noting that in the design of upward light emission, theoretically, a reflective unit that is narrow at the top and wide at the bottom has better reflection efficiency than when the sidewalls are close to vertical or the reflective unit is wide at the top and narrow at the bottom. This can avoid energy consumption during the reflection process and present better light extraction efficiency. However, there are limitations in the actual process. Specifically, if a white or gray photoresist-type reflective material is used, if the reflective material R is directly prepared as a reflective unit that is narrow at the top and wide at the bottom, due to the scattering properties of the reflective material R and the difficulty of the exposure energy to completely reach the bottom, it is actually difficult to obtain a reflective unit with a bottom angle (relative to the substrate 210) less than 85°. Moreover, when the height of the reflective unit is greater than 10 microns, it will not be possible to maintain a narrow top and wide bottom shape during the preparation process, and will be transformed into a wide top and narrow bottom shape. Therefore, there are limitations on the bottom angle and height of the current reflective unit.

[0092] In contrast, the reflective unit 260 of the present disclosure utilizes a combination of positive photoresist and thermal reflow to form an arc-shaped photoresist layer 240 having an arc-shaped surface 240A that is narrow at the top and wide at the bottom (see also FIG. Figure 2D ) is shaped, and then the curved photoresist layer 240 is removed, exposing a recess T with a curved surface T1 (see also FIG2F ). Reflective material R is then directly filled into recess T to form reflective unit 260. By utilizing positive photoresist and thermal reflow, it is possible to form a reflective unit 260 that is wide at the top and narrow at the bottom, without being restricted by height or bottom angle, and to precisely control the desired curvature of the curved sidewall 260S.

[0093] In some embodiments, the vertical distance D between the connecting line A0 of the reflective unit 260 and the substrate 210 is greater than 10 microns. In some embodiments, the vertical distance D between the connecting line A0 of the reflective unit 260 and the substrate 210 is greater than the height H1 of the light-emitting diode 220 by at least 5 microns, for example, between 5 microns and 10 microns.

[0094] Furthermore, it's worth noting that, compared to the planar sidewalls of conventional reflective units, the curved sidewalls 260S of the reflective unit 260 utilize a gradually expanding shape to improve light dispersion uniformity and light extraction efficiency. For example, compared to a planar sidewall with an 85° angle between the sidewall and the substrate 210, the curved sidewalls 260S of the reflective unit 260 can at least improve brightness at light incident angles between 50° and 70°, and increase overall light extraction efficiency by 2% to 3%.

[0095] In some other embodiments, see, for example, Figure 3 , showing a cross-sectional schematic diagram of a display device 300 according to some embodiments of the present disclosure. Figure 3 For example, the reflective material R can completely cover the arc surface T1 of the groove T (see Figure 2F), the reflective material R is continuously filled until the reflective material R just fills the groove T. It is understandable that due to the surface tension and cohesive force of the reflective material R, when the reflective material R just fills the groove T, the top surface 360T of the top portion 360P of the reflective unit 360 is higher than the top surface 350T of the filling layer 350, and the top surface 360T bulges away from the substrate 310.

[0096] In some other embodiments, see, for example, Figures 4A to 4B , showing a cross-sectional schematic diagram of some stages in a method for manufacturing a display device in some embodiments of the present disclosure, Figures 4A to 4B (Please refer to Figure 2F ) illustrates a method of forming the reflective unit 460 by filling the reflective material R in an amount greater than the capacity of the groove T and then removing the excess reflective material R.

[0097] Specifically, see Figure 4A Fill the reflective material R until the reflective material R overflows the groove T (see Figure 2F ) outside, and the reflective material R covers the filling layer 450. Next, see Figure 4B , the reflective material R above the filling layer 450 is removed to obtain a reflective unit 460, wherein a top portion 460P of the reflective unit 460 is connected to the arc-shaped sidewall 460S via a connecting line A0, and the top portion 460P is rectangular (or island-shaped), with a top surface 460T of the top portion 460P higher than the top surface 450T of the filling layer 450. In some embodiments, after the reflective material R is coated on the filling layer 450, a patterned photoresist is formed to expose the reflective material R to be removed (located on the filling layer 450), and the exposed reflective material R is then removed through a hot melt process, resulting in a reflective unit 460 that only fills the groove T (see FIG. 2F ) and is not located on the filling layer 450. Finally, the photoresist is removed.

[0098] Next, please see Figures 5A to 5C , a schematic cross-sectional view of display panels (display panel 500A, display panel 500B, and display panel 500C) in a display device according to some embodiments of the present disclosure is shown.

[0099] Please see Figure 5A In the display panel 500A, a light shielding layer BM may be provided on the reflective unit 560 to prevent light from interfering with each other between adjacent LEDs 520 (eg, LED 522 and LED 524), thereby affecting light extraction efficiency and light wavelength band.

[0100] In some embodiments, light of different colors can be generated by combining LED 520 with a filler layer 550 containing color conversion materials of different colors or a transparent filler layer 550 (e.g., optical adhesive). For example, filler layer 552 contains red phosphor, filler layer 554 contains green phosphor, and filler layer 556 contains no phosphor. Therefore, when blue LED 520 emits light, the blue light is converted to purple, cyan, and blue after passing through filler layer 552, filler layer 554, and filler layer 556, respectively.

[0101] Please see Figure 5B , a lens array MLA may be first disposed above the filling layer 550, and then a light shielding layer BM may be disposed between the lens array MLA to improve the uniformity of light. In some embodiments, the lens array MLA may be made of glass or quartz. It is understood that the reflective unit 560 is a reflective unit 560 having a rectangular top portion 560P (see also FIG. Figure 4B The reflective unit 460) is provided with a planar structure of the top surface 560T, thereby improving the convenience and fixation of the lens array MLA. However, in some other embodiments, the reflective unit 560 may also be provided as follows: Figure 3 The setting form of the reflection unit 360 (for example, the top surface 560T is convex towards the direction away from the substrate 510).

[0102] Please see Figure 5C The reflecting unit 560 may be provided in a manner such that the top surface 560T thereof is concave toward the substrate 510 (see FIG. Figure 2G Specifically, the lens array MLA is disposed on the filling layer 550, and then a light shielding material is filled between the lens array MLA to form a light shielding layer BM that at least fills the concave area of ​​the top surface 560T, or further fills it to a level slightly lower than the top surface MLat of the lens array MLA.

[0103] Next, please see Figures 6A to 6B , a schematic cross-sectional view of a backlight module (backlight module 600A to backlight module 600B) in a display device according to some embodiments of the present disclosure is shown.

[0104] Please see Figure 6A In the backlight module 600A, the reflective unit 660 can reflect the light L1 emitted by the light emitting diode 620 at multiple angles through the gradually expanding arc-shaped sidewall 660S, thereby improving the uniformity of the light.

[0105] Please see Figure 6B , when the top surface 660T of the reflective unit 660 is concave toward the substrate 610 (see Figure 2GAs shown in the reflecting unit 260, the reflecting unit 660 can not only reflect the light L1 of the light-emitting diode 620 through the curved side wall 660S, but also serve as a virtual light source. Through the curved concave structure of the top surface 660T, the light L2 reflected from the self-reflective layer RL is reflected and diverged at multiple angles, thereby further improving the light utilization and light uniformity.

[0106] In some embodiments, a blue LED 620 (emitting blue light) can be used in conjunction with a filler layer 650 containing yellow fluorescent dye to produce white light. In other embodiments, the LED 620 can directly emit white light and be used in conjunction with a transparent filler layer 650.

[0107] Some embodiments of the present disclosure provide a display device and a method for manufacturing the same. By thermally reflowing a positive photoresist, a curved shape is formed. The positive photoresist is then replaced with a reflective material to obtain a reflective unit having curved sidewalls. This overcomes the bottom angle and height limitations of the reflective material due to its material properties. Furthermore, the reflective unit's shape characteristics, which gradually expand outward through the curved sidewalls, can improve the light dispersion uniformity and light extraction efficiency of the display device.

[0108] Although the present disclosure has been disclosed above in multiple implementation modes and examples, they are not intended to limit the present disclosure. Any person skilled in the art may make various changes and modifications without departing from the concept and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the claims.

Claims

1. A display device comprising: a substrate; A plurality of light emitting diodes are disposed on the substrate; A plurality of reflective units are disposed between the light emitting diodes, wherein any one of the reflective units separates any two adjacent ones of the light emitting diodes, wherein any one of the reflective units includes an arc-shaped sidewall and a top portion away from the substrate. The top portion is a top surface or a shape having multiple surfaces, and the top portion is connected to the arc-shaped side wall via a connecting line. The tangent slope of the arc-shaped sidewall is continuously and gradually changed, and when reaching the connecting line, the tangent slope gradually changes. in, The arc-shaped sidewall is in a gradually expanding shape. 2 . The display device as claimed in claim 1 , wherein the top portion is the top surface and is concave toward the substrate. The display device as claimed in claim 1 , wherein the top portion has a rectangular shape. The display device as claimed in claim 1 , wherein a top surface of the top portion is convex toward a direction away from the substrate.

5. The display device as described in claim 1 further comprises a plurality of filling layers covering the light-emitting diodes and filling the spaces between the reflective units, wherein a vertical distance from a top surface of any one of the filling layers to the substrate is consistent with a vertical distance from the connecting line to the substrate. 6 . The display device as claimed in claim 5 , wherein a material of the filling layers comprises a color conversion material, an optical adhesive, or a combination thereof. 7 . The display device as claimed in claim 1 , further comprising a plurality of light shielding layers respectively disposed on the reflective units. 8 . The display device as claimed in claim 7 , further comprising a plurality of lens arrays disposed between the light shielding layers. 9 . The display device as claimed in claim 8 , wherein when the top portion is concave toward the substrate, the light shielding layers fill the concave area of ​​the top portion. 10 . The display device as claimed in claim 8 , wherein a vertical distance between the connecting line and the substrate is greater than a vertical distance between a top surface of any one of the light emitting diodes and the substrate by 5 μm to 10 μm.

11. A method for manufacturing a display device, comprising: providing a substrate; Disposing a plurality of light emitting diodes on the substrate; Disposing a positive photoresist material between the light emitting diodes; exposing the positive photoresist material; Performing a thermal reflow process on the positive photoresist material to obtain a plurality of arc-shaped photoresist layers between the light-emitting diodes; Covering the light-emitting diodes with a plurality of filling layers and filling the spaces between the arc-shaped photoresist layers; removing the arc-shaped photoresist layers to expose a plurality of grooves with arc surfaces between the filling layers; A reflective material is filled into the grooves. 12 . The method according to claim 11 , wherein the step of filling the reflective material into the grooves comprises filling the reflective material until the reflective material completely covers the curved surface. 13 . The method of claim 12 , wherein the step of filling the reflective material into the grooves further comprises filling an amount of the reflective material that is less than a capacity of the grooves. 14 . The method of claim 12 , wherein the step of filling the grooves with the reflective material further comprises filling the grooves with the reflective material. 15 . The method of claim 12 , wherein the step of filling the reflective material into the grooves further comprises filling the reflective material in an amount greater than the capacity of the grooves.

16. The method according to claim 15, wherein the step of filling the reflective material into the grooves further comprises: Filling the reflective material until the reflective material overflows the grooves and covers the filling layers; as well as The reflective material above the filling layers is removed.

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